Light emitting diode package

Information

  • Patent Grant
  • D678225
  • Patent Number
    D678,225
  • Date Filed
    Wednesday, December 14, 2011
    13 years ago
  • Date Issued
    Tuesday, March 19, 2013
    11 years ago
  • US Classifications
    Field of Search
    • US
    • D13 180
    • D26 2
    • 257 079000
    • 257 080000
    • 257 081000
    • 257 088000
    • 257 089000
    • 257 095000
    • 257 098000
    • 257 099000
    • 257 100000
    • 257 E33058
    • 313 483000
    • 313 498000
    • 313 500000
    • 362 555000
    • 362 800000
  • International Classifications
    • 1303
    • Term of Grant
      14Years
      Disclaimer
      This patent is subject to a terminal disclaimer.
Abstract
Description


FIG. 1 is a front perspective view of light emitting diode package showing the new design;



FIG. 2 is a front elevational view thereof;



FIG. 3 is a rear elevational view thereof;



FIG. 4 is a left side elevational view thereof;



FIG. 5 is a right side elevational view thereof;



FIG. 6 is a top plan view thereof; and,



FIG. 7 is a bottom plan view thereof.


Claims
  • The ornamental design for light emitting diode package, as shown and described.
Priority Claims (1)
Number Date Country Kind
100305993 Nov 2011 TW national
US Referenced Citations (11)
Number Name Date Kind
D578084 Kobayakawa Oct 2008 S
D608309 Kim Jan 2010 S
D628541 Lin Dec 2010 S
D632267 Chen et al. Feb 2011 S
D635529 Hsu Apr 2011 S
D640995 Lin et al. Jul 2011 S
D640996 Lee et al. Jul 2011 S
D656107 Hsu Mar 2012 S
20070096114 Aoki et al. May 2007 A1
20100102348 Lin Apr 2010 A1
20110127566 Yoon Jun 2011 A1