1. Field of the Invention
The present invention generally relates to light-emitting diode (LED) packaging. More specifically, the invention relates to LED packaging for motor vehicle headlamp and other applications.
2. Description of Related Art
An LED is one type of semiconductor that generates light when voltage is applied to it. There are various advantages to using LEDs in vehicle headlamp applications, such as long lifetime, low drive voltage, high vibration resistance, and high tolerance to repeated power switching. An LED is typically provided in an LED package that provides optics for the LED, such as a dome, and LED terminals for electrical connection. The LED terminals are typically provided having one of several variations, such as gull leads (conductors extending from the LED) or flat terminal strips.
The state of current LED lighting technology for headlamps is generally limited by the light output of LEDs. LED manufacturers are working to increase the lumen output of their devices. The current ratings are in the range of 30-50 lm/W. It is estimated that LEDs will be approaching an output of 80-100 lm/W in the next few years, which will reduce the number of LEDs needed to generate a legal light output. In order to effect these results, most improvements will require packaging the LEDs in an efficient manner and providing adequate thermal heatsinking.
In vehicle headlamp applications, typical methods of providing electrical connection to LED packages include soldering the LED terminals to a printed wiring board, utilizing a wave soldering or reflow process, and/or crimping the LED terminals to wiring. Typically, an LED package is first connected to a printed wiring board or a Thermal Clad substrate (T-Clad), and then secondarily, the printed wiring board or T-Clad utilizes another electrical connection, such as a header or board connector, for outer interconnection within a circuit. These types of LED terminal connections may not be robust because, without also having mechanical interlocking features, the connections may separate. In addition, the installation process may be costly due to material costs for multiple interconnection processes. The installation process may also be open to error because the installer must undertake multiple steps, some of which may require a high amount of precision. These factors provide for an expensive packaging design for LEDs.
In satisfying the above need, as well as overcoming the enumerated drawbacks and other limitations of the related art, the present invention provides an LED package holder that is configured to provide an electrical interconnection to an LED package, while including various other useful components, such as a heat sink, lens-alignment features, a lens, a connector shroud, and/or biasing contact features.
In one aspect, an LED package holder for holding and electrically connecting an LED package includes a housing having an aperture defined therein and portions defining a recess. A plurality of contact features are retained by the housing and extend into the aperture. Each contact feature has an exposed portion configured to engage an LED electric terminal of an LED package received within the aperture. A heat sink is also retained by the housing and is at least partially located within the recess of the housing. The heat sink is configured to draw heat away from the LED package received within the aperture.
In another aspect, an LED package holder for holding and electrically connecting an LED package includes a housing having an aperture defined therein and a lens-alignment feature configured to align a lens with the housing. The LED package holder also has a plurality of contact features, which are retained by the housing. Each contact feature has an exposed portion to engage an LED electric terminal of an LED package received within the aperture.
In yet another aspect, an LED package holder for holding and electrically connecting an LED package includes a housing having an aperture defined therein and a lens connected to the housing and disposed over the aperture. A plurality of contact features are retained by the housing and extend into the aperture. Each contact feature has an exposed portion that engages an LED electric terminal of an LED package received within the aperture.
In still another aspect, an LED package holder for holding and electrically connecting an LED package includes a housing, a plurality of contact features, a heat sink, a connector shroud, a lens-alignment feature, and a lens. The housing has an aperture defined therein and portions defining a recess. The plurality of contact features are retained by the housing and extend into the aperture. Each contact feature has an exposed portion that engages an LED electric terminal of an LED package received within the aperture and to bias the LED package so as to secure the LED package to a surface. The heat sink is also retained by the housing and is at least partially located within the recess of the housing to draw heat away from the LED package within the aperture. The connector shroud is integrally formed with the housing and has portions forming a cavity to receive a connector therein. A portion of each contact extends into the connector shroud and engages connector terminals when a connector is inserted into the cavity of the connector shroud. The connector shroud has a latching feature that releasably retains the connector within the cavity of the connector shroud. The lens is connected to the housing and disposed over the aperture while a lens-alignment feature aligns the lens with the housing for that connection.
Further objects, features, and advantages of this invention will become readily apparent to persons skilled in the art after a review of the following description, with reference to the drawings and claims that are appended to and form a part of this specification.
Referring now to
The housing 12 may have one or more alignment features 22 for aligning a lens (shown in
An LED package 30 is disposed within the aperture 14, such that the dome 32 of the LED package 30 protrudes from the aperture 14. The LED package 30 includes a substrate 34 upon which the LED chip 36 is disposed and electric terminals 38 for electrically connecting the LED chip 36 within a circuit. It should be understood that the LED package 30 could have other configurations, without falling beyond the spirit and scope of the present invention, such as a flat optic instead of a dome 32. The LED electrical terminals 38 could be of any suitable type, as known in the art. For example, the LED electric terminals 38 could be Ni/Au plated, Ni/Sn plated, or clad aluminum pads.
A pair of contact features 40 is retained by the housing 12 and extends into the aperture 14 from the housing 12 to electrically connect to the electric terminals 38 of an LED package 30. Each contact feature 40 has an exposed portion that engages the LED electric terminals 38. In the embodiment of
The contact features 40 may be molded into the housing 12, or they may be retained by the housing 12 in another way, such as by being press-fit to the housing 12, snapped into connecting features (not shown) located on the housing 12, heat staked to the housing 12, or adhesively attached to the housing 12. The contact features 40 extend through an interior portion of the housing 12 (see
Each contact feature 40 is shown molded into the housing 12 with a free end extending into the aperture 14. In the alternative, each contact feature 40 could be molded into, or retained by, two opposite sides of the aperture 14 of the housing 12, such that the contact features 40 extend across the aperture 14 to contact the LED electric terminals 38, but there are no “free ends” within the aperture 14. This configuration could operate similarly to the contact features 40 as shown, but with improved strength.
The contact features 40 may be formed of any suitable material or combination of materials, so long as they are configured to connect the LED package 30 within a circuit. For example, the contact features 40 may be formed of metal alloys, such as Be—Cu, spring steel, brass, Tin-Bronze, or Cu—Ni. In the alternative, the contact features 40 could be formed of a platable grade polymer and over-plated with a conducting material. The contact features 40 may have a surface finish comprising Ni/Sn or Ni/Au, for example.
The connector shroud 16 is integrally formed with the housing 12. In the embodiment illustrated, the connector shroud 16 is unitarily formed with the housing 12 and therefore made of the same material as the housing 12. The connector shroud 16 is configured to receive a connector (not shown) therein to connect the LED package 30 within a circuit. Thus, portions of the contact features 40 extend into a cavity 42 of the connector shroud 16. These portions of the contact features 40 are configured to engage electrical leads of the connector when the connector is inserted into the cavity 42 of the connector shroud 16. The connector could be of a terminal category 0 or 1 type, or any other suitable connector. It is contemplated that the connector may form a part of a wire harness to interconnect the LED package 20 within a circuit. The connector shroud 16 optionally has a latching feature 44 configured to releasably retain the connector within the cavity 42 of the connector shroud 46. For example, the latching feature 44 could be an aperture that retains a displaceable release button of the connector. The connector shroud 16 and contact features 40 may be formed by any suitable method and may be formed, for example, using the method of U.S. patent application Ser. No. 11/778,945, which is herein incorporated by reference in its entirety.
The housing 12 optionally has locating features 46 to aid in positioning the LED package 30 within the aperture 14 of the housing 12 (shown only in
Referring now to
The heat sink 20 may be retained within the recess of the housing 12 with an interference fit. In other words, the heat sink 20 may be retained by the housing by virtue of friction between the portions 18 forming the recess and sides 50 of the heat sink 20, when there is a close fit between the heat sink 20 and the portions 18 forming the recess, with little or no gap between the sides 50 of the heat sink 20 and the portions 18 forming the recess.
In addition, or in the alternative, the heat sink 20 may be retained with the housing 12 through adhesive bonding (not shown). For example, adhesive bonding could be located between various portions of the housing 12 and the heat sink 20 to secure the heat sink 20 to the housing 12. Among other places, the adhesive material could be located between the sides 50 of the heat sink 20 and the portions 18 forming the recess within the housing 12.
In addition to either or both the interference fit and the adhesive bonding, the heat sink 20 could be retained by the housing 12 by heat staking. For example, as seen in
Each feature for retaining the heat sink 20 to the housing 12 as described above (e.g., the interference fit, adhesive bonding, and heat staking elements) may be used separately or together with the other features for retaining the heat sink 20. In the alternative, any other suitable feature for retaining the heat sink 20 to the housing 12 may be used, as would be known to one having ordinary skill in the art, such as utilizing fasteners to retain the heat sink 20 to the housing 12.
With reference to
The lens 64 is preferably disposed over the LED package 30 to help focus light rays emanating from the LED package 30. The lens 64 could be of any suitable type, depending on the application. For example, the lens 64 could be a collimating lens or a light-spreading lens. The lens 64 is preferably formed a light-transmitting or transparent material, such as polycarbonate or polymethylmethacrylate (PMMA).
With reference to
With reference to
A pair of contact features 240 extends through the housing 12, each having an exposed end portion disposed within the aperture 14 of the housing 12. The contact features 240 are flat leads that extend over the LED electric terminals 38 and are electrically connected therewith via wire bonds 280. The wire bonds 280 are preferably formed of aluminum or gold and are preferably potted with a sealant having a low modulus of elasticity, such as Silicone. Such wire bond interconnections may be suitable for high temperature and high vibration applications because they may help avoid issues of fretting or micro-motion between the LED electric terminals 38 and the contact features 240. The contact features 240 may be configured to locate the LED package 30 within the LED package holder 10 by extending over the LED package 30, such that the LED package 30 is inserted tightly between the LED package 30 and the heat sink 20. The contact features 240 may optionally bias the LED package to the heat sink 20, as described above.
As a person skilled in the art will readily appreciate, the above description is meant as an illustration of implementation of the principles this invention. This description is not intended to limit the scope or application of this invention in that the invention is susceptible to modification, variation and change, without departing from the spirit of this invention, as defined in the following claims.