Patent Application
20150188005
This application claims priority to Chinese patent application no. 201310742364.2 filight emitting diode on Dec. 30, 2013, the contents of which are incorporated by reference herein.
The present disclosure generally relates to a light emitting diode (light emitting diode) package and method for manufacturing the same.
In recent years, due to excellent light quality and high luminous efficiency, light emitting diodes (light emitting diodes) have increasingly been used as substitutes for incandescent bulbs, compact fluorescent lamps and fluorescent tubes as light sources of illumination devices.
Implementations of the present technology will now be described, by way of example only, with reference to the attached figures.
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts have been exaggerated to better illustrate details and features of the present disclosure.
A definition that applies throughout this disclosure will now be presented.
The term “comprising,” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series and the like.
The present disclosure is described in relation to a light emitting diode package and method for manufacturing the same.
The encapsulation 11 can be made of transparent material, such as epoxy resin. Optionally, there can be phosphor powder distributing in the encapsulation 11, so as to obtain light with a requirement color when light radiated from the light emitting diode die 12 is excitated by the phosphor powder to have a different wavelength and then mixture with original light.
The light emitting diode die 12 is mounted on a bottom of the encapsulation 11. the light emitting diode die 12 has two electrodes 120, 122. the two electrodes 120, 122 are exposed out of the bottom of the encapsulation 11. specially, the encapsulation 11 has a bottom surface 112. the two electrodes 120, 122 stand on the bottom surface 112 and are un-encapsulated on the bottom of the encapsulation.
The isolating layer 13 is not transparent. The isolating layer 13 covers the bottom of the encapsulation 11. Further, the isolating layer 13 is attached to the bottom surface 112 of the encapsulation 11 without the electrodes 120, 122 located. Two recesses 130 are defined below the two electrodes 120, 122, respectively, thereby exposing the electrodes 120, 122 out of the isolating layer 13. The isolating layer 13 has a lower surface 132 which is away from the encapsulation 11. In this embodiment, the lower surface 132 is parallel to the bottom surface 112 of the encapsulation 11. The isolating layer 13 can be made of epoxy molding compound (EMC) or sheet molding compound (SMC).
The two leads 14 each are positioned at one of the recesses 130. Each lead 14 is extended from one recess 130 of the isolating layer 13 away from the encapsulation 11 and covers the lower surface 132 of the isolating layer 13. Each lead 14 is attached with a corresponding electrode 120/122, thereby electrically connecting to the light emitting diode die 12.
Referring to
A method for manufacturing the light emitting diode package in accordance with the first embodiment of the present disclosure includes steps of:
At block 202, referring to
At block 204, referring to
At block 206, referring to
At block 208, referring to
At block 210, referring to
The method 200 can further include a step of cutting the encapsulation 11 and the isolating layer 13 into several individual pieces to obtain several individual light emitting diode packages 10. Each light emitting diode package 10 includes one light emitting diode die 12 and two leads 14. In this embodiment, the cutting process is performed along an arrowhead illustrated in
The film 20 can be made of an uv film. Accordingly, when the film 20 is needed to be removed, an uv light can be supplied on the uv film to decrease a viscosity of the uv film, thereby separating the uv film from the encapsulation 11.
It is to be further understood that even though numerous characteristics and advantages have been set forth in the foregoing description of embodiments, together with details of the structures and functions of the embodiments, the disclosure is illustrative only; and that changes may be made in detail, according in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
The embodiments shown and described above are only examples. Many details are often found in the art such as the other features of a light emitting diode package. Therefore, many such details are neither shown nor described. Even though numerous characteristics and advantages of the present technology have been set forth in the foregoing description, together with details of the structure and function of the present disclosure, the disclosure is illustrative only, and changes may be made in the detail, especially in matters of shape, size and arrangement of the parts within the principles of the present disclosure up to, and including the full extent established by the broad general meaning of the terms used in the claims. It will therefore be appreciated that the embodiments described above may be modified within the scope of the claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201310742364.2 | Dec 2013 | CN | national |
