Patent Grant
10957736
The subject matter disclosed herein relates generally to light emitter components and methods. More particularly, the subject matter disclosed herein relates to light emitting diode (LED) components and related methods.
Light emitting diodes (LEDs) or LED chips are solid state devices that convert electrical energy into light. LED chips can be utilized in light emitter components or packages for providing different colors and patterns of light. Light emitter components can be mounted directly onto a surface of an underlying circuit component or heat sink for use in various lighting applications.
One problem with existing LED components is an inadequate viewing angle. Existing LED components, for example, existing surface mount design (SMD) components, have a full width at half maximum (FWHM) beam angle (e.g., an effective viewing angle) that is about 115°. This is not suitable for use in lighting bulbs applications and other high-power LED applications, such as, for example, projection or architectural lighting, which utilize wider FWHM beam angles for a more uniform light extraction. Manufacturers of LED lighting products are constantly seeking ways to provide components suitable for use in a plurality of different lighting applications, to encourage the adoption of LED products. One solution known in the art comprises using a translucent or transparent dam or other retention material to surround a transparent encapsulant while the encapsulant cures. However, while the dams may be formed from a transparent material, it is nevertheless possible for light to adversely interact with such transparent dams. For example, given the need for the dams in such known LED components to have a higher viscosity than the encapsulant, it is often the case that the dam material has a different refractive index from the encapsulant; as a result of the differences in the relative refractive indexes, the angle of the light exiting will change as the light passes from the encapsulant into the dam. Another disadvantage of such known LED components is that the dam and encapsulant may have poor adhesion with one another, whether inherently due to the types of materials used or from a manufacturing quality issue. In short, the dam adds complexity to the manufacturing process and can lead to reduced light extraction performance, quality issues, increased cost, and the like. LED Components incorporating fewer raw materials at sustained or increased brightness levels with uniform lighting are becoming more desirable.
Accordingly, and despite the availability of various LED components in the marketplace, a need remains for improved components and methods which can be produced quickly, efficiently, at a lower cost, and with larger viewing angles for more uniform lighting in light bulb and/or bulb applications. Such components can be single or multi-chip components, and their reduced cost and improved efficiency make it easier for end-users to justify switching to LED products from a return on investment or payback perspective.
In accordance with this disclosure, novel light emitting diode (LED) components, systems, and methods are provided.
A light emitting diode (LED) component can comprise: a submount; first and second electrically conductive traces located on opposite sides of a first surface of the submount from each other and disposed only at least proximate to or at outer edges or the outer perimeter of the submount, wherein the plurality of electrically conductive traces extend at least a majority of a distance around all of the outer edges of the submount; a plurality of LED chips disposed on the first surface of the submount and spaced apart from the first and second electrically conductive traces, the plurality of LED chips comprising one or more red LED chips of a first size, one or more green LED chips of a second size, and one or more blue LED chips of a third size, at least one of the first size, the second size, and the third size being a different size; a plurality of wirebonds connecting the plurality of LED chips between the plurality of electrically conductive traces; and a molded encapsulant disposed on the first surface of the submount around the plurality of LED chips. Such a component can have a full width at half maximum (FWHM) beam angle that is, for example, greater than 125°. In such LED components, the one or more red LED chips collectively comprise a first total light-emitting area, the one or more green LED chips collectively comprise a second total light-emitting area, and the one or more blue LED chips collectively comprise a third total light-emitting area, each of the first, second, and third total light-emitting areas being substantially similar total light-emitting areas. In such LED components, the molded encapsulant has an at least substantially or entirely flat top surface, the molded encapsulant comprises lateral exterior walls that extend at least substantially or entirely to the outer edges of the submount to each be at least substantially or entirely co-planar with a lateral exterior wall of the submount. The LED component is devoid of a retention structure or wall laterally surrounding the molded encapsulant.
A light emitting system can comprise: a first LED component, a second LED component, and a third LED component, each of the first LED component, the second LED component, and the third LED component comprising: a submount; at least first and second electrically conductive traces located on opposite sides of a first surface of the submount from each other and disposed only at least proximate to or at outer edges or the outer perimeter of the submount; one or more LED chip disposed on a first surface of the submount; and a molded encapsulant disposed on the first surface of the submount around the one or more LED chip. Such a light emitting system can have a full width at half maximum (FWHM) beam angle that is greater than 125°. In such embodiments of the first, second, and third LED components, the molded encapsulant can have an at least substantially or entirely flat top surface, the molded encapsulant can comprise lateral exterior walls that can each extend at least substantially or entirely to the outer edges of the submount to be at least substantially or entirely co-planar with a lateral exterior wall of the submount. The LED component is devoid of a retention structure or wall laterally surrounding the molded encapsulant. Such a system can further comprise a controller. In such systems, the first LED component is configured to output a red light, the second LED component is configured to output a green light, and the third LED component is configured to output a blue light, so that the system is configured to output a mixed color light by controlling an activation of the first, second, and third LED components. Such a system can also further comprise a white LED or could have all LEDs and white LEDs.
A method of providing an LED component can comprise: providing a substantially flat submount; disposing first and second electrically conductive traces on opposite sides of a first surface of the submount from each other and disposed at least proximate to, or at outer edges of, the submount, wherein the first and second electrically conductive traces occupy a majority of the opposite sides on which the first and second electrically conductive traces are respectively located; attaching a plurality of LED chips over the first surface of the submount, the plurality of LED chips being spaced apart from the first and second electrically conductive traces and comprising one or more red LED chips of a first size, one or more green LED chips of a second size, and one or more blue LED chips of a third size, at least one of the first size, the second size, and the third size being a different size; electrically connecting, via wirebonding, each of the plurality of LED chips between the first and second electrically conductive traces; and then providing, such as for example by molding, at least an outer top surface of an encapsulant over the first surface of the submount and over the plurality of LED chips so that the outer top surface of the encapsulant is substantially flat, wherein the encapsulant comprises at least one lateral exterior wall that extends entirely to one of the outer edges of the submount. The LED component can have a full width at half maximum (FWHM) beam angle that is, for example, greater than 125°. In such an LED component provided according to the method herein, the one or more red LED chips collectively comprise a first total light-emitting area, the one or more green LED chips collectively comprise a second total light-emitting area, and the one or more blue LED chips collectively comprise a third total light-emitting area, each of the first, second, and third total light-emitting areas being substantially similar total light-emitting areas. In such an LED component provided according to a method herein, the molded encapsulant has an at least substantially or entirely flat top surface, the molded encapsulant comprises lateral exterior walls that each extend at least substantially or entirely to an outer edge of the submount to be at least substantially or entirely co-planar with a lateral exterior wall of the submount, and the LED component is devoid of a retention structure or wall laterally surrounding the molded encapsulant.
These and other objects of the present disclosure as can become apparent from the disclosure herein are achieved, at least in whole or in part, by the subject matter disclosed herein.
A full and enabling disclosure of the present subject matter including the best mode thereof to one of ordinary skill in the art is set forth more particularly in the remainder of the specification, including reference to the accompanying figures, in which:
The subject matter disclosed herein is directed to light emitting diode (LED) components and methods.
LED components described herein can be submount based, and singulated from a larger panel of material, for example, a ceramic panel or substrate. This enables a plurality of different and/or customized components to be quickly and efficiently formed over the substrate and obviates the need for extensive processing (e.g., injection molding) and/or tooling. In some embodiments, LED components and methods described herein exhibit improved manufacturability and improved light extraction suitable for use in a wide variety of lighting applications, including and not limited to light bulbs.
In some embodiments, components herein comprise electrical contacts or traces that can comprise a minimized surface area over portions of the submount to reduce interference with light as described in commonly owned, assigned, and co-pending U.S. patent application Ser. No. 14/292,331, the content of which is incorporated by reference herein, in the entirety. The metallic can be spaced apart from one or more LED chip and disposed proximate the outermost edges of each individual submount for reducing interference with, absorption of, and/or potential blockage of light. Each trace can be disposed over a panel and below a wall, “dam”, or other structure.
Reference will be made in detail to possible aspects or embodiments of the subject matter herein, one or more examples of which are shown in the figures. Each example is provided to explain the subject matter and not as a limitation. In fact, features illustrated or described as part of one embodiment can be used in another embodiment to yield still a further embodiment. It is intended that the subject matter disclosed and envisioned herein covers such modifications and variations.
As illustrated in the various figures, some sizes of structures or portions are exaggerated relative to other structures or portions for illustrative purposes and, thus, are provided to illustrate the general structures of the present subject matter. Furthermore, various aspects of the present subject matter are described with reference to a structure or a portion being formed on other structures, portions, or both. As will be appreciated by those of skill in the art, references to a structure being formed “on” or “above” another structure or portion contemplates that additional structure, portion, or both may intervene.
References to a structure or a portion being formed “on” another structure or portion without an intervening structure or portion are described herein as being formed “directly on” the structure or portion. Similarly, it will be understood that when an element is referred to as being “connected”, “attached”, or “coupled” to another element, it can be directly connected, attached, or coupled to the other element, or intervening elements may be present. In contrast, when an element is referred to as being “directly connected”, “directly attached”, or “directly coupled” to another element, no intervening elements are present.
Furthermore, relative terms such as “on”, “above”, “upper”, “top”, “lower”, or “bottom” are used herein to describe one structure's or portion's relationship to another structure or portion as illustrated in the figures. It will be understood that relative terms such as “on”, “above”, “upper”, “top”, “lower” or “bottom” are intended to encompass different orientations of the component in addition to the orientation depicted in the figures. For example, if the component in the figures is turned over, structure or portion described as “above” other structures or portions would now be oriented “below” the other structures or portions. Likewise, if components in the figures are rotated along an axis, structure or portion described as “above”, other structures or portions would be oriented “next to” or “left of” the other structures or portions. Like numbers refer to like elements throughout.
Unless the absence of one or more elements is specifically recited, the terms “comprising”, including”, and “having” as used herein should be interpreted as open-ended terms that do not preclude the presence of one or more elements.
As used herein, the terms “through-hole”, “thru-hole”, and/or “via” are synonymous and refer an opening in the submount, often filled and/or lined (e.g., along one or more side walls) with an electrically conductive material that allows for an electrically conductive conduit or pathway between different layers, surfaces, or features of the component.
As used herein a “ceramic based material” or the term “ceramic based” includes a material that consists primarily of a ceramic material, such as an inorganic, non-metallic material made from compounds of a metal or metalloid and a non-metal (e.g., aluminum nitride, aluminum oxide, beryllium oxide, silicon carbide). A “non-ceramic based material” consists primarily a metallic material, a primarily organic (e.g., polymeric) material, and/or a primarily synthetic or semi-synthetic organic solid that can be dispensed or molded (e.g., plastic).
As used herein, the term “viewing angle” represents the luminous intensity of the LED component in space, which is characterized by an optical far field pattern (FFP). The viewing angle characterized by a FFP comprises a normalized luminous intensity ratio at different radiation angles. As used herein, the viewing angle is the angular extent to which the intensity of light emitted from the LED component is at least about 50% (e.g., full width at half maximum (FWHM)) of the intensity peak in a FFP.
Light emitter components according to embodiments described herein can comprise group III-V nitride (e.g., gallium nitride (GaN)) based LED chips or lasers. Fabrication of LED chips and lasers is generally known and only briefly described herein. LED chips or lasers can be fabricated on a growth substrate, for example, a silicon carbide (SiC) substrate, such as those devices manufactured and sold by Cree, Inc. of Durham, N.C. Other growth substrates are also contemplated herein, for example and not limited to sapphire, silicon (Si), and GaN.
Although various embodiments of LED chips disclosed herein can comprise a growth substrate, it will be understood by those skilled in the art that the crystalline epitaxial growth substrate on which the epitaxial layers comprising an LED chip are grown can be removed, and the freestanding epitaxial layers can be mounted on a substitute carrier substrate or substrate which can have different thermal, electrical, structural and/or optical characteristics than the original substrate. The subject matter described herein is not limited to structures having crystalline epitaxial growth substrates and can be used in connection with structures in which the epitaxial layers have been removed from their original growth substrates and bonded to substitute carrier substrates.
LED chips according to some embodiments of the present subject matter, for example, can be fabricated on growth substrates (e.g., Si, SiC, or sapphire substrates) to provide horizontal devices (with at least two electrical contacts on a same side of the LED chip) or vertical devices (with electrical contacts on opposing sides of the LED chip).
Where used, the growth substrate can be maintained on the LED chip after fabrication or removed (e.g., by etching, grinding, polishing, etc.). The growth substrate can be removed, for example, to reduce a thickness of the resulting LED chip and/or to reduce a forward voltage through a vertical LED chip. A horizontal device (with or without the growth substrate), for example, can be flip chip bonded (e.g., using solder) to a carrier substrate or printed circuit board (PCB), or wirebonded. A vertical device (with or without the growth substrate) can have a first terminal (e.g., anode or cathode) solder bonded to a carrier substrate, mounting pad, or PCB and a second terminal (e.g., the opposing anode or cathode) wirebonded to the carrier substrate, electrical element, or PCB.
Examples of vertical and horizontal LED chip structures are discussed by way of example in U.S. Publication No. 2008/0258130 to Bergmann et al. and in U.S. Pat. No. 7,791,061 to Edmond et al. which issued on Sep. 7, 2010, the disclosures of which are hereby incorporated by reference herein in their entireties.
One or more LED chip can be at least partially coated with one or more phosphors. The phosphors can absorb a portion of light from the LED chip and emit light at a different wavelength such that the light emitter component emits a combination of light from each of the LED chip and the phosphor. In one embodiment, the light emitter component emits what is perceived as white light resulting from a combination of light emission from the LED chip and the phosphor. In one embodiment according to the present subject matter, white emitting components can consist of an LED chip that emits light in the blue wavelength spectrum and a phosphor that absorbs some of the blue light and re-emits light in the green, yellow, and/or red wavelength spectrum. The components can therefore emit a white light combination across the visible spectrum of light. In other embodiments, the LED chips can emit a non-white light combination of blue and yellow light as described in U.S. Pat. No. 7,213,940. LED chips emitting red light or LED chips covered by a phosphor that absorbs LED light and emits a red light are also contemplated herein. As referenced herein, “blue” light can comprise, for example, a wavelength between and including approximately 400 nanometers (nm) and approximately 490 nm, “green” light can comprise, for example, a wavelength between and including approximately 490 nm and approximately 570 nm, “red” light can comprise, for example, a wavelength between and including approximately 600 nm and approximately 750 nm, and “white” light can be between and including a cool white and a warm white, with a correlated color temperature (CCT) having a range between and including approximately 2,000 K and approximately 7,000 K at any color rendering index (CRI).
LED chips can be coated with a phosphor using many different methods, with one suitable method being described in U.S. patent application Ser. Nos. 11/656,759 and 11/899,790, both entitled “Wafer Level Phosphor Coating Method and Devices Fabricated Utilizing Method”, and both of which are incorporated herein by reference in their entireties. Other suitable methods for coating one or more LED chip are described in U.S. Pat. No. 8,058,088 entitled “Phosphor Coating Systems and Methods for Light Emitting Structures and Packaged Light Emitting Diodes Including Phosphor Coating” which issued on Nov. 15, 2011, and the continuation-in-part application U.S. patent application Ser. No. 12/717,048 entitled “Systems and Methods for Application of Optical Materials to Optical Elements”, the disclosures of which are hereby incorporated by reference herein in their entireties. LED chips can also be coated using other methods such as electrophoretic deposition (EPD), with a suitable EPD method described in U.S. patent application Ser. No. 11/473,089 entitled “Close Loop Electrophoretic Deposition of Semiconductor Devices”, which is also incorporated herein by reference in its entirety.
In some embodiments, panels, substrates, and/or submounts described herein comprise ceramic, and have a thermal conductivity of greater than approximately 5 W/mK, greater than approximately 10 W/mK, greater than approximately 50 W/mK, greater than approximately 100 W/mK, greater than approximately 150 W/mK, or greater than approximately 200 W/mK. In more particular embodiments, the thermal conductivity of panel substrates described herein can be approximately 20 W/mK (+ or −5 W/mK), such as for when the submount comprises alumina, or the thermal conductivity of the submount can be approximately 170 W/mK (+ or −5 W/mK), such as for when the submount comprises AlN.
It is understood that light emitter components and methods according to the present subject matter can also have multiple LED chips of different colors, one or more of which can be white emitting.
LED component 10′ comprises an ESD protection device 34 electrically connected to traces 30 and 32 via a wirebond 28 and mounted over submount 16. ESD protection device 34 is covered by retention structure 12. Wirebonds 28 extending from ESD protection device 34 and LED chips 18 terminate under portions of retention structure 12. Retention structure 12 can comprise an opaque or light transmissive wall or dam. In such prior art devices, it is necessary to ensure that the height of the dam is greater than the height of the LED chips 18 so that the LED chips 18 can be covered entirely with encapsulant 14′. Encapsulant 14′ is provided over submount 16 and retained via internal walls of retention structure 12. Encapsulant 14′ is dispensed between portions of at least two opposing walls of retention structure 12.
Referring to
Referring in general to
In some embodiments, panel P, and portions thereof, form the building blocks for the novel LED components provided herein, as customized LED components can easily be formed or provided over panel P. For example, and as
In some embodiments, panel P comprises a substrate 15 comprising any suitable length, such as, for example and without limitation, a length L1 of approximately 4 inches (″) and any suitable width, such as, for example and without limitation, a width W1 of approximately 2″ (e.g., an area of 4″×2″) such that approximately 120 LED components having individual submounts (e.g., 16,
In some embodiments, panel P can be singulated (e.g., cut, sawn, diced, broken, laser cut, etched, etc.) such as along singulation lines S into individual LED components 10 having individual submounts (e.g., 16,
Still referring in general to
Substrate 15 of panel P can comprise any metallic or non-metallic material. In some embodiments, panel P comprises a highly reflective material, such as a white, silver, or transparent ceramic based material configured to improve light extraction and reflectance. Panel P can comprise a highly reflective aluminum oxide (e.g., alumina or Al2O3) or aluminum nitride (AlN) panel with reflective particles dispersed or doped therein. Panel P can also comprise any suitable oxide ceramic such as zirconium oxide, or zirconia (ZrO2), or a mixture, composite or alloy of zirconia and/or alumina. Panel P can comprise a powder based (e.g., “green”) ceramic that is pressed and fired prior to attachment of one or more LED chip (18,
Notably, LED components 10 provided herein can be efficiently batch formed and/or batch processed over panel P, to thereby simultaneously form a plurality of customized packages that are submount based and provided at lowered costs and/or have improved manufacturability. Notably, LED components 10 formed over panel P can be created without the use of a retention structure or dam (see, e.g., retention structure 12,
That is, customized LED components 10, which are customized with regard to size, shape, color, number, and/or connectivity of LED chips, traces (e.g., customized size, shape, and/or placement thereof), and/or optical elements (e.g., customized shape, size, placement, surface features, etc.) can be provided as a batch over panel P, and batch processed. Aspects of the LED chips, traces, retention structures and/or optical elements can be customized to provide light emitter components operable at various electrical and/or optical specifications per customer and/or consumer requests. LED components 10 can be customized in regard to a beam shape, a beam size, a beam direction, and/or a color temperature, or, for monochromatic components that are not on the blackbody curve, a wavelength is described in commonly owned and co-pending U.S. patent application Ser. No. 14/538,526, the content of which is and was incorporated herein by reference in the entirety above, panel P can be highly reflective to visible light (e.g., greater than about 90%) and provide conduction of heat as well as mechanical support. In some embodiments, non-metallic and/or ceramic materials containing Al2O3 exhibit such qualities. Accordingly, panel P (i.e., and individual submounts (16,
In some embodiments, panel P is similar to and/or provided using methods described in U.S. utility patent application Ser. No. 11/982,275, filed Oct. 31, 2007 and/or U.S. utility patent application Ser. No. 12/757,891, filed Apr. 9, 2010. The entire contents of each of these references are hereby incorporated by reference herein.
In some embodiments, each layer of encapsulant 14 can be provided, such as molding each or all of the layers of encapsulant 14, over panel P after providing traces (e.g., 30, 32,
Encapsulant can be dispensed over the surface of the panel P and can be molded by a substantially flat press (e.g., a press that has an acceptable flatness tolerance) that applies heat and/or pressure to cure/mold the encapsulant in a substantially uniformly flat layer to cover the LED chips (e.g., 18,
In some embodiments and upon singulation, panel P is cut, sawn, diced, laser cut, etched, or otherwise separated along singulation lines S, which are shown in broken lines for illustration purposes, such that encapsulant 14 is contiguous and/or co-planar with each of the edges of the submount 16 to form external surfaces or lateral walls of individual LED components 10. In some embodiments, encapsulant 14 can, but does not have to, comprise a same size and/or shape as the individual submounts (e.g., 16,
In some embodiments, encapsulant 14 comprises a polymeric and/or plastic material. In some embodiments, encapsulant 14 is devoid of any color or pigment. Encapsulant 14 can comprise a matrix of transparent (e.g., transmissive to light) or clear silicone or epoxy with one or more binders dispersed therein. Encapsulant 14 can, but does not have to, contain and/or be coated with an amount of wavelength conversation material (e.g., phosphor(s)) while remaining devoid of reflective particles and/or reflective properties. That is, encapsulant 14 can be non-reflective, and instead allow light to readily pass therethrough. Encapsulant 14 can be at least partially, if not fully, transparent for readily emitting light therefrom and/or allowing light to pass therethrough. This can advantageously result in a larger viewing angle and increased demand and use of such LED components. Transparent encapsulant 14 also enables LED components 10 to accommodate a larger number of lighting applications (e.g., energy efficient bulbs,
Encapsulant 14 can be provided in various thicknesses or heights vertically disposed with respect to panel P. In some embodiments, encapsulant 14 comprises a single layer of material. In other embodiments, encapsulant 14 comprises multiple layers of material, and can be dispensed in more than one layer via dispensing tool. Encapsulant 14 is shown to be substantially uniform in height, but in some embodiments can vary in height across panel P. Encapsulant 14 can, for example as shown particularly in
In some embodiments, encapsulant 14 can comprise, without limitation, a transparent or clear silicone, epoxy, etc. having light-permeable binders or fillers therein, including but not limited to fumed silica, silica gel, nanomaterials (e.g., nano-binders or nano-fillers), ceramic nanoparticles, ceramic micro-particles, quantum dots, phosphor, ceramic fiber(s), non-ceramic fiber(s), combinations thereof, or any other suitable filler(s) and/or binder(s).
The broken lines in
As used herein, the term batch processes or batch processing refers to one or more processing steps, not limited to depositing traces (e.g., electroplating, deposition, electroless plating, etc.), die attaching LED chips, wirebonding LED and/or ESD chips, forming electrically conductive vias (e.g., 36,
Referring to
LED chips 18 can be wirebonded to each other and/or one or more electrically conductive portions of material (e.g., component contacts of terminals) via wirebonds 28. In such embodiments, die-attached LED chips 18 are not used, as they are incompatible with electrical connections through wirebonds 28. Wirebonds 28 can comprise any electrically conductive material such as a metal, a metal alloy, Au, Al, Sn, Ag, Cu, etc. LED chips 18 are linearly arranged into a plurality of strings of linearly-arranged LED chips that extend between and are connected to traces 30 and 32, which are disposed on opposite sides of the submount 16. LED chips 18 can be serially connected, connected in parallel, and/or combinations thereof between anode/cathode contacts or terminals (e.g., traces 30 and 32).
Multiple LED chips 18, where provided, can be configured to emit a same wavelength or chromaticity (see, e.g.,
LED chips 18 can comprise any size and/or shape. LED chips 18 can be substantially square, rectangular, regular, irregular, or asymmetrical in shape. In some embodiments, LED chips 18 can, for example and without limitation, comprise a footprint where at least one side (e.g., a length or width) measures more than 2000 μm or approximately 2000 μm or less, such as approximately 1000 μm or less, approximately 900 μm or less, approximately 700 μm or less, approximately 600 μm or less, approximately 500 μm or less, approximately 400 μm or less, approximately 300 μm or less, approximately 200 μm or less, approximately 100 μm or less, and/or combinations thereof where multiple LED chips 18 are used. Any dimension of LED chip(s) 18 can be provided.
A plurality of electrical contacts, such as electrically conductive traces 30 and 32, can be provided over panel P (
Still referring to
ESD protection device 34 can be mounted over submount 16 using any known material and/or technique. ESD protection device 34 can be smaller than LED chips 18 so that it does not occupy an excessive area of submount 16. ESD protection device 34 can also be covered by an encapsulant 14 that can be formed by molding at least the outer top surface of the encapsulant 14 using a molding element (e.g., with the ESD protection device 34 being proximate to or at an edge of LED component 10). ESD protection device 34 can prevent excessive current from passing through LED component 10 during an ESD event by providing an alternative path for current to flow besides the LED chips 18. Wirebond 28 extending from ESD protection device 34 and/or LED chips 18 can terminate under, below, and/or within portions of the molded encapsulant 14. In some embodiments, LED component 10 comprises an SMD in which electrically conductive traces 30 and 32, wirebonds 28, and/or ESD protection device 34 are covered (e.g., fully or at least partially) by and/or within molded encapsulant 14. LED component 10 can be devoid of uncovered electrically conductive traces 30 and 32 on a top surface thereof. In some embodiments, at least a portion of, only a portion of or all of the encapsulant 14 of each LED component 10 can be, as described hereinabove relative to
Electrically conductive vias, generally designated 36, can optionally be provided within portions of panel P (
Referring to
First and second contacts 40 and 42 can electrically communicate to or with traces 30 and 32, respectively, using the one or more internally disposed thru-holes or vias 36. Vias 36 can extend internally within a portion of submount 16 depending upon how formed within panel (e.g., P,
Referring to
Encapsulant 14 can have any suitable thickness and/or height. In some embodiments, the thickness of the encapsulant 14 can be any value between approximately 0.1 and 2.0 mm, however, any thickness can be provided. Encapsulant 14 can comprise a height having any value between approximately 0.1 mm and 3.0 mm. The height and the thickness of the encapsulant 14 can be independent of each other. The height of the encapsulant 14 can, in some aspects, be directly correlated with the height of the LED chips in the package (e.g., for a flat package), as the height of the encapsulant 14 should be above the height of the LED chips so that the LED chips can be covered entirely with encapsulant 14.
In one aspect, the height range of the encapsulant 14 can be from approximately 0.2 mm to 5.0 mm and the thickness of the encapsulant 14 can be from approximately 0.1 mm to 5.0 mm.
Still referring in general to
In some embodiments, encapsulant 14 comprises a silicone matrix, encapsulant, or plastic material, which can be deposited or dispensed directly over panel P and respective submounts 16 without incurring time or expense associated with overmolded lenses. Encapsulant 14 can be formed to have any height and cured prior to singulation of individual components 10 from panel P (
Encapsulant 14 can provide both environmental and mechanical protection of individual LED components 10. In some embodiments, an optional layer of optical conversion material(s), such as phosphor(s), can be applied directly on or over the one or more LED chip 18, on, over, or within one or more surfaces of encapsulant 14 (e.g., an inner, outer, upper, or lower surface) for producing cool and/or warm white output. Optical conversion material (i.e., wavelength conversion material including phosphor) can be uniformly or non-uniformly dispersed within encapsulant 14 or can be omitted entirely from LED components 10. Optical conversion material can comprise one or more phosphors adapted to emit blue, yellow, red, and/or green light upon impingement with light from the one or more LED chip 18. In some embodiments, optical conversion material may be provided when encapsulant 14 is in liquid form and fixed therein as encapsulant 14 cures. In some embodiments, encapsulant 14 can be devoid of any optical conversion material.
Notably, LED components 10 can be devoid of a costly leadframe encased within molded plastic, and can rather utilize thin, electrically conductive traces 30 and 32, which can be customized with respect to size, placement, layout, and/or electrical configuration with respect to LED chips 18 and bottom contacts 40 and 42. Individual LED components 10 can each comprise an individual submount 16 over which LED chips 18 are provided, where each submount 16 is a portion of panel P, which is singulated from panel P during a singulation process (e.g., sawing, dicing, laser cutting, shearing, breaking, etc.). Submount 16 can comprise any size, shape, and/or cross-sectional shapes. For illustration purposes, a substantially square shape having a substantially rectangular cross-sectional shape is illustrated, however, any other non-square and non-rectangular shape(s) can be provided.
In some embodiments, submount 16 can be square and for example comprise a length and width of approximately 5 mm×5 mm, or a surface area of approximately 25 mm2. As noted above however, any size and/or shape of submount 16 can be provided (e.g., where a length and/or width is approximately 10 mm or less, approximately 7 mm or less, approximately 5 mm or less, approximately 3 mm or less, etc.). Submount 16 can comprise any thickness, such as between approximately 0.35 and 2.0 mm thick. In some embodiments, submount 16 is approximately 0.6 mm, or 0.635 mm. Submount 16 can also be thicker than 0.5 mm or 1.0 mm (e.g., 2.0 mm, 3.0 mm, etc.) where desired.
Referring to
In some embodiments, this wider full width at half maximum (FWHM) beam angle of the dam-less LED component 10 is greater than 125°. An effective FWHM beam angle (e.g., an effective viewing angle) can be approximately 126° or more, approximately 128° or more, approximately 130° or more, and/or approximately 135° or more. Increasing the viewing angle here does not adversely affect color temperature, or other optical properties associated with LED component 10.
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Embodiments described herein have particular utility with respect to various form factor light fixtures. For example, each of the embodiments disclosed herein may be alternatively implemented in various types of solid state light fixtures including, for example, downlights, troffers, streetlights, canopy lights, parking garage lights, lights that use waveguide technology and other lighting fixtures, example embodiments of which are shown and discussed relative to
Bulb 400 can deliver at least 50 LPW or more, at least 100 LPW or more, at least 110 LPW or more, or more than 150 LPW. In some embodiments, lighting fixture is configured to emit white light having a reference point on the blackbody locus (e.g., 1931 CIE Chromaticity Diagram) having a color temperature of less than or approximately equal to 5000 K, less than or approximately equal to 4000 K, less than or approximately equal to 3500 K, less than or approximately equal to 3000 K, or less than or approximately equal to 2700 K. In some embodiments, combined emissions from bulb 400 embody a color rendering index (CRI Ra) value of at least 70, at least 75, at least 80 (e.g., 82 or 85), or at least 90 or more. Bulb 400 can also be dimmable, where desired.
Notably, the light intensity distribution of bulb 400 can comprise any light intensity distribution, and in one embodiment comprises the desired light intensity distribution conforms to the ENERGY STAR® Partnership Agreement Requirements for Luminous Intensity Distribution, which is incorporated herein by reference, in the entirety. For an omnidirectional lamp, the Luminous Intensity Distribution is defined as “an even distribution of luminous intensity (candelas) within the 0° to 135° zone (vertically axially symmetrical). Luminous intensity at any angle within this zone shall not differ from the mean luminous intensity for the entire 0° to 135° zone by more than 20%. At least 5% of total flux (lumens) must be emitted in the 135°-180° zone. Distribution shall be vertically symmetrical as measures in three vertical planes at 0°, 45°, and 90°.”
In some embodiments, the free end of enclosure 404, opposite to the base 402, is considered 0° and the base 402 of the bulb is considered 180°. As defined in the standard, luminous intensity is measured from 0° to 135° where the measurements are repeated in vertical planes at 0°, 45° and 90°. The structure and operation of bulb 400 of the instant disclosure is compliant with the ENERGY STAR® standard set forth above in some embodiments; however, and in other embodiments, bulb 400 can also be used to create other light intensity distribution patterns.
Components described herein can be easily produced as the time consuming process and additional cost associated providing customized packages or components (e.g., customized pressed or molded plastic bodies, cavities, and/or individually molded optical elements) becomes obsolete. A multitude of different customized components, having customized colors, brightness, voltage, power, layout, sizes, and/or viewing angles can be provided without the expense of creating custom fabricated components and/or leadframe components.
Embodiments as disclosed herein may, for example and without limitation, provide one or more of the following beneficial technical effects: reduced cost of providing light emitter components; reduced processing time; increased viewing angle; improved light extraction; more uniform light extraction; improved manufacturability of light emitter components; improved ability to vary component features, such as trace design, number of LED chips, and retention structure layout.
While the components and methods have been described herein in reference to specific aspects, features, and illustrative embodiments, it will be appreciated that the utility of the subject matter is not thus limited, but rather extends to and encompasses numerous other variations, modifications and alternative embodiments, as will suggest themselves to those of ordinary skill in the field of the present subject matter, based on the disclosure herein. Various combinations and sub-combinations of the structures and features described herein are contemplated and will be apparent to a skilled person having knowledge of this disclosure. Any of the various features and elements as disclosed herein may be combined with one or more other disclosed features and elements unless indicated to the contrary herein. Correspondingly, the subject matter as hereinafter claimed is intended to be broadly construed and interpreted, as including all such variations, modifications and alternative embodiments, within its scope and including equivalents of the claims.
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