Light emitting diode package

Abstract

A light emitting diode package with reduced light loss includes a package substrate, a light emitting diode chip mounted on the package substrate and an encapsulant formed on the package substrate to encapsulate the light emitting diode chip. The encapsulant has a refractive index gradient with refractive indices continuously increasing from a peripheral surface thereof to a central axis thereof.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features and other advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

FIG. 1 is a side sectional view illustrating a conventional Light Emitting Diode (LED) package;

FIG. 2 is a side sectional view illustrating another conventional LED package;

FIG. 3 is a side sectional view illustrating an LED package according to an embodiment of the present invention including a refractive index gradient and light paths of an encapsulant;

FIG. 4 is a graph illustrating examples of refractive index gradient of the encapsulant according to various embodiments of the present invention;

FIG. 5 is a side sectional view illustrating an LED package according to another embodiment of the present invention including the refractive index gradient of the encapsulant;

FIG. 6 is a view illustrating an LED package according to another embodiment of the present invention; and

FIG. 7 is a view illustrating an LED package according to further another embodiment of the present invention.

Claims

1. A light emitting diode package comprising: a package substrate;a light emitting diode chip mounted on the package substrate;an encapsulant formed on the package substrate to encapsulate the light emitting diode chip,wherein the encapsulant has a refractive index gradient with refractive indices continuously increasing from a peripheral surface thereof to a central axis thereof.

2. The light emitting diode package according to claim 1, wherein the refractive indices of the encapsulant increase nonlinearly from the peripheral surface thereof to the central axis thereof.

3. The light emitting diode package according to claim 2, wherein the refractive index gradient of the encapsulant has a parabolic form with respect to a horizontal distance.

4. The light emitting diode package according to claim 2, wherein the refractive index gradient of the encapsulant has a semicircular form with respect to a horizontal distance.

5. The light emitting diode package according to claim 1, wherein the refractive indices of the encapsulant increase linearly from the peripheral surface thereof to the central axis thereof.

6. The light emitting diode package according to claim 1, wherein the encapsulant comprises a polymer resin.

7. The light emitting diode package according to claim 1, wherein the encapsulant comprises glass.

8. The light emitting diode package according to claim 1, wherein the refractive index of the encapsulant is higher in an upper region thereof than in a lower region thereof.

9. The light emitting diode package according to claim 8, wherein the refractive indices of the encapsulant increase continuously from a lower region thereof to an upper region thereof.

10. The light emitting diode package according to claim 1, further comprising a reflecting cup disposed on the package substrate, wherein the light emitting diode chip is mounted on a floor surface of the reflecting cup.

11. The light emitting diode package according to claim 10, wherein the reflecting cup has a reflective metal film coated on an inner surface thereof.

12. The light emitting didoe package according to claim 10, wherein the reflecting cup has oxide powder having a refractive index of at least 2.0 dispersed therein.

13. The light emitting diode package according to claim 12, wherein the oxide powder comprises TiO2.