Light emitting diode package

Information

  • Patent Grant
  • D709039
  • Patent Number
    D709,039
  • Date Filed
    Thursday, September 13, 2012
    13 years ago
  • Date Issued
    Tuesday, July 15, 2014
    11 years ago
  • US Classifications
    Field of Search
    • US
    • D13 180
    • D26 1
    • 257 079000
    • 257 080000
    • 257 081000
    • 257 088000
    • 257 089000
    • 257 095000
    • 257 098000
    • 257 099000
    • 257 100000
    • 257 E33058
    • 313 483000
    • 313 498000
    • 313 500000
    • 362 555000
    • 362 800000
    • CPC
    • H01L25/167
    • H01L25/0753
    • H01L33/08
    • H01L33/10
    • H01L33/20
    • H01L33/38
    • H01L33/52
    • H01L33/54
    • H01L33/60
    • H01L33/62
    • H01L33/382
    • H01L33/486
    • H01L33/642
  • International Classifications
    • 1303
    • Term of Grant
      14Years
Abstract
Description


FIG. 1 is a front perspective view of a light emitting diode package showing the new design;



FIG. 2 is a bottom perspective view thereof;



FIG. 3 is a front elevational view thereof;



FIG. 4 is a rear elevational view thereof;



FIG. 5 is a left side elevational view thereof;



FIG. 6 is a right side elevational view thereof;



FIG. 7 is a top plan view thereof; and,



FIG. 8 is a bottom plan view thereof.


Claims
  • The ornamental design for a light emitting diode package, as shown and described.
US Referenced Citations (21)
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D668235 Chang et al. Oct 2012 S
D668623 Hsu Oct 2012 S
D669044 Hsu Oct 2012 S
D671082 Chang Nov 2012 S
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