Light-emitting element module

Information

  • Patent Grant
  • D1074628
  • Patent Number
    D1,074,628
  • Date Filed
    Friday, July 9, 2021
    3 years ago
  • Date Issued
    Tuesday, May 13, 2025
    6 days ago
  • US Classifications
    Field of Search
    • US
    • D13 180
    • D13 182
    • D26 1
    • CPC
    • H01L2223/5441
    • H01L2223/54433
    • H01L25/167
    • H01L25/0753
    • H01L27/15
    • H01L27/156
    • H01L33/08
    • H01L33/10
    • H01L33/20
    • H01L33/38
    • H01L33/42
    • H01L33/48
    • H01L33/483
    • H01L33/486
    • H10H20/80
    • H10H20/81
    • H10H20/812
    • H10H20/813
  • International Classifications
    • 1303
    • Term of Grant
      15Years
Abstract
Description


FIG. 1 is a front view of a light-emitting element module of the present invention;



FIG. 2 is a rear view thereof;



FIG. 3 is a top plan view thereof;



FIG. 4 is a bottom plan view thereof;



FIG. 5 is a right side view thereof;



FIG. 6 is a left side view thereof;



FIG. 7 is a front, top and left side perspective view thereof; and,



FIG. 8 is a rear, bottom and left side perspective view thereof.


The broken lines show portions of a light-emitting element module that form no part of the claimed design.


Claims
  • The ornamental design for a light-emitting element module as shown and described.
Priority Claims (1)
Number Date Country Kind
2021-001105 D Jan 2021 JP national
US Referenced Citations (86)
Number Name Date Kind
6777719 Fujii Aug 2004 B1
D576571 Itai Sep 2008 S
7491977 Fukasawa Feb 2009 B2
D590355 Tsuchiya et al. Apr 2009 S
D590357 Miyashita Apr 2009 S
D597502 Ogata et al. Aug 2009 S
D599303 Seo et al. Sep 2009 S
7589354 Lin et al. Sep 2009 B2
D602884 Wada et al. Oct 2009 S
7675087 Cheng et al. Mar 2010 B1
D624883 Lin Oct 2010 S
D624886 Ni et al. Oct 2010 S
D626097 Takeuchi et al. Oct 2010 S
D627310 Lin et al. Nov 2010 S
D633449 Lin Mar 2011 S
D640644 Tsou Jun 2011 S
D640994 Lin et al. Jul 2011 S
D644190 Shimizu et al. Aug 2011 S
D649942 Shimizu et al. Dec 2011 S
D653222 Fukui et al. Jan 2012 S
D653628 Miyashita Feb 2012 S
D653629 Miyashita Feb 2012 S
D656110 Shimizu et al. Mar 2012 S
D663703 Kobayakawa et al. Jul 2012 S
D664104 Hsu Jul 2012 S
D668623 Hsu Oct 2012 S
D674965 Lueken et al. Jan 2013 S
D708154 Hayashi Jul 2014 S
D724549 Song Mar 2015 S
D731989 Huang et al. Jun 2015 S
D737784 Song Sep 2015 S
D741821 Song Oct 2015 S
D744965 Chen et al. Dec 2015 S
D763805 Huang Aug 2016 S
D774475 Song Dec 2016 S
D774476 Song Dec 2016 S
D778846 Song Feb 2017 S
D778847 Song Feb 2017 S
D783547 Bergmann Apr 2017 S
D792639 Deyaf et al. Jul 2017 S
D793002 Kim et al. Jul 2017 S
D797359 Deyaf et al. Sep 2017 S
D797360 Deyaf et al. Sep 2017 S
D797361 Deyaf et al. Sep 2017 S
D797362 Deyaf et al. Sep 2017 S
D797363 Deyaf et al. Sep 2017 S
D797364 Deyaf et al. Sep 2017 S
D797365 Deyaf et al. Sep 2017 S
D797366 Deyaf et al. Sep 2017 S
D799103 Gloor et al. Oct 2017 S
D831593 Nishio Oct 2018 S
D832802 Nishio Nov 2018 S
D846511 Nishio Apr 2019 S
D847102 Chen et al. Apr 2019 S
D856946 Song Aug 2019 S
D906270 Song Dec 2020 S
11935910 Yang Mar 2024 B2
D1022307 Tomney Apr 2024 S
11949050 Chen Apr 2024 B2
12113159 Park Oct 2024 B2
12132154 Lee Oct 2024 B2
D1057674 Bailey Jan 2025 S
20060214273 Wang et al. Sep 2006 A1
20070034855 Hwang Feb 2007 A1
20070063213 Hsieh et al. Mar 2007 A1
20070096114 Aoki et al. May 2007 A1
20080303018 Kim Dec 2008 A1
20090045428 Lin Feb 2009 A1
20100006888 Watanabe Jan 2010 A1
20100123145 Lee May 2010 A1
20110180782 Fattal Jul 2011 A1
20130068936 Nagai Mar 2013 A1
20150211935 Ojima et al. Jul 2015 A1
20200013759 Yoo et al. Jan 2020 A1
20210005590 Ishii Jan 2021 A1
20210183825 Wuu Jun 2021 A1
20210348739 Lee Nov 2021 A1
20210358998 Kishimoto Nov 2021 A1
20210398479 Kim Dec 2021 A1
20220052229 Min Feb 2022 A1
20220181532 Hasunuma Jun 2022 A1
20220279638 Iwazaki et al. Sep 2022 A1
20230126339 Do Apr 2023 A1
20230411563 Do Dec 2023 A1
20240204150 Kawano Jun 2024 A1
20240222565 Do Jul 2024 A1
Foreign Referenced Citations (1)
Number Date Country
1389544 Jun 2010 JP
Non-Patent Literature Citations (4)
Entry
U.S. Office Action issued Aug. 22, 2024 in U.S. Appl. No. 29/798,677.
“Lumistrips the new Chip Scale Packaged Flip Chip LED technology”, Lumistrips LED Professional https://www.lumistrips.com/lumistrips-blog/chip_scale_leds_explained, Mar. 12, 2020.
“New LED packaging technology improves performance”, phys.org https://phys.org/news/2012-09-packaging-technology. html, Sep. 25, 2012.
U.S. Office Action issued Feb. 4, 2025 in U.S. Appl. No. 29/798,752.