LIGHT-EMITTING DEVICE

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to Chinese Invention Patent Application No. 202210088785.7, filed on Jan. 25, 2022.

FIELD

The disclosure relates to a semiconductor device, and more particularly to a light-emitting device.

BACKGROUND

Light-emitting diodes (LEDs) are considered to be one of the light sources having the most potential as they offer advantages including high luminous intensity, high efficiency, small size, and long lifespan. In recent years, LEDs have been widely applied in various fields, such as lighting, signal display, backlight, automotive light, big screen display, etc., all of which ask for a higher level of luminous intensity and efficiency of the LEDs.

SUMMARY

Therefore, an object of the disclosure is to provide a light-emitting device that can alleviate at least one of the drawbacks of the prior art.

According to the disclosure, the light-emitting device includes a semiconductor epitaxial structure that has a first surface and a second surface opposite to the first surface, and that includes a first semiconductor layer, an active layer, and a second semiconductor layer sequentially stacked on one another in such order from the first surface to the second surface. The active layer includes a quantum well structure having multiple periodic units each of which includes a well layer and a barrier layer disposed sequentially in such order. A bandgap of the barrier layer is greater than that of the well layer, and the bandgaps of the barrier layers of the periodic units gradually increase in a direction from the first surface of the semiconductor epitaxial structure to the second surface of the semiconductor epitaxial structure.

BRIEF DESCRIPTION OF THE DRAWINGS

Other features and advantages of the disclosure will become apparent in the following detailed description of the embodiment(s) with reference to the accompanying drawings. It is noted that various features may not be drawn to scale.

FIG. 1 is a schematic view illustrating an epitaxial structure according to a first embodiment of the disclosure.

FIGS. 2 and 3 are views each illustrating a bandgap change in an active layer according to the first embodiment of the disclosure.

FIG. 4 is a schematic view illustrating a light-emitting device according to the first embodiment of the disclosure.

FIGS. 5 to 7 are schematic views illustrating a manufacturing method according to a second embodiment of the disclosure, which produces the light-emitting device of the first embodiment.

FIG. 8 is a schematic view illustrating the light-emitting device according to a third embodiment of the disclosure.

FIGS. 9 and 10 are schematic views illustrating a manufacturing method according to a fourth embodiment of the disclosure, which produces the light-emitting device of the third embodiment.

FIG. 11 is a graph illustrating the relationship between current density and luminous flux for each of a conventional light-emitting device and the light-emitting device of the first embodiment.

FIG. 12 is a schematic view illustrating a micro light-emitting device according to a fifth embodiment of the disclosure.

FIG. 13 is a schematic view illustrating the micro light-emitting device according to the fifth embodiment of the disclosure in a supported state before being unitized.

FIG. 14 is a graph illustrating the relationship between current density and wall plug efficiency (WPE) for each of the conventional light-emitting device and the micro light-emitting device of the fifth embodiment.

FIG. 15 is a schematic view illustrating the light-emitting equipment according to a sixth embodiment of the disclosure.

DETAILED DESCRIPTION

Before the disclosure is described in greater detail, it should be noted that where considered appropriate, reference numerals or terminal portions of reference numerals have been repeated among the figures to indicate corresponding or analogous elements, which may optionally have similar characteristics.

It should be noted herein that for clarity of description, spatially relative terms such as “top,” “bottom,” “upper,” “lower,” “on,” “above,” “over,” “downwardly,” “upwardly” and the like may be used throughout the disclosure while making reference to the features as illustrated in the drawings. The features may be oriented differently (e.g., rotated 90 degrees or at other orientations) and the spatially relative terms used herein may be interpreted accordingly.

Referring to FIG. 1, an epitaxial structure according to a first embodiment of the disclosure includes a growth substrate 100 and a semiconductor epitaxial structure that includes a first current spreading layer 104, a first cladding layer 105, an active layer 106, a second cladding layer 107, a second current spreading layer 108, and a second ohmic contact layer 109 sequentially stacked on one another in such order.

Specifically, referring to FIG. 1, a material for the growth substrate 100 may include, but is not limited to, GaAs, other materials may also be used, such as GaP, InP, etc. In this embodiment, the growth substrate 100 is made of GaAs. In some embodiments, the epitaxial structure of the light-emitting device may further include a buffer layer 101, an etch stop layer 102, and a first ohmic contact layer 103 sequentially disposed in such order between the growth substrate 100 and the first current spreading layer 104. A lattice quality of the buffer layer 101 is better than that of the growth substrate 100; therefore, forming the buffer layer 101 on the growth substrate 100 may reduce adverse effects of lattice defects of the growth substrate 100 on the semiconductor epitaxial structure. The etch stop layer 102 serves to stop etching in later procedures. In certain embodiments, the etch stop layer 102 is an n-type etch stop layer made of n-type GalnP. To facilitate a later removal of the growth substrate 100, the etch stop layer 102 has a thickness that is greater than 0 nm and no greater than 500 nm. In some embodiments, the thickness of the etch stop layer 102 is greater than 0 nm and no greater than 200 nm. The first ohmic contact layer 103 may be made of gallium arsenide, and may have a thickness ranging from 10 nm to 100 nm and a doping concentration ranging from 1E18/cm³ to 10E18/cm³. In some embodiments, the doping concentration of the first ohmic contact layer 103 is 2E18/cm³ so as to achieve better ohmic contact.

The semiconductor epitaxial structure may be formed on the growth substrate 100 by using methods such as physical vapor deposition (PVD), chemical vapor deposition (CVD), epitaxy growth technology, atomic layer deposition (ALD), etc. The semiconductor epitaxial structure may contain a semiconductor material that generates light, such as ultra-violet light, blue light, green light, yellow light, red light, and infrared light. Specifically, the semiconductor material of the semiconductor epitaxial structure may be a material that generates a peak wavelength ranging from 200 nm to 950 nm, such as a nitride material, specifically such as a GaN-based laminate doped with aluminum, indium, etc. and having a peak wavelength ranging from 200 nm to 550 nm band, or an AIGaInP-based or an AlGaAs-based laminate having a peak wavelength ranging from 550 nm to 950 nm.

The semiconductor epitaxial structure has a first surface and a second surface, and includes a first semiconductor layer, the active layer 106, and a second semiconductor layer sequentially stacked on one another in such order from the first surface to the second surface the growth substrate 100. The first semiconductor layer and the second semiconductor layer may be doped with an n-type dopant and a p-type dopant, respectively, to provide electrons and holes, respectively. An n-type semiconductor layer may be doped with n-type dopants such as Si, Ge, or Sn, and a p-type semiconductor layer may be doped with p-type dopants such as Mg, Zn, Ca, Sr, or Ba. When the first semiconductor layer is the n-type semiconductor layer, the second semiconductor layer is the p-type semiconductor layer. When the first semiconductor layer is the p-type semiconductor layer, the second semiconductor layer is the n-type semiconductor layer. Specifically, the first semiconductor layer, the active layer 106, and the second semiconductor layer may be formed by materials such as aluminum gallium indium nitride, gallium nitride, aluminum gallium nitride, aluminum indium phosphide, aluminum gallium indium phosphide, gallium arsenide, aluminum gallium arsenic, or combinations thereof.

The first and second semiconductor layers may be made from a material, such as aluminum gallium indium phosphide, aluminum indium phosphide or aluminum gallium arsenic, and respectively have the first cladding layer 105 and the second cladding layer 107 to provide electrons and holes for the active layer 106. In some embodiments, when the active layer 106 is made of AlGaInP, the first cladding layer 105 and the second cladding layer 107 are made of AlInP and provide the electrons and the holes, respectively. To enhance a uniform current spreading, the first semiconductor layer and the second semiconductor layer further include the first current spreading layer 104 and the second current spreading layer 108, respectively.

The active layer 106 is a light emitting area for the electrons and the holes to recombine. Depending on a wavelength of light emitted by the active layer 106, materials for the active layer 106 may vary. In this embodiment, the active layer 106 includes a quantum well structure having multiple periodic units (i.e., pairs), and each of the periodic units of the quantum well structure includes a well layer and a barrier layer disposed sequentially in such order (i.e., each periodic unit/pair of the quantum well structure includes one well layer and one barrier layer). In addition, a bandgap of the barrier layer is greater than that of the well layer. By adjusting a composition of the semiconductor material of the active layer 106, when the electrons and the holes recombine, the light having a pre-determined wavelength is emitted. The material of the active layer 106, such as InGaAsP or AlGaAs, exhibits electroluminescence property. In some embodiments, the active layer 106 is made of AlGaInP, which may be a single well structure or a multiple quantum well structure. In this embodiment, the semiconductor epitaxial structure is made of AlGaInP or GaAs-based materials, and the active layer 106 emits light having a peak wavelength ranging from 550 nm to 950 nm.

In this embodiment, the quantum well structure has n periodic units (i.e., multiple periodic units), and n ranges from 2 to 100. The well layer has a composition that is represented by Al_xGa_1-xInP. The barrier has a composition that is represented by Al_yGa_1-yInP, where 0≤x≤y≤ 1, and the value of y of an aluminum content ranges from 0.3 to 0.85. The well layer has a thickness ranging from 5 nm to 25 nm. In some embodiments, the well layer has a thickness ranging from 8 nm to 20 nm. The barrier layer has a thickness ranging from 5 nm to 25 nm. In some embodiments, the barrier layer has a thickness ranging from 10 nm to 20 nm. In some embodiments, the bandgaps of the barrier layers gradually increase in a direction (i.e., a thickness direction) from the first semiconductor layer to the second semiconductor layer (i.e., from the first surface of the semiconductor epitaxial structure to the second surface of the semiconductor epitaxial structure).

In some embodiments, when the light-emitting device is to be used under a condition of a relatively great current density (e.g., no smaller than 2A/mm²), a number of the periodic units of the quantum well structure ranges from 6 to 50, such as from 12 to 25, so as to meet the needs of saturation current density. In certain embodiments, a percentage of the aluminum content in the quantum well structure gradually increases in the direction from the first semiconductor layer to the second semiconductor layer. By adjusting components of the barrier layers in the quantum well structure of the active layer 106, light absorption due to an increase in a thickness of the active layer 106 may be reduced, thereby improving luminescence efficiency. Furthermore, varying the percentage of the aluminum content of the barrier layer in the quantum well structure of the active layer 106 may change a refraction coefficient of the barrier layer and an angle at which the light exits from the quantum well structure, thereby improving the light-emitting efficiency of the light-emitting device.

In some embodiments, the percentage of the aluminum content in the quantum well structure gradually increases in the thickness direction in a linear manner or stepwise manner. Specifically, FIGS. 2 and 3 each is a bandgap diagram of the active layer 106. Referring to FIG. 2, the percentage of the aluminum content in the quantum well structure increases from one periodic unit to the other periodic unit in the direction from the first semiconductor layer to the second semiconductor layer. Referring to FIG. 3, the quantum well structure may be grown in a periodic sequence that includes two or more sequence loops. For example, in FIG. 3, the sequence loops are loop A, loop B, loop C, etc., where A≥2, B≥2, C≥2, etc. (A, B or C represents the number of periodic units in each of the sequence loop). That is to say, the number of periodic units in each of the loop A, B or C is two or more than two so that a group of two or more than two periodic units (i.e., a group of multiple periodic units) of the quantum well structure are produced in each of the loop A, B, or C. The values of A, B and C may be the same or different. The constituents of the well layers formed in all of the sequence loops A, B, C, etc. are the same. In each sequence loop A, B or C, the aluminum content is not varied so that the aluminum contents of the barrier layers in each group of periodic units are the same. However, the aluminum content is varied or increased when the sequence loops A, B, C are changed from one to another so that the aluminum contents of the barrier layers increase from one group of the periodic units to the other group of the period units in the direction from the first semiconductor layer to the second semiconductor layer. To form the barrier layers with the gradually increased aluminum contents, a supply rate of aluminum may be increased in a linear or stepwise manner during the process of growing the quantum well structure.

In one embodiment, the semiconductor epitaxial structure of the light-emitting device is provided with the components as shown in Table 1, wherein the first semiconductor layer is n-type doped and includes an n-type current spreading layer 104 and an n-type cladding layer 105, and the second semiconductor layer is p-type doped and includes a p-type cladding layer 107, a p-type current spreading layer 108 and a p-type ohmic contact layer 109. The active layer 106 has the multiple quantum well structure, which is made by repeatedly stacking the well layer that has a composition represented by Al_xGa_1-xInP and the barrier layer that has a composition represented by Al_yGa_1-yInP, wherein 0≤x≤y≤1.

TABLE 1

No.
Layer
Material
Thickness (nm)
Function

109
p-type ohmic contact layer
GaP+Mg
40-150
Ohmic contact

108
p-type current spreading layer
GaP+Mg
300-12000
Spreading current

107
p-type cladding layer
AlInP+Mg
300-1500
Providing holes

106
active layer
Al_xGa_1-xInP and Al_yGa_1-yInP (0≤x≤y≤1)
2-100 pairs (i.e., periodic units)
Determining peak wavelength and luminous intensity

105
n-type cladding layer
AlInP+Si
300-1500
Providing electrons

104
n-type current spreading layer
Al_x1Ga_1-x1InP+Si
2500-4000
Spreading current

In this embodiment, the first semiconductor layer includes the n-type current spreading layer 104 and the n-type cladding layer 105, wherein the n-type current spreading layer 104 performs a function of current spreading, and the effectiveness of the current spreading function is related to a thickness of the n-type current spreading layer 104. In this embodiment, the n-type current spreading layer 104 has a composition that is represented by Al_x1Ga_1-x1InP, has the thickness ranging from 2500 nm to 4000 nm, and has a doping concentration ranging from 4E17/cm³ to 8E17/cm³. The n-type cladding layer 105 provides the electrons for the active layer 106, is made of AlInP, has a thickness ranging from 300 nm to 1500 nm, and is doped with silicon but is not limited to.

The second semiconductor layer includes the p-type cladding layer 107, the p-type current spreading layer 108, and the p-type ohmic contact layer 109. The p-type cladding layer 107 provides the holes for the quantum well structure, is made of AllnP, has a thickness ranging from 300 nm to 1500 nm, and is doped with magnesium but is not limited to. The p-type current spreading layer 108 performs a function of current spreading, and the effectiveness of the current spreading function is related to a thickness of the p-type current spreading layer 108. In this embodiment, the thickness of the p-type current spreading layer 108 may vary based on the size of the light-emitting device, and the thickness of the p-type current spreading layer 108 may be no smaller than 300 nm and no greater than 12000 nm. In this embodiment, the p-type current spreading layer 108 has the thickness ranging from 500 nm to 10000 nm, is made of GaP, has a doping concentration ranging from 6E17/cm³ to 2E18/cm³, and is doped with magnesium but is not limited to.

The second ohmic contact layer 109 forms an ohmic contact with a second electrode 204, may be made of GaP, and has a doping concentration of 1E19/cm³. In some embodiments, the doping concentration of the second ohmic contact layer 109 is no smaller than 5E19/cm³ so as to achieve better ohmic contact. The second ohmic contact layer 109 has a thickness that is no smaller than 40 nm and no greater than 150 nm. In this embodiment, the thickness of the second ohmic contact layer 110 is 60 nm.

The active layer 106 has the multiple quantum well structure, which is made by repeatedly stacking the well layer that has a composition represented by Al_xGa_1-xInP and the barrier layer that has a composition represented by Al_yGa_1-yInP, wherein 0≤x≤y≤1. Specifically, in this embodiment, the number of periodic units of the quantum well structure is 16, and are arranged into four groups each having four periodic units that have four consecutively adjacent barrier layers. The aluminum contents of the barrier layers gradually increase from one group to the other group in the direction from the first semiconductor layer to the second semiconductor layer. In some embodiments, the thickness of the well layer ranges from 8 nm to 20 nm, and the thickness of the barrier layer ranges from 10 nm to 20 nm.

In this embodiment, the aluminum content of the barrier layer increases from the first semiconductor layer to the second semiconductor layer so as to reduce light absorption of the barrier layers. The adjustment of the percentage of the aluminum content of the barrier layer in the quantum well structure of the active layer 106 may change the refraction coefficient of the barrier layer and the angle at which the light exits from the quantum well structure, thereby improving the light-emitting efficiency of the light-emitting device.

Referring to FIG. 4, the light-emitting device having the epitaxial structure shown in FIG. 1 includes a substrate 200 and the semiconductor epitaxial structure bonded to the substrate 200 by a bonding layer 201. The semiconductor epitaxial structure includes the first ohmic contact layer 103, the first current spreading layer 104, the first cladding layer 105, the active layer 106, the second cladding 107, the second current spreading layer 108, and the second ohmic contact layer 109 sequentially stacked in such order on the substrate 200.

The substrate 200 is a conductive substrate and may be made of silicon, silicon carbide, or a metal. Examples of the metal include copper, tungsten, molybdenum, etc. In some embodiments, the substrate 200 has a thickness no smaller than 50 µm so as to have sufficient mechanical strength to support the semiconductor epitaxial structure. In addition, to facilitate further mechanical processing of the substrate 200 after bonding the substrate 200 to the semiconductor epitaxial structure, the substrate 200 may have a thickness that is no greater than 300 µm. In this embodiment, the substrate 200 is a copper substrate.

The second electrode 204 is disposed on the second ohmic contact layer 109. The second electrode 204 and the second ohmic contact layer 109 form an ohmic contact to allow an electric current to pass therethrough. During formation of the light-emitting device, the second ohmic contact layer 109 is etched to maintain a portion of the second ohmic contact layer 109 located right below the second electrode 204. The second current spreading layer 108 includes two portions in a horizontal direction perpendicular to the bottom-top direction: a first portion (P1) that is located right below the second ohmic contact layer 109 and the second electrode 204 (i.e., the portion covered by the second ohmic contact layer 109 and the second electrode 204), and a second portion (P2) that is not located right below the second electrode 204 (i.e., the portion not covered by the second ohmic contact layer 109 and the second electrode 204). The second portion (P2) has a light-exiting surface that is not covered by and exposed from the second ohmic contact layer 109 and the second electrode 204. The light-exiting surface may surround the second electrode 204 and be a patterned surface or a roughened surface obtained via etching. The roughened surface may have a regular or an arbitrarily irregular micro/nanostructure. The light-exiting surface that is patterned or roughened facilitates an exit of light, so as to increase the luminous efficiency of the light-emitting device. In some embodiments, the light-exiting surface is a roughened surface that has a roughened structure with a height difference (between the peak and the valley of the roughened structure) of less than 1 µm, e.g., from 10 nm to 300 nm.

Of the second current spreading layer 108, the first portion (P1) has a contact surface that is in contact with the second ohmic contact layer 109. The contact surface is not roughened because the contact surface is protected by the second electrode 204. The roughened surface of second portion (P2) of the second current spreading layer 108 is relatively lower than the contact surface of the first portion (P1) on a horizontal level.

Specifically, as shown in FIG. 4, in this embodiment, the first portion (P1) has a first thickness (t1), and the second portion (P2) has a second thickness (t2). In certain embodiments, the first thickness (t1) ranges from 1.5 µm to 2.5 µm, and the second thickness (t2) ranges from 0.5 µm to 1.5 µm. The first thickness (t1) of the first portion (P1) is greater than the second thickness (t2) of the second portion (P2). In some embodiments, the first thickness (t1) is greater than the second thickness (t2) by at least 0.3 µm.

The light-emitting device may further include a mirror layer 202 that is disposed between the semiconductor epitaxial structure and the substrate 200. The mirror layer 202 includes an ohmic contact metal layer 202a and a dielectric layer 202b. On one hand, the ohmic contact metal layer 202a and the dielectric layer 202b cooperate with the first ohmic contact layer 103 to form an ohmic contact. On the other hand, the ohmic contact metal layer 202a and the dielectric layer 202b reflect the light emitted by the active layer 106 toward the light-exiting surface of the second current spreading layer 108 or a side wall of the semiconductor epitaxial structure so as to facilitate the exit of light.

The light-emitting device further includes a first electrode 203. In some embodiments, the first electrode 203 is disposed on the substrate 200 at a side where the semiconductor epitaxial structure is disposed or at a side opposite to where the semiconductor epitaxial structure is disposed.

Each of the first electrode 203 and the second electrode 204 may be made of a transparent conductive material or a metal material. The transparent conductive material may be indium tin oxide (ITO) or indium zinc oxide (IZO). The metal material may be GeAuNi, AuGe, AuZn, Au, Al, Pt, and Ti, and combinations thereof. The first electrode 203 and the second electrode 204 are also electrically connected to the first semiconductor layer and the second semiconductor layer, respectively.

To improve the reliability of the light-emitting device, surfaces and side walls of the light-emitting device are covered with an insulation layer (not shown). The insulation layer may be a single-layered or multilayered structure, and composed of at least one material of SiO₂, SiNx, Al₂O₃, and Ti₃O₅.

In this embodiment, the bandgaps of the barrier layers gradually increase in the direction from the first surface of the semiconductor epitaxial structure to the second surface of the semiconductor epitaxial structure. That is to say, the percentage of the aluminum content of the barrier layers gradually increases in the direction from the first surface of the semiconductor epitaxial structure to the second surface of the semiconductor epitaxial structure, so as to reduce the light absorption of the barrier layers, optimize the angle at which the light exits from the quantum well structure, thereby improving the light-emitting efficiency of the light-emitting device. Referring to FIG. 11, the light-emitting device having a size of 2175 µm * 1355 µm was packaged and subjected to a test of current density (J) against luminous flux. When the current density was 4A/mm², the luminous flux of the light-emitting device of the disclosure (i.e., 1932 lm) was 17.5 % higher than that of a conventional light-emitting device (i.e., 1644 lm).

Referring to FIGS. 5 to 7, a method for manufacturing the light-emitting device of the first embodiment is provided below.

FIG. 1 illustrates the epitaxial structure. First, the growth substrate 100 is provided. By using an epitaxy process, such as metal-organic chemical vapor deposition (MOCVD), the semiconductor epitaxial structure is grown on the growth substrate 100. The semiconductor epitaxial structure includes the buffer layer 101, the etch stop layer 102 for removing the growth substrate 100, the first ohmic contact layer 103, the first current spreading layer 104, the first cladding layer 105, the active layer 106, the second cladding layer 107, the second current spreading layer 108, and the second ohmic contact layer 109 sequentially stacked in such order on the growth substrate 100.

Next, referring to FIG. 5, the second electrode 204 is formed on the second ohmic contact layer 110. The semiconductor epitaxial structure is bonded to a temporary substrate 206 using a bonding glue 205. In certain embodiments, the bonding glue is a BCB glue; the temporary substrate 206 is a glass substrate.

Then, the growth substrate 100, the buffer layer 101, and the etch stop layer 102 are removed using wet etching to reveal the first ohmic contact layer 103. The mirror layer 202 is formed on the first ohmic contact layer 103 opposite to the first current spreading layer 104. The mirror layer 202 includes the ohmic contact metal layer 202a and the dielectric layer 202b, both of which cooperate to form the ohmic contact with the first ohmic contact layer 103. On the other hand, the ohmic contact metal layer 202a and the dielectric layer 202b reflect the light emitted by the active layer 106. Next, the substrate 200 is provided, which is bonded with the mirror layer 202 through the bonding layer 201 to obtain a structure shown in FIG. 6.

Then, the temporary substrate 206 is removed by wet etching. A mask (not shown) is formed to cover the second electrode 204, and the second ohmic contact layer 109 that is not covered by and surrounds the second electrode 204 is left exposed. Etching is performed to remove the second ohmic contact layer 109 surrounding the second electrode 204 so that the second ohmic contact layer 109 not located right below the second electrode 204 is completely removed so as to reveal the second current spreading layer 108. The second current spreading layer 108 is etched to form a patterned or roughened surface so as to form a structure shown in FIG. 7. The removal of the second ohmic contact layer 109 and the roughening of the second current spreading layer 108 may be conducted by wet etching in one step or multiple steps. Solutions used for wet etching may be acidic, such as hydrochloric acid, sulfuric acid, hydrofluoric acid, citric acid, or other chemical reagents.

Finally, the first electrode 203 is formed on a surface of the substrate 200 opposite to the bonding layer 201, as shown in FIG. 4. Depending on requirements, processes such as etching or dicing are performed to obtain a plurality of unitized light-emitting devices.

FIG. 8 illustrates a light-emitting device according to a third embodiment of the disclosure, which has the epitaxial structure shown in FIG. 1, and includes the substrate 200 and the semiconductor epitaxial structure bonded to the substrate 200 by the bonding layer 201. The semiconductor epitaxial structure includes the second ohmic contact layer 109, the second current spreading layer 108, the second cladding layer 107, the active layer 106, the first cladding layer 105, the first current spreading layer 104, and the first ohmic contact layer 103 sequentially stacked on the substrate 200.

The first electrode 203 is disposed on the first ohmic contact layer 103. The first electrode 203 and the first ohmic contact layer 103 form an ohmic contact to allow an electric current to pass therethrough. During formation of the light-emitting device, the first ohmic contact layer 103 is etched to maintain a portion of the first ohmic contact layer 103 located right below the first electrode 203. The first current spreading layer 104 includes two portions in a horizontal direction perpendicular to the bottom-top direction: a third portion (P3) that is located right below the first ohmic contact layer 103 and the first electrode 203 (i.e., the portion covered by the first ohmic contact layer 103 and the first electrode 203), and a fourth portion (P4) that is not located right below the first electrode 203 (i.e., the portion not covered by the first ohmic contact layer 103 and the first electrode 203). The fourth portion (P4) has a light-exiting surface that is not covered by and exposed from the first ohmic contact layer 103 and the first electrode 203. The light-exiting surface may surround the first electrode 203 and be a patterned surface or a roughened surface obtained via etching. The roughened surface may have a regular or an arbitrarily irregular micro/nanostructure. The light-exiting surface that is patterned or roughened facilitates an exit of light, so as to increase the luminous efficiency of the light-emitting device. In some embodiments, the light-exiting surface is a roughened surface that has a roughened structure with a height difference (between the peak and the valley of the roughened structure) of less than 1 µm, e.g., from 10 nm to 300 nm.

Of the first current spreading layer 104, the third portion (P3) has a contact surface that is in contact with the first ohmic contact layer 103. The contact surface is not roughened because the contact surface is protected by the first electrode 203. The roughened surface of fourth portion (P4) of the first current spreading layer 104 is relatively lower than the contact surface of the third portion (P3) on a horizontal level.

Specifically, as shown in FIG. 8, in this embodiment, the third portion (P3) has a third thickness (t3), and the fourth portion (P4) has a fourth thickness (t4). In certain embodiments, the third thickness (t3) ranges from 1.5 µm to 2.5 µm, and the fourth thickness (t4) ranges from 0.5 µm to 1.5 µm. The third thickness (t3) of the third portion (P3) is greater than the fourth thickness (t4) of the fourth portion (P4). In some embodiments, the third thickness (t3) is greater than the fourth thickness (t4) by at least 0.3 µm.

The light-emitting device may further include the mirror layer 202 that is disposed between the semiconductor epitaxial structure and the substrate 200. The mirror layer 202 includes the ohmic contact metal layer 202a and the dielectric layer 202b. On one hand, the ohmic contact metal layer 202a and the dielectric layer 202b cooperate with the second ohmic contact layer 110 to form an ohmic contact. On the other hand, the ohmic contact metal layer 202a and the dielectric layer 202b reflect the light emitted by the active layer 106 toward the light-exiting surface of the first current spreading layer 104 or a side wall of the semiconductor epitaxial structure so as to facilitate the exit of light.

The light-emitting device further includes the second electrode 204 disposed on the substrate 200 at a side where the semiconductor epitaxial structure is disposed or at a side opposite to the semiconductor epitaxial structure.

Referring to FIGS. 9 to 10, a fourth embodiment of the disclosure including a method for manufacturing the light-emitting device of the third embodiment is provided below.

Next, the semiconductor epitaxial structure is transferred onto the substrate 200 and the growth substrate 100 is removed to obtain a structure as shown in FIG. 9. The steps include: forming the mirror layer 202 on the second ohmic contact layer 110, where the mirror layer 202 includes the ohmic contact metal layer 202a and the dielectric layer 202b; providing the substrate 200; disposing the bonding layer 201 on the substrate 200; bonding the substrate 200 with the mirror layer 202 through the bonding layer 201; and removing the growth substrate 100. In cases where the growth substrate 100 is made of gallium arsenide, the growth substrate may be removed by wet etching until the first ohmic contact layer 103 is revealed.

Next, referring to FIG. 10, the first electrode 203 is formed on the first ohmic contact layer 103 so a good ohmic contact is established between the first electrode 203 and the first ohmic contact layer 103, and the second electrode 204 is formed on the substrate 200 opposite to the semiconductor epitaxial structure. A conductive current may then pass through the first electrode 203, the second electrode 204, and the semiconductor epitaxial structure. In addition, the substrate 200 has a pre-determined thickness that is capable of supporting the semiconductor epitaxial structure.

Then, a mask (not shown) is formed to cover the first electrode 203, and a portion of the first ohmic contact layer 103 that is not covered by and surrounds the first electrode 203 is left exposed. Next, etching is performed to remove the portion of the first ohmic contact layer 103 that is left exposed, so that the first ohmic contact layer 103 not located right below the first electrode 203 is completely removed so as to reveal the first current spreading layer 104. Afterwards, the first current spreading layer 104 is etched to form a patterned or roughened surface as shown in FIG. 8. It should be noted that the removal of the first ohmic contact layer 103 and the roughening of the first current spreading layer 104 may be conducted by wet etching in one step or multiple steps. Solutions used for wet etching may be acidic, such as hydrochloric acid, sulfuric acid, hydrofluoric acid, citric acid, or other chemical reagents.

Finally, depending on requirements, processes such as etching or dicing are performed to obtain a plurality of unitized light-emitting devices.

FIG. 12 illustrates a light-emitting device according to a fifth embodiment of the disclosure, which is a micro light-emitting device having the epitaxial structure shown in FIG. 1. The micro light-emitting device includes the semiconductor epitaxial structure that includes the first semiconductor layer, the active layer 106, and the second semiconductor layer sequentially stacked on one another in such order, a first mesa (S1) formed by the first semiconductor layer, a second mesa (S2) formed by the second semiconductor layer, the first electrode 203 formed on the first mesa (S1) and electrically connected to the first semiconductor layer, and the second electrode 204 formed on the second mesa (S2) and electrically connected to the second semiconductor layer.

In this embodiment, the first semiconductor layer includes a p-type current spreading layer 104 and a p-type cladding layer 105, wherein the p-type current spreading layer 104 performs a function of current spreading, and the effectiveness of the current spreading function is related to a thickness of the p-type current spreading layer 104. In this embodiment, the p-type current spreading layer 104 has a composition that is represented by Al_x1Ga_1-x1InP, has a thickness ranging from 2500 nm to 5000 nm, and has a doping concentration ranging from 2E18/cm³ to 5E18/cm³. The value of x₁ ranges from 0.3 to 0.7 so as to ensure light transmission of the p-type current spreading layer 104. The p-type current spreading layer 104 is electrically connected to and forms an ohmic contact with the first electrode 203. A surface of the p-type current spreading layer 104 away from the active layer 106 is a light-exiting surface. The p-type cladding layer 105 provides the holes for the active layer 106, is made of AlInP, has a thickness ranging from 200 nm to 1200 nm, and is doped with magnesium but is not limited to.

The second semiconductor layer includes an n-type cladding layer 107, an n-type current spreading layer 108, and an n-type ohmic contact layer 109. The n-type cladding layer 107 has a multiple quantum well structure and provides the electrons for the active layer 106, is made of AllnP, has a thickness ranging from 200 nm to 1200 nm, and is doped with silicon but is not limited to. The n-type current spreading layer 108 performs a function of current spreading, and the effectiveness of the current spreading function is related to a thickness of the n-type current spreading layer 108. In this embodiment, the thickness of the n-type current spreading layer 108 may vary based on the size of the light-emitting device, and the thickness of the n-type current spreading layer 108 is no smaller than 200 nm and no greater than 1500 nm. In this embodiment, the n-type current spreading layer 108 has a thickness ranging from 300 nm to 1000 nm, is made of GaP, has a doping concentration ranging from 9E17/cm³ to 4E18/cm³, and is doped with silicon but is not limited to.

The n-type ohmic contact layer 109 covers the n-type current spreading layer 108, may be made of GaP, may have a thickness ranging from 30 nm to 100 nm, and may have a doping concentration ranging from 5E18/cm³ to 5E19/cm³. In some embodiments, the n-type ohmic contact layer 109 has a doping concentration of 9E18/cm³, and is electrically connected to and forms a good ohmic contact with the second electrode 204. By using a GaP material instead of an n-type GaAs or an n-type AlGaInP material, the n-type ohmic contact layer 109 may reduce light absorption and improve luminous efficiency.

The active layer 106 has the multiple quantum well structure, which is made by repeatedly stacking the well layer that has a composition represented by Al_xGa_1-xInP and the barrier layer that has a composition represented by Al_yGa_1-yInP, wherein 0≤x≤y≤1. In this embodiment, the quantum well structure has n periodic units, and n ranges from 2 to 20. In certain embodiments, n ranges from 2 to 15. The percentages of the aluminum contents of the barrier layers gradually increase in the direction from the first semiconductor layer to the second semiconductor layer. The well layer has a thickness ranging from 3 nm to 7 nm, and the barrier layer has a thickness ranging from 4 nm to 8 nm.

The first electrode 203 and a metal in contact with the first semiconductor layer may be made of gold, platinum or silver, etc., or a transparent conductive oxide, specifically such as ITO or ZnO. In some embodiments, the first electrode 203 may be made of a multi-layered material, such as at least one of gold germanium nickel, gold beryllium, gold germanium, gold zinc, an alloy material, and combinations thereof. In certain embodiment, the first electrode 203 may also include a reflective metal, such as gold or silver, to reflect partial light toward the semiconductor epitaxial structure from the active layer 106 via the current spreading layer 104 of the first semiconductor layer, and to facilitate the exit of light from the light-exiting surface of the first current spreading layer 104.

To form the good ohmic contact between the second electrode 204 and the n-type ohmic contact layer 109 of the second semiconductor layer, in some embodiments, the second electrode 204 may be made of a conductive metal such as gold, platinum or silver. In certain embodiments, the second electrode 204 may be made of a multi-layered material, such as at least one of gold germanium nickel, gold beryllium, gold germanium, gold zinc, an alloy material, and combinations thereof. In some embodiments, to improve the ohmic contact between the second electrode 204 and the n-type ohmic contact layer 109, at least one metal capable of diffusing into the n-type ohmic contact layer 109 may be included in the second electrode 204 so as to reduce an ohmic contact resistance. To facilitate the diffusion of the metal into the n-type ohmic contact layer 109, fusion of the metal may be conducted under at least a temperature of 300° C. The metal may directly contact the n-type ohmic contact layer 109, such as gold, platinum or silver.

To improve the reliability of the micro light-emitting device, the first mesa (S1), the second mesa (S2), and the side wall of the semiconductor epitaxial structure are covered by an insulation layer 207 (not shown in FIG. 12 but shown in FIG. 13). The insulation layer 207 may be a single or multilayered structure, and composed of at least one material of SiO₂, SiNx, Al₂O₃, and Ti₃O₅. In some embodiments, the insulation layer 207 is a Bragg reflective layer structure, such that the insulation layer 207 is formed by alternatively stacking Ti₃O₅ and SiO₂. In this embodiment, the insulation layer 207 is made of SiNx or SiO₂ and has a thickness no smaller than 1 µm.

In this embodiment, the first electrode 203 and the second electrode 204 are located on a surface opposite the light-exiting surface of the first current spreading layer 104. The first electrode 203 and the second electrode 204 may be electrically connected to external components through the surface opposite to the light-existing surface of the first current spreading layer 104 so as to form a flip-chip structure. The first electrode 203 includes a first ohmic contact portion 203a and a first pad electrode 203b. The second electrode 204 includes the second ohmic contact portion 204a and a second pad electrode 204b. The first pad electrode 203b and the second pad electrode 204b may have at least one layer made of gold, aluminum, silver, etc. so as to achieve die bonding of the electrode 203 and second electrode 204. The first electrode 203 and the second electrode 204 may be equal or unequal in height. The first pad electrode 203b and the second pad electrode 204b do not overlap each other in the thickness direction.

The bandgaps of the barrier layers gradually increase in the direction from the first surface of the semiconductor epitaxial structure to the second surface of the semiconductor epitaxial structure. That is to say, the percentages of the aluminum contents of the barrier layers gradually increase in the direction from the first surface of the semiconductor epitaxial structure to the second surface of the semiconductor epitaxial structure, which may reduce light absorption of the barrier layer, optimize the angle from which the light emits from the quantum well structure, thereby improving the light-emitting efficiency and luminous intensity of the light-emitting device. Referring to FIG. 14, a chiplet of the micro light-emitting device having a size of 17 µm * 31 µm was packaged and subjected to a test of current density (J) against wall plug efficiency (WPE). When the current density was 0.1A/mm², the WPE of the micro light-emitting device of the disclosure (i.e., 5.63 %) was 12 % higher than that of the conventional light-emitting device (i.e., 5.02 %).

FIG. 13 illustrates a base frame 250 that supports the micro light-emitting device shown in FIG. 12 before the micro light-emitting device is unitized, and two bridging arms 240 (not shown) that are used to connect the micro light-emitting device and the base frame 250. The base frame 250 includes the substrate 200 and the bonding layer 201 that has a receiving space to receive the micro light-emitting device. In this embodiment, the bonding layer 201 is made of a BCB adhesive, silicone, a UV adhesive or resin. The bridging arms 240 may be made of a dielectric, metal or semiconductor material. In some embodiments, a horizontal portion 2071 (not shown) of the insulation layer 207 is formed into the bridging arms 240 that straddle the bonding layer 201 so as to be connected to the micro light-emitting device and the base frame 250.

To unitize the micro light-emitting device, the micro light-emitting device is separated from the base frame 250 by transfer printing. Materials of transfer printing includes PDMS, silicone, a pyrolytic adhesive, or a UV adhesive. In some cases, a sacrificial layer 208 may be disposed between the micro light-emitting device and the base frame 250 because the sacrificial layer 208 has a higher removal efficiency than the micro light-emitting device. Technical measures for removal include chemical separation or physical separation, such as UV decomposition, etching, or impacting.

Referring to FIG. 15, a light-emitting equipment 300 is provided and includes a plurality of the light-emitting devices as described in any one of the previous embodiments. The light-emitting devices are arranged in arrays. In FIG. 15, only a portion of an array of the light-emitting devices is shown.

In this embodiment, the light-emitting equipment 300 may be used in a dashboard in a military aircraft, a stage light, a projector, or a display.

The light-emitting equipment 300 adopts the epitaxial structure of the light-emitting device according to the disclosure. The bandgaps of the barrier layers of the quantum well structure increase in the direction from the first semiconductor layer to the second semiconductor layer, which may reduce light absorption of the quantum well structure, optimize the angle at which the light emits from the quantum well structure, thereby improving the light-emitting efficiency and luminous intensity of the light-emitting equipment 300.

In the description above, for the purposes of explanation, numerous specific details have been set forth in order to provide a thorough understanding of the embodiment(s). It will be apparent, however, to one skilled in the art, that one or more other embodiments may be practiced without some of these specific details. It should also be appreciated that reference throughout this specification to “one embodiment,” “an embodiment,” an embodiment with an indication of an ordinal number and so forth means that a particular feature, structure, or characteristic may be included in the practice of the disclosure. It should be further appreciated that in the description, various features are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure and aiding in the understanding of various inventive aspects; such does not mean that every one of these features needs to be practiced with the presence of all the other features. In other words, in any described embodiment, when implementation of one or more features or specific details does not affect implementation of another one or more features or specific details, said one or more features may be singled out and practiced alone without said another one or more features or specific details. It should be further noted that one or more features or specific details from one embodiment may be practiced together with one or more features or specific details from another embodiment, where appropriate, in the practice of the disclosure.

While the disclosure has been described in connection with what is(are) considered the exemplary embodiment(s), it is understood that this disclosure is not limited to the disclosed embodiment(s) but is intended to cover various arrangements included within the spirit and scope of the broadest interpretation so as to encompass all such modifications and equivalent arrangements.

LIGHT-EMITTING DEVICE

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