This application is based upon and claims priority to Japanese Patent Application No. 2022-080603, filed on May 17, 2022, the entire contents of which are incorporated herein by reference.
This application is based upon and claims priority to Japanese Patent Application No. 2022-130463, filed on Aug. 18, 2022, the entire contents of which are incorporated herein by reference.
This application is based upon and claims priority to Japanese Patent Application No. 2022-188865, filed on Nov. 28, 2022, the entire contents of which are incorporated herein by reference.
Embodiments described herein relate generally to a light-emitting module and a method for manufacturing a light-emitting module.
Light-emitting modules that combine a light guide member and a light-emitting element such as a light-emitting diode or the like are widely utilized in, for example, planar light sources such as backlights of liquid crystal displays, etc. For example, Japanese Patent Publication No. 2019-61929 discusses a backlight device that includes an LED substrate including a reflective sheet and multiple light-emitting diodes, and a diffusion plate facing the LED substrate.
A light-emitting module according to an aspect of the invention includes a light source part, a light-transmitting member including first and second light-transmitting parts, and a light-adjusting member located at an upper side of the light source part, the first light-transmitting part, and the second light-transmitting part, wherein the first light-transmitting part contacts a lateral surface of the light source part, the second light-transmitting part is positioned at an upper side of the light source part and the first light-transmitting part, the light-adjusting member includes a through-hole positioned away from the light source part in a plan view, the light-transmitting member includes a recess communicating with the through-hole, and at least a portion of the recess is positioned lower than a lower surface of the light-adjusting member.
According to an aspect of the invention, a method for manufacturing a light-emitting module includes, in order, a process of providing an intermediate body including a light source part, a light-transmitting member, and a light-adjusting member positioned at an upper side of the light source part and the light-transmitting member, and a process of forming a through-hole in the light-adjusting member, wherein the light-transmitting member contacts a lateral surface of the light source part, and the through-hole is positioned away from the light source part in a plan view.
Embodiments will now be described with reference to the drawings. Because the drawings schematically show embodiments, the scales, spacing, positional relationships, and the like of the members may be exaggerated, or some of the members may not be illustrated. In the specification, the arrow direction of a Z-axis is taken as up, and the direction at the side opposite to the arrow direction of the Z-axis is taken as down. End views that show only cross sections may be used as cross-sectional views.
In the following description, components that have substantially the same function may be shown using common reference numerals; and a description may be omitted. Terms that indicate specific directions or positions (e.g., “up”, “down”, and other terms including such terms) may be used. Such terms, however, are used merely for better understanding of relative directions or positions when referring to the drawings. As long as the relationships are the same, the relative directions or positions according to terms such as “up”, “down”, etc., used when referring to the drawings may not have the same arrangements in drawings, actual products, and the like outside the disclosure. In the specification, “parallel” includes not only the case where two straight lines, sides, surfaces, or the like do not cross even when extended, but also the case where the angle between two straight lines, sides, surfaces, or the like is within 10°. The positional relationship referred to as “on”, “above”, and “upper side” in the specification includes the case of being in contact and the case of being positioned above without contact.
A light-emitting module 100 and a planar light source 300 of the embodiment will now be described with reference to
The planar light source 300 includes the light-emitting module 100 and a support member 200. The light-emitting module 100 is located on the support member 200. The light-emitting module 100 includes a light source part 10, a light-transmitting member 20, and a light-adjusting member 30. The light-transmitting member 20 includes a first light-transmitting part 21 and a second light-transmitting part 22. The first light-transmitting part 21 contacts the lateral surface of the light source part 10. The second light-transmitting part 22 is positioned at the upper side of the light source part 10. The second light-transmitting part 22 is positioned at the upper side of the first light-transmitting part 21. The light-adjusting member 30 is located at the upper side of the light source part 10. The light-adjusting member 30 is located at the upper side of the first light-transmitting part 21. The light-adjusting member 30 is located at the upper side of the second light-transmitting part 22. The light-adjusting member 30 includes a through-hole 30A. The through-hole 30A of the light-adjusting member 30 is positioned away from the light source part 10 in a plan view. The light-transmitting member 20 includes a recess 20A. The recess 20A of the light-transmitting member 20 communicates with the through-hole 30A. At least a portion of the recess 20A of the light-transmitting member 20 is positioned lower than the lower surface of the light-adjusting member 30.
Because the light-adjusting member 30 is positioned at the upper side of the light source part 10, the region directly above the light source part 10 can be prevented from being too bright. Uneven luminance of the light-emitting module 100 is reduced thereby.
Components included in the light-emitting module 100 and the planar light source 300 will now be elaborated.
As shown in
As shown in
The structure of the light-emitting layer may be a structure that has a single active layer such as a double hetero structure or single quantum well structure (SQW), or may be a structure that has one active layer group such as a multi-quantum well structure (MQW). The light-emitting layer can emit visible light or ultraviolet light. The light-emitting layer can emit blue to red light as the visible light. A semiconductor stacked body including such a light-emitting layer can include, for example, InxAlyGa1-x-yN (0≤x, 0≤y, and x+y≤1). The semiconductor stacked body can include at least one light-emitting layer capable of the light emission described above. For example, the semiconductor stacked body may have a structure that includes at least one light-emitting layer between the n-type semiconductor layer and the p-type semiconductor layer, or may have a configuration in which a structure including the n-type semiconductor layer, the light-emitting layer, and the p-type semiconductor layer in this order is repeated multiple times. When the semiconductor stacked body includes multiple light-emitting layers, light-emitting layers of different light emission peak wavelengths may be included, or light-emitting layers of the same light emission peak wavelength may be included. For example, the light emission peak wavelength being the same means that there may be variation of about several nm. A combination of such light-emitting layers can be selected as appropriate; for example, when the semiconductor stacked body includes two light-emitting layers, the light-emitting layer can be selected to have combinations such as blue light and blue light, green light and green light, red light and red light, ultraviolet light and ultraviolet light, blue light and green light, blue light and red light, green light and red light, etc. Also, the light-emitting layer may include multiple active layers of different light emission peak wavelengths, or may include multiple active layers of the same light emission peak wavelength.
The light source part 10 shown in
As shown in
For example, the light source light-transmitting member 13 is transmissive to the light emitted by the light-emitting element 11. The light source light-transmitting member 13 may include a light-transmitting resin, and may further include a phosphor. For example, a silicone resin, an epoxy resin, or the like can be used as the light-transmitting resin. An yttrium-aluminum-garnet-based phosphor (e.g., (Y, Gd)3(Al, Ga)5O12:Ce), a lutetium-aluminum-garnet-based phosphor (e.g., Lu3(Al, Ga)5O12:Ce), a terbium-aluminum-garnet-based phosphor (e.g., Tb3(Al, Ga)5O12:Ce), a CCA-based phosphor (e.g., Ca10(PO4)6Cl2:Eu), an SAE-based phosphor (e.g., Sr4Al14O25:Eu), a chlorosilicate-based phosphor (e.g., Ca8MgSi4O16Cl2:Eu), a silicate-based phosphor (e.g., (Ba, Sr, Ca, Mg)2SiO4:Eu), an oxynitride-based phosphor such as a β-sialon-based phosphor (e.g., (Si, Al)3(O, N)4:Eu), an α-sialon-based phosphor (e.g., Ca(Si, Al)12(O, N)16:Eu), or the like, a nitride-based phosphor such as an LSN-based phosphor (e.g., (La, Y)3Si6N11:Ce), a BSESN-based phosphor (e.g., (Ba, Sr)2Si5N8:Eu), an SLA-based phosphor (e.g., SrLiAl3N4:Eu), a CASN-based phosphor (e.g., CaAlSiN3:Eu), a SCASN-based phosphor (e.g., (Sr, Ca)AlSiN3:Eu), or the like, a fluoride-based phosphor such as a KSF-based phosphor (e.g., K2SiF6:Mn), a KSAF-based phosphor (e.g., K2 (Si1-xAlx)F6-x:Mn, where x satisfies 0<x<1), a MGF-based phosphor (e.g., 3.5MgO·0.5MgF2·GeO2:Mn), or the like, a quantum dot having a perovskite structure (e.g., (Cs, FA, MA)(Pb, Sn)(F, Cl, Br, I)3, where FA and MA are respectively formamidinium and methylammonium), a Group II-VI quantum dot (e.g., CdSe), a Group III-V quantum dot (e.g., InP), a quantum dot having a chalcopyrite structure (e.g., (Ag, Cu)(In, Ga)(S, Se)2), etc., can be used as the phosphor. One type of phosphor or multiple types of phosphors may be used as the phosphor added to the light source light-transmitting member 13.
A wavelength conversion sheet that contains the phosphor described above may be located on the planar light source 300. The planar light source can emit white light by the wavelength conversion sheet absorbing a portion of the blue light from the light source part 10 and emitting yellow light, green light, and/or red light. For example, white light can be obtained by combining the light source part 10 capable of a blue light emission and a wavelength conversion sheet containing a phosphor capable of a yellow light emission. Also, the light source part 10 that is capable of a blue light emission and a wavelength conversion sheet that contains a red phosphor and a green phosphor may be combined. The light source part 10 that is capable of a blue light emission and multiple wavelength conversion sheets may be combined. For example, a wavelength conversion sheet that contains a phosphor capable of a red light emission and a wavelength conversion sheet that contains a phosphor capable of a green light emission can be selected as the multiple wavelength conversion sheets. The light source part 10 that contains the light-emitting element 11 capable of a blue light emission and the light source light-transmitting member 13 containing a phosphor capable of a red light emission may be combined with a wavelength conversion sheet that contains a phosphor capable of a green light emission.
For example, it is preferable to use the yttrium-aluminum-garnet-based phosphor described above as a phosphor capable of a yellow light emission used in the wavelength conversion sheet. For example, it is preferable to use the quantum dot having the perovskite structure, the Group III-V quantum dot, or the quantum dot having the chalcopyrite structure described above, which have narrow light emission peak wavelength widths at half maximum, as a phosphor capable of a green light emission used in the wavelength conversion sheet. For example, it is preferable to use the KSF-based phosphor, the KSAF-based phosphor, the Group III-V quantum dot, or the quantum dot phosphor having the chalcopyrite structure described above, which have narrow light emission peak wavelength widths at half maximum similarly to the phosphor capable of a green light emission, as a phosphor capable of a red light emission used in the wavelength conversion sheet.
The light source part 10 can further include a cover member 14. The cover member 14 is located at the lower surface of the light-emitting element 11. The cover member 14 is located so that the lower surfaces of the electrodes 12 of the light source part 10 are exposed from the cover member 14. The cover member 14 also is located at the lower surface of the light source light-transmitting member 13 covering the lateral surface of the light-emitting element 11.
The cover member 14 is reflective to the light emitted by the light-emitting element 11. The cover member 14 can include, for example, a resin member that contains light-scattering particles. For example, a thermoplastic resin such as an acrylic resin, a polycarbonate resin, a cyclic polyolefin resin, a polyethylene terephthalate resin, a polyester resin, or the like, or a thermosetting resin such as an epoxy resin, a silicone resin, or the like can be used as the resin member of the cover member 14. For example, particles of titania, silica, alumina, zinc oxide, magnesium oxide, zirconia, yttria, calcium fluoride, magnesium fluoride, niobium pentoxide, barium titanate, tantalum pentoxide, barium sulfate, glass, etc., can be used as the light-scattering particles of the cover member 14.
As shown in
The light source light-adjusting member 15 can include, for example, a resin member that contains light-scattering particles. A material similar to the resin member of the cover member 14 can be used as the resin member of the light source light-adjusting member 15. A material similar to the light-scattering particles of the cover member 14 can be used as the light-scattering particles of the light source light-adjusting member 15. The light source light-adjusting member 15 may be, for example, a dielectric multilayer film or a metal member of aluminum, silver, etc.
As shown in
The shape of the light source part 10 in a plan view is not particularly limited. The shape of the light source part 10 in a plan view can be, for example, circular, triangular, quadrilateral, hexagonal, octagonal, etc. When the shape of the light source part 10 in a plan view is quadrilateral, a pair of outer edges of the light source part 10 may be parallel to the first direction (the X-direction) or may be oblique to the first direction (the X-direction). According to the embodiment, the pair of outer edges of the light source part 10 is rotated 45° with respect to the first direction (the X-direction).
The light-transmitting member 20 is a member that is transmissive to the light emitted by the light source part 10. The light-transmitting member 20 includes the first light-transmitting part 21 and the second light-transmitting part 22. According to the embodiment, the first light-transmitting part 21 and the second light-transmitting part 22 are separate bodies. The first light-transmitting part 21 and the second light-transmitting part 22 may be formed to have a monolithic body of the same material. It is preferable for the transmittances of the first and second light-transmitting parts 21 and 22 for the peak wavelength of the light source part 10 to be, for example, not less than 60%, and more favorably not less than 80%.
As shown in
The first light-transmitting part 21 may be configured as a single layer in the third direction (the Z-direction) or may be configured as a stacked body of multiple layers. The first light-transmitting part 21 may contain a phosphor and/or light-scattering particles. When the first light-transmitting part 21 is a stacked body, each layer may or may not contain a phosphor and/or light-scattering particles. For example, the first light-transmitting part 21 may include a layer that contains a phosphor and a layer that does not contain a phosphor. For example, a material similar to the resin member of the cover member 14 can be used as the material of the first light-transmitting part 21.
The second light-transmitting part 22 is positioned at the upper side of the light source part 10. The second light-transmitting part 22 is positioned at the upper side of the first light-transmitting part 21. It is preferable for the second light-transmitting part 22 to contact the upper surface of the light source part 10 and/or the upper surface of the first light-transmitting part 21. Thereby, the light-emitting module 100 is more easily downsized in the third direction (the Z-direction).
For example, a material similar to the resin member of the cover member 14 can be used as the material of the second light-transmitting part 22. A sheet-like optically clear adhesive (OCA) may be used as the second light-transmitting part 22. A hot-melt resin may be used as the material of the second light-transmitting part 22. The second light-transmitting part 22 may contain a phosphor and/or light-scattering particles.
As shown in
The light-transmitting recess 20A of the light-transmitting member 20 communicates with the through-hole 30A (hereinbelow, referred to as the light-adjusting through-hole) of the light-adjusting member 30. That is, the space inside the light-transmitting recess 20A and the space inside the light-adjusting through-hole 30A communicate with each other. The shielding of the light emitted from the light-transmitting recess 20A by the light-adjusting member 30 can be reduced thereby. That is, the light exiting the light-transmitting recess 20A passes through the light-adjusting through-hole 30A and is extracted outside the light-emitting module 100. The light extraction efficiency of the light-emitting module 100 is increased thereby. The light-transmitting recess 20A overlaps the light-adjusting through-hole 30A in a plan view.
As shown in
At least a portion of the light-transmitting recess 20A of the light-transmitting member 20 is positioned lower than the lower surface of the light-adjusting member 30. The distance from the light-transmitting recess 20A to the light source part 10 in the third direction (the Z-direction) can be reduced thereby. The amount of the light from the light source part 10 that passes through the light-transmitting recess 20A and is extracted outside the light-emitting module 100 is more easily increased thereby.
The light-transmitting recess 20A may be provided in only the second light-transmitting part 22 as shown in the light-emitting module 100 of
As shown in a light-emitting module 103 and a planar light source 303 of
The shapes and quantity of the light-transmitting protrusions 20B in a plan view are not particularly limited. For example, as shown in
According to the embodiment, the light-transmitting protrusion 20B is triangular in a cross-sectional view. In a cross sectional view, the light-transmitting protrusion 20B may be polygonal such as octagonal, hexagonal, quadrilateral such as trapezoidal, etc. The light-transmitting protrusion 20B may include a curved portion in a cross sectional view. The upper surface of the light-transmitting protrusion 20B may include a recess.
The light-adjusting member 30 is reflective and transmissive to the light emitted by the light source part 10. A portion of the light emitted from the light source part 10 is reflected by the light-adjusting member 30; and another portion of the light passes through the light-adjusting member 30. The transmittance of the light-adjusting member 30 for the peak wavelength of the light source part 10 is less than the transmittances of the first and second light-transmitting parts 21 and 22 for the peak wavelength of the light source part 10. For example, it is preferable for the transmittance of the light-adjusting member 15 for the peak wavelength of the light source part 10 to be, for example, not less than 1% and not more than 50%, and more favorably not less than 3% and not more than 30%. The light-adjusting member 30 may be configured as a single layer or may be configured as a stacked body of multiple layers.
The light-adjusting member 30 is located at the upper side of the light source part 10. The light-adjusting member 30 and the light source part 10 overlap in a plan view; and the light-adjusting member 30 is positioned at the upper side of the light source part 10 at the overlapping portion. Because the light-adjusting member 30 is positioned at the upper side of the light source part 10, the region directly above the light source part 10 can be prevented from being too bright.
The light-adjusting member 30 is located at the upper side of the first light-transmitting part 21. The light-adjusting member 30 and the first light-transmitting part 21 overlap in a plan view; and the light-adjusting member 30 is positioned at the upper side of the first light-transmitting part 21 at the overlapping portion. Because the light-adjusting member 30 is positioned at the upper side of the first light-transmitting part 21, the region directly above the first light-transmitting part 21 can be prevented from being too bright.
The light-adjusting member 30 is located at the upper side of the second light-transmitting part 22. The light-adjusting member 30 and the second light-transmitting part 22 overlap in a plan view; and the light-adjusting member 30 is positioned at the upper side of the second light-transmitting part 22 at the overlapping portion. Because the light-adjusting member 30 is positioned at the upper side of the second light-transmitting part 22, the region directly above the second light-transmitting part 22 can be prevented from being too bright.
The light-adjusting member 30 has the light-adjusting through-hole 30A. Because the light-adjusting member 30 has the light-adjusting through-hole 30A, it is easier to adjust the luminance in the region directly above the light-adjusting member 30. For example, the shielding of the light from the light source part 10 by the light-adjusting member 30 can be adjusted by modifying the size and/or position of the light-adjusting through-hole 30A. The luminance in the region directly above the light-adjusting member 30 is more easily adjusted thereby, and the uneven luminance of the light-emitting module 100 is easily reduced. The light-adjusting through-hole 30A is positioned away from the outer edge of the light-adjusting member 30 in a plan view.
It is preferable for the light-adjusting through-hole 30A of the light-adjusting member 30 to be positioned away from the light source part 10 in a plan view. Thereby, the region directly above the light source part 10 can be prevented from being too bright. When the light-adjusting member 30 has multiple light-adjusting through-holes 30A, it is preferable for all of the multiple light-adjusting through-holes 30A to be positioned away from the light source part 10 in a plan view. Thereby, the region directly above the light source part 10 can be prevented from being too bright. When the light-adjusting member 30 has multiple light-adjusting through-holes 30A, at least one of the multiple light-adjusting through-holes 30A of the light-adjusting member 30 may overlap the light source part 10 in a plan view.
The shape of the light-adjusting through-hole 30A in a plan view is not particularly limited. As shown in
As shown in
As shown in
As shown in
As shown in
The light-adjusting member 30 can include a resin member 31A (hereinbelow, referred to as the light-adjusting resin member), and a reflector 31B (hereinbelow, referred to as the light-adjusting reflector) contained in the light-adjusting resin member 31A. A material similar to the resin member of the cover member 14 can be used as the material of the light-adjusting resin member 31A. A material similar to the light-scattering particles of the cover member 14 can be used as the material of the light-adjusting reflector 31B. A gas such as air or the like may be used as the light-adjusting reflector 31B.
It is preferable for the refractive index of the light-adjusting reflector 31B to be less than the refractive index of the light-adjusting resin member 31A. Thereby, a portion of the light from the light source part 10 that is incident on the light-adjusting resin member 31A is totally reflected more easily at the interface between the light-adjusting resin member 31A and the light-adjusting reflector 31B. The light that escapes upward from the light source part 10 can be reduced thereby, and the region directly above the light source part 10 can therefore be prevented from being too bright. In the specification, the refractive index means the refractive index of the peak wavelength of the light source part 10.
When the refractive index of the light-adjusting reflector 31B is less than the refractive index of the light-adjusting resin member 31A, it is preferable for the refractive index of the light-adjusting resin member 31A to be greater than the refractive index of the base material of the first light-transmitting part 21. The refractive index difference between the light-adjusting resin member 31A and the light-adjusting reflector 31B is more easily increased thereby. Thereby, a portion of the light traveling from the light-adjusting resin member 31A to the light-adjusting reflector 31B is totally reflected more easily at the interface between the light-adjusting resin member 31A and the light-adjusting reflector 31B. The light that escapes upward from the light source part 10 can be reduced thereby, and the region directly above the light source part 10 can therefore be prevented from being too bright.
As shown in
As shown in
The quantity of the light guide members 40 included in the light-emitting module 100 may be one or more. According to the embodiment, the light-emitting module 100 includes multiple light guide members 40 including a first light guide part 40A, a second light guide part 40B, a third light guide part 40C, and a fourth light guide part 40D. The first light guide part 40A and the second light guide part 40B are next to each other in the first direction (the X-direction). The third light guide part 40C and the fourth light guide part 40D are next to each other in the first direction (the X-direction). The first light guide part 40A and the third light guide part 40C are next to each other in the second direction (the Y-direction). The second light guide part 40B and the fourth light guide part 40D are next to each other in the second direction (the Y-direction). The first light source 10A is located in the housing part 403 of the first light guide part 40A. The second light source 10B is located in the housing part 403 of the second light guide part 40B. The third light source 10C is located in the housing part 403 of the third light guide part 40C. The fourth light source 10D is located in the housing part 403 of the fourth light guide part 40D.
As shown in
The light guide member 40 is partitioned by a partitioning groove 41. One region partitioned by the partitioning groove 41 is taken as a light-emitting region 300A. According to the embodiment, the first light guide part 40A, the second light guide part 40B, the third light guide part 40C, and the fourth light guide part 40D that are partitioned by the partitioning groove 41 are individual light-emitting regions 300A. One light-emitting region 300A can be the driving unit of local dimming. The quantity of the light-emitting regions 300A included in the planar light source 300 is not particularly limited. For example, the planar light source 300 may has one light-emitting region 300A, or the planar light source 300 may has multiple light-emitting regions 300A. A planar light source device that has a larger surface area may be made by arranging the multiple planar light sources 300. A member that is reflective to the light emitted by the light source part 10 may be located inside the partitioning groove 41. The contrast ratio between a light-emitting region in a light-emitting state and a light-emitting region in a non-light-emitting state can be improved thereby. In the light-emitting module, a member that is reflective to the light emitted by the light source part 10 may not be provided inside the partitioning groove 41.
According to the embodiment, the light guide member 40 includes a lattice-shaped partitioning groove 41 including first partitioning groove portions 41A extending in the second direction (the Y-direction), and second partitioning groove portions 41B extending in the first direction (the X-direction). The first partitioning groove portion 41A that extends in the second direction (the Y-direction) is positioned between the first light guide part 40A and the second light guide part 40B. The second partitioning groove portion 41B that extends in the first direction (the X-direction) is positioned between the first light guide part 40A and the third light guide part 40C. It is preferable for the partitioning groove 41 to extend from the first surface 401 to the second surface 402 of the light guide member 40. Thereby, the light guide member 40 can be divided into a plurality of parts; therefore, for example, warpage of the support member 200 due to the thermal expansion coefficient difference between the light guide member 40 and the support member 200 can be reduced. The occurrence of cracks in a conductive member 80 described below can be reduced thereby. The partitioning groove 41 may be a recess open at only the first surface 401 side of the light guide member 40, or may be a recess open at only the second surface 402 side of the light guide member 40. When the partitioning groove 41 is a recess, the partitioning groove 41 has a bottom surface formed of the light guide member 40.
As shown in
The shape of the first light guide hole part 42A in a plan view is not particularly limited. As shown in
In the specification, the point most distant to the center of the first light source 10A on the outer edge of the first light guide part 40A positioned at the first surface 401 is referred to as a first point P1; and the point most proximate to the center of the first light source 10A on the outer edge of the first light guide part 40A positioned at the first surface 401 is referred to as a second point P2. According to the embodiment, the first point P1 is positioned at a corner of the first light guide part 40A; and the second point P2 is positioned at the center of each side of the first light guide part 40A. The quantities of the first points P1 and the second points P2 are one or plural.
As shown in
It is preferable for multiple first light guide hole parts 42A to be positioned on the imaginary straight line connecting the first point P1 and the center of the first light source 10A. The luminance at the vicinity of the first point P1 is more easily adjusted thereby, and the uneven luminance of the light-emitting module is easily reduced. It is preferable for the quantity of the first light guide hole parts 42A positioned on the imaginary straight line connecting the first point P1 and the center of the first light source 10A to be greater than the quantity of the first light guide hole parts 42A positioned on the imaginary straight line connecting the second point P2 and the center of the first light source 10A. The difference between the luminance at the first point P1 and the luminance at the second point P2 is more easily reduced thereby. There is no first light guide hole part 42A positioned on the imaginary straight line connecting the second point P2 and the center of the first light source 10A.
It is preferable for at least one of the first light guide hole parts 42A to extend in a direction oblique to the first and second directions to extend away from the first light source 10A from the end portion of the first light guide hole part 42A proximate to the center of the first light source 10A in a plan view. Thereby, a portion of the light from the first light source 10A can be guided in the direction in which the first light guide hole part 42A extends. The uneven luminance of the light-emitting module can be reduced thereby.
The shapes and/or quantity of the first light guide hole parts 42A located in the first light guide part 40A and the shapes and/or quantity of the first light guide hole parts 42A located in the second light guide part 40B may be respectively the same or different. For example, the uneven luminance of the first light guide part 40A and the uneven luminance of the second light guide part 40B are checked before forming the first light guide hole parts 42A in the light guide member 40. The first light guide hole parts 42A that are suited to the first and second light guide parts 40A and 40B are formed in the light guide member 40 after checking the uneven luminance of the first light guide part 40A and the uneven luminance of the second light guide part 40B. The uneven luminance of the light-emitting module 100 can be reduced thereby. For example, if the uneven luminance is within the desired range before forming the first light guide hole parts 42A in the light guide member 40, the first light guide hole parts 42A may not be provided in the light guide member 40. For example, as the technique of checking the uneven luminance of the first light guide part 40A and the uneven luminance of the second light guide part 40B, the luminance can be checked by measuring with a two-dimensional color luminance meter (Konica Minolta CA-2500).
As in the light-emitting module 101 shown in
It is preferable for a maximum length L5 of the second light guide hole part 42B in the lateral direction to be less than the maximum length L2 of the light-adjusting through-hole 30A in the lateral direction in a cross sectional view. In other words, it is preferable for the maximum length L2 of the light-adjusting through-hole 30A in the lateral direction to be greater than the maximum length L5 of the second light guide hole part 42B in the lateral direction. The shielding of the light emitted from the second light guide hole part 42B by the light-adjusting member 30 can be reduced thereby.
As in a light-emitting module 102 and a planar light source 302 shown in
For example, a thermoplastic resin such as acrylic, polycarbonate, cyclic polyolefin, polyethylene terephthalate, polyester, or the like, a thermosetting resin such as epoxy, silicone, or the like, glass, etc., can be used as the material of the light guide member 40.
It is preferable for the thickness of the light guide member 40 to be, for example, not less than 150 μm and not more than 800 μm. In the specification, the thickness of each member is taken to be the maximum value from the upper surface of the member to the lower surface of the member along the third direction (the Z-direction). The light guide member 40 may be configured as a single layer in the third direction or may be configured as a stacked body of multiple layers. When the light guide member 40 is configured as a stacked body, one or more transmissive adhesives may be located between the layers. The major materials of the layers of the stacked body may be different types.
The support member 200 is a member on which the light-emitting module 100 is located. The support member 200 supports the light source part 10 and the light guide member 40. The light guide member 40 is located on the support member 200 so that the second surface 402 faces the upper surface of the support member 200.
The support member 200 includes a wiring substrate 50. The wiring substrate 50 includes an insulating base material 51, and at least one wiring layer 52 located in at least one surface of the insulating base material 51. The insulating base material 51 may be a rigid substrate or a flexible substrate. It is preferable for the insulating base material 51 to be a flexible substrate to make the planar light source thin. The insulating base material 51 may be configured as a single layer in the third direction (the Z-direction) or may be configured as a stacked body of multiple layers. For example, the insulating base material 51 may be configured as a single-layer flexible substrate or may be configured as a stacked body of multiple rigid substrates. For example, a resin such as polyimide or the like can be used as the material of the insulating base material 51. The wiring layer 52 is a metal film, e.g., a copper film.
The support member 200 further includes a first adhesive layer 61 located on the wiring substrate 50, a reflecting member 70 located on the first adhesive layer 61, and a second adhesive layer 62 located on the reflecting member 70.
The first adhesive layer 61 is located between the wiring substrate 50 and the reflecting member 70 and bonds the wiring substrate 50 and the reflecting member 70. The first adhesive layer 61 can be formed of, for example, a resin member that contains light-scattering particles. For example, a material similar to the resin member of the cover member 14 can be used as the resin member of the first adhesive layer 61. For example, a material similar to the light-scattering particles of the cover member 14 can be used as the light-scattering particles of the first adhesive layer 61. A sheet-like optical clear adhesive may be used as the first adhesive layer 61.
It is preferable for the refractive index of the resin member of the first adhesive layer 61 to be less than the refractive index of the resin member of the reflecting member 70. Thereby, a portion of the light traveling from the reflecting member 70 to the first adhesive layer 61 is totally reflected more easily at the interface between the reflecting member 70 and the first adhesive layer 61. The light that escapes downward from the light-emitting module 100 can be reduced thereby, and the light extraction efficiency of the light-emitting module 100 is therefore increased.
The reflecting member 70 is located below the second surface 402 of the light guide member 40, below the light source part 10, below the light-transmitting member 20, and below the partitioning groove 41. The reflecting member 70 is reflective to the light emitted by the light source part 10. The reflecting member 70 can be formed of a resin member, and a reflector contained in the resin member. For example, a material similar to the resin member of the cover member 14 can be used as the resin member of the reflecting member 70. A material similar to the light-scattering particles of the cover member 14 can be used as the material of the reflector of the reflecting member 70. A gas such as air or the like may be used as the reflector of the reflecting member 70.
It is preferable for the refractive index of the reflector of the reflecting member 70 to be less than the refractive index of the resin member of the reflecting member 70. Thereby, a portion of the light from the light source part 10 that is incident on the reflecting member 70 is totally reflected more easily at the interface between the resin member of the reflecting member 70 and the reflector of the reflecting member 70. The light that escapes downward from the reflecting member 70 can be reduced thereby, and the light extraction efficiency of the light-emitting module 100 is therefore increased.
When the refractive index of the reflector of the reflecting member 70 is less than the refractive index of the resin member of the reflecting member 70, it is preferable for the refractive index of the resin member of the reflecting member 70 to be greater than the refractive index of the base material of the first light-transmitting part 21. The refractive index difference between the resin member of the reflecting member 70 and the reflector of the reflecting member 70 is more easily increased thereby. Thereby, a portion of the light from the light source part 10 that is incident on the reflecting member 70 is totally reflected more easily at the interface between the resin member of the reflecting member 70 and the reflector of the reflecting member 70.
The second adhesive layer 62 is located between the reflecting member 70 and the second surface 402 of the light guide member 40 to bond the reflecting member 70 and the light guide member 40. The light source part 10 is located on the second adhesive layer 62 inside the housing part 403 of the light guide member 40. The second adhesive layer 62 can be formed of, for example, a resin member that contains light-scattering particles. For example, a material similar to the resin member of the cover member 14 can be used as the resin member of the second adhesive layer 62. For example, a material similar to the light-scattering particles of the cover member 14 can be used as the light-scattering particles of the second adhesive layer 62. A sheet-like optical clear adhesive may be used as the second adhesive layer 62.
It is preferable for the refractive index of the resin member of the second adhesive layer 62 to be less than the refractive index of the base material of the light guide member 40. Thereby, a portion of the light traveling from the light guide member 40 to the second adhesive layer 62 is totally reflected more easily at the interface between the light guide member 40 and the second adhesive layer 62. The light that escapes downward from the light-emitting module 100 can be reduced thereby, and the light extraction efficiency of the light-emitting module 100 is therefore increased. It is preferable for the refractive index of the resin member of the second adhesive layer 62 to be less than the refractive index of the base material of the first light-transmitting part 21. Thereby, a portion of the light traveling from the first light-transmitting part 21 to the second adhesive layer 62 is totally reflected more easily at the interface between the first light-transmitting part 21 and the second adhesive layer 62. The light that escapes downward from the light-emitting module 100 can be reduced thereby, and the light extraction efficiency of the light-emitting module 100 is therefore increased.
The support member 200 further includes the conductive member 80. The conductive member 80 is formed of, for example, a resin, and metal particles contained in the resin. For example, an epoxy resin or a phenol resin can be used as the resin of the conductive member 80. For example, particles of copper or silver can be used as the metal particles.
The conductive member 80 includes a connection part 81 and a wiring part 82. The connection part 81 extends through the second adhesive layer 62, the reflecting member 70, the first adhesive layer 61, and the insulating base material 51 in the third direction (the Z-direction). The wiring part 82 is located at the surface of the wiring substrate 50 at which the wiring layer 52 is located; and the wiring part 82 is connected with the connection part 81. The connection part 81 and the wiring part 82 can be formed as a continuous body of the same material. A portion of the wiring part 82 is connected with the wiring layer 52.
A pair of conductive members 80 are separated from each other and are provided to correspond to the pair of positive and negative electrodes 12 of the light source part 10. The connection part 81 of one conductive member 80 is connected with the positive-side electrode 12 below the light source part 10; and the connection part 81 of the other conductive member 80 is connected with the negative-side electrode 12 below the light source part 10. The electrodes 12 of the light source part 10 are electrically connected with the conductive members 80 and the wiring layer 52.
The shape of the connection part 81 of the conductive member 80 in a bottom view is not particularly limited. According to the embodiment as shown in
The support member 200 further includes an insulating layer 90. The insulating layer 90 is located at the lower surface of the wiring substrate 50 and covers the wiring layer 52. For example, an epoxy resin, a urethane resin, or an acrylic resin can be used as the material of the insulating layer 90.
An example of a method for manufacturing the light-emitting module 102 and the planar light source 302 will now be described with reference to
A stacked member 210 shown in
As shown in
As shown in
As shown in
After the light source part 10 is disposed inside the housing part 403, the conductive member 80 is formed inside the through-hole of the stacked member 210 as shown in
After the conductive member 80 is formed, the insulating layer 90 that covers the lower surface of the conductive member 80 is formed. For example, the insulating layer 90 can be formed by a method such as printing, potting, spraying, inkjet, bonding a resin sheet, etc.
After forming the insulating layer 90 covering the lower surface of the conductive member 80, the first light-transmitting part 21 that covers the lateral surface of the light source part 10 is formed inside the housing part 403 as shown in
After the first light-transmitting part 21 is formed, the first light guide hole part 42A and the third light guide hole part 42C that are open at the first surface 401 side of the light guide member 40 are formed as shown in
After the first light guide hole part 42A and the third light guide hole part 42C are formed, the uncured second light-transmitting part 22 is disposed at the upper side of the light source part 10 and the first light-transmitting part 21 as shown in
After the uncured second light-transmitting part 22 is disposed at the upper side of the light source part 10 and the first light-transmitting part 21, a light-adjusting member 32 (hereinbelow, referred to as the light-adjusting intermediate member) is disposed at the upper side of the light source part 10 and the first light-transmitting part 21 with the uncured second light-transmitting part 22 interposed as shown in
After the process of providing the intermediate body, the light-adjusting through-hole 30A is formed in the light-adjusting intermediate member 32 as shown in
The light-adjusting end piece 33 is removed after the process of singulating into the light-adjusting members 30. It is preferable to include an ozone cleaning or plasma treatment of the light-adjusting member 30 after the light-adjusting end piece 33 is removed. Impurities such as organic compounds, etc., can be removed thereby. Even when a portion of the light-adjusting member 30 is yellowed by laser irradiation, at least a portion of the yellowed light-adjusting member 30 can be removed by performing ozone cleaning or plasma treatment of the light-adjusting member 30. The light extraction efficiency of the light-emitting module 102 is increased thereby. The light-emitting module 102 and the planar light source 302 shown in
When a hot-melt resin is used as the material of the second light-transmitting part 22, at least a portion of the second light-transmitting part 22 may be melted further by heating after the light-emitting module 102 and the planar light source 302 shown in
An example of a method for manufacturing the light-emitting module 103 and the planar light source 303 will now be described with reference to
As shown in
As shown in
By the light-adjusting intermediate member 32 including the light-adjusting hole part 32C, the variation of the size in the lateral direction of the second light-transmitting part 22 is more easily reduced. The uncured second light-transmitting part 22 also can wet and spread into the light-adjusting hole part 32C when disposing the light-adjusting intermediate member 32 at the upper side of the light source part and the first light-transmitting part 21 with the uncured second light-transmitting part 22 interposed. Thereby, the size of the wetting and spreading of the uncured second light-transmitting part 22 in the lateral direction is more easily adjusted by the light-adjusting hole part 32C. Therefore, by the light-adjusting intermediate member 32 having the light-adjusting hole part 32C, the variation of the size in the lateral direction of the second light-transmitting part 22 is more easily reduced. The light-transmitting protrusion 20B is formed of the second light-transmitting part 22 that wets and spreads into the light-adjusting hole part 32C.
After the process of providing the intermediate body, the light-adjusting through-hole 30A is formed in the light-adjusting intermediate member 32 as shown in
After the process of forming the light-adjusting through-hole 30A in the light-adjusting member 30, a portion of the second region 32B that is positioned at the outer side of the light-adjusting through-hole 30A and includes the light-adjusting through-hole 30A is removed. The removed portion of the second region 32B of the light-adjusting intermediate member 32 is positioned outward from the light-adjusting through-hole 30A. The removed portion of the second region 32B of the light-adjusting intermediate member 32 includes the light-adjusting through-hole 30A. The removed portion of the second region 32B of the light-adjusting intermediate member 32 is the same portion as the light-adjusting end piece 33. After the light-adjusting end piece 33 is removed, an ozone cleaning or plasma treatment of the light-adjusting member 30 may be performed. The light-emitting module 103 and the planar light source 303 shown in
According to embodiments, a light-emitting module and a method for manufacturing a light-emitting module can be provided in which uneven luminance can be reduced.
The specification includes the following embodiments.
A light-emitting module, comprising:
The light-emitting module according to Clause 1, wherein
The light-emitting module according to Clause 1 or Clause 2, wherein
The light-emitting module according to any one of Clauses 1 to 3, wherein
The light-emitting module according to any one of Clauses 1 to 4, further comprising:
The module according to Clause 5, wherein
The light-emitting module according to Clause 5 or Clause 6, wherein
The light-emitting module according to Clause 7, wherein
A method for manufacturing a light-emitting module, the method comprising, in order:
The method for manufacturing the light-emitting module according to Clause 9, wherein
The method for manufacturing the light-emitting module according to Clause 9 or Clause 10, wherein
The method for manufacturing the light-emitting module according to any one of Clauses 9 to 11, the method further comprising:
The method for manufacturing the light-emitting module according to any one of Clauses 9 to 12, wherein
Hereinabove, exemplary embodiments of the invention are described with reference to specific examples. However, the embodiments of the invention are not limited to these specific examples. All embodiments practicable by an appropriate design modification by one skilled in the art based on the exemplary embodiments of the invention described above also are within the scope of the invention to the extent that the purport of the invention is included. Various other variations and modifications can be conceived by those skilled in the art within the spirit of the invention, and it is understood that such variations and modifications are also encompassed within the scope of the invention.
Number | Date | Country | Kind |
---|---|---|---|
2022-080603 | May 2022 | JP | national |
2022-130463 | Aug 2022 | JP | national |
2022-188865 | Nov 2022 | JP | national |