1. Technical Field
The present disclosure relates to a luminous device, and more particularly, to a light emitting diode (LED) luminous device.
2. Description of Related Art
LEDs have been widely promoted as a light source of electronic devices owing to many advantages, such as high luminosity, low operational voltage and low power consumption. In practice, the LEDs generate a large amount of heat during operation. If the heat is not timely removed, the luminous efficiency will be reduced, and life of the LEDs will be shortened significantly. Typically, a heat dissipation device is provided to take away the heat generated by the LEDs to make sure that the LED luminous device works normally under a proper temperature. The heat dissipation device generally includes a fin assembly. However, the ordinary fin assembly is difficult to satisfy heat dissipation requirement as power of the LEDs increases.
Therefore, an LED luminous device capable of overcoming the above described shortcoming is desired.
Many aspects of the present disclosure can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
Embodiment of the present LED luminous device will now be described in detail below and with reference to the drawings.
Referring to
Also referring to
Each of the heat pipes 200 is filled with cooling liquid, and includes a first pipe 210 and a plurality of second pipes 220 communicated with the first pipe 210. The first pipe 210 includes a straight, horizontal pipe 211 and two extending pipes 212 extending downwardly from two opposite ends of the straight, horizontal pipe 211, respectively. In this embodiment, the two extending pipes 212 are perpendicular to the straight, horizontal pipe 211, and the second pipes 220 are located between the two extending pipes 212, and parallel to the two extending pipes 212. The second pipes 220 are communicated with the straight, horizontal pipe 211. The first pipe 210 and the plurality of second pipes 220 of each heat pipe 200 cooperatively form a comb-shaped configuration.
A sum of a number of the extending pipes 212 and a number of the second pipes 220 of each heat pipe 200 is equal to that of the through holes 121 of one fin 120 in each row. The extending pipes 212 and the second pipes 220 are inserted into the corresponding through holes 121 in each row, and the straight, horizontal pipe 211 is located above the fin assembly 100. When the fin assembly 100 and the plurality of heat pipes 200 are assembled together, the straight, horizontal pipes 211 are located over a top of the fin assembly 100 and spaced from each other along a length direction of the fin assembly 100, with the extending pipes 212 and the second pipes 220 being fitted into the elongated through holes 123 of the fin assembly 100. Since the heat pipe 200 is filled with cooling liquid, for example, water, heat generated by the LEDs 400 can be quickly absorbed by the heat pipes 200 via the base 110 and then dissipated to the surrounding environment by the fin assembly 100, wherein air convection can be effectively achieved by air flowing through the channels 130 between the fins 120. Each heat pipe 200 can have an evaporating part located at a bottom end of each of the extending pipes 212 and the second pipes 220 in engagement with the base 110, at which the cooling liquid evaporates into vapor after absorbing heat from the LEDs 400. Furthermore, each heat pipe 200 can have a condensing part located at a side wall of each of the extending pipes 212 and the second pipes 220 which is in engagement with the fins 120. At the condensing part, the vapor releases the heat and condenses back to the cooling liquid.
The printed circuit board 300 is metal core printed circuit board, and located on the base 110 of the fin assembly 100. The printed circuit board 300 and the fins 120 are located on opposite sides of the base 110, respectively. The LEDs 400 are located on the printed circuit board 300.
During operation of the LED luminous device 10, the heat generated by the LEDs 400 is transferred to the base 110 of the fin assembly 100. The extending pipes 212 and the second pipes 220 of the heat pipes 200 absorb the heat from the base 110, and transfer the heat to the fins 120 quickly and evenly. As such, the heat dissipation efficiency is improved. Additionally, each fin 120 forms a plurality of annular walls 122, and the annular walls 122 are stacked together to form the plurality of elongated through holes 123. The extending pipes 212 and the second pipes 220 of the heat pipes 200 are inserted into the elongated through holes 123, thereby contacting the annular walls 122 sufficiently. Due to that contacting area between the heat pipes 200 and the fins 120 is increased, the heat dissipation efficiency is improved thereby.
Particular embodiments are shown and described by way of illustration only. The principles and the features of the present disclosure may be employed in various and numerous embodiments thereof without departing from the scope of the disclosure as claimed. The above-described embodiments illustrate the scope of the disclosure but do not restrict the scope of the disclosure.
Number | Date | Country | Kind |
---|---|---|---|
101114345 | Apr 2012 | TW | national |