Light emitting diode package

Information

  • Patent Grant
  • D1000400
  • Patent Number
    D1,000,400
  • Date Filed
    Friday, April 16, 2021
    3 years ago
  • Date Issued
    Tuesday, October 3, 2023
    9 months ago
  • US Classifications
    Field of Search
    • US
    • D13 180
    • D24 1
    • CPC
    • H01L25/167
    • H01L25/0753
    • H01L27/15
    • H01L27/156
    • H01L31/02
    • H01L33/00
    • H01L33/04
    • H01L33/08
    • H01L33/10
    • H01L33/20
    • H01L33/38
    • H01L33/42
    • H01L33/48
    • H01L33/483
    • H01L33/486
    • H01L2223/5441
    • H01L2223/54433
  • International Classifications
    • 1303
    • Term of Grant
      15Years
Abstract
Description


FIG. 1 is a top perspective view of the light emitting diode package;



FIG. 2 is a top view of the light emitting diode package of FIG. 1;



FIG. 3 is a bottom view of the light emitting diode package of FIG. 1;



FIG. 4 is a side view of the light emitting diode package of FIG. 1;



FIG. 5 is an opposing side view of the light emitting diode package of FIG. 1;



FIG. 6 is an end view of the light emitting diode package of FIG. 1;



FIG. 7 is an opposing end view of the light emitting diode package of FIG. 1; and,



FIG. 8 is a bottom perspective view of the light emitting diode package of FIG. 1.


The broken lines shown in the drawings depict portions of the light emitting diode package that form no part of the claimed design.


Claims
  • The ornamental design for a light emitting diode package, as shown and described.
US Referenced Citations (36)
Number Name Date Kind
6084679 Steffan Jul 2000 A
D615504 Keller et al. May 2010 S
D656906 Leung Apr 2012 S
8242514 Joung Aug 2012 B2
D671661 Leung Nov 2012 S
D675169 Chou Jan 2013 S
8415260 Banach Apr 2013 B2
D691973 Donofrio et al. Oct 2013 S
D698322 Takeda Jan 2014 S
D703348 Reiherzer Apr 2014 S
D709041 Yu Jul 2014 S
D709464 Abare et al. Jul 2014 S
D711840 Lowes et al. Aug 2014 S
D718258 Lowes et al. Nov 2014 S
D718725 Reiherzer et al. Dec 2014 S
8901715 Popp Dec 2014 B1
D746240 Bergmann et al. Dec 2015 S
D777122 Bergmann Jan 2017 S
D783547 Bergmann et al. Apr 2017 S
D790486 Reiherzer et al. Jun 2017 S
D794583 Kuriki Aug 2017 S
10439112 Clark Oct 2019 B2
D926714 Wilcox Aug 2021 S
11145689 Hall Oct 2021 B2
20020036356 Teshima Mar 2002 A1
20050250291 Baluswamy Nov 2005 A1
20090108281 Keller Apr 2009 A1
20120126257 Reiherzer May 2012 A1
20150311249 Weng Oct 2015 A1
20150311414 Lin Oct 2015 A1
20170243831 Butler Aug 2017 A1
20180094799 Shan Apr 2018 A1
20180286841 Makanoeich Oct 2018 A1
20190164901 Liu May 2019 A1
20190355783 Koh Nov 2019 A1
20200176507 Hall Jun 2020 A1
Foreign Referenced Citations (5)
Number Date Country
D140189 Apr 2011 TW
D144345 Dec 2011 TW
D157836 Dec 2013 TW
D160509 May 2014 TW
D170851 Oct 2015 TW
Non-Patent Literature Citations (3)
Entry
Examination Report for Taiwanese Patent Application No. 111301994, dated Sep. 30, 2022, 6 pages.
Examination Report for Taiwanese Patent Application No. 110305363, dated Jan. 25, 2022, 6 pages.
Reasons for Rejection for Taiwanese Patent Application No. 110305363, dated Jul. 5, 2022, 5 pages.