The present invention is generally in the field of lighting and luminaires utilizing light emitting diodes (LEDs) to facilitate desired illumination. More particularly, the invention provides an LED module, arrays of LED modules, luminaires incorporating such arrays, and methods of illumination where the configuration of respective components facilitates any one or more of desired angle, location and shape of illumination provided by the LEDs.
Recently, commercial, as well as residential, lighting applications have been transitioning to the use of LEDs where arrays of LED modules provide illumination in applications such as street lighting, office building lighting, and many other outdoor and indoor applications.
LEDs perform well in the industry, but there are often problems with aiming of the light output from LEDs in a desired direction and pattern. In general, LEDs emit light in all directions away from the circuit board thereof. Consequently, a good portion of light emitted by an LED can be wasted because it is not directed towards a desired area of illumination. Conventionally, such side-emitters and asymmetrical distribution LEDs are controlled with lenses and prisms. Such control optics tend to decrease the amount of lumens (or candlepower) produced by any given fixture utilizing LEDs because of the loss of lumens through the lens or prism material. Other conventional means for directing light emitted by LEDs include use of reflective surfaces which, while avoiding light losses suffered by lenses and prisms, may be more difficult to configure to achieve the desired illumination direction or patterns.
Another known design consideration associated with the use of LEDs in lighting fixtures is heat dissipation. Accordingly, LED modules for use in LED arrays often incorporate heat sinks to facilitate dissipation of heat generated by the LEDs during operation.
Conventional configurations that attempt to address the above-noted considerations in LED and other lighting applications are described in, for example, U.S. Design Pat. Nos. D576,331, D576,330 and D568,521, U.S. Patent Applications Publication Nos. 2008/0080196, 2007/0076414, 2008/0078524, 2008/0212329 and 2008/0080162, and U.S. Pat. Nos. 5,580,156, 6,942,361, 6,234,648, 5,947,587, 3,562,513, 4,337,507, 6,676,279, 7,252,408, 7,347,706, the entire disclosures of all of which are incorporated herein by reference.
While the conventional configurations described in the above disclosures provide different means to address various considerations associated with utilization of LEDs, a need still exists for a luminaire that can be readily and efficiently configured to utilize LEDs and direct light emitted from the LEDs at a desired angle and in a desired pattern.
Accordingly, exemplary embodiments of the present invention address at least the above-noted needs by providing an LED module and array of LED modules, as well as a light fixture and illumination methods that facilitate an increase in candlepower and accurate aiming of light output by LEDs onto the surface to be illuminated.
Another object of the present invention is to provide a reflector module that is adaptable to all area and garage lighting products.
A further object of the present invention is to provide a unique LED board with at least three diodes positioned horizontally with a quick connection for promoting ease of assembly.
Still another object of the present invention is to provide extruded heat-sink modules to dissipate the heat on LED circuit boards.
Yet another object of the present invention is to provide an LED module for creating multiple distinct lighting distributions wherein the center beam exits the luminaire at an angle of about 70° from the carrier plate when the carrier plate is substantially parallel to the surface to be illuminated.
A further object of the present invention is to provide an LED module that is easily replaceable and environment-friendly to eliminate the need to replace an entire fixture when an LED no longer emits light.
The foregoing objects are addressed by exemplary embodiments of the present invention that provide structures and methods of illumination where one or more LED modules are selectively disposed on a carrier plate. Each of the LED modules includes an LED circuit board with one or more LED chips disposed thereon, a heat sink formed of heat transmitting material and having a mounting surface for accommodating the LED circuit board to dissipate heat from the LED chip(s), and a reflector with its reflective surface disposed with respect to the LED chip(s) to direct the emitted light emitted toward an axis of illumination extending away from and essentially perpendicular to a plane of the LED circuit board. The heat sink, the LED circuit board and the reflector are arranged such that the axis of illumination is not perpendicular with respect to a plane of a surface illuminated by the light emitted from the LED chip(s).
According to exemplary embodiments of the present invention, by forming the LED module in this manner and selectively configuring such modules on a carrier plate, distinct lighting distributions can be achieved that exit a lighting fixture employing the carrier plate at an angle of about 70° with respect to the surface to be illuminated.
Other objects, advantages, and salient features of the present invention will become apparent from the following detailed description, which, taken in conjunction with the annexed drawings, discloses preferred embodiments of the invention.
Referring to the drawings which form a part of this disclosure and illustrate non-limiting, exemplary implementations of certain exemplary embodiments of the present invention:
a is a side perspective view of the LED module as seen in
Throughout the drawings, like reference numerals will be understood to refer to like parts, components, and structures.
Several embodiments of the present invention will now be described in detail with reference to the annexed drawings. In the following description, a detailed description of known functions and configurations incorporated herein has been omitted for conciseness and clarity.
Turning to
Assuming, for simplicity of explanation only, that a davit arm 11 extends the housing 14 away from pole 12 by a negligible distance, then the direction of light emitted from housing 14 mounted on pole 12 at a height “x” with respect to the surface 16 to be illuminated should be such that the distance at which the axis corresponding to maximum candlepower of light M emitted from the LED modules 20 hits the surface 16 to be illuminated at a distance of approximately 2.75× (i.e., about 2.75 times the height of the pole).
For example, if implemented as a street light where the height of pole 12 is 20 feet, light M should be emitted from the LED arrays configured in the housing 14 of the luminaire 10 such that the brightest area of illumination is at a distance of about 55 feet from the base of pole 12. The support structure can be a pole or wall if the housing 14 is wall mounted. A davit arm 11, or any other analogous connecting structure, for connecting the housing 14 to the support structure is optional.
Referring now to
In an exemplary implementation as illustrated in
In an exemplary implementation, as further illustrated in, for example,
Heat sinks 30 dissipate heat from the LED boards 40 and allow the boards 40 to cool adequately to survive the applicable implementation environment. According to an exemplary implementation, each module 20 can be configured, for example to snap fit into corresponding structures of the carrier plate 22, to achieve a toolless connection of modules 20 to carrier plate 22.
According to an exemplary embodiment, fins 39 of the heat sink 30 can include at least one recess 35 to facilitate snap fitting of the heat sink 30, and thereby module 20, into a corresponding opening or aperture 23 of a carrier plate 22. As seen in
In an exemplary implementation, each of the LED circuit boards 40 includes at least one, or as illustrated in the drawings three, LEDs 42 mounted thereon. The LED circuit board 40 is configured with respect to the heat sink module 30 so that the heat from all LEDs accommodated and mounted on the LED circuit board 40 is dissipated by means of heat sink 30. The LEDs 42 are positioned horizontally as shown, for example in
In the illustrated exemplary implementations of the embodiments of the present invention, the plane of the planar LED circuit board 40 is substantially parallel to the planar mounting surface 31 when LED circuit board is attached to the heat sink 30. This configuration enables the angle between the plane of the LED circuit board 40 and the carrier plate 22 to be essentially the same as the angle between the plane of the mounting surface 31 of the heat sink 30 and the carrier plate 22. Thus, if orientation of the mounting surface 31 is changed with respect to the carrier plate 22, the orientation of the LED circuit board 40 is analogously changed. According to an exemplary embodiment of the present invention, when a lighting fixture, for example a luminaire as shown in
In certain exemplary configurations, the LED circuit board 40 is attached to the mounting surface 31 of the heat sink 30 with transfer thermal tape, grease, or a similar material. The attachment can be permanent or removable, for example for ease of replacement of individual board 40 should any LED mounted thereon fail. The LED circuit board 40 may also include a thermal sensor device (not shown) to monitor the heat on the LED circuit board 40 and to make adjustments if the board temperature rises beyond an acceptable value.
According to an exemplary embodiment of the present invention, reflector 50 is configured with respect to LEDs 42 and the heat sink 30. In an exemplary implementation, reflector 50 is plastic molded and generally constructed and configured to direct light from LEDs 42 outward along the axis A generally perpendicular to the plane of the LED circuit board 40 (see
In an exemplary implementation, the reflectors 50 increase the output of the LED circuit board 40 by gathering light emitted by the LEDs 42 and redirecting it along the axis generally perpendicular to the plane of LED circuit board 40, essentially doubling the center beam candlepower. According to an exemplary configuration, the light emitted from LEDs 42 is increased by as much as 250% in the horizontal plane by means of the reflectors 50. A configuration of three LEDs 42 within a reflector 50 facilitates horizontal distribution of light emitted from the three horizontally positioned LEDs as a means to spread the light across the surface to be illuminated at high angles.
In an exemplary implementation, the reflectors 50 can be coupled to and fitted, for example snap fitted, onto the heat sink 30, as shown for example in
According to an exemplary embodiment of the present invention, carrier plate 22 can be configured to include, or with respect to, reflector panels 60, as shown for example in
In an exemplary implementation, each of the modules 20 is oriented on the carrier plate 22 to form an LED array that facilitates directing of light exiting the LED arrays to form a beam having a desired shape (or footprint) whose optical axis (or axis corresponding the maximum candlepower) hits the surface to be illuminated at an angle of approximately 60° to 80°, or about 70° depending on the application, as illustrated in the example of
While exemplary embodiments of the present invention have been chosen to illustrate the invention, it will be understood by those skilled in the art that various changes, modifications, additions, and substitutions are possible, without departing from the scope and spirit of the present invention. Therefore, the present invention is not limited to the above-described embodiments, but is defined by the following claims, along with their full scope of equivalents.
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