This application claims priority to Taiwan Application Serial Number 102140370, filed Nov. 6, 2013, which is herein incorporated by reference.
1. Field of Invention
The present invention relates to a light emitting diode substrate and a light emitting diode lamp.
2. Description of Related Art
Light emitting diode (LED) light bulb has gradually replaced the conventional incandescent light bulb and been broadly used for its economic power consumption feature. Nevertheless, light emitting elements of a conventional LED light bulb are basically arranged toward a front position such that all the light beams tend to be projected towards a single concentrated direction from the front position. Although the conventional LED light bulb may therefore have good concentrated illumination ability at the front, the luminance on the circumference of the LED light bulb has poor uniformity, which adversely affects the overall illumination performance.
The issue of poor uniformity on the circumference of the LED light bulb may be solved by bending the LED substrate which is used to carry the light-emitting elements. By arranging light-emitting elements on the bending substrate, the LED light bulb may uniformly emit light. However, it is difficult to bend the LED substrate into multiple different faces within limited space and thus, it is hard to manufacture an LED light bulb having multiple light emitting directions.
To improving heat dissipation efficiency, the LED substrate may be made of aluminum, an insulating glue and clutch gold which may be pasted on the surface of the aluminum substrate as a line layer. The insulating glue typically has poor ductility. During the bending of the aluminum substrate, the insulating glue may also peel off of the aluminum substrate, which may result in the damage of the line layer on the surface of the aluminum substrate.
Accordingly, one aspect of the present invention is to provide a light emitting diode (LED) substrate and a LED lamp, so as to solve the problems of the related art.
According to an embodiment of the invention, a LED substrate is provided. The LED substrate includes a substrate body, a positive circuit and a negative circuit. The substrate body includes a light source disposing face, a bottom face and a lateral face. The lateral face is connected between the bottom face and the light source disposing face. The light source disposing face includes a main disposing surface, at least one sub-disposing surface, and a plurality pairs of positive and negative electrode pads. The main disposing surface is parallel to the bottom face. The sub-disposing surface surrounds the main disposing surface and is at an inclined angle to the main disposing surface. The positive, negative electrode pads are formed on the main disposing surface and the sub-disposing surface respectively. The positive circuit and the negative circuit are buried inside the substrate body and are electrically connected with each pair of the positive and the negative electrode pads respectively.
According to an embodiment of the invention, the inclined angle is greater than 0 degree and smaller than 90 degrees.
According to an embodiment of the invention, the positive circuit and the negative circuit include a positive and a negative circuit channels and a metal material used to fill the positive and the negative circuit channels.
According to an embodiment of the invention, an aperture of the positive and the negative circuit channels is greater than 10 μm and less than 1 mm.
According to an embodiment of the invention, the filling of the metal material is performed by an evaporation or an electroplating process.
According to an embodiment of the invention, the light source disposing face, shaped by the main disposing surface and the at least one sub-disposing surface, bulges outward on its middle portion.
According to an embodiment of the invention, the light source disposing face, shaped by the main disposing surface and the at least one sub-disposing surface, hollows inward on its middle portion.
According to an embodiment of the invention, a material of the LED substrate is selected from the group consisting of aluminum oxide, aluminum nitride, boron nitride, and a combination thereof.
According to another embodiment of the invention, a LED lamp including the LED substrate mentioned above and a plurality of light emitting diodes (LEDs) is provided. The LEDs are disposed on the light source disposing face, and each of the LEDs electrically connected with one of pairs of the positive and negative electrode pads disposed on the main disposing surface or the sub-disposing surface.
According to another embodiment of the invention, the lamp base has a first end and a second end opposite to each other and the first end is configured to support the substrate body.
According to another embodiment of the invention, the lamp base further includes a power driving member electrical connected with the positive circuit and the negative circuit.
According to another embodiment of the invention, the LED lamp further includes a lamp cover covering the plurality of the LEDs.
It is to be understood that both the foregoing general description and the following detailed description are by examples, and are intended to provide further explanation of the invention as claimed.
The invention can be more fully understood by reading the following detailed description of the embodiment, with reference made to the accompanying drawings as follows:
The following embodiments are disclosed with accompanying diagrams for detailed description. For illustration clarity, many details of practice are explained in the following descriptions. However, it should be understood that these details of practice do not intend to limit the present invention. That is, these details of practice are not necessary in parts of embodiments of the present invention. Furthermore, for simplifying the drawings, some of the conventional structures and elements are shown with schematic illustrations. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
In following embodiments, a light emitting diode (LED) substrate having multiple light emitting faces is provided. The LED substrate in the following embodiments can be shaped into multiple different inclined faces by using a method of grinding. The LED light sources can be set on those grinding faces to emit the light beams on various angles. Furthermore, in the following embodiments, a metallic circuit lines can be configured inside the LED substrate before the grinding operation, so as to solve the problem of damaging the line layer while bending the aluminum substrate in related art.
Please refer to
The substrate body 100 further includes a bottom face 105 and a lateral face 106, in which the lateral face 106 is connected between the bottom face 102 and the light source disposing face 102. In present embodiment, the light source disposing face 102 includes a main disposing surface 107 and a plurality of sub-disposing surfaces 108. In case of
The main disposing surface 107 is parallel to the bottom face 105. In present embodiment, the sub-disposing surfaces 108 surround the main disposing surface 107. Further, the light source disposing face 102 may be shaped by the main disposing surface 107 and the sub-disposing surfaces 108, and the light source disposing face 102 may bulge outward on its middle portion. As illustrated in
In present embodiment, the inclined angle θ is greater than 0 degree and less than 90 degrees. The positive circuit 120 and the negative circuit 130 are formed inside the substrate body 100 in advance, and then using grinding means to manufacture the sub-disposing surfaces 108 having the inclined angle θ with the main disposing surface 107.
For further comprehension of the invention, a manufacturing method of the LED substrate in the embodiment of
Next, as illustrated in
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It is worthy to mention that in the present embodiment, the aperture of the positive and the negative circuit channels is 100 μm, but is not limited thereto. In other embodiments of the present invention, the aperture of the positive and the negative circuit channels is greater than 10 μm and less than 1 mm. In practical use, if the aperture of positive and the negative circuit channels is less than 10 μm, the curved part of the channels may be difficult to use an evaporation process, or be electroplate with a metal material. If the aperture of positive and the negative circuit channels is greater than 1 mm, the cost of manufacturing substrate body 100 may be too high. However, the above manufacture or cost issue is not limited the scope of the present invention. A person ordinarily skilled in the art may produce the positive and the negative circuit channels having aperture larger than 1 mm or less than 10 μm without considering the cost or omitting the evaporation or electroplating difficulties.
Next, after finishing the evaporation or electroplating process of the metal material, a grinding process can be performed on the surface of the light source disposing face 102 and a positive and negative electrode pads 103, 104 (illustrated in
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Furthermore, the positive circuit 120 and the negative circuit 130 are buried inside the substrate body 100, and the main disposing surface 107 and each sub-disposing surface 108 has a pair of positive and a negative electrode pads 103, 104, in which the positive circuit 120 and the negative circuit 130 are electrically connected with each pair of positive and negative electrode pads 103, 104 respectively, so that the LED substrate 20 of the present embodiment can emit the light beams with multiple faces and its metal lines are buried inside the substrate body 100.
It should be explained that, the manufacturing method of the LED substrate 20 of the present embodiment is similar to the first embodiment, which is to form the positive and the negative circuit channels inside the substrate body 100 and the positive circuit 120 and the negative circuit 130 is formed by filling the metal material into the positive and the negative circuit channels by an evaporation or an electroplating process; and finally the sub-disposing surfaces 108 are formed by performing the grinding process, so as to produce the LED substrate 20 of the present embodiment.
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As illustrated in
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It should be understood that, the LED substrate 10 of the first embodiment is taken as an example in the present embodiment but in other embodiments of the present invention, the LED substrate 20 of the second embodiment may be applied to the LED lamp 30 as well, so as to emitting the light beams from various angles.
As discussed above, the LED substrate of above embodiments includes the main disposing surface and the sub-disposing surface that is inclined to the main disposing surface; therefore, the LED substrate can have various light emitting angles. Furthermore, the metal lines of the LED substrate of above embodiments can be buried inside the substrate body. Hence, there is no necessary to arrange additional line layer on the surface of the substrate body or to bend the substrate body to manufacture various light emitting angles. Accordingly, an issue of damaging the line layer in related art caused by bending the substrate body can be solved.
It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims.
Number | Date | Country | Kind |
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102140370 | Nov 2013 | TW | national |