Patent Application
20240423054
The present application claims priority to and the benefit of Korean Patent Application No. 10-2023-0077375, filed on Jun. 16, 2023 in the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference.
Aspects of some embodiments of the present disclosure relate to a light emitting display device.
A display device is a device that includes a screen or display panel that displays images, and includes a liquid crystal display (LCD), an organic light emitting diode (OLED), and the like.
Such display devices are used in various electronic devices such as mobile phones, navigation devices, digital cameras, electronic books, portable game consoles, and terminals.
Organic light emitting display devices generally have self-luminance characteristics and, unlike a liquid crystal display devices, generally do not require a separate light source, so the thickness and weight can be relatively reduced. In addition, organic light emitting diode displays have relatively high-quality characteristics such as relatively low power consumption, relatively high luminance, and relatively fast response speed.
The above information disclosed in this Background section is only for enhancement of understanding of the background and therefore the information discussed in this Background section does not necessarily constitute prior art.
Aspects of some embodiments include a light emitting display device securing a space capable of transmitting a voltage to a cathode by a method such as using a laser.
Aspects of some embodiments include a high-resolution light emitting display device.
Aspects of some embodiments include a light emitting display device in which light emitting devices of the same color have the same lifetime.
A light emitting display device according to some embodiments includes one unit pixel group composed of at least two unit pixels, one unit pixel including a first light emitting layer, a second light emitting layer, and a third light emitting layer corresponding to three primary colors, the first light emitting layer including two first light emitting layers in one unit pixel, a laser drilling position is formed in a part of the unit pixel group, and the second light emitting layer and the third light emitting layer adjacent to the laser drilling position include a second modified light emitting layer including a groove, the second and third normal light emitting layers are formed of a third modified light emitting layer, and the second and third light emitting layers are formed of a second normal light emitting layer and a third normal light emitting layer that do not include grooves, and the area of the second modified light emitting layer and the area of the second normal light emitting layer are the same or have an area difference of less than 10%, and the area of the third modified light emitting layer and the area of the third normal light emitting layer are the same or have an area difference of less than 10%.
According to some embodiments, the grooves of the second modified light emitting layer and the grooves of the third modified light emitting layer may be respectively formed at a side of the laser drilling position of the second deformable light emitting layer and that of the third modified light emitting layer.
According to some embodiments, the second modified light emitting layer may be extended at a side portion of the second normal light emitting layer, the grooves of the second modified light emitting layer may be reduced at a corner portion of the second normal light emitting layer, the third modified light emitting layer may be extended at a side portion of the third normal light emitting layer, and the grooves of the third modified light emitting layer may be narrowed at a corner portion of the third normal light emitting layer.
According to some embodiments, planar shapes of the second normal light emitting layer and the third normal light emitting layer may have a quadrangle shape, and corners may have chamfered or rounded corners.
According to some embodiments, the first light emitting layer is formed of a first normal light emitting layer that does not contain grooves, and the first light emitting layer included in the unit pixel includes a first-1 light emitting layer and a first-2 light emitting layer, and the first-1 light emitting layer and the first-2 light emitting layer have a rectangular shape in a flat shape, and the corner portion is away or has round corners, the direction in which the first light emitting layer is arranged and the direction in which the first and second light emitting layers are arranged may be different.
According to some embodiments, included in one unit pixel, a light emitting device including the first-1 light emitting layer and a light emitting device including the first-2 light emitting layer may be electrically connected to the same pixel driving unit through a connection line.
According to some embodiments, when all of the laser drilling positions are positioned in the one unit pixel, a portion of the connection line may extend along the periphery of the unit pixel.
According to some embodiments, the first light emitting layer adjacent to the laser drilling position is formed as a first modified light emitting layer that includes a home, and the aforementioned first light emitting layer located away from the laser drilling position is formed as a first normal light emitting layer that does not include a home, the area of the first modified light emitting layer and the area of the first normal light emitting layer can be the same or have an area difference of 10% or less.
According to some embodiments, each of the first normal light emitting layers has a rectangular shape in a planar shape, corners are chamfered or rounded, and two first modified light emitting layers are included in one unit pixel, and the two first modified light emitting layers may have different elongated directions.
According to some embodiments, the second modified light emitting layer may additionally extend even at a corner portion of the second normal light emitting layer, and the third modified light emitting layer may additionally extend also at a corner portion of the third normal light emitting layer.
According to some embodiments, the one unit pixel group may include four unit pixels, and the laser drilling position may be positioned across all four unit pixels.
According to some embodiments, the center of the laser drilling position may be positioned at one of the four unit pixels.
According to some embodiments, the center of the laser drilling position may be positioned at a point where the four unit pixels meet.
According to some embodiments, the one unit pixel group may include four unit pixels, and the laser drilling position may be positioned across two of the four unit pixels.
According to some embodiments, the one unit pixel group may include four unit pixels, and the laser drilling position may be positioned in one of the four unit pixels.
According to some embodiments, the laser drilling positions may be different from each other in at least two different unit pixel groups.
According to some embodiments, a light emitting display device includes one unit pixel group including at least two unit pixels, one unit pixel including a first light emitting layer, a second light emitting layer, and a third light emitting layer corresponding to three primary colors, wherein the first light emitting layer includes two first light emitting layers in one unit pixel, a laser drilling position is formed in a part of the unit pixel group, the first light emitting layer is formed of a first normal light emitting layer not including a groove, and the second light emitting layer and the third light emitting layer are formed of a second modified light emitting layer and a third modified light emitting layer including grooves.
According to some embodiments, among the second modified light emitting layer and the third modified light emitting layer adjacent to the laser drilling position, the groove may be formed at a side of the laser drilling position of the second modified light emitting layer and the third modified light emitting layer, respectively.
According to some embodiments, the second modified light emitting layer and the third modified light emitting layer positioned apart from the laser drilling position may be positioned on a side different from a side on which the groove is positioned in the second modified light emitting layer and the third modified light emitting layer adjacent to the laser drilling position, respectively.
According to some embodiments, the one unit pixel group includes four unit pixels, the second modified light emitting layer and the third modified light emitting layer have a rectangular shape except for the groove, and have chamfered or rounded corners, each of the second modified light emitting layer and the third modified light emitting layer are included in the one unit pixel group, each of the second modified light emitting layer and the third modified light emitting layer adjacent to the laser drilling position is one, and the second modified light emitting layer is positioned away from the laser drilling position, and the third modified light emitting layers, respectively, and corners where the grooves are positioned in the second and third modified light emitting layers adjacent to the laser drilling position and corners at which the grooves are positioned in the second and third modified light emitting layers positioned away from the laser drilling position may all be different.
According to some embodiments, a structure for applying power to a cathode, such as laser drilling, may be formed across adjacent unit pixels, and thus, despite a reduced area, light emitting devices of the same color may have the same area and the same lifetime. The planar shape of at least one light emitting device may be changed.
According to some embodiments, a high-resolution light emitting display device may be provided by preventing a user from seeing a low resolution by preventing light emitting regions or light emitting devices of the same color from being located adjacent to each other in two adjacent unit pixels.
Hereinafter, with reference to the accompanying drawings, aspects of some embodiments will be described in more detail so that those skilled in the art can carry out embodiments according to the present disclosure.
Embodiments according to the present disclosure may be embodied in many different forms and is not limited to the embodiments set forth herein.
In order to more clearly describe the embodiments, some description of some parts or components that is not necessary to enable a person having ordinary skill in the art to make and use the embodiments according to the present disclosure may be omitted, and the same reference numerals are assigned to the same or similar constituent elements throughout the specification.
Also, the size and thickness of each component shown in the drawings are arbitrarily represented for the convenience of explanation, so embodiments according to the present disclosure are not necessarily limited to that what is shown.
In the drawings, the thickness is shown enlarged to clearly express the various layers and regions.
In the drawings, for convenience of explanation, the thicknesses of some layers and regions are exaggerated.
Also, when a part such as a layer, film, region, plate, or component is said to be “above” or “on” another part, this includes not only the case where it is “directly on” the other part, but also the case where there is another part in between.
Conversely, when a part is said to be “directly on” another part, it means that there is no other part in between.
In addition, being “above” or “on” a reference part means being positioned above or below the reference part, and does not necessarily mean being positioned “above” or “on” it in a direction opposite to gravity.
In addition, throughout the specification, when a certain component is said to “include,” it means that it may further include other components without excluding other components unless otherwise stated.
In addition, throughout the specification, when reference is made to “planar image,” it means when the target part is viewed from above, and when reference is made to “cross-sectional image,” it means when a cross-section of the target part cut vertically is viewed from the side.
In addition, throughout the specification, when reference is made to “connected,” this does not mean only the case where two or more components are directly connected, but also when two or more constituent elements are indirectly connected through another component, when physically connected or electrically connected, as well as when referred to by different names according to positions or functions, but may include connecting substantially integral parts to each other.
In addition, throughout the specification, when a part such as a wire, layer, film, region, plate, or component “extends in a first direction or a second direction,” it does not mean only a straight line extending in the corresponding direction, but also includes a structure extending generally along the first or second direction, a structure that is bent at one part, has a zigzag structure, or a structure that extends while including a curved structure.
In addition, electronic devices (e.g., mobile phones, TVs, monitors, and notebook computers) including display devices and display panels described in the specification or electronic devices including display devices and display panels manufactured by the manufacturing method described in the specification are not excluded from the scope of the present specification.
First, a planar structure of four unit pixels included in a light emitting display device will be described with respect to
In
Four unit pixels PXU11, PXU12, PXU21, and PXU22 illustrated in
Each of the unit pixels PXU11, PXU12, PXU21, and PXU22 can include three pixel driving parts (refer to PCa, PCb, and PCc in
Each light emitting device may include an anode, a light emitting layer, and a cathode, and in
The planar shape of each light emitting layer (EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2, EML11b, EML12b, EML21b, EML22b, EML11c, EML12c, EML21c, EML22c) shown in
For example, the opening OP of the pixel defining layer 380 exposes at least a portion of the anode, and within the opening OP of the pixel defining layer 380, each light emitting layer (EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2, EML11b, EML12b, EML21b, ML22b, EML11c, EML12c, EML21c, EML22c) may be positioned.
As a result, the light emitting layers (EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2, EML11b, EML12b, EML21b, EML22b, EML11c, EML12c, EML21c, EML22c) open the pixel defining layer 380 (OP), the light emitting layers (EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2, EML11b, EML12b, EML21b, EML22b, EML11c, EML12c, EML21c, EML22c) are pixel defining layers 380 and may have the same planar shape as the planar shape of the opening OP.
Here, each of the light emitting layers (EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2, EML11b, EML12b, EML21b, EML22b, EML11c, EML12c, EML21c, EML22c) has an opening (OP), and may include at least one of quantum dot materials according to some embodiments.
The pixel defining layer 380 and the light emitting layers (EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2, EML11b, EML12b, EML21b, EML22b, EML11c, EML12c, EML21c, EML22c) are shown in
Each light emitting layer (EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2, EML11b, EML12b, EML21b, EML22b, EML11c, EML12c, EML21c, EML22c) is a first light emitting layer capable of emitting different colors (EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2), a second light emitting layer (EML11b, EML12b, EML21b, EML22b), and a third light emitting layer (EML11c, EML12c, EML21c, EML22c), the first light emitting layers (EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2) may emit the same color as the first-1 light emitting layers (EML11a1, EML12a1, EML21a1, EML22a1) and the first-2 light emitting layers (EML11a2, EML12a2, EML21a2, EML22a2).
Here, the first light emitting layer can emit red light, the second light emitting layer can emit green light, and the third light emitting layer can emit blue light.
However, according to some embodiments, the first light emitting layer divided into two light emitting layers (first-1 light emitting layer and first-2 light emitting layer) may emit blue or green light, and the remaining two lights may correspond to the second light emitting layer and the third light emitting layer, respectively.
Also, according to some embodiments, light of three primary colors other than red, green, and blue light may be emitted.
Within each unit pixel (PXU11, PXU12, PXU21, PXU22), the second light emitting layer (EML11b, EML12b, EML21b, EML22b) and the third light emitting layer (EML11c, EML12c, EML21c, EML22c) are arranged in the first diagonal direction, and the first-1 light emitting layer (EML11a1, EML12a1, EML21a1, EML22a1) and the first-2 light emitting layer (EML11a2, EML12a2, EML21a2, EML22a2) can be arranged in the second diagonal direction intersecting with the first diagonal direction.
Here, the first oblique direction is a direction between the reverse direction of the first direction DR1 and the second direction DR2, and may have an angle of 45 degrees with the reverse direction of the first direction DR1 or the second direction DR2.
Meanwhile, the second oblique direction is a direction between the first direction DR1 and the second direction DR2, and may have an angle of 45 degrees with the first direction DR1 or the second direction DR2.
Each of the three pixel driving units PCa, PCb, and PCc includes a first light emitting device including the first light emitting layers EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, and EML22a2, and a second light emitting device including the second light emitting layers EML11b, EML12b, EML21b, and EML22b. It is electrically connected to the third light emitting device including the device and the third light emitting layer (EML11c, EML12c, EML21c, EML22c).
Meanwhile, the pixel driving part connected to the first light emitting device is electrically connected to both the first-1 light emitting device, which includes the first-1 light emitting layer (EML11a1, EML12a1, EML21a1, EML22a1), and the first-2 light emitting device, which includes the first-2 light emitting layer (EML11a2, EML12a2, EML21a2, EML22a2), and at this time, the first-1 light emitting device and the first-2 light emitting device can be connected in parallel.
However, according to some embodiments, they may be connected in series.
Referring to
In
In addition, in the embodiments of
This may be because the laser drilling position LDP is positioned far from the largest light emitting layer EML11c among the four adjacent light emitting layers (EML11c, EML12a2, EML21a1, and EML22b).
A connecting electrode (see CE in
Laser drilling electrically connects the connecting electrode CE and a cathode formed as a whole by irradiating a laser to melt an insulating layer positioned between the two.
At this time, when the area of the portion melted by the laser is large and the laser is irradiated to the light emitting layer and/or the anode, and other conductors, a short-circuit may occur and the pixel may malfunction.
Therefore, it is necessary to allocate a certain area for laser drilling.
In the embodiments of
The light emitting layer (EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2, EML11b, EML12b, EML21b, EML22b, EML11c, EML12c, EML21c, EML22c) can be divided into a normal light emitting layer (EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2, EML11b, EML12b, EML21b, EML12c, EML21c, EML22c) that does not include a significantly concave home, and a modified light emitting layer (EML11c, EML22b) that includes a home.
Here, the normal light emitting layer may be positioned away from the laser drilling position LDP, and the modified light emitting layer may be positioned adjacent to the laser drilling position LDP.
The first light emitting layer (hereinafter referred to as a first normal light emitting layer) not including grooves (hereinafter referred to as a first normal light emitting layer; EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2) has a rectangular planar shape, and may have a structure with chamfered or rounded corners.
Some of the first normal light emitting layers (EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2) (first-1 normal light emitting layers EML11a1, EML12a1, EML21a1, EML22a1) are arranged to be elongated in the first direction DR1, and the other part (first-2 normal light emitting layers EML11a2, EML12a2, EML21a2, and EML22a2 may be arranged to be elongated in the second direction DR2.
On the other hand, the second light emitting layer (hereinafter referred to as the second normal light emitting layer; EML11b, EML12b, EML21b) that does not include grooves has a square planar shape and may have a structure in which corners are chamfered, according to some embodiments, the corners may also be rounded.
Hereinafter, chamfered embodiments will be mainly examined.
In addition, the third light emitting layer (hereinafter also referred to as the third normal light emitting layer; EML12c, EML21c, EML22c) without grooves may have a square planar shape and a structure with chamfered corners.
Hereinafter, chamfered embodiments will be mainly examined.
In the embodiments of
However, according to some embodiments, the areas may be the same or the second normal light emitting layer (EML11b, EML12b, EML21b) may have a larger area.
According to some embodiments, the first normal light emitting layer (EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2), the second normal light emitting layer (EML11b, EML12b, EML21b), and the third normal light emitting layer (EML12c, EML21c, EML22c) can have a polygonal shape such as a triangle or a circular or elliptical shape, and in the case of a polygon, the edges may be chamfered or have rounded corners.
Meanwhile, the modified light emitting layer (EML11c, EML22b) including the groove is positioned adjacent to the laser drilling position LDP, and includes a recessed groove to maintain a certain distance from the position of the laser drilling position LDP.
In
Here, the dotted line represents the size of the third normal light emitting layer (EML12c, EML21c, EML22c) and the second normal light emitting layer (EML11b, EML12b, EML21b) positioned in different parts; for example, it is examined through
First, a plan shape of the third light emitting layer EML11c positioned in the unit pixel PXU11 will be described through
In
Meanwhile, in
In
In
For example, in the third modified light emitting layer EML11c, reference numerals are assigned to the side portion EML11c-1 and the groove portion EML11c-2, and in the third normal light emitting layer EML12c, reference numerals are assigned to the side portion EML12c-1 and the corner portion EML12c-2 corresponding to the groove portion EML11c-2 of the third modified light emitting layer EML11c.
An arrow, shown in
That is, it extends from the side portion EML12c-1 of the third normal light emitting layer EML12c to the side portion EML11c-1 of the third modified light emitting layer EML11c, and contracts from the corner portion EML12c-2 of the third normal light emitting layer EML12c to the groove portion EML11c-2 of the third modified light emitting layer EML11c.
A relationship between the areas of the third normal light emitting layer EML12c is shown in
In
The area located on the left side of
In
An equal sign, shown in the center of
Therefore, since the third modified light emitting layer EML11c and the third normal light emitting layers EML12c, EML21c, and EML22c all have the same area, and the lifespan of the light emitting layer is proportional to the planar area of the light emitting layer, all the third light emitting layers EML11c, EML12c, EML21c, and EML22c may have the same lifespan.
The area of the third light emitting layers EML11c, EML12c, EML21c, and EML22c may be formed in various ways according to the material constituting the light emitting layer.
Meanwhile, a difference in area between the two sides may occur due to dispersion or errors that may occur in the actual manufacturing process.
Here, the position of the edge of the light emitting layer may vary within 1 μm due to dispersion or error, and the area difference that may occur between the normal light emitting layer and the modified light emitting layer due to dispersion or error may have an area difference of up to 10%.
Although a difference in lifespan of the light emitting layer may occur due to the difference in area, this difference in lifespan may be negligible.
Meanwhile, hereinafter, the planar shape of the second light emitting layer EML22b positioned in the unit pixel PXU22 will be described through
In
Meanwhile, in
In
In
For example, reference numerals are assigned to the side portion EML22b-1 and groove portion EML22b-2 of the second modified light emitting layer EML22b, and reference numerals are assigned to the side portion EML21b-1 of the second normal light emitting layer EML21b and the corner portion EML21b-2 corresponding to the groove portion EML22b-2 of the second modified light emitting layer EML22b.
An arrow, shown in
That is, it extends from the side portion EML21b-1 of the second normal light emitting layer EML21b to the side portion EML22b-1 of the second modified light emitting layer EML22b, and contracts from the corner portion EML21b-2 of the second normal light emitting layer EML21b to the groove portion EML22b-2 of the second modified light emitting layer EML22-b.
A relationship between the areas of the second normal light emitting layer EML21b is shown in
In
The portion located on the right side of
The portion located on the left side of
An equal sign, shown in the center of
Therefore, since the second modified light emitting layer EML22b and the second normal light emitting layers (EML11b, EML12b, and EML21b) all have the same area, and the lifespan of the light emitting layer is proportional to the planar area of the light emitting layer, all the second light emitting layers (EML11b, EML12b, EML21b, and EML22b) may have the same lifespan.
The area of the third light emitting layer (EML11b, EML12b, EML21b, EML22b) can be formed variably depending on the material constituting the light emitting layer.
Meanwhile, a difference in area between the two sides may occur due to dispersion or errors that may occur in the actual manufacturing process.
Here, the position of the edge of the light emitting layer may vary within 1 μm due to dispersion or error, and the area difference that may occur between the normal light emitting layer and the modified light emitting layer due to dispersion or error may have an area difference of up to 10%.
Although a difference in lifespan of the light emitting layer may occur due to the difference in area, this difference in lifespan may be negligible.
The groove side area Ald, which is the area between the corner portion EML12c-2 of the third normal light emitting layer EML12c and the groove portion EML11c-2 of the third modified light emitting layer EML11c shown in
However, according to some embodiments, the groove-side areas Ald of
As shown in
Also, when the laser drilling position LDP requires a certain area, it can be formed to span multiple adjacent unit pixels (PXU11, PXU12, PXU21, PXU22) as in the embodiments of
Since the spacing between adjacent light emitting layers can be changed due to the modified light emitting layer as described above, the horizontal spacing between light emitting layers will be examined in more detail through
The comparative example of
As a result, it can be confirmed that the spacing between each light emitting layer (EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2, EML11b, EML12b, EML21b, EML22b, EML11c, EML12c, EML21c, EML22c) is all the same as Gap1.
However, as the comparative example of
Referring to
However, the distance between the modified light emitting layers EML11c and EML22b, and the normal light emitting layer may have a different distance from Gap1.
For example, the third modified light emitting layer EML11c may have Gap2 at intervals from adjacent normal light emitting layers EML11a1, EML11a2, EML12a2, and EML21a1, and the second modified light emitting layer EML22b may have Gap3 at intervals from adjacent normal light emitting layers EML12a2, EML21a1, EML22a1, and EML22a2.
Referring to
Gap2, which is the distance between the third modified light emitting layer (EML11c) having a larger area and the adjacent normal light emitting layers (EML11a1, EML11a2, EML12a2, and EML21a1), is greater than Gap3, which is the distance between the second modified light emitting layer (EML22b), which has a smaller area, and the adjacent normal light emitting layers (EML12a2, EML21a1, EML22a1, and EML22a2) can have a large value.
Here, Gap1 may have a larger value than Gap2 and Gap3, and when Gap1 is 100, Gap2 may be about 95, according to embodiments, Gap2 may be 92 or more and 98 or less, and Gap3 may be about 93.
However, according to some embodiments, Gap3 may have a larger value than Gap2.
Meanwhile, in
Here, the interval between the modified light emitting layers may pass through the center of the laser drilling position LDP.
Meanwhile, among the intervals between the deformable light-emitting layers, the length corresponding to the laser drilling position LDP—that is, the length of the diameter of the laser drilling position LDP—may have an interval corresponding to Gap1, and the distance between the laser drilling position LDP and one deformal light emitting layer may have an interval equivalent to half of Gap1.
When Gap1 is 100, the diameter of the laser drilling position LDP may have a value of 90 or more and 100 or less, and the distance between the laser drilling position LDP and the modified light emitting layer may have a value of 50 or more and 55 or less.
Meanwhile, the area occupied by the laser drilling position LDP may have a value of 90 or less depending on the development of laser technology.
In the embodiments of
That is, a connecting electrode (see CE in
At this time, the opening through which the connecting electrode (see CE in
Hereinafter, the characteristics of comparative examples and embodiments will be numerically reviewed through
Here,
First, comparative example 1 and embodiment 1 will be compared and reviewed through
Comparative example 1 is shown in
Also, in
Referring to
Gap1 is an interval between normal emission layers in
However, in embodiment 1, the laser drilling part (L/D part) may have a value of Gap2 or Gap3, and the positions of Gap2 and Gap3 may be as shown in
Here, Gap1 may be about 25 μm, Gap2 may be about 24 μm, and Gap3 may be about 23.5 μm.
On the other hand, comparative example 2 and embodiment 2 through
Comparative example 2 is similar to
Referring to
Meanwhile, the gap (380 GAP) of the pixel defining layer (see 380 in
Gap1′ is the distance between the normal emission layers in comparative example 2, and may be the same as the distance (normal part) between the normal emission layers in embodiment 2.
However, in embodiment 2, the laser drilling portion (L/D portion) may have a value of Gap2′ or Gap3′.
The positions of Gap2′ and Gap3′ may be the same as the positions of Gap2 and Gap3 in
Here, Gap1′ may be about 21.5 μm, Gap2′ may be about 20 μm, and Gap3′ may be about 19.8 μm.
Referring to
The interval as described above may be changed according to embodiments.
Hereinafter, a cross-sectional structure of a light emitting display device according to some embodiments will be schematically reviewed through
In the cross-sectional view of
A light emitting device may be positioned in the light emitting device layer.
In addition, in
In
A brief overview of the driving element layer structure from the substrate 110 to the interlayer insulating layer 161 is as follows.
The substrate 110 may include a rigid material, such as glass, that does not bend, or may include a flexible material that can bend, such as plastic or polyimide.
In the case of a flexible substrate, a double-layered structure of polyimide and a barrier layer formed of an inorganic insulating material thereon may be repeatedly formed.
A lower shielding layer BML including metal is positioned on the substrate 110, and the lower shielding layer BML may overlap a channel of one of the transistors positioned in the pixel driving units (PCa, PCb, PCc) included in the pixel on a plane.
According to some embodiments, a driving low-voltage line (see 174 of
The substrate 110 and the lower shielding layer BML are covered by the buffer layer 111.
The buffer layer 111 serves to block penetration of impurity elements into the semiconductor layer ACT, and may be an inorganic insulating layer including silicon oxide SiOx, silicon nitride SiNx, or silicon oxynitride SiONx.
A semiconductor layer ACT formed of a silicon semiconductor (e.g., polycrystalline semiconductor (P-Si)) or an oxide semiconductor is positioned on the buffer layer 111.
The semiconductor layer ACT is a semiconductor layer positioned in the pixel driving units PCa, PCb, and PCc included in the pixel, and may include a channel of a transistor including a driving transistor and a first region and a second region positioned on both sides thereof.
Here, the channel of the transistor may be a portion of the semiconductor layer ACT overlapping the gate electrode GE, and the first region and the second region may be portions of the semiconductor layer ACT that do not overlap the gate electrode GE.
That is, the first region and the second region positioned on both sides of the channel of the semiconductor layer ACT are not covered by the gate electrode GE, and have conductive layer characteristics by plasma treatment or doping, so that they can serve as the first and second electrodes of the transistor.
A first gate insulating layer 141 may be positioned on the semiconductor layer ACT.
The first gate insulating layer 141 may be an inorganic insulating layer including silicon oxide SiOx, silicon nitride SiNx, or silicon oxynitride SiONx.
A first gate conductive layer including the gate electrodes GE of transistors positioned in the pixel driving units PCa, PCb, and PCc may be positioned on the first gate insulating layer 141.
An auxiliary driving low-voltage line 174-1 is positioned in the first gate conductive layer, and scan lines may be formed in addition to gate electrodes GE of transistors positioned in the pixel driving units PCa, PCb, and PCc.
Meanwhile, the first gate conductive layer may include one electrode of one capacitor positioned in the pixel driving units PCa, PCb, and PCc.
The first gate conductive layer may include a metal or metal alloy such as aluminum (Al), copper (Cu), molybdenum (Mo), titanium (Ti), or the like, and may be composed of a single layer or multiple layers.
After forming the first gate conductive layer, a plasma treatment or a doping process may be performed to make an exposed region of the first semiconductor layer a conductor.
That is, the semiconductor layer ACT covered by the gate electrode GE is not conductive, and a portion of the semiconductor layer ACT not covered by the gate electrode GE may have the same characteristics as the conductive layer.
An interlayer insulating layer 161 may be positioned on the first gate conductive layer and the first gate insulating layer 141.
The first interlayer insulating layer 161 may include an inorganic insulating layer including silicon oxide SiOx, silicon nitride SiNx, silicon oxynitride SiONx, or the like, and according to some embodiments, an inorganic insulating material may be formed thickly.
Also, according to some embodiments, the interlayer insulating layer 161 may be formed of an organic insulating layer and may include one or more materials selected from the group consisting of polyimide, polyamide, acrylic resin, benzocyclobutene, and phenol resin.
An anode layer including an anode and a connecting electrode CE is positioned on the interlayer insulating layer 161.
The anode is connected to the second region of the semiconductor layer ACT serving as the second electrode of the transistor through an opening (OP2; hereinafter referred to as an anode opening) located in the interlayer insulating layer 161 and the first gate insulating layer 141.
As a result, the anode can receive the output of the transistor.
The connecting electrode CE is formed of the same material as the anode and is connected to the auxiliary driving low-voltage line 174-1 through an opening (OP1; hereinafter referred to as a laser drilling opening) located in the interlayer insulating layer 161.
As a result, the connecting electrode CE receives the driving low-voltage ELVSS. The anode layer may be composed of a single layer including a transparent conductive oxide layer or a metal material, or a multi-layer including the same.
The transparent conductive oxide layer may include indium tin oxide (ITO), poly-ITO, indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), and indium tin zinc oxide (ITZO).
The metal material may include silver (Ag), molybdenum (Mo), copper (Cu), gold (Au), and aluminum (Al).
A pixel defining layer 380 including an opening OP is formed on the anode layer.
An opening (OP; hereinafter, also referred to as a light emitting device opening) of the pixel defining layer 380 is a portion corresponding to the light emitting region and/or the light emitting layer EML, exposes a portion of the anode, and may have a tapered sidewall.
The light emitting layer EML is positioned within the opening OP of the pixel defining layer 380, and the light emitting layer EML may also be positioned on the pixel defining layer 380 as shown in
The light emitting layer EML may be formed by an inkjet method, and may include at least one of quantum dot materials according to some embodiments.
When the light emitting layer EML is formed by the inkjet method, the pixel defining layer 380 may serve to partition the injected liquid, and in this case, the light emitting layer EML may be positioned only within the opening OP of the pixel defining layer 380.
The light emitting layer (EML) may include a quantum dot material, and according to some embodiments, a color conversion layer including a quantum dot material may be separately positioned above the cathode.
In the present specification, a quantum dot means a crystal of a semiconductor compound, and may include any material capable of emitting light of various emission wavelengths according to the size of the crystal or by adjusting the ratio of elements in the quantum dot compound.
The diameter of the quantum dots may be, for example, about 1 nm to 10 nm.
Quantum dots may be synthesized by a wet chemical process, an organometallic chemical vapor deposition process, a molecular beam epitaxy process, or a process similar thereto.
The wet chemical process is a method of growing quantum dot particle crystals after mixing an organic solvent and a precursor material.
When the crystal grows, since the organic solvent acts as a dispersant naturally coordinated on the surface of the quantum dot crystal and controls the growth of the crystal, the growth of quantum dot particles can be controlled through a process that is easier and cheaper than vapor deposition methods such as metal organic chemical vapor deposition MOCVD or molecular beam epitaxy MBE.
Quantum dots are group III-VI semiconductor compounds; group II-VI semiconductor compounds; group III-V semiconductor compounds; group I-III-VI semiconductor compounds; group IV-VI semiconductor compounds; group IV elements or compounds; or any combination thereof.
Examples of II-VI group semiconductor compounds include binary element compounds such as CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnO, HgS, HgSe, HgTe, MgSe, MgS and the like; ternary compounds such as CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, CdZnSe, CdZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, MgZnSe, MgZnS, and the like; quaternary compounds such as CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeS, HgZnSeTe, HgZnSTe, and the like; or any combination thereof.
Examples of group III-V semiconductor compounds include binary element compounds such as GaN, GaP, GaAs, GaSb, AlN, AlP, AlAs, AlSb, InN, InP, InAs, InSb, and the like; ternary compounds such as GaNP, GaNAs, GaNSb, GaPAs, GaPSb, AlNP, AlNAs, AlNSb, AlPAs, AlPSb, InGaP, InNP, InAlP, InNAs, InNSb, InPAs, InPSb, GaAlNP, and the like; quaternary compounds such as GaAlNAs, GaAlNSb, GaAlPAs, GaAlPSb, GaInNP, GaInNAs, GaInNSb, GaInPAs, GaInPSb, InAlNP, InAlNAs, InAlNSb, InAlPAs, InAlPSb, and the like; or any combination thereof.
Meanwhile, the group III-V semiconductor compound may further include a group II element.
Examples of the group III-V semiconductor compound further including a group II element may include InZnP, InGaZnP, InAlZnP, and the like.
Examples of group III-VI semiconductor compounds include binary element compounds such as GaS, Ga2S3, GaSe, Ga2Se3, GaTe, InS, InSe, In2Se3, InTe, and the like; ternary compounds such as InGaS3 and InGaSe3; or any combination thereof.
Examples of the group I-III-VI semiconductor compound include ternary compounds such as AgInS, AgInS2, AgInSe2, AgGaS, AgGaS2, AgGaSe2, CuInS, CuInS2, CuInSe2, CuGaS2, CuGaSe2, CuGaO2, AgGaO2, AgAlO2, and the like; quaternary compounds such as AgInGaS2 and AgInGaSe2; or any combination thereof.
Examples of group IV-VI semiconductor compounds include binary element compounds such as SnS, SnSe, SnTe, PbS, PbSe, PbTe, and the like; ternary compounds such as SnSeS, SnSeTe, SnSTe, PbSeS, PbSeTe, PbSTe, SnPbS, SnPbSe, SnPbTe, and the like; quaternary compounds such as SnPbSSe, SnPbSeTe, and SnPbSTe; or any combination thereof.
Group IV elements or compounds include single-element compounds such as Si, Ge, and the like; binary element compounds such as SiC, SiGe, and the like; or any combination thereof.
Each element included in a multi-element compound such as a binary element compound, a ternary element compound, and a quaternary element compound may be present in a particle at a uniform concentration or a non-uniform concentration.
That is, the chemical formula means the types of elements included in the compound, and the element ratios in the compound may be different.
For example, AgInGaS2 may mean AgInxGa1-xS2 (x is a real number between 0 and 1).
On the other hand, the quantum dot may have a single structure in which the concentration of each element included in the quantum dot is uniform or a dual core-shell structure.
For example, a material included in the core and a material included in the shell may be different from each other.
The shell of the quantum dots may serve as a protective layer for maintaining semiconductor properties by preventing chemical denaturation of the core and/or as a charging layer for imparting electrophoretic properties to the quantum dots.
The shell may be monolayer or multilayer.
The interface between the core and the shell may have a concentration gradient in which the concentration of elements present in the shell decreases toward the center.
Examples of the quantum dot shell include oxides of metals or non-metals, semiconductor compounds, or combinations thereof.
Examples of oxides of metals or nonmetals include binary element compounds such as SiO2, Al2O3, TiO2, ZnO, MnO, Mn2O3, Mn3O4, CuO, FeO, Fe2O3, Fe3O4, CoO, Co3O4, NiO, and the like; ternary compounds such as MgAl2O4, CoFe2O4, NiFe2O4, CoMn2O4, and the like; or any combination thereof.
Examples of semiconductor compounds include group III-VI semiconductor compounds, as described herein; group II-VI semiconductor compounds; group III-V semiconductor compounds; group I-III-VI semiconductor compounds; group IV-VI semiconductor compounds; or any combination thereof.
For example, the semiconductor compound may include CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnSeS, ZnTeS, GaAs, GaP, GaS, GaSe, AgGaS, AgGaS2, GaSb, HgS, HgSe, HgTe, InAs, InP, InGaP, InSb, AlAs, AlP, AlSb, or any combination thereof.
Each element included in a multi-element compound such as a two-element compound or a three-element compound may be present in a particle at a uniform or non-uniform concentration.
That is, the chemical formula means the types of elements included in the compound, and the element ratios in the compound may be different.
Quantum dots may have a full width of half maximum (FWHM) of an emission wavelength spectrum of about 45 nm or less, specifically about 40 nm or less, more specifically about 30 nm or less, and color purity or color reproducibility can be improved within this range.
In addition, since light emitted through the quantum dots is emitted in all directions, a wide viewing angle may be improved.
In addition, the shape of the quantum dots may be in the form of spherical, pyramidal, multi-arm, or cubic nanoparticles, nanotubes, nanowires, nanofibers, nanoplatelet particles, and the like.
Since the energy band gap can be controlled by adjusting the size of the quantum dots or the ratio of elements in the quantum dot compound, light of various wavelengths can be obtained from the quantum dot light emitting layer.
Therefore, by using quantum dots as described above (using quantum dots of different sizes or having different element ratios in a quantum dot compound), a light emitting device emitting light of various wavelengths can be implemented.
For example, control of the size of the quantum dots or the ratio of elements in the quantum dot compound may be selected to emit red, green and/or blue light.
In addition, the quantum dots may be configured to emit white light by combining light of various colors.
A first functional layer FL1 may be positioned between the anode and the light emitting layer EML, and a second functional layer FL2 may be positioned on the light emitting layer EML.
Here, the first functional layer FL1 may include a hole injection layer and/or a hole transport layer, and the second functional layer FL2 may include an electron transport layer and/or an electron injection layer.
Here, the functional layer FL and the light emitting layer EML may be referred to as an intermediate layer.
The first functional layer FL1 and the second functional layer FL2 are also formed on the pixel defining layer 380 and in the opening OP.
Therefore, in the embodiments of
However, according to some embodiments, the light emitting layer EML is positioned only within the opening OP of the pixel defining layer 380, and the functional layer FL may be formed on the pixel defining layer 380 and also within the opening OP.
A cathode is formed on the second functional layer FL2 and on the pixel defining layer 380 and the opening OP.
The anode, the light emitting layer EML, and the cathode constitute a light emitting device, and the light emitting device may further include a functional layer FL.
The current delivered to the anode passes through the first functional layer FL1, the light emitting layer EML, and the second functional layer FL2 and is delivered to the cathode.
At this time, the light emitting layer EML emits light due to the current flowing through the light emitting layer EML, so that the first light emitting device exhibits luminance.
Referring to
However, since the intermediate layer and the pixel defining layer 380 are melted by the laser, and the cathode and the connecting electrode CE are electrically connected, the cross-sectional structure may not be neat, unlike
Meanwhile, according to some embodiments, a spacer may be further formed on the pixel defining layer 380, and the spacer may have a tapered sidewall like the pixel defining layer 380.
Although the structure on the cathode is not shown in
The encapsulation layer may include at least one inorganic layer and at least one organic layer, and may have a triple-layer structure including a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer.
The encapsulation layer may be for protecting the light emitting layer EML from moisture or oxygen that may be introduced from the outside.
According to some embodiments, the encapsulation layer may include a structure in which an inorganic layer and an organic layer are sequentially stacked.
According to some embodiments, a sensing insulation layer and a plurality of sensing electrodes may be positioned on the encapsulation layer for touch sensing.
According to some embodiments, a layer including a polarizing plate may be attached to the encapsulation layer to reduce reflection of external light.
In addition, a color filter or a color conversion layer may be further formed to improve color quality, and at this time, a polarizing plate may not be attached.
A light blocking layer may be positioned between the color filters or the color conversion layer.
In addition, according to some embodiments, a layer having a material capable of absorbing some wavelengths of external light (hereinafter referred to as a reflection adjusting material) may be further included, and in this case, a polarizing plate may not be attached.
In addition, according to some embodiments, the front surface of the light emitting display device may be flattened by covering it with an additional organic layer (also referred to as a planarization layer).
Hereinafter, modified embodiments of the above embodiments will be reviewed through
First, in
In
In
Here, the groove is formed on the laser drilling position LDP side of the modified light emitting layers (EML11c, EML21b).
Meanwhile, in
Here, the groove is formed on the laser drilling position LDP side of the modified light emitting layers EML11c and EML12b.
In one light emitting display device, the laser drilling position LDP may be formed only at the position shown in
However, according to some embodiments, the laser drilling positions LDP formed at positions shown in
On the other hand, according to some embodiments, three positions including not only positions shown in
As described above, when the laser drilling positions LDP are variously arranged, the display quality may be uniform over the entire area of the light emitting display device.
In particular, even when the user rotates the light emitting display device by 90 degrees, the laser drilling position LDP is not skewed to one side, so the display quality can be constant.
Meanwhile, in
In
Here, the groove is formed on the laser drilling position LDP side of the modified light emitting layers (EML11c, EML11b).
Meanwhile, in
Here, the groove is formed on the laser drilling position LDP side of the modified light emitting layers (EML22c, EML22b).
In
In one light emitting display device, the laser drilling position LDP may be formed only at the position shown in
However, according to some embodiments, three laser drilling positions LDP each formed at positions shown in
As described above, when the laser drilling positions LDP are variously arranged, display quality may be uniform over the entire area of the light emitting display device.
In particular, even when the user rotates the light emitting display device by 90 degrees, the laser drilling position LDP is not skewed to one side, so the display quality can be constant.
Referring to
Hereinafter, referring to embodiments in which the modified light emitting layer is modified in a manner different from that of
For example, the third modified light emitting layer EML11c in
In
Meanwhile, the third modified light emitting layer EML11c is illustrated by a solid line, and the third modified light emitting layer EML11c not only has the side portion EML11c-1 and the groove portion EML11c-2, but also includes corner portions EML11-c3.
An arrow, shown in
That is, it extends from the side portion EML12c-1 of the third normal light emitting layer EML12c to the side portion EML11c-1 of the third modified light emitting layer EML11c, and extends from the corner portion EML12c-3 of the third normal light emitting layer EML12c to the corner portion EML11-c3 of the third modified light emitting layer EML11c, and the third normal light emitting layer EML12c is reduced from the corner portion EML12c-2 to the groove portion EML11c-2 of the third modified light emitting layer EML11c.
Meanwhile, in
In
The area located on the left side of
A portion located on the right side of
An equal sign, shown in the center of
Therefore, since the third modified light emitting layer EML11c and the third normal light emitting layers EML12c, EML21c, and EML22c all have the same area, the lifespan of the light emitting layer is proportional to the planar area of the light emitting layer, and all the third light emitting layers EML11c, EML12c, EML21c, and EML22c may have the same lifespan.
The area of the third light emitting layers EML11c, EML12c, EML21c, and EML22c may be formed in various ways according to the material constituting the light emitting layer.
Meanwhile, a difference in area between the two sides may occur due to dispersion or errors that may occur in the actual manufacturing process.
Here, the position of the edge of the light emitting layer may vary within 1 μm due to dispersion or error, and the area difference that may occur between the normal light emitting layer and the modified light emitting layer due to dispersion or error may have an area difference of up to 10%.
Although a difference in lifespan of the light emitting layer may occur due to the difference in area, this difference in lifespan may be negligible.
When the groove side area Ald is the same in the embodiments of
In
In the embodiments of
Here, the positions of the grooves of the two light emitting layers EML11c and EML22b adjacent to the laser drilling position LDP are fixed to be located on the side of the laser drilling position LDP, and the positions of the grooves of the other light emitting layers are free.
That is, the grooves of the second modified light emitting layers EML11b, EML12b, and EML21b and the third modified light emitting layers EML12c, EML21c, and EML22c located away from the laser drilling position LDP may be positioned on a side different from the side on which the grooves are located in the second and third modified light emitting layers EML22b and EML11c adjacent to the laser drilling position LDP, respectively.
Referring to
According to the embodiments of
Meanwhile, in
In
Referring to
For example, in
Here, the dotted lines indicate the sizes of the first normal light emitting layers (EML11a1, EML12a1, EML22a1, EML11a2, EML21a2, EML22a2) located in different parts, and will be examined through
The first modified light emitting layers EML12a2 and EML21a1 according to the embodiments of
Hereinafter, a planar shape of the first modified light emitting layer EML21a1 positioned in the unit pixel PXU21 among the first modified light emitting layers EML12a2 and EML21a1 will be described in detail.
The boundary of the first modified light emitting layer EML21a1 shown as a solid line is located outside the dotted line except for the groove.
As a result, it can be confirmed that the first modified light emitting layer EML21a1 extends more than the first normal light emitting layers EML11a1, EML12a1, and EML22a1 except for the groove.
However, the first normal light emitting layers EML11a1, EML12a1, and EML22a1 are formed to be larger in the portion where the groove of the first modified light emitting layer EML21a1 is located.
Also, as shown in
For example, on the right side of
In
A portion located on the left side of
An equal sign, shown in the center of
Therefore, the first modified light emitting layer EML21a1 and the first normal light emitting layers EML11a1, EML12a1, and EML22a1 all have the same area.
Also, the first modified light emitting layer EML12a2 positioned in the unit pixel PXU12 shown in
That is, the first modified light emitting layer EML12a2 has the same area as the first normal light emitting layers EML11a2, EML21a2, and EML22a2.
Here, since the lifespan of the light emitting layer is proportional to the planar area of the light emitting layer, all of the first light emitting layers EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, and EML22a2 may have the same lifespan.
The area of the first light emitting layer (EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2) may be formed in various ways according to the material constituting the light emitting layer.
Meanwhile, a difference in area between the two sides may occur due to dispersion or errors that may occur in the actual manufacturing process.
Here, the position of the edge of the light emitting layer may vary within 1 μm due to dispersion or error, and the area difference that may occur between the normal light emitting layer and the modified light emitting layer due to dispersion or error may have an area difference of up to 10%.
Although a difference in lifespan of the light emitting layer may occur due to the difference in area, this difference in lifespan may be negligible.
Meanwhile, in the embodiments of
That is, the center of the laser drilling position LDP and the points where all four unit pixels PXU11, PXU12, PXU21, and PXU22 meet may coincide with each other.
In this case, the modified light emitting layers EML11c and EML22b adjacent to the position LDP of the laser drilling may be the same or different from the position LDP of the laser drilling.
However, the gap between the modified light emitting layers EML11c and EML22b and the laser drilling position LDP may be formed at a certain level or more to prevent damage to the light emitting layer during laser drilling.
Here, a certain level can have a gap equivalent to half of the gap Gap1 between the normal light emitting layers, as seen in
Meanwhile, in the embodiments of
Referring to
Here, the opening VCP may be smaller than the area of the laser drilling position LDP, the length of the diameter of the opening may have a value smaller than Gap1, and when Gap1 is 100, it may have a value of 30 or more and less than 100.
Also, the opening VCP may have a quadrangular planar shape as shown in
In this case, the two light emitting layers EML11c and EML22b adjacent to the opening VCP may be formed as modified light emitting layers EML11c and EML22b, and each of the two light emitting layers EML11c and EML22b may have a side parallel to one side of the opening VCP.
Also, the area of the modified light emitting layers EML11c and EML22b may be the same as that of the normal light emitting layer displaying the same color among other normal light emitting layers.
Meanwhile, according to embodiments, the opening VCP may have various planar shapes, such as a circular shape, unlike that shown in
Although only one embodiment is shown in
Meanwhile, in the embodiments of
First, in
Referring to
Meanwhile,
Referring to
As shown in
That is, a connecting electrode (CE in
However, in the case of a row in which a connecting electrode (CE of
However, as in the embodiments of
On the other hand, in
The first-1 light emitting layers EML11a1, EML12a1, EML21a1 and EML22a1 and the first-2 light emitting layers EML11a2, EML12a2, EML21a2 and EML22a2 are electrically connected to one pixel driving unit PCa to form two first-1 light emitting layers EML11a1, EML12a1, EML21a1 and EML22a1, and the first and second light emitting layers (EML11a2, EML12a2, EML21a2, EML22a2) also need to be connected.
In
First, referring to
The connection line CLa may electrically connect the pixel circuit unit (see PCa in
The connection line CLa may be positioned on one of the conductive layers positioned between the substrate and the anode.
Meanwhile, referring to
The connection line CLb may electrically connect the pixel circuit unit (refer to PCa in
The connection line CLb may be positioned on one of the conductive layers positioned between the substrate and the anode.
In the above, it has been described that the anode of the light emitting device including the first-1 light emitting layer (EML11a1) and the anode of the light emitting device including the first-2 light emitting layer (EML11a2) are connected by the connection lines (CLa, CLb), however, according to some embodiments, the anode of one light emitting device and the cathode of another light emitting device may be connected, or may be connected to the cathodes of two light emitting devices.
A unit pixel group may refer to a group of unit pixels in which one laser drilling position LDP is formed, and the embodiments of
Meanwhile, in
According to some embodiments, the laser drilling position LDP may also be positioned at the same position as in the embodiments of
According to some embodiments, the number of unit pixels included in a unit pixel group may be various, other than 4, 6, and 8.
At this time, the laser drilling positions LDP may be formed for each unit pixel of various numbers, other than 4, 6, and 8 positions.
In the foregoing, various embodiments of the light emitting display device have been described, focusing on the structure of the light emitting layer included in the light emitting device and the structure for applying voltage to the cathode.
Hereinafter, a schematic planar structure of a pixel driving unit positioned under a light emitting device will be described through
In
In
Each of the three pixel driving units PCa, PCb, and PCc constitutes a pixel driving unit of the unit pixel PXU, and a total of four unit pixels PXU are shown in
In embodiments described below, four unit pixels PXU are collectively referred to as one unit pixel group.
One unit pixel PXU may include three pixels corresponding to three primary colors.
Each of the three pixel driving units PCa, PCb, and PCc belonging to one unit pixel PXU may have a structure extending in the first direction DR1, and each of the three may be pixel driving units PCa, PCb, and PCc corresponding to a pixel displaying three primary colors of light.
Structures of the pixel driving units PCa, PCb, and PCc may vary, and according to some embodiments may have the same circuit structure as that of
In
Here, the pixel driving units PCa, PCb, and PCc may be commonly connected to the first scan signal line 151, the second scan signal line 151-1, the driving voltage line 172, the initialization voltage line 173, and the driving low-voltage line 174.
Also, the first pixel driving unit PCa may be connected to the first data line 171a, the second pixel driving unit PCb may be connected to the second data line 171b, and the third pixel driving unit PCc may be connected to the third data line 171c.
Each of the pixel driving units PCa, PCb, and PCc may correspond to each area in which a planar area partitioned by the first scan signal line 151 and the second scan signal line 151-1, and the driving low-voltage line 174 is divided into three areas.
Meanwhile, in
The auxiliary driving low-voltage line 174-1 is positioned on a different conductive layer from the driving low-voltage line 174, and extends in a different direction.
For example, the auxiliary driving low-voltage line 174-1 is connected to the driving low-voltage line 174 extending in the second direction DR2, and the driving low-voltage ELVSS can be transmitted in the first and second directions DR1 and DR2, so that a constant level of the driving low-voltage ELVSS can be applied over the entire display area of the light emitting display device.
The driving low-voltage ELVSS should also be applied to the cathode of the light emitting device.
Referring to
A laser drilling method may be used in this embodiment to electrically connect the uppermost cathode and the auxiliary driving low-voltage line 174-1.
The laser drilling method is a method of irradiating a laser in a state where the cathode is formed and melting the irradiated portion so that the auxiliary driving low-voltage line 174-1 located at the bottom and the cathode are electrically connected.
In the embodiments of
For example, in the embodiments of
The connecting electrode CE is electrically connected to the cathode through laser drilling.
As a result, the cathode may receive the driving low-voltage ELVSS through the auxiliary driving low-voltage line 174-1.
According to some embodiments, the connecting electrode CE may correspond to a position where laser drilling occurs on a plane.
In addition, the first scan signal line 151 and the second scan signal line 151-1 overlapped the connecting electrode CE on a plane, but located below, are blocked by the connecting electrode CE during laser drilling, so that they are not short-circuited with the connecting electrode CE, and the driving low-voltage ELVSS is not transmitted.
Therefore, when the connecting electrode CE is used, the wiring can be formed below the area where laser drilling is performed, so that the wiring and element can be formed in a small area, thereby improving the degree of integration.
Meanwhile, according to some embodiments, a separate opening may be formed to electrically connect the cathode and the connecting electrode CE.
Meanwhile, in embodiments in which the position of the laser drilling position LDP is changed as in various embodiments described above, the positions of the auxiliary driving low-voltage line 174-1 and the connecting electrode CE may be changed together.
A light emitting device (or light emitting area) may be positioned on the third direction DR3 of the pixel driving units PCa, PCb, and PCc.
In the embodiments of
The first pixel driving unit PCa may be electrically connected to the first-1 light emitting device including the first-1 light emitting layers EML11a1, EML12a1, EML21a1, and EML22a1 and the first-2 light emitting device including the 1-2 light emitting layers EML11a2, EML12a2, EML21a2, and EML22a2.
Here, the first-1 light emitting device and the first-2 light emitting device may be connected by connection lines CLa and CLb shown in
Meanwhile, the second pixel driving unit PCb may be electrically connected to the second light emitting device including the second light emitting layers EML11b, EML12b, EML21b, and EML22b, and the third pixel driving unit PCc may be electrically connected to the third light emitting device including the third light emitting layers EML11c, EML12c, EML21c, and EML22c.
Connections between the pixel driving units PCa, PCb, and PCc and each light emitting device and the circuit structure of each pixel driving unit PCa, PCb, and PCc will be described in more with respect to
The plurality of pixels may include a first pixel PXa, a second pixel PXb, and a third pixel PXc.
Each of the first pixel PXa, the second pixel PXb, and the third pixel PXc includes a plurality of transistors T1, T2, and T3, a storage capacitor Cst, and light emitting devices EDa1, EDa2, EDb, and EDc.
Here, one pixel (PXa, PXb, PXc) may be divided into light emitting devices (EDa1, EDa2, EDb, EDc) and pixel driving units (PCa, PC, PCc), and the pixel driving units (PCa, PCb, PCc) may correspond to the portion shown by the dotted line in
Referring to
Also, according to some embodiments, it may further include capacitors (Cleda, Cledb, Cledc; hereinafter referred to as light emitting part capacitors) connected at both ends of the light emitting devices EDa1, EDa2, EDb, EDc, the light emitting part capacitors (Cleda, Cledb, Cledc) may not be included in the pixel driving part, and can be included in the light emitting devices EDa1, EDa2, EDb, EDc.
For example, the first pixel driving unit PCa may be electrically connected to the first-1 and the first-2 light emitting devices EDa1 and the first-2 light emitting device EDa2, the second pixel driving unit PCb may be electrically connected to the second light emitting device EDb, and the third pixel driving unit PCc may be electrically connected to the third light emitting device EDc.
A detailed circuit structure of the pixel driving units PCa, PCb, and PCc according to the embodiments of
The plurality of transistors T1, T2, and T3 are formed of one driving transistor T1 (also referred to as a first transistor) and two switching transistors T2 and T3, and the two switching transistors are divided into an input transistor T2 (also referred to as a second transistor) and an initialization transistor (T3; also referred to as a third transistor).
Each transistor (T1, T2, T3) includes a gate electrode, a first electrode, and a second electrode, and also includes a semiconductor layer containing a channel, so that current flows or is blocked in the channel of the semiconductor layer depending on the voltage of the gate electrode.
Here, one of the first electrode and the second electrode may be a source electrode, and the other may be a drain electrode according to a voltage applied to each of the transistors T1, T2, and T3.
The gate electrode of the driving transistor T1 is connected to one end of the storage capacitor Cst and also connected to the second electrode (output side electrode) of the input transistor T2.
In addition, the first electrode of the driving transistor T1 is connected to the driving voltage line 172 that transmits the driving voltage ELVDD, and the second electrode of the driving transistor T1 is connected to the anodes of the light emitting devices EDa1, EDa2, EDb, and EDc, the other end of the storage capacitor Cst, the first electrode of the initialization transistor T3, and one end of the light emitting part capacitors Cleda, Cledb, and Cledc.
The driving transistor T1 receives the data voltages DVa, DVb, and DVc to the gate electrode according to the switching operation of the input transistor T2, and supplies driving current to the light emitting devices EDa1, EDa2, EDb, and EDc according to the voltage of the gate electrode.
At this time, the storage capacitor Cst stores and maintains the voltage of the gate electrode of the driving transistor T1.
A gate electrode of the input transistor T2 is connected to the first scan signal line 151 transmitting the first scan signal SC.
A first electrode of the input transistor T2 is connected to data lines 171a, 171b, and 171c transmitting data voltages DVa, DVb, and DVc, and a second electrode of the input transistor T2 is connected to one end of the storage capacitor Cst and the gate electrode of the driving transistor T1.
The plurality of data lines 171a, 171b, and 171c transfer different data voltages DVa, DVb, and DVc, respectively, and the input transistor T2 of each pixel PXa, PXb, and PXc is connected to the different data lines 171a, 171b, and 171c.
The gate electrodes of the input transistors T2 of each pixel PXa, PXb, and PXc are connected to the same first scan signal line 151, allowing them to receive the same timing of the first scan signal SC.
Even though the input transistors T2 of the pixels PXa, PXb, and PXc are simultaneously (or concurrently) turned on by the first scan signal SC at the same timing, the different data voltages DVa, DVb, and DVc are transferred to the gate electrode of the driving transistor T1 and one end of the storage capacitor Cst of the pixels PXa, PXb, and PXc through the different data lines 171a, 171b, and 171c.
The gate electrode of the initialization transistor T3 is connected to the second scan signal line 151-1 transmitting the second scan signal SS.
The first electrode of the initialization transistor T3 is connected to the other end of the storage capacitor Cst, the second electrode of the driving transistor T1, the anodes of the light emitting devices EDa1, EDa2, EDb, and EDc, and one end of the light emitting part capacitors Cleda, Cledb, and Cledc, and the second electrode of the initialization transistor T3 is connected to the initialization voltage line 173 that transmits the initialization voltage VINT.
The initialization transistor T3 is turned on according to the second scan signal SS and transfers the initialization voltage VINT to the anodes of the light emitting devices EDa1, EDa2, EDb, and EDc, one end of the light emitting unit part capacitors Cleda, Cledb, and Cledc, and the other end of the storage capacitor Cst to initialize the voltages of the anodes of the light emitting devices EDa1, EDa2, EDb, and EDc.
The initialization voltage line 173 may function as a sensing line SL by performing an operation of sensing the voltages of the anodes of the light emitting devices EDa1, EDa2, EDb, and EDc before applying the initialization voltage VINT.
Through the sensing operation, it may be confirmed whether the voltage of the first anode is maintained at the target voltage.
The sensing operation and the initialization operation of transmitting the initialization voltage VINT may be separated in time, and the initialization operation may be performed after the sensing operation is performed.
In the embodiments of
One end of the storage capacitor Cst is connected to the gate electrode of the driving transistor T1 and the second electrode of the input transistor T2, and the other end is connected to the first electrode of the initialization transistor T3, the second electrode of the driving transistor T1, the anodes of the light emitting devices EDa1, EDa2, EDb, and EDc, and one end of the light emitting part capacitors Cleda, Cledb, and Cledc.
The light emitting devices EDa1, EDa2, EDb, and EDc receive the output current of the driving transistor T1 at the anode, the cathodes of the light emitting elements EDa1, EDa2, EDb, and EDc receive the driving low-voltage ELVSS through the driving low-voltage line 174, and the light emitting devices EDa1, EDa2, EDb, and EDc emit light to display modulation according to the output current of the driving transistor T1.
In addition, the light emitting part capacitors Cleda, Cledb, and Cledc are formed at both ends of the light emitting devices EDa1, EDa2, EDb, and EDc so that the voltage across the light emitting devices EDa1, EDa2, EDb, and EDc can be maintained constant so that the light emitting devices EDa1, EDa2, EDb, and EDc can display constant luminance.
Hereinafter, an operation of a pixel having a circuit as shown in
In
However, according to some embodiments, each of the transistors T1, T2, and T3 may be a P-type transistor.
When the emission section ends, one frame begins.
After that, the high-level second scan signal SS is supplied to turn on the initialization transistor T3.
When the initialization transistor T3 is turned on, an initialization operation and/or a sensing operation may be performed.
Embodiments in which both an initialization operation and a detection operation are performed will be described below.
The sensing operation may be performed first before the initialization operation is performed.
That is, when the initialization transistor T3 is turned on, the initialization voltage line 173 serves as a sensing line SL to sense the voltages of the anodes of the light emitting devices EDa1, EDa2, EDb, and EDc.
Through the sensing operation, it may be confirmed whether the voltage of the anode is maintained at the target voltage.
After that, an initialization operation may be performed, and the voltage of the other terminal of the storage capacitor Cst, the second electrode of the driving transistor T1, and the anodes of the light emitting devices EDa1, EDa2, EDb, and EDc are changed to the initialization voltage VINT transmitted from the initialization voltage line 173 to perform initialization.
As described above, the sensing operation and the initialization operation of transmitting the initialization voltage VINT are separated in time, so that the pixel can perform various operations while using a minimum number of transistors and reducing the area occupied by the pixel.
As a result, resolution of the display panel may be improved.
Along with the initialization operation or at a separate timing, the first scan signal SC is also changed to a high level and applied, the input transistor T2 is turned on, and a writing operation is performed.
That is, the data voltages DVa, DVb, and DVc from the data lines 171a, 171b, and 171c are input to the gate electrode of the driving transistor T1 and one end of the storage capacitor Cst through the turned-on input transistor T2 is stored.
The data voltages DVa, DVb, and DVc and the initialization voltage VINT are applied to both ends of the storage capacitor Cst by the initialization operation and the writing operation.
In a state in which the initialization transistor T3 is turned on, even if an output current is generated by the driving transistor T1, it may be output to the outside through the initialization transistor T3 and the initialization voltage line 173, so that it may not be input to the first anode of the first light emitting devices EDa1, EDb1, and EDc1.
In addition, according to some embodiments, during the writing period in which the first scan signal SC of high level is supplied, the driving voltage ELVDD may be applied as a low-level voltage or the driving low-level voltage ELVSS may be applied as a high-level voltage so that current does not flow through the light emitting devices EDa1, EDa2, EDb, and EDc.
Then, when the first scan signal SC is changed to a low level, the driving transistor T1 generates and outputs an output current according to the high-level driving voltage ELVDD applied to the driving transistor T1 and the gate voltage of the driving transistor T1 stored in the storage capacitor Cst.
The output current of the driving transistor T1 is input to the light emitting devices EDa1, EDa2, EDb, and EDc, and a light emitting period in which the light emitting devices EDa1, EDa2, EDb, and EDc emit light proceeds.
The embodiments of the light emitting display device as described above may be included in an electronic device, and the light emitting display device according to the present embodiments may be used in a medium-sized electronic device such as a monitor or a TV.
However, examples of electronic devices are not limited thereto.
Hereinafter, an embodiment of one electronic device in which the light emitting display device according to the present embodiments may be included will be reviewed through
The electronic device 1 outputs various information through the display module MD2 within the operating system.
When the processor PROC executes the application stored in the memory MM, the display module MD2 provides application information to the user through the display panel MD21.
Here, the light emitting display device described above may be used as the display panel MD21.
The processor PROC obtains an external input through the input module MD1 or the sensor module MD41, and executes an application corresponding to the external input.
For example, when the user selects a camera icon displayed on the display panel MD21, the processor PROC obtains a user input through the input sensor MD41-2 and activates the camera module MD51.
The processor PROC transfers image data corresponding to the photographic image acquired through the camera module MD51 to the display module MD2.
The display module MD2 may display an image corresponding to the captured image through the display panel MD21.
As another example, when personal information authentication is executed in the display module MD2, the fingerprint sensor MD41-1 obtains input fingerprint information as input data.
The processor PROC compares the input data acquired through the fingerprint sensor MD41-1 with authentication data stored in the memory MM, and executes an application according to the comparison result.
The display module MD2 may display information executed according to application logic through the display panel MD21.
As another example, when the music streaming icon displayed on the display module MD2 is selected, the processor PROC obtains a user input through the input sensor MD41-2 and activates a music streaming application stored in the memory MM.
When a music execution command is input in the music streaming application, the processor PROC activates the sound output module MD43 to provide sound information corresponding to the music execution command to the user.
In the above, the operation of the electronic device 1 has been briefly described.
Hereinafter, the configuration of the electronic device 1 will be described in detail.
Some of the components of the electronic device 1 described later may be integrated and provided as one component, or one component may be provided separately as two or more components.
Referring to
According to some embodiments, the electronic device 1 may include a processor PROC, a memory MM, an input module MD1, a display module MD2, a power module MD3, an embedded module MD4, and an external module MD5.
According to some embodiments, in the electronic device 1, at least one of the above-described components may be omitted, or one or more other components may be added.
According to some embodiments, some of the above-described components (e.g., sensor module MD41, antenna module MD42, or sound output module MD43) may be integrated into another component (e.g., display module MD2).
The processor PROC may execute software to control at least one other component (e.g., hardware or software component) of the electronic device 1 connected to the processor PROC, and may perform various data processing or calculations.
According to some embodiments, as at least part of data processing or operation, the processor PROC may store commands or data received from other components (e.g., input module MD1, sensor module MD41, or communication module MD53) in volatile memory MM1, process the commands or data stored in volatile memory MM1, and store the resulting data in non-volatile memory MM2.
The processor PROC may include a main processor MPROC and an auxiliary processor SPROC.
The main processor MPROC may include one or more of a central processing unit (MPROC-1) or an application processor (AP).
The main processor MPROC may further include one or more of a graphic processing unit (MPROC-2), a communication processor (CP), and an image signal processor (ISP).
The main processor MPROC may further include a neural processing unit (NPU; MPROC-3).
A neural network processing device is a processor specialized in processing an artificial intelligence model, and the artificial intelligence model may be generated through machine learning.
The artificial intelligence model may include a plurality of artificial neural network layers.
The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), deep Q-networks, or a combination of two or more of the above, but is not limited to the above examples.
The artificial intelligence model may include, in addition or alternatively, software structures as well as hardware structures.
At least two of the above-described processing unit and processor may be implemented as an integrated component (e.g., a single chip) or each may be implemented as an independent component (e.g., a plurality of chips).
The auxiliary processor SPROC may include a controller SPROC-1.
The controller SPROC-1 may include an interface conversion circuit and a timing control circuit.
The controller SPROC-1 receives the video signal from the main processor MPROC, converts the data format of the video signal to meet the interface specification with the display module MD2, and outputs video data.
The controller SPROC-1 can output various control signals required to drive the display module MD2.
The auxiliary processor SPROC may further include a data conversion circuit SPROC-2, a gamma correction circuit SPROC-3, a rendering circuit SPROC-4, and the like.
The data conversion circuit SPROC-2 receives image data from the controller SPROC-1, compensates the image data so that the image is displayed with a desired luminance according to the characteristics of the electronic device 1 or user settings, or converts the image data to reduce power consumption or compensate for afterimages.
The gamma correction circuit SPROC-3 may convert image data or a gamma reference voltage so that an image displayed on the electronic device 1 has desired gamma characteristics.
The rendering circuit SPROC-4 may receive image data from the controller SPROC-1 and render the image data in consideration of the pixel arrangement of the display panel MD21 applied to the electronic device 1.
At least one of the data conversion circuit SPROC-2, the gamma correction circuit SPROC-3, or the rendering circuit SPROC-4 may be incorporated into other components (e.g., the main processor MPROC or the controller SPROC-1).
At least one of the data conversion circuit SPROC-2, the gamma correction circuit SPROC-3, or the rendering circuit SPROC-4 may be incorporated into a data driver MD23 described later.
The memory MM may store various data used by at least one component of the electronic device 1 (e.g., the processor PROC or the sensor module MD41) and input data or output data for a command related thereto.
The memory MM may include at least one of a volatile memory MM1 or a non-volatile memory MM2.
The input module MD1 may receive commands or data to be used in components of the electronic device 1 (e.g., the processor PROC, the sensor module MD41, or the sound output module MD43) from the outside of the electronic device 1 (e.g., a user or an external electronic device 2).
The input module MD1 may include a first input module MD11 for receiving a command or data from a user and a second input module MD12 for receiving a command or data from the external electronic device 2.
The first input module MD11 may include a microphone, mouse, keyboard, key (e.g., button), or pen (e.g., passive pen or active pen).
The second input module MD12 may support a designated protocol capable of being connected to the external electronic device 2 by wire or wirelessly.
According to some embodiments, the second input module MD12 may include a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
The second input module MD12 may include a connector that can be physically connected to the external electronic device 2—for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).
The display module MD2 provides visual information to the user.
The display module MD2 may include a display panel MD21, a scan driver MD22, and a data driver MD23.
The display module MD2 may further include a window, a chassis, and a bracket to protect the display panel MD21.
The display panel MD21 may include a liquid crystal display panel, an organic light emitting display panel, or an inorganic light emitting display panel, and the type of display panel MD21 is not particularly limited.
The display panel MD21 may be a rigid type or a flexible type capable of being rolled or folded.
The display module MD2 may further include a supporter, a bracket, or a heat-dissipation part that supports the display panel MD21.
The scan driver MD22 may be mounted on the display panel MD21 as a driving chip.
Also, the scan driver MD22 may be integrated into the display panel MD21.
For example, the scan driver MD22 can include an amorphous silicon TFT gate driver circuit (ASG), a low-temperature polycrystalline silicon TFT gate driver circuit (LTPS), or an oxide semiconductor TFT gate driver circuit (OSG) embedded in the display panel MD21.
The scan driver MD22 receives a control signal from the controller SPROC-1 and outputs scan signals to the display panel MD21 in response to the control signal.
The display panel MD21 may further include a light emitting driver.
The light emitting driver outputs a light emitting control signal to the display panel MD21 in response to the control signal received from the controller SPROC-1.
The light emitting driver may be formed separately from the scan driver MD22 or integrated into the scan driver MD22.
The data driver MD23 receives a control signal from the controller SPROC-1, converts image data into analog voltages (e.g., data voltages) in response to the control signal, and then outputs the data voltages to the display panel MD21.
The data driver MD23 may be incorporated into other components (e.g., controller SPROC-1).
The functions of the interface conversion circuit and timing control circuit of the controller SPROC-1 described above may be integrated into the data driver MD23.
The display module MD2 may further include a light driver and a voltage generator circuit.
The voltage generator circuit may output various voltages necessary for driving the display panel MD21.
The power module MD3 supplies power to components of the electronic device 1.
The power module MD3 may include a battery charging the power voltage.
The battery may include a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
The power module MD3 may include a power management integrated circuit (PMIC).
The PMIC supplies optimized power to each of the above-described modules and modules described later.
The power module MD3 may include a wireless power transmission/reception part electrically connected to the battery.
The wireless power transmission/reception part may include a plurality of antenna radiators in the form of coils.
The electronic device 1 may further include an internal module MD4 and an external module MD5.
The internal module MD4 may include a sensor module MD41, an antenna module MD42, and a sound output module MD43.
The external module MD5 may include a camera module MD51, a light module MD52, and a communication module MD53.
The sensor module MD41 may detect an input by the user's body or an input by a pen among the first input modules MD11, and generate an electrical signal or data value corresponding to the input.
The sensor module MD41 may include at least one of a fingerprint sensor MD41-1, an input sensor MD41-2, or a digitizer MD41-3.
The fingerprint sensor MD41-1 may generate a data value corresponding to the user's fingerprint.
The fingerprint sensor MD41-1 may include either an optical or capacitive fingerprint sensor.
The input sensor MD41-2 may generate data values corresponding to coordinate information of an input by a user's body or a pen.
The input sensor (MD41-2) generates the amount of change in capacitance by the input as a data value.
The input sensor (MD41-2) can detect an input by a passive pen or transmit/receive data to/from an active pen.
The input sensor MD41-2 may measure biosignals such as blood pressure, moisture, or body fat.
For example, when the user touches a body part to a sensor layer or a sensing panel and does not move for a certain period of time, the input sensor MD41-2 detects a biosignal based on a change in an electric field caused by the body part, and outputs information desired by the user to the display module MD2.
The digitizer MD41-3 may generate data values corresponding to coordinate information input by the pen.
The digitizer (MD41-3) generates the amount of electromagnetic change by the input as a data value.
The digitizer (MD41-3) can detect input by the passive pen or transmit/receive data to/from the active pen.
At least one of the fingerprint sensor MD41-1, input sensor MD41-2, or digitizer MD41-3 may be implemented as a sensor layer formed on the display panel MD21 through a continuous process.
The fingerprint sensor MD41-1, the input sensor MD41-2, and the digitizer MD41-3 may be arranged above the display panel MD21, and any one of the fingerprint sensor MD41-1, the input sensor MD41-2, and the digitizer MD41-3—for example, the digitizer MD41-3—may be arranged below the display panel MD21.
At least two of the fingerprint sensor MD41-1, the input sensor MD41-2, and the digitizer MD41-3 may be integrated into one sensing panel through the same process.
When integrated into one sensing panel, the sensing panel may be located between the display panel MD21 and a window located above the display panel MD21.
According to some embodiments, the sensing panel may be located on the window, and the position of the sensing panel is not particularly limited.
At least one of the fingerprint sensor MD41-1, input sensor MD41-2, or digitizer MD41-3 may be embedded in the display panel MD21.
That is, at least one of the fingerprint sensor MD41-1, the input sensor MD41-2, or the digitizer MD41-3 may be simultaneously (or concurrently) formed through a process of forming elements included in the display panel MD21 (e.g., a light emitting device, a transistor, etc.).
In addition, the sensor module MD41 may generate an electrical signal or data value corresponding to an internal state or an external state of the electronic device 1.
The sensor module MD41 may further include, for example, a gesture sensor, a gyro sensor, an air-pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a bio sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
The antenna module MD42 may include one or more antennas for transmitting or receiving signals or power to the outside.
According to some embodiments, the communication module MD53 may transmit a signal to an external electronic device or receive a signal from an external electronic device through an antenna suitable for a communication method.
The antenna pattern of the antenna module MD42 may be integrated into one component of the display module MD2 (for example, the display panel MD21) or the input sensor MD41-2.
The sound output module MD43 is a device for outputting sound signals to the outside of the electronic device 1, and may include, for example, a speaker used for general purposes such as multimedia playback or recording playback, and a receiver used exclusively for receiving calls.
According to some embodiments, the receiver may be formed integrally with or separately from the speaker.
The sound output pattern of the sound output module MD43 may be integrated with the display module MD2.
The camera module MD51 may capture still images and moving images.
According to some embodiments, the camera module MD51 may include one or more lenses, image sensors, or image signal processors.
The camera module MD51 may further include an infrared camera capable of measuring the presence or absence of the user, the user's location, and the user's line of sight.
The light module MD52 may provide light.
The light module MD52 may include a light emitting diode or a xenon lamp.
The light module MD52 may operate in conjunction with the camera module MD51 or independently.
The communication module MD53 may support establishment of a wired or wireless communication channel between the electronic device 1 and the external electronic device 2 and communication through the established communication channel.
The communication module MD53 may include any one or all of a wireless communication module such as a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module, a local area network (LAN) communication module, or a wired communication module such as a power line communication module.
The communication module MD53 may communicate with the external electronic device 2 through a short-distance communication network such as Bluetooth, WiFi direct, or infrared data association (IrDA) or a long-distance communication network such as a cellular network, the Internet, or a computer network (e.g., LAN or WAN).
The various types of communication modules (MD53) described above may be implemented as one chip or may be implemented as separate chips.
The input module MD1, the sensor module MD41, the camera module MD51, and the like may be used to control the operation of the display module MD2 in conjunction with the processor PROC.
The processor PROC outputs commands or data to the display module MD2, the sound output module MD43, the camera module MD51, or the light module MD52 based on the input data received from the input module MD1.
For example, the processor PROC may generate image data corresponding to input data applied through a mouse or an active pen and output the image data to the display module MD2, or generate command data corresponding to the input data and output the image data to the camera module MD51 or the light module MD52.
When input data is not received from the input module MD1 for a certain period of time, the processor PROC converts the operation mode of the electronic device 1 into a low-power mode or a sleep mode to reduce power consumed by the electronic device 1.
The processor PROC outputs commands or data to the display module MD2, the sound output module MD43, the camera module MD51, or the light module MD52 based on the sensing data received from the sensor module MD41.
For example, the processor PROC may compare authentication data applied by the fingerprint sensor MD41-1 with authentication data stored in the memory MM, and then execute an application according to the comparison result.
The processor PROC may execute a command or output corresponding image data to the display module MD2 based on the sensing data sensed by the input sensor MD41-2 or the digitizer MD41-3.
When the sensor module MD41 includes a temperature sensor, the processor PROC may receive temperature data for the temperature measured from the sensor module MD41 and further perform luminance correction on the image data based on the temperature data.
The processor PROC may receive measurement data about the presence or absence of the user, the location of the user, and the gaze of the user from the camera module MD51.
The processor PROC may further perform luminance correction on the image data based on the measurement data.
For example, the processor PROC, which determines whether or not there is a user through an input from the camera module MD51, outputs image data whose luminance is corrected through the data conversion circuit SPROC-2 or the gamma correction circuit SPROC-3 to the display module MD2.
Some of the components may be connected to each other through a communication method between peripheral devices—for example, a bus, general purpose input/output (GPIO), serial peripheral interface (SPI), mobile industry processor interface (MIPI), or ultra path interconnect (UPI) link to exchange signals (e.g., commands or data) with each other.
The processor PROC may communicate with the display module MD2 through an agreed interface. For example, any one of the above communication methods may be used, and the above communication method is not limited thereto.
The electronic device 1 according to embodiments disclosed in this document may be various types of devices.
The electronic device 1 may include, for example, at least one of a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance.
The electronic device 1 according to the embodiments of this document is not limited to the aforementioned devices.
Although the embodiments have been described in more detail above, the scope of embodiments according to the present disclosure is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concepts of the present embodiments defined in the following claims, and their equivalents, are also within the scope of the present embodiments according to the present disclosure.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10-2023-0077375 | Jun 2023 | KR | national |
