LIGHT-EMITTING ELEMENT

FIELD OF THE PRESENT DISCLOSURE

The present disclosure relates to a light-emitting element and, in particular, to an organic light-emitting element.

DESCRIPTION OF THE PRIOR ART

The organic light emitting display (OLED) has been widely used in the most high-end electronic devices. However, due to the limitations of the prior art, the luminous effect of the luminescent material in the OLED cannot be effectively controlled, resulting in problems such as halo and optical crosstalk, and the optical effect of the OLED is not as expected. In the prior art, sometimes additional polarizers are added to improve the above problems, but the halo cannot be effectively eliminated, and the additional polarizers have disadvantages such as increasing the thickness of the display and high cost. The present disclosure provides a device that can solve the above-mentioned dilemma.

SUMMARY OF THE PRESENT DISCLOSURE

In the present disclosure, a light-emitting element is provided. The light-emitting element comprises a substrate, a plurality of light shielding layers, a capping layer, a conductive layer and a plurality of protrusions. The plurality of light shielding layers is disposed under the substrate. The capping layer contacts a first surface of the substrate and covers the plurality of light shielding layers. The conductive layer contacts a second surface of the substrate. The plurality of protrusions is disposed on the second surface of the substrate and covers a part of the conductive layer, and an organic light-emitting unit comprising an organic material is disposed between two adjacent protrusions of the plurality of protrusions. One of the plurality of protrusions has an edge, which is offset from an edge of one of the plurality of light shielding layers in the longitudinal direction.

In some embodiments, an area of each of the plurality of light shielding layers in the lateral direction is larger than an area of each of the plurality of protrusions.

In some embodiments, the conductive layer includes a transparent conductive film, and the transparent conductive film includes ITO (indium tin oxide), IZO (indium zinc oxide) or IGZO (indium gallium zinc oxide).

In some embodiments, the light-emitting element comprises a release layer under the capping layer, wherein the release layer is separated from the plurality of light shielding layers by the capping layer.

In some embodiments, a distance between respective edges of the two adjacent protrusions of the organic light-emitting unit is greater than a distance between respective edges of two adjacent light shielding layers in the plurality of light shielding layers.

In some embodiments, one of the plurality of light shielding layers includes a depression having a cross-shaped profile that exposes light emitted by a single organic light-emitting unit.

In some embodiments, one of the plurality of light shielding layers include a depression having a cross-shaped profile that exposes light emitted by a plurality of organic light-emitting units.

In the present disclosure, a light-emitting element is provided. The light-emitting element includes a substrate, a patterned light shielding layer, a capping layer, a plurality of protrusions and a release layer. The patterned light shielding layer is disposed under the substrate and has an opening. The capping layer is disposed under the patterned light shielding layer. The plurality of protrusions arranged on the substrate, an organic light-emitting unit containing an organic light-emitting material being disposed between two adjacent protrusions of the plurality of protrusions, wherein the organic light-emitting unit includes a first light-emitting unit, a second light-emitting unit and a third light-emitting unit, wherein an edge of the patterned light shielding layer is not aligned with an edge of one of the plurality of protrusions. The release layer is disposed under the capping layer, wherein the release layer and the patterned light shielding layer are separated by the capping layer.

In some embodiments, the organic light-emitting material includes a molecular structure with a resonance structure, and can be selected from the group consisting of a spiro-triarylamine, a bis-triarylamine and a combination thereof.

In some embodiments, the first light-emitting unit, the second light-emitting unit and the third light-emitting unit each have an effective light-emitting area whose size is defined by an anode located under each light-emitting unit, each light-emitting unit having a black area and a bright area when emitting light, wherein a total area of the black area is less than 50% of the effective light-emitting area.

In some embodiments, the first light-emitting unit, the second light-emitting unit and the third light-emitting unit each have an organic light-emitting stack layer containing an organic material, wherein the organic light-emitting stack layer includes: a carrier injection layer; a carrier transport layer; an organic emission layer; and an organic carrier transfer layer.

In some embodiments, the light shielding layer and the capping layer include an organic material, and the release layer includes an inorganic material.

In some embodiments, the substrate comprises a transparent material.

In some embodiments, a distance between respective edges of two adjacent protrusions of the first light emitting unit is greater than a width of the opening of the patterned light shielding layer.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top view illustrating an intermediate product of a light-emitting element.

FIG. 2 is an illustration of a cross-sectional view along line AA in FIG. 1.

FIG. 3 is a cross-sectional view showing the relative relationship between the light-emitting element and the debonding film.

FIG. 4A to FIG. 4K depict a process of manufacturing a light-emitting element according to an embodiment.

FIG. 5A and FIG. 5B depict top views of a light shielding layer according to an embodiment.

DETAILED DESCRIPTION OF THE EMBODIMENTS

FIG. 1 is a top view illustrating an intermediate product of a light-emitting element 10. The light-emitting element 10 has a light-emitting layer 20 and a capping layer 40 disposed over the light-emitting layer 20. For the light-emitting layer 20, a spacer 21 can be designed to provide an array of recesses for accommodating an array of light-emitting pixels. In some embodiments, the spacer 21 may comprise a photosensitive material.

FIG. 2 is an illustration of a cross-sectional view along line AA in FIG. 1 and illustrates only a light-emitting region. For simplicity, the covering layer 40 is omitted here. The spacer 21 has a plurality of protrusions 105 to define a light-emitting pixel pattern. A recess is located between two adjacent protrusions 105 and provides a space for accommodating a light-emitting pixel. Those skilled in the art should understand that from the cross-sectional view, the protrusions 105 are depicted as disconnected, but from the top view of FIG. 1, they can be connected to one another through other portions of the spacer 21.

The light-emitting element 10 includes a light-emitting array, which includes a first organic light-emitting unit 10a, a second organic light-emitting unit 10b and a third organic light-emitting unit 10c. The organic light-emitting unit may also be referred to as a light-emitting pixel herein. In some embodiments, the light-emitting unit 10a includes a first electrode 104, a carrier injection layer 106L1 above the protrusion 105 and the first electrode 104, a carrier transport layer 106L2 above the carrier injection layer 106L1, an organic emission layer 106L3 above a portion of the carrier transport layer 106L2 and an organic carrier transport layer 106L4 above the organic emission layer 106L3. The carrier injection layer 106L1, the carrier transport layer 106L2, the organic emission layer 106L3 and the organic carrier transport layer 106L4 may be collectively referred to as an organic light-emitting stack layer.

In some embodiments, the carrier injection layer 106L1 is arranged between the first electrode 104 and the carrier transport layer 106L2. The light-emitting unit 10a includes an organic material, which can be placed in any one of the carrier transport layer, the carrier injection layer or the organic emission layer in the light-emitting unit 10a according to different implementations. Further, in some embodiments, the organic material has an absorption rate of greater than or equal to 50% for a specific wavelength. In some embodiments, the organic material has an absorption rate of greater than or equal to 60% for a specific wavelength. In some embodiments, the organic material has an absorption rate of greater than or equal to 70% for a specific wavelength. In some embodiments, the organic material has an absorption rate of greater than or equal to 80% for a specific wavelength. In some embodiments, the organic material has an absorption rate of greater than or equal to 90% for a specific wavelength. In some embodiments, the organic material has an absorption rate of greater than or equal to 95% for a specific wavelength.

In some embodiments, the specific wavelength is not greater than 400 nm. In some embodiments, the specific wavelength is not greater than 350 nm. In some embodiments, the specific wavelength is not greater than 300 nm. In some embodiments, the specific wavelength is not greater than 250 nm. In some embodiments, the specific wavelength is not greater than 200 nm. In some embodiments, the specific wavelength is not greater than 150 nm. In some embodiments, the specific wavelength is not greater than 100 nm.

The substrate 100 is located under the light-emitting layer 20. In some embodiments, the substrate 100 may include a thin film transistor (TFT) array. In some embodiments, the substrate 100 includes a base (not shown), a dielectric layer (not shown) and one or more circuits (not shown) disposed on or in the base. In some embodiments, the base is a transparent base, or is at least partially transparent. In some embodiments, the base is a non-flexible base, and the material of the base may include glass, quartz, low temperature poly-silicon (LTPS) or other suitable materials. In some embodiments, the base is a flexible base, and the material of the base may include transparent epoxy resin, polyimide, polyvinyl chloride, methyl methacrylate or other suitable materials. The dielectric layer may be disposed on the base as needed. In some embodiments, the dielectric layer may include silicon oxide, silicon nitride, silicon oxynitride or other suitable materials.

In some embodiments, the circuit may comprise a complementary metal-oxide-semiconductor (CMOS) circuit, or comprise a plurality of transistors and a plurality of capacitors adjacent to the transistors, wherein the transistors and capacitors are formed on the dielectric layer. In some embodiments, the transistor is a thin-film transistor (TFT). Each transistor includes source/drain regions (including at least one source region and a drain region), a channel region between the source/drain regions, a gate electrode disposed above the channel region, and a gate insulator between the channel region and the gate electrode. The channel region of the transistor may be made of a semiconductor material, such as silicon or other elements selected from Group IV or Group III and Group V.

A plurality of light shielding layers 101 is formed under the substrate 100. The plurality of light shielding layers 101 is formed on a first surface 100a of the substrate 100. The plurality of light shielding layers 101 is separated from the substrate 100. The plurality of light shielding layers 101 can also be collectively referred to as patterned light shielding layers 101. The plurality of light shielding layers 101 is separated from one another by a distance W1. The portions that separate the plurality of light shielding layers 101 from one another can also be referred to as openings, and the opening has a width W1. The plurality of light shielding layers 101 can absorb more than 90% of visible light. In some embodiments, the light shielding layer 101 may comprise a black body material. In some embodiments, the light shielding layer 101 includes a layer of a single material. In some embodiments, the light shielding layer 101 includes a composite layer formed of a plurality of materials. In some embodiments, the light shielding layer 101 includes an organic material. In some embodiments, the light shielding layer 101 includes an inorganic material.

The capping layer 102 contacts the first surface 100a of the substrate 100 and covers the plurality of light shielding layers 101. The capping layer 102 is formed in the gap between the plurality of light shielding layers 101. The capping layer 102 is formed in the openings of the patterned light shielding layer 101. The capping layer 102 covers the lower surface and two side surfaces of the light shielding layer 101. The capping layer 102 separates the substrate 100 from the plurality of light shielding layers 101. In some embodiments, capping layer 102 includes an organic material. In some embodiments, the capping layer 102 can protect the light shielding layer 101 from being scratched during the manufacturing process.

A plurality of first electrodes 104 is formed on a second surface 100b of the substrate 100. The plurality of first electrodes 104 is in contact with the substrate 100. The plurality of first electrodes 104 is in contact with the second surface 100b of the substrate 100. The plurality of first electrodes 104 is separated from one another. The plurality of first electrodes 104 is electrically connected to the substrate 100.

As shown in FIG. 2, a plurality of protrusions 105 is arranged on the second surface of the substrate 100 and cover a part of the first electrode 104. The peripheral area of the first electrode 104 is covered by the protrusion 105. In some embodiments, the edge corners of the first electrode 104 are completely surrounded by the protrusion 105. In some embodiments, the sidewall of the first electrode 104 is completely in contact with the protrusion 105. In some embodiments, two protrusions 105 in the gaps between two first electrodes 104 are separated from each other.

In this case, the first electrode 104 may be an anode. In this case, the first electrode 104 can be a conductive layer. The first electrode 104 of the light-emitting unit 10a can define the size of the effective light-emitting area. In some examples, the light-emitting unit 10a has a black area and a bright area when emitting light. The total area of the black area is less than 50% of the effective light-emitting area. The effective light-emitting area can also be called the effective illumination area.

In some embodiments, the effective illumination area has a width of at least less than 10 microns. In some embodiments, the effective illumination area has a width of about 3 microns to 6 microns. In some embodiments, the effective illumination area has a width of about 4 microns to 6 microns. The effective illumination area determines the pixel size of the light-emitting element 10 in FIG. 1. Since the size of the effective illumination area can be controlled below 10 microns, the pixel density of the light-emitting element 10 can exceed 1000 or 2000 ppi.

In FIG. 2, the light shielding layer 101 has a thickness 101T. The first electrode 104 has a thickness 104T. In some embodiments, the thickness 101T of the light shielding layer 101 is greater than the thickness 104T of the first electrode 104. In some embodiments, the thickness 101T of the light shielding layer 101 is equal to the thickness 104T of the first electrode 104. In some embodiments, the thickness 101T of the light shielding layer 101 is smaller than the thickness 104T of the first electrode 104.

The first electrode 104 may have a total thickness of about 1500 Å to about 2700 Å. In some embodiments, the first electrode 104 has a total thickness of about 1800 Å to about 2200 Å. In some embodiments, the first electrode 104 has a total thickness of about 2000 Å. The first electrode 104 can be an electrically conductive layer. The first electrode 104 may comprise ITO, IZO, IGZO, AlCu alloy, AgMo alloy, about 50 Å to 500 Å ITO (or IZO or IGZO) and 500 Å to 2000 Å metal film (Ag, Al, Mg, Au) and about 50 Å to 1000 Å ITO (or IZO or IGZO).

In some embodiments, the electrode 104 is a composite structure. For example, the electrode 104 has a conductive film and a transparent conductive film located thereon. The conductive film is located between the transparent conductive film and the substrate 100. In some embodiments, the conductive film includes aluminum, gold, silver, copper, or the like. In some embodiments, the transparent conductive film includes indium, tin, graphene, zinc, oxygen, and the like. In some embodiments, the electrode 104 includes a transparent conductive thin film. In some embodiments, the electrode 104 includes ITO (indium tin oxide). In some embodiments, the electrode 104 includes IZO (indium zinc oxide). In some embodiments, the electrode 104 includes IGZO (indium gallium zinc oxide). In some embodiments, a roughness Ra of the transparent conductive film is less than 10 Å. A thickness of the conductive film may range from about 1500 Å to about 3000 Å. A thickness of the transparent conductive film may be between about 80 Å and about 1000 Å.

In some embodiments, the first electrode 104 has at least three different films. A conductive film (such as Al, Cu, Ag, Au, etc.) is sandwiched between two transparent conductive films. In some circumstances, one of the two transparent conductive films is ITO, one side of which is in contact with the substrate 100 and the other side is in contact with the conductive film. In some circumstances, one of the two transparent conductive films is ITO, one side of which is in contact with the conductive film and the other side is in contact with the protrusion 105 or the light-emitting material.

In some embodiments, each protrusion 105 has a curved surface protruding away from the substrate 100 and covering a peripheral area of the first electrode 104. The protrusions 105 can be of different shapes. In some embodiments, the protrusion 105 has a curved surface. In some embodiments, the protrusion 105 is trapezoidal in shape. In some embodiments, the protrusion 105 is rectangular in shape. The pattern of the protrusion 105 is designed according to the pixel arrangement, and the patterned protrusion 105 may be called a pixel defined layer (PDL). The protrusions 105 are arranged over the substrate 100. Each protrusion 105 fills the gap between two adjacent first electrodes 104. Each first electrode 104 is partially covered by a protrusion 105. The protrusions 105 may include the photosensitive material. In FIG. 2, the area of each of the plurality of light shielding layers 101 is larger than the area of each of the protrusions 105 in the lateral direction.

One of the protrusions 105 has an edge 105a on an upper surface thereof covering the first electrode 104. The light shielding layer 101 has an edge 101a near the center of the first electrode 104. The edge 101a of the light shielding layer 101 is not aligned with the edge 105a of the protrusion 105. An offset d exists between the edge 105a of the protrusion 105 and the edge 101a of the light shielding layer in the longitudinal direction. The percentage of the offset d to the width of the light shielding layer 101 may be greater than or equal to 1%. The percentage of the offset d to the width of the light shielding layer 101 may be greater than or equal to 5%. The percentage of the offset d to the width of the light shielding layer 101 may be greater than or equal to 10%. The percentage of the offset d to the width of the light shielding layer 101 may be greater than or equal to 15%.

One of the protrusions 105′ has an edge 105′a on an upper surface thereof covering the first electrode 104. The light shielding layer 101′ has an edge 101′a near the center of the first electrode 104. The edge 101′a of the light shielding layer 101′ is not aligned with the edge 105′a of the protrusion 105′. An offset d′ exists between the edge 105′a of the protrusion 105′ and the edge 101′a of the light shielding layer. The percentage of the offset d′ to the width of the light shielding layer 101′ may be greater than or equal to 1%. The percentage of the offset d′ to the width of the light shielding layer 101′ may be greater than or equal to 5%. The percentage of the offset d′ to the width of the light shielding layer 101′ may be greater than or equal to 10%. The percentage of the offset d′ to the width of the light shielding layer 101′ may be greater than or equal to 15%. In some embodiments, the offset d is equal to the offset d′. In some embodiments, the offset d is greater than the offset d′. In some embodiments, the offset d is less than the offset d′.

In FIG. 2, the distance between the plurality of light shielding layers 101 and 101′ is W1, and the distance between the respective edges 105a and 105′a of two adjacent protrusions 105 and 105′ is W2. Due to the offset d and d′, the distance W2 between the respective edges 105a and 105′a of two adjacent protrusions 105 and 105′ is greater than the distance W1 between the respective edges 101a and 101′a of the two adjacent light shielding layers 101 and 101′ among the plurality of light shielding layers. In FIG. 2, the distance W2 between the respective edges 105a and 105′a of two adjacent protrusions 105 and 105′ may be the sum of the distance W1 between the two light shielding layers 101 and 101′ among the plurality of light shielding layers 101, the offset d and the offset d′. The distance W2 between the respective edges 105a and 105′a of two adjacent protrusions 105 and 105′ can define the area of the effective light-emitting region. Because the distance W1 between the light shielding layers 101 and 101′ is smaller than the distance W2, the light shielding layers 101 and 101′ can control the light emitted by the first electrode 104, thereby improving the imaging effect of the pattern.

In some embodiments, the absorption rate of the protrusion 105 for a specific wavelength is greater than or equal to 50%. In some embodiments, the absorption rate of the protrusion 105 for a specific wavelength is greater than or equal to 60%. In some embodiments, the absorption rate of the protrusion 105 for a specific wavelength is greater than or equal to 70%. In some embodiments, the absorption rate of the protrusion 105 for a specific wavelength is greater than or equal to 80%. In some embodiments, the absorption rate of the protrusion 105 for a specific wavelength is greater than or equal to 90%. In some embodiments, the absorption rate of the protrusion 105 for a specific wavelength is greater than or equal to 95%. In some embodiments, the specific wavelength is not greater than 400 nm. In some embodiments, the specific wavelength is not greater than 350 nm. In some embodiments, the specific wavelength is not greater than 300 nm. In some embodiments, the specific wavelength is not greater than 250 nm. In some embodiments, the specific wavelength is not greater than 200 nm. In some embodiments, the specific wavelength is not greater than 150 nm. In some embodiments, the specific wavelength is not greater than 100 nm.

The carrier injection layer 106L1 is disposed on the exposed surfaces of the capping layer 102, the protrusion 105 and the first electrode 104. The carrier injection layer 106L1 continuously covers the exposed surfaces of the protrusion 105 and the first electrode 104. In some embodiments, the exposed surface of each first electrode 104 is configured for an effective light-emitting area of one light-emitting unit 10a. Optionally, the carrier injection layer 106L1 is in contact with the protrusion 105. In some embodiments, the carrier injection layer 106L1 is in contact with the first electrode 104. In some embodiments, the carrier injection layer 106L1 is an organism. In some embodiments, the carrier injection layer 106L1 is configured to perform hole injection. In some embodiments, the carrier injection layer 106L1 is a hole injection layer. In some embodiments, the carrier injection layer 106L1 may have a thickness of about 80 Å to about 500 Å.

The carrier transport layer 106L2 is disposed on the exposed surfaces of the capping layer 102, the protrusion 105 and the first electrode 104. The carrier transport layer 106L2 is disposed above the carrier injection layer 106L1 and completely covers the carrier injection layer 106L1. The carrier injection layer 106L1 is disposed under the carrier transport layer 106L2. The carrier transport layer 106L2 continuously covers the carrier injection layer 106L1. The carrier transport layer 106L2 covers the plurality of protrusions 105 and the plurality of first electrodes 104. Optionally, the carrier transport layer 106L2 is in contact with the carrier injection layer 106L1. In some embodiments, the carrier transport layer 106L2 is an organism. In some embodiments, carrier transport layer 106L2 is configured to perform hole transport. In some embodiments, the carrier transport layer 106L2 is a first hole transport layer. In some embodiments, the carrier injection layer 106L1 may have a thickness of about 80 Å to about 500 Å.

The organic emission layer 106L3 is disposed on the exposed surfaces of the capping layer 102, the protrusion 105 and the first electrode 104. The organic emission layer 106L3 is disposed above the carrier transport layer 106L2 and completely covers the carrier transport layer 106L2. The carrier transport layer 106L2 is disposed under the organic emission layer 106L3. The organic emission layer 106L3 continuously covers the carrier transport layer 106L2. The organic emission layer 106L3 covers the plurality of protrusions 105 and the plurality of first electrodes 104. Optionally, the organic emission layer 106L3 is in contact with the carrier transport layer 106L2. The organic emission layer 106L3 is configured to emit a first color.

In some embodiments, the absorption rate of the organic emission layer 106L3 for a specific wavelength is greater than or equal to 50%. In some embodiments, the absorption rate of the organic emission layer 106L3 for a specific wavelength is greater than or equal to 60%. In some embodiments, the absorption rate of the organic emission layer 106L3 for a specific wavelength is greater than or equal to 70%. In some embodiments, the absorption rate of the organic emission layer 106L3 for a specific wavelength is greater than or equal to 80%. In some embodiments, the absorption rate of the organic emission layer 106L3 for a specific wavelength is greater than or equal to 90%. In some embodiments, the absorption rate of the organic emission layer 106L3 for a specific wavelength is greater than or equal to 95%. In some embodiments, the specific wavelength is not greater than 400 nm. In some embodiments, the specific wavelength is not greater than 350 nm. In some embodiments, the specific wavelength is not greater than 300 nm. In some embodiments, the specific wavelength is not greater than 250 nm. In some embodiments, the specific wavelength is not greater than 200 nm. In some embodiments, the specific wavelength is not greater than 150 nm. In some embodiments, the specific wavelength is not greater than 100 nm.

In some embodiments, at least one of the carrier transport layer 106L2 and the organic emission layer 106L3 includes an organic material. The organic material may include a molecular structure having a resonance structure. The organic material may be selected from the group consisting of a spiro-triarylamine, a bis-triarylamine and a combination thereof. In some embodiments, at least one of the carrier transport layer 106L2 and the organic emission layer 106L3 includes the spiro-triarylamine. In some embodiments, at least one of the carrier transport layer 106L2 and the organic emission layer 106L3 includes the bis-triarylamine. In some embodiments, the carrier transport layer 106L2 and the organic emission layer 106L3 comprise the same material. In some embodiments, the carrier transport layer 106L2 includes

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and the organic emission layer 106L3 includes

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In some embodiments, the carrier transport layer 106L2 includes

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and the organic emission layer 106L3 includes

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The organic carrier transport layer 106L4 is disposed on the exposed surfaces of the capping layer 102, the protrusion 105 and the first electrode 104. The organic carrier transport layer 106L4 is disposed on the organic emission layer 106L3 and completely covers the organic emission layer 106L3. The organic emission layer 106L3 is disposed under the organic carrier transport layer 106L4. The organic carrier transport layer 106L4 continuously covers the organic emission layer 106L3. The organic carrier transport layer 106L4 covers the plurality of protrusions 105 and the plurality of first electrodes 104. Optionally, the organic carrier transport layer 106L4 is in contact with the organic emission layer 106L3.

The second electrode 106D is disposed on the exposed surfaces of the capping layer 102, the protrusion 105 and the first electrode 104. The second electrode 106D is located above the organic carrier transport layer 106L4 and completely covers the organic carrier transport layer 106L4. In some circumstances, the second electrode 106D is patterned to cover only the effective light-emitting area of each light-emitting pixel. In some circumstances, the second electrode 106D is in contact with the organic carrier transport layer 106L4.

The second electrode 106D may have a thickness of about 80 Å to about 500 Å. In some embodiments, the second electrode 106D may have a thickness of about 80 Å to about 150 Å. In some embodiments, the second electrode 106D may have a thickness of about 150 Å to about 200 Å. In some embodiments, the second electrode 106D may have a thickness of about 200 Å to about 300 Å. In some embodiments, the second electrode 106D may have a thickness of about 300 Å to about 400 Å. In some embodiments, the second electrode 106D may have a thickness of about 400 Å to about 500 Å.

In this case, the second electrode 106D may be a cathode. The second electrode 106D can be a metal material, such as Ag, Mg and the like. In some embodiments, the second electrode 106D includes ITO (indium tin oxide) or IZO (indium zinc oxide).

In some embodiments, the second electrode 106D is a composite structure. For example, the second electrode 106D has a conductive film and a transparent conductive film thereon. The conductive film is located between the transparent conductive film and the organic carrier transport layer 106L4. In some embodiments, the conductive film includes aluminum, gold, silver, copper, magnesium, molybdenum, and the like. In some embodiments, the transparent conductive film includes indium, tin, graphene, zinc, oxygen, and the like. In some embodiments, the transparent conductive film is ITO (indium tin oxide). In some embodiments, the transparent conductive film is IZO (indium zinc oxide). In some embodiments, the transparent conductive film is located between the conductive film and the organic carrier transport layer 106L4. In some embodiments, the second electrode 106D can be a patterned conductive layer, or a patterned conductive layer with a patterned insulating layer.

In FIG. 2, the light-emitting element 10 includes a substrate 100, a plurality of protrusions 105 on the substrate 100 and a plurality of light-emitting units separated by the protrusions 105.

These light-emitting units include a first light-emitting unit 10a, a second light-emitting unit 10b and a third light-emitting unit 10c. In some embodiments, the first light-emitting unit 10a, the second light-emitting unit 10b and the third light-emitting unit 10c are adjacent to one another. In some embodiments, the second light-emitting unit 10b and the third light-emitting unit 10c have a structure similar to that of the first light-emitting unit 10a. In addition, although the first light-emitting unit 10a, the second light-emitting unit 10b and the third light-emitting unit 10c are illustrated as having similar features, this is merely exemplary and not intended to limit these embodiments. The first light-emitting unit 10a, the second light-emitting unit 10b and the third light-emitting unit 10c may have similar structures or different structures to meet desired functional requirements.

The first light-emitting unit 10a, the second light-emitting unit 10b and the third light-emitting unit 10c may be different from one another at least in the thickness of the organic light-emitting stack layer. In some embodiments, the first light-emitting unit 10a emits green light, the second light-emitting unit 10b emits red light, and the third light-emitting unit 10c emits blue light.

In some embodiments, the light-emitting units 10a, 10b, 10c are configured to be divided into at least three different groups, wherein each group emits a different color than the other groups. The thickness of each organic light-emitting stack layer may be related to the color displayed by the corresponding light-emitting unit 10a, 10b, 10c. In some embodiments, the first light-emitting unit 10a emits green light compared to other light-emitting units configured to emit a different color, and the organic light-emitting stack layer of the first light-emitting unit 10a may have a minimum thickness. In some embodiments, compared with other light-emitting units configured to emit different colors, the second light-emitting unit 10b emits red light, and the thickness of the organic light-emitting stack layer in the second light-emitting unit 10b may be between the thickness of the organic light-emitting stack layer in the first light-emitting unit 10a and the thickness of the organic light-emitting stack layer in the third light-emitting unit 10c. In some embodiments, the third light-emitting unit 10c emits blue light compared to other light-emitting units configured to emit different colors, and the organic light-emitting stack layer of the third light-emitting unit 10c may have a maximum thickness. The organic light-emitting stack layers of the first light-emitting unit 10a, the second light-emitting unit 10b and the third light-emitting unit may be formed through various processes such as vapor deposition, liquid jetting or inkjet printing.

In some embodiments, the first, second and third light-emitting units 10a, 10b, may differ from one another at least in the thickness difference of the carrier transport layer of the first, second and third light-emitting units 10a, 10b, 10c.

In some embodiments, the light-emitting units 10a, 10b, 10c are configured to be divided into at least three different groups, wherein each group emits a different color than the other groups. The thickness of the carrier transport layer can be correlated to the color displayed by the respective light-emitting unit 10a. In some embodiments, the first light-emitting unit 10a emits green light compared to other light-emitting units configured to emit a different color, and the carrier transport layer of the first light-emitting unit 10a may have a minimum thickness. In some embodiments, the second light-emitting unit 10b emits red light compared to other light-emitting units configured to emit a different color, and the thickness of the carrier transport layer in the second light-emitting unit 10b may be between the thickness of the carrier transport layer in the first light-emitting unit 10a and the thickness of the carrier transport layer in the third light-emitting unit 10c. In some embodiments, the third light-emitting unit 10c emits blue light compared to other light-emitting units configured to emit a different color, and the carrier transport layer of the third light-emitting unit 10c may have a maximum thickness.

FIG. 3 is a cross-sectional view showing the relative relationship between the light-emitting element and the debonding film. The release layer 103 is formed under the capping layer 102. In some embodiments, the release layer 103 can protect the capping layer 102. In some embodiments, the capping layer 102 can protect the light shielding layer 101. In some embodiments, the release layer 103 can protect the light shielding layer 101. The release layer 103 is separated from the plurality of light shielding layers 101 by the capping layer 102. In some embodiments, the release layer 103 includes an inorganic material. In some embodiments, the release layer 103 includes silicon oxide or silicon nitride. In some embodiments, the release layer 103 may include silicon.

During the manufacturing process, a debonding film 107 is provided to fix the plurality of light-emitting elements 10′. As the relative positional relationship shown in FIG. 3, the release layer 103 is formed between the capping layer 102 and the debonding film 107, and the release layer 103 is in contact with the debonding film 107. The debonding film 107 is used to fix a wafer on which the light-emitting elements are formed, so as to ensure cutting accuracy when dividing the light-emitting elements. After the cutting is completed, the light-emitting element 10′ is separated from the debonding film 107. In some embodiments, the debonding film 107 comprises an organic material. When the light-emitting element 10′ and the debonding film 107 are separated by irradiating ultraviolet light, since the release layer 103 is an inorganic material and the debonding film 107 is an organic material, the release layer 103 and the debonding film 107 are easily peeled off, thereby improving the process yield when dividing the light-emitting element 10′. In some embodiments, the release layer 103 can achieve the technical effect of easy peeling. In some embodiments, the release layer 103 can protect the light shielding layer 101. In some embodiments, the release layer 103 includes a scratch-resistant material. In some embodiments, the release layer 103 prevents the light shielding layer 101 from diffusing.

In some embodiments, the release layer 103 includes a layer of a single material. In some embodiments, the release layer 103 includes a composite layer formed of a plurality of materials. In some embodiments, the release layer 103 can be coated or sprayed on the capping layer 102. In some embodiments, the thickness of the release layer 103 may be less than 15 μm, for example, between 1 μm and 10 μm. In some embodiments, the release layer 103 may include a photoresist material, such as carbon, hydrogen, oxygen, other suitable materials, or a mixture of a combination thereof. In some embodiments, one side surface of the release layer 103 may be coated with a release agent with separation property. In some embodiments, the release force of the release layer 103 may be less than 15 grams/millimeter (g/mm), such as less than 10 g/mm.

FIG. 4A to FIG. 4K depict a method of manufacturing a light-emitting element according to an embodiment.

In FIG. 4A, a substrate 100 is provided.

In FIG. 4B, a plurality of light shielding layers 101 is disposed on the first surface 100a of the substrate 100. Each light shielding layer 101 is arranged on the same side of the substrate. The respective light shielding layers 101 are separated from one another.

In FIG. 4C, a capping layer 102 is disposed on each light shielding layer 101 on the first surface 100a of the substrate 100. The capping layer 102 surrounds the upper surface and two side surfaces of each of the plurality of light shielding layers 101. The capping layer 102 contacts the substrate 100. The capping layer 102 is formed on the plurality of light shielding layers 101 through one of chemical vapor deposition (CVD), physical vapor deposition (PVD) and spin-on-glass (SOG) spin coating.

In FIG. 4D, a plurality of first electrodes 104 is disposed on the second surface 100b of the substrate 100. Each first electrode 104 is configured to be electrically connected to the substrate 100. The array pattern of the first electrodes 104 is designed in consideration of the arrangement of pixels.

In FIG. 4E, a photosensitive layer 105L is provided on the first electrode 104. In some embodiments, the photosensitive layer 105L is coated on the first electrode 104 and the capping layer 102. The photosensitive layer 105L fills in the gap between adjacent first electrodes 104. The photosensitive layer 105L is heated to a predetermined temperature and then exposed to a specified wavelength. The photosensitive layer 105L can absorb more than 90% of visible light. After exposure, the photosensitive layer 105L is wetted in a solution for development.

As shown in FIG. 4F, a portion of the photosensitive layer 105L is removed, and the remaining portion partially covers the gap between adjacent first electrodes 104. In this cross-sectional view, the remaining photosensitive layer 105L forms a plurality of protrusions 105, and each protrusion 105 is formed on part of the upper surface of the first electrode 104 and covers one side surface of the first electrode 104. The protrusions 105 partially cover the respective first electrodes 104.

The protrusions 105 may be formed in different shapes. In FIG. 4F, the protrusion 105 has a curved surface. In some embodiments, the protrusion 105 is trapezoidal in shape. After the protrusions 105 are formed, a cleaning operation is performed to clean the exposed surfaces of the protrusions 105 and the first electrodes 104. In one embodiment, the deionized water is heated to a temperature between 30° C. and 80° C. during the cleaning operation. After the temperature of the deionized water is raised to a predetermined temperature, the deionized water is introduced to the exposed surfaces of the protrusions 105 and the first electrodes 104.

In some embodiments, ultrasound is used during the cleaning operation. Ultrasound is introduced into a cleaning agent (such as water or isopropyl alcohol (IPA), etc.). In some embodiments, carbon dioxide is introduced into the cleaning agent. After the cleaning operation, the cleaning agent is removed from the exposed surfaces through a heating operation. During the heating operation, the substrate 100 and protrusions 105 may be heated to a temperature between 80° C. and 110° C. In some instances, compressed air is directed to the exposed surface to help remove the residue of the cleaning agent while heating.

After the heating operation, the exposed surfaces can be treated with O2, N2, or Ar plasma. Plasma is used to roughen the exposed surfaces. In some embodiments, ozone is used to condition the surface state of the exposed surfaces.

As shown in FIG. 4G, the carrier injection layer 106L1 is disposed on the protrusion 105, a part of the exposed surface of the capping layer 102 and the exposed surface of the first electrode 104. The carrier injection layer 106L1 is continuously lining along the exposed surface. More specifically, the exposed surface of each first electrode 104 is configured as an effective light-emitting area of a light-emitting unit (i.e., a pixel). In this embodiment, all light-emitting units use the carrier injection layer 106L1. In some embodiments, the carrier injection layer 106L1 is used for hole injection. In some embodiments, the carrier injection layer 106L1 is used for electron injection. The carrier injection layer 106L1 continuously covers the exposed surfaces of the plurality of protrusions 105 and the first electrodes 104. Optionally, the carrier injection layer 106L1 is in contact with the protrusion 105. In one embodiment, the carrier injection layer 106L1 is in contact with the first electrode 104. In some embodiments, the carrier injection layer 106L1 is organic.

As shown in FIG. 4H, a carrier transport layer 106L2 is disposed on the protrusion 105, a part of the exposed surface of the capping layer 102 and the exposed surface of the first electrode 104. The carrier injection layer 106L1 is disposed below the carrier transport layer 106L2. The carrier transport layer 106L2 is continuously lining along the carrier injection layer 106L1. In this embodiment, all the light-emitting units use the carrier transport layer 106L2. In some embodiments, the carrier transport layer 106L2 is used for hole injection. In some embodiments, the carrier transport layer 106L2 is used for electron injection. The carrier transport layer 106L2 continuously covers the plurality of protrusions 105 and the first electrodes 104. Optionally, the carrier transport layer 106L2 is in contact with the carrier injection layer 106L1. In some embodiments, the carrier transport layer 106L2 is organic.

In FIG. 4I, the organic emission layer 106L3 is disposed on the protrusion 105, a portion of the exposed surface of the capping layer 102 and the exposed surface of the first electrode 104. The organic emission layer 106L3 covers the carrier transport layer 106L2. The organic emission layer 106L3 completely covers the exposed carrier transport layer 106L2. The organic emission layer 106L3 is configured to emit a first color.

As shown in FIG. 4J, an organic carrier transport layer 106L4 is disposed on the organic emission layer 106L3. The organic carrier transport layer 106L4 can be a hole or electron transport layer. In some embodiments, the organic carrier transport layer 106L4 and the carrier transport layer 106L2 are respectively configured in opposite valence states.

In FIG. 4K, a second electrode 106D is disposed on the organic carrier transport layer 106L4. The second electrode 106D covers the organic carrier transport layer 106L4. The second electrode 106D can be a metal material, such as Ag, Mg and the like. In some embodiments, the second electrode 106D includes ITO (indium tin oxide) or IZO (indium zinc oxide). In some embodiments, each light-emitting unit (i.e., pixel) has an independent second electrode 106D from a cross-sectional view.

The operations shown in FIG. 4A to FIG. 4K can be repeatedly performed to form light-emitting units of different colors.

As shown in FIG. 4K, the light L1 generated by the light-emitting unit can be emitted outwards towards the substrate, and part of the light L2 can also be emitted outwards towards the second electrode 106D. When the light L2 hits the second electrode 106D, a different reflected light L2r may be generated due to different materials in the second electrode 106D. The reflected light L2r may interfere with the light L1 generated by the light-emitting unit, thus causing problems such as halo and optical crosstalk, resulting in an unsatisfactory optical effect of the organic light-emitting display. According to the light shielding layer 101 of the present disclosure, through proper configuration (for example, using the above discussion to shield the ambient light), the interference of the reflected light L2r on the light L1 can be greatly reduced, thereby solving problems such as halo and optical crosstalk, and improving the contrast of the light-emitting unit.

Referring to FIG. 5A, in some embodiments, the light shielding layer 101 may have a cross-shaped depression 500 (which may correspond to the W1 portion marked in FIG. 2) from a top view. The cross-shaped profile 500 allows the light emitted by the light-emitting unit (e.g. 10a, 10b or 10c) to pass through. In some embodiments, the cross-shaped profile 500 allows the light emitted by a single light-emitting unit to pass through. In some embodiments, the cross-shaped profile 500 allows the light emitted by the plurality of light-emitting units to pass through.

Referring to FIG. 5B, in some embodiments, the light shielding layer 101 may include a first depression 502 and second depressions 504, 506, 508, 510. The first depression 502 has a cross-shaped profile; the second depressions 504, 506, 508, 510 are located on four sides of the first depression 502, and have an L-shaped profile, so that the first depression 502 and the second depressions 504, 506, 508, 510 together form a crosshair pattern. The crosshair pattern can allow the light emitted by the light-emitting unit (for example 10a, 10b or 10c) to pass through. In some embodiments, the first depression 502 may overlap with the effective light-emitting area of a single light-emitting unit, allowing the light emitted by the single light-emitting unit to pass through. In some embodiments, the first depression 502 may overlap with the effective light-emitting area of a plurality of light-emitting units, allowing the light emitted by the plurality of light-emitting units to pass through. In some embodiments, each of the second depressions 504, 506, 508, 510 may overlap with the effective light-emitting area of a single light-emitting unit, each allowing the light emitted by the single light-emitting unit to pass through. In some embodiments, each of the second depressions 504, 506, 508, 510 may overlap with the effective light-emitting area of a plurality of light-emitting units, allowing the light emitted by the plurality of light-emitting units to pass through.

In some embodiments, the first depression 502 and the second depressions 504, 506, 508, 510 may overlap with the effective light-emitting area of a single light-emitting unit, allowing the light emitted by the single light-emitting unit to pass through. In some embodiments, the first depression 502 and the second depressions 504, 506, 508, 510 can overlap with the effective light-emitting areas of a plurality of light-emitting units, so that the light emitted by the plurality of light-emitting units can pass through.

The present application can adjust the patterning into a desired shape according to actual needs.

The foregoing content outlines the features of some implementations so that those skilled in the art may understand various aspects of the disclosure better. Those skilled in the art should understand that the present disclosure can be easily used as a basis for designing or modifying other processes and structures to reach the same purpose and/or achieve the same advantages as the embodiments described in this application. Those skilled in the art should also understand that this equal configuration does not depart from the spirit and scope of the disclosure, and those skilled in the art can make various changes, substitutions and replacements without departing from the spirit and scope of the disclosure.

LIGHT-EMITTING ELEMENT

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