Patent Application
20070215896
1. Field of the Invention
The present invention relates to a light emitting diode (LED), and more particular to a light emitting diode package structure and a method of manufacturing the same.
2. Description of Prior Art
A light emitting diode (LED) is a solid-state semiconductor device that combines two carriers produced by passing an electric current through the LED to release energy in the form of light. LED has the advantages of a compact size, a fast response rate, and a pollution-free feature, so that the LEDs can be used extensively in different industries. Since LEDs have bottlenecks including an insufficient brightness and a low luminous efficiency at an early stage, a high power LED is developed later to overcome the drawback of insufficient brightness, and thus LEDs become increasingly popular in the high power illumination market and tend to gradually take over the position of traditional tungsten lamps. LED products have the potential of replacing traditional illumination devices.
As LED manufacturing technologies are improved constantly and new materials are developed to meet the requirements of various different applications, the technology and structure of LEDs become mature, and thus leading to the development of a high power LED with enhanced energy capacity and brightness as well as the extensive use of high power LEDs in different areas. Among the types of high power LEDs, the surface mount device light emitting diode (SMD LED) is a common type of LEDs, and the general SMD LEDs are divided mainly into two types: a lead frame type and a printed circuit board type. The lead frame type uses a metal frame and a heat-resisting plastic material to produce a socket as a fixed lead frame of an LED chip by injection molding, and the printed circuit board type uses a composite material as a substrate, and both of these two types have to go through the processes of die bonding, wire bonding and encapsulation processes to complete the LED structure.
In a general die bonding process as shown in
However, there is a major drawback of the aforementioned packaging process, since the package structure and material cannot resist high temperature, and particularly the light emitting diode and other circuit board have to be processed in a soldering pot (at 250° C.˜300° C.), and the plastic shell 101 and the soft plastic material 103 usually cannot stand the high temperature of the soldering pot, and the light emitting diode structure may have broken lines or the plastic shell 101 may become soft. Even if the plastic shell 101 and the soft plastic material 103 can resist the high temperature, the coefficients of thermal expansion of the plastic shell 101 and the soft plastic material 103 are different, and cracks may be produced between the packaging plastic shell 101 and the soft plastic material 103, and thus resulting a defective light emitting diode. To reduce the defects in a manufacturing process, the soldering is conducted manually, and thus making the manufacture more difficult and time-consuming.
In view of the foregoing shortcomings of the prior art, the inventor of the present invention based on years of experience in the related industry to conduct experiments and modifications, and finally designed a light emitting diode package structure and a method of manufacturing the same to overcome the shortcomings of the prior art structure.
The present invention is to provide a light emitting diode package structure with a heat-resisting cover and a method of manufacturing the same that adopts a heat-resistant packaging material capable of contacting air directly as a packaging cover material to improve the yield rate for the process of connecting other electronic components at a high temperature and overcome the problem of having cracks produced by the thermal expansion of traditional packaging housing and packaging material.
Accordingly, the present invention provides a light emitting diode packaging structure and a method of manufacturing the same that comprise a base, an LED chip, a plastic shell, and a packaging material, wherein the plastic shell is substantially in the shape of a bowl, and the plastic shell has an injection hole thereon. After the LED chip is installed on the base, the packaging plastic shell is covered onto the base, and the LED chip is fully and air-tightly sealed. A packaging material is injected into the plastic shell through the injection hole until the plastic shell is filled up with the packaging material to form a packaging cover, and finally the packaging plastic shell is removed to complete the LED package structure.
The features of the invention believed to be novel are set forth with particularity in the appended claims. The invention itself however may be best understood by reference to the following detailed description of the invention, which describes certain exemplary embodiments of the invention, taken in conjunction with the accompanying drawings in which:
FIGS. 5(a) to 5(c) are schematic view of a manufacturing procedure according to another preferred embodiment of the invention;
The technical characteristics, features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiments with reference to the accompanying drawings.
Referring to FIGS. 2 to 4 for the cross-sectional views of an LED packaging process according to a preferred embodiment of the present invention, the structure of an LED packaging process as shown in
In
Referring to
injecting a packaging material into an injection hole 31 of the plastic shell 3 for the formation until the plastic shell 3 is filled up with the packaging material 4 (S3); and releasing and removing the mold of the plastic shell 3 to complete the light emitting diode structure, after the packaging material 4 forms a packaging cover 11 (S4).
Referring to
The present invention are illustrated with reference to the preferred embodiment and not intended to limit the patent scope of the present invention. Various substitutions and modifications have suggested in the foregoing description, and other will occur to those of ordinary skill in the art. Therefore, all such substitutions and modifications are intended to be embraced within the scope of the invention as defined in the appended claims.
