Light emitting device

Information

  • Patent Application
  • 20070164675
  • Publication Number
    20070164675
  • Date Filed
    January 12, 2007
    17 years ago
  • Date Published
    July 19, 2007
    17 years ago
Abstract
It is an object of the present invention to prevent an insulating film from peeling in a section where the insulating film is adjacent to a sealing region. Over a first substrate 104, a pixel portion 100 provided with a light emitting element, a source driver 101, a gate driver 102, and a sealing region 103 are provided. A light emitting element is sealed between the first substrate 104 and a second substrate 110 by a sealant 108. An insulating film 107 serves as a partition wall of the light emitting element. An end portion of the insulating film 107 which is adjacent to the sealing region 103 does not overlap with a step formed by a side surface and an upper surface of a conductive film 106 which serves as a wiring.
Description

BRIEF DESCRIPTION OF THE DRAWINGS


FIGS. 1A and 1B are explanatory diagrams of Embodiment Mode 1.



FIGS. 2A and 2B are explanatory diagrams of Embodiment Mode 1.



FIGS. 3A and 3B are explanatory diagrams of Embodiment Mode 2.



FIGS. 4A and 4B are explanatory diagrams of Embodiment Mode 2.



FIGS. 5A and 5B are explanatory diagrams of Embodiment Mode 3.



FIGS. 6A and 6B show cross-sections of a light emitting device (an EL display device) of Embodiment 1.



FIG. 7 shows a pixel circuit of Embodiment 2.



FIGS. 8A and 8B show a pixel circuit of Embodiment 2.



FIGS. 9A to 9F show examples of applications of the present invention to electronic devices of Embodiment 3.



FIGS. 10A and 10B illustrate examples of conventional art.


Claims
  • 1. A light emitting device comprising: a first substrate including a pixel portion and a sealing region;a sealant formed in the sealing region which surrounds the pixel portion;a second substrate fixed to the first substrate by the sealant;a first insulating film formed over the first substrate;a conductive film formed over the first insulating film; anda second insulating film formed over the conductive film and the first insulating film,wherein an end portion and a side surface of the second insulating film are in contact with the sealant,wherein a top edge of the second insulating film is covered with the sealant,wherein the end portion of the second insulating film does not overlap with a step formed by the side surface and an upper surface of the conductive film, andwherein the pixel portion comprises a light emitting element.
  • 2. The light emitting device according to claim 1, wherein the second insulating film includes organic resin.
  • 3. The light emitting device according to claim 2, wherein the organic resin comprises one selected from the group consisting of acrylic, polyimide-polyamide, and polyimideamide.
  • 4. The light emitting device according to claim 1, wherein the conductive film comprises one selected from the group consisting of aluminum, titanium, molybdenum, and tungsten.
  • 5. The light emitting device according to claim 1, wherein the first insulating film comprises one selected from the group consisting of a silicon oxide, a silicon nitride, and a silicon oxynitride.
  • 6. A light emitting device comprising: a first substrate including a pixel portion and a sealing region;a sealant formed in the sealing region which surrounds the pixel portion;a second substrate fixed to the first substrate by the sealant;a first insulating film formed over the first substrate;a conductive film formed over the first insulating film;a second insulating film formed over the conductive film and the first insulating film; anda third insulating film formed over the conductive film and the first insulating film with the second insulating film interposed therebetween,wherein the pixel portion comprises a light emitting element,wherein the sealant is in contact with the second insulating film and a side surface of the third insulating film.
  • 7. The light emitting device according to claim 6, wherein the second insulating film comprises one selected from the group consisting of a silicon oxide, a silicon nitride, and a silicon oxynitride.
  • 8. The light emitting device according to claim 6, wherein the third insulating film includes organic resin.
  • 9. The light emitting device according to claim 8, wherein the organic resin comprises one selected from the group consisting of acrylic, polyimide-polyamide, and polyimideamide.
  • 10. The light emitting device according to claim 6, wherein wherein the conductive film comprises one selected from the group consisting of aluminum, titanium, molybdenum, and tungsten.
  • 11. The light emitting device according to claim 6, wherein the first insulating film comprises one selected from the group consisting of a silicon oxide, a silicon nitride, and a silicon oxynitride.
  • 12. A light emitting device comprising: a first substrate including a pixel portion and a sealing region;a sealant formed in the sealing region which surrounds the pixel portion;a second substrate fixed to the first substrate by the sealant;a first insulating film formed over the first substrate;a conductive film formed over the first insulating film; anda second insulating film formed over the conductive film and the first insulating film,wherein the pixel portion comprises a light emitting element,wherein the second insulating film is formed of inorganic material,wherein an end portion of the second insulating film is in contact with the sealant,wherein a top edge of the second insulating film is covered with the sealant, andwherein the end portion of the second insulating film does not overlap with a step formed by the side surface and an upper surface of the conductive film.
  • 13. The light emitting device according to claim 12, wherein the second insulating film comprises one selected from the group consisting of a silicon oxide, a silicon nitride, and a silicon oxynitride.
  • 14. The light emitting device according to claim 12, wherein the conductive film comprises one selected from the group consisting of aluminum, titanium, molybdenum, and tungsten.
  • 15. The light emitting device according to claim 12, wherein the first insulating film comprises one selected from the group consisting of a silicon oxide, a silicon nitride, and a silicon oxynitride.
Priority Claims (1)
Number Date Country Kind
2006-010197 Jan 2006 JP national