Patent Application
20120092853
The present invention relates to a light emitting module, and in particular, to a light emitting module comprising a light emitting element and a light wavelength conversion member configured to convert the wavelength of the light emitted by the light emitting element and to emit the light.
Currently, white LEDs (Light Emitting Diodes) emitting white light are widely used. Herein, a white LED emitting white light by additive color mixing of blue light, green light, and red light is proposed, the mixing being achieved by, for example, combining a semiconductor light emitting element emitting the blue light, a phosphor emitting the green light by being excited with the blue light, and a phosphor emitting the red light by being excited with the blue light (see, for example, Patent Document 1). In the white LED, the semiconductor light emitting element emitting the blue light is covered by pouring a binder containing the phosphors into a cup on the bottom of which the semiconductor light emitting element has been arranged.
On the other hand, in a white LED having such a structure, the distance between the semiconductor light emitting element and the emitting surface of a binder paste is not uniform, and hence an amount of light whose wavelength is converted while the light emitted from the semiconductor light emitting element is passing through the binder paste, becomes different in accordance with an emission direction. Accordingly, an area where the binder paste is thick looks yellow because the yellow light emitted after the wavelength thereof has been converted is large in amount, while an area where the binder paste is thin looks blue because yellow light is small in amount. Thus, it becomes difficult to uniformly obtain white light emission. When color shade is generated in a light emitting module, as stated above, it becomes difficult, particularly in applications as light sources for lighting, to provide high quality lighting.
Accordingly, in order to make the thickness of a binder paste containing phosphors to be uniform, a method of forming a light emitting diode has been proposed, in which a fluorescent substance is arranged on an LED chip by an ink jet printing method (see, for example, Patent Document 2). In addition, a light emitting device, which is produced by, for example, depositing a stencil composition in an opening of a stencil whose position has been determined and then by removing the stencil to cure the stencil composition, has been proposed (see, for example, Patent Document 3).
In the techniques described in the aforementioned Patent Documents 2 and 3, it has been taken into consideration to make the thickness of a binder paste to be uniform, in order to make the color of the light emitted from a light emitting device. However, when it is needed to make the thickness of a binder paste to be uniform, there is the fear that the degree of freedom of the shape of the binder paste may be decreased. On the other hand, LEDs have recently been used in an increasingly wide range of applications, and hence there is a demand for achieving LED light emitting elements having various forms. In this case, when a restriction is set in the shape of a binder paste, there is the possibility that the degree of freedom in designing an LED may be impaired. In particular, when a plurality of semiconductor light emitting elements spaced apart from each other are integrally covered with a binder paste, the distance between each of the semiconductor light emitting elements and the emitting surface of the binder paste does not become uniform only by making the surface of the binder paste to be uniformly flat; and hence it is difficult to obtain a light emitting module emitting uniform color in the techniques described in the aforementioned Patent Documents 2 and 3.
Thus, the present invention has been made to solve the aforementioned problem, and a purpose of the invention is to provide a light emitting module that emits uniform color while the degree of freedom of forms is being secured.
In order to solve the aforementioned problem, a light emitting module according to an embodiment of the present invention comprises: a light emitting element; and a light wavelength conversion member configured to convert the wavelength of the light emitted by the light emitting element and to emit the light. The light wavelength conversion member contains a plurality of phosphors, the wavelength range of the light emitted after the wavelength thereof has been converted by one of the plurality of phosphors being different from the excitation wavelengths for the others, the light wavelength conversion member being formed to cover the light emitting element.
According to the embodiment, it can be avoided that the light whose wavelength has been converted by one of the phosphors may be excited and absorbed by the other phosphors. Accordingly, a light emitting module that emits light having uniform color, independently of the thickness of a light wavelength conversion member, can be obtained.
It may be made that a plurality of the light emitting elements are provided side by side to be spaced apart from each other and the light wavelength conversion member is formed so as to integrally cover the plurality of the light emitting elements.
In recent years, there is a demand for developing light emitting modules that can emit light having uniform color onto a wider area, because it is demanded to use LEDs in the applications as light sources for lighting, etc. However, if a plurality of light emitting elements are arranged so as to be spaced apart from each other in order to achieve a light emitting module that can emit light from a wider area, it becomes difficult to make the distance between each of the plurality of light emitting elements and the emitting surface of a light wavelength conversion member when the light emitting elements are integrally covered with the light wavelength conversion member. According to the embodiment, by using a light wavelength conversion member containing a plurality of phosphors, the wavelength range of the light emitted after the wavelength thereof has been converted by one of the plurality of phosphors being different from the excitation wavelengths for the others, a light emitting module that emits uniform light, even when a plurality of light emitting elements have been provided side by side to be spaced apart from each other, can be achieved.
The plurality of the light emitting elements may be arranged on the same flat surface.
When a plurality of light emitting elements are used, for example, as light sources for lighting, an aspect can be considered in which the plurality of light emitting elements are provided on the same flat surface and side by side so as to be spaced apart from each other. In addition, when a plurality of light emitting elements are provided, it is also strongly demanded to arrange them on the same flat surface, because a substrate can be simply configured when they can be arranging on the same substrate. However, when a plurality of light emitting elements are provided on the same flat surface and side by side so as to be spaced apart from each other, color shade, if any, becomes very noticeable because it becomes possible to visually confirm the light from all of the light emitting elements from the same viewpoint. According to the embodiment, occurrence of color shade can be suppressed even when a plurality of light emitting elements are arranged on the same flat surface. Accordingly, a light emitting module on a flat surface that emits light having uniform color can be achieved. The plurality of the light emitting elements may be provided side by side on a straight line or arranged in a scattered manner on a flat surface.
Another embodiment of the present invention is also a light emitting module. This light emitting module comprises: a light emitting element configured to emit near-ultraviolet light or the light in the wavelength range of short-wavelength visible light; and a light wavelength conversion member that contains both a first phosphor represented by the general formula of M1O2.a(M21-z,M4z)O.bM3X2 (wherein, M1 is at least one element selected from the group consisting of Si, Ge, Ti, Zr, and Sn; M2 is at least one element selected from the group consisting of Mg, Ca, Sr, Ba, and Zn; M3 is at least one element selected from the group consisting of Mg, Ca, Sr, Ba, and Zn; X is at least one halogen element; M4 is at least one element in which Eu2+ is essential selected from the group consisting of rare earth elements and Mn; and a, b, and z are respectively within the ranges of 0.1≦a≦1.3, 0.1≦b≦0.25, and 0.03≦z≦0.8), and a second phosphor that converts the wavelength of the light emitted by the light emitting element and emits blue light, the light wavelength conversion member being formed so as to cover the light emitting element.
As a result of intensive research and development by the present inventors, it has been confirmed that the wavelength range of the light emitted after the wavelength thereof has been converted by either of the aforementioned first phosphor and second phosphor is approximately different from the excitation wavelength for the other. Therefore, according to the embodiment, it can be avoided that the light whose wavelength has been converted by either of the first phosphor and the second phosphor may be excited and absorbed by the other. Accordingly, a light emitting module that emits light having uniform color, independently of the thickness of a light wavelength conversion member, can be obtained.
Also, in this embodiment, it may be made that a plurality of the light emitting elements are provided side by side to be spaced apart from each other and the light wavelength conversion member is formed so as to integrally cover the plurality of the light emitting elements. In addition, the plurality of the light emitting elements may be arranged on the same flat surface. The plurality of the light emitting elements may be arranged on a straight line or in a scattered manner on a flat surface.
According to the present invention, a light emitting module that emits uniform color, while the degree of freedom of forms is being secured, can be provided.
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
The supporting substrate 12 is formed of aluminum nitride (AlN) and circuits are formed on the upper surface thereof by gold evaporation. The supporting substrate 12 may be formed of another material having no conductivity but high thermal conductivity, such as, for example, alumina, mullite, ceramic, such as glass ceramic, glass epoxy, or the like. In the first embodiment, the supporting substrate 12 is formed into a rectangular plate shape having a length of 6 mm, a width of 1 mm, and a thickness of 1 mm.
In the first embodiment, an LED emitting near-ultraviolet light or short-wavelength visible light was adopted as the semiconductor light emitting element 14. The semiconductor light emitting element 14 is formed into, for example, a chip having a size of 1 umm×1 mm, and is provided such that the central wavelength of the emitted light is approximately 400 nm. In the first embodiment, MvpLED (trademark) SL-V-U40AC made by SemiLEDs Corporation, having a leak wavelength at 402 nm, was used for the semiconductor light emitting element 14. It is needless to say that the semiconductor light emitting element 14 is not limited thereto, but, for example, a semiconductor laser diode (LD) may be adopted.
A semiconductor light emitting element of a so-called vertical chip type is adopted as the semiconductor light emitting element 14. It is needless to say that a semiconductor light emitting element of another type may be adopted as the semiconductor light emitting element 14, and, for example, a semiconductor light emitting element of a so-called flip-chip type or a so-called face-up type may be adopted as that.
A plurality of the semiconductor light emitting elements 14 are provided on the same flat surface of the supporting substrate 12 and side by side so as to be spaced apart from each other. Specifically, the two semiconductor light emitting elements 14 are mounted in series on the supporting substrate 12, the elements 14 being 2.3 mm spaced apart from each other. It is needless to say that the number of the semiconductor light emitting elements 14 and an interval between them are not limited to these. In addition, the supporting substrate 12 may be provided on a surface other than the same flat surface, for example, on a curved surface or on respective steps provided on a surface.
The light wavelength conversion member 16 is formed so as to integrally cover a plurality of the semiconductor light emitting elements 14. The light wavelength conversion member 16 contains a first phosphor and a second phosphor, the wavelength range of the light emitted after the wavelength thereof has been converted by either of the two being approximately different from the excitation wavelength for the other. The light wavelength conversion member 16 is formed by containing the first and second phosphors into a transparent binder paste to produce a phosphor paste and by potting the phosphor paste so as to integrally cover the plurality of the semiconductor light emitting elements 14 and then by curing it.
A material that efficiently absorbs near-ultraviolet light or short-wavelength visible light but hardly absorbs visible light having a wavelength of 450 nm or more, is used for the first phosphor. The first phosphor is a yellow phosphor that converts the wavelength of near-ultraviolet light or short-wavelength visible light and emits yellow light, in which the dominant wavelength of the emitted light is 564 nm or more and 582 nm or less.
In the first embodiment, a phosphor represented by SiO2.1.0 (Ca0.54, Sr0.36, Eu0.1) O.0.17SrCl2 was used as the first phosphor. The first phosphor is one in which cristobalite has been generated by adding an excessive amount of SiO2 in the mixing ratio of raw materials.
In producing the first phosphor, each material of SiO2, Ca(OH)2, SrCl2.6H2O, and Eu2O3 was first weighed such that the molar ratio of these materials was SiO2:Ca(OH)2:SrCl2.6H2O:Eu2O3=1.1:0.45:1.0:0.13. Subsequently, each material thus weighed was put into an alumina mortar to grind and mix it for 30 minutes, thereby obtaining a material mixture. A fired substance was obtained by putting the material mixture into an alumina crucible to fire it in an electric furnace having a reducing atmosphere (H2/N2: 5/95) and at 1030° C. for 5 to 40 hours. The first phosphor was obtained by carefully washing the obtained fired substance with hot pure water. A material of which the first phosphor is formed is not limited to the aforementioned material, but other materials represented by the general formula of M1O2.a(M21-z,M4z)O.bM3X2 may be adopted. Herein, M1 represents at least one element selected from the group consisting of Si, Ge, Ti, Zr, and Sn. M2 represents at least one element selected from the group consisting of Mg, Ca, Sr, Ba, and Zn. M3 represents at least one element selected from the group consisting of Mg, Ca, Sr, Ba, and Zn. X represents at least one halogen element, M4 represents at least one element in which Eu2+ is essential selected from the group consisting of rare earth elements and Mn, and a, b, and z are respectively within the ranges of 0.1≦a≦1.3, 0.1≦b≦0.25, and 0.03≦z≦0.8. In the first phosphor adopted in the first embodiment, the following equations hold in this general formula: M1=si; M2=Ca/Sr (molar ratio: 60/40); M3=Sr; X=Cl; M4=Eu2+; a=0.9, b=0.17, and c/(a+c)=0.1 (wherein, C is the content of M4 (molar ratio)).
The second phosphor is a blue phosphor that converts the wavelength of near-ultraviolet light or short-wavelength visible light and emits blue light. A phosphor that efficiently absorbs near-ultraviolet light or red light and emits the light whose dominant wavelength is 440 nm or more and 470 nm or less is used as the second phosphor. In the first embodiment, the phosphor represented by (Ca4.67Mg0.5) (PO4)3Cl:Eu0.08 was used as the second phosphor. The second phosphor is not limited thereto, but may be selected from the group consisting of the phosphors represented by the following general formulae.
General Formula of M1a(M2O4)bXc:Re4
M2 includes one or more elements selected from the group of Ca, Sr, and Ba as essential elements, and part of M1 can be substituted with the element selected from the group consisting of Mg, Zn, Cd, K, Ag, and Tl. M2 includes P as an essential element, and part of M2 can be substituted with the element selected from the group consisting of V, Si, As, Mn, Co, Cr, Mo, W, and B. X represents at least one halogen element, and Re represents at least one rare earth element in which Eu2+ is essential, or Mn. In addition, it is made that a, b, c, and d are respectively within the ranges of 4.2≦a≦5.8, 2.5≦b≦3.5, 0.8≦c≦1.4, and 0.01≦d≦0.1.
It is made that M1 is at least one element selected from the group consisting of Ca, Sr, Ba, and Zn, and a is within a range of 0.001≦a≦0.5.
It is made that M1 is at least one element selected from the group consisting of Ca, Sr, Ba, and Zn, and a is within a range of 0.001≦a≦0.8.
It is made that M1 is at least one element selected from the group consisting of Ca, Sr, Ba, and Zn, X is at least one halogen element, and a is within a range of 0.001≦a≦0.5.
In producing the second phosphor, each material of CaCO3, MgCO3, CaCl2, CaHPO4, and Eu2O3 was first weighed such that the molar ratio of these materials was CaCO3:MgCO3:CaCl2:CaHPO4:Eu2O3=0.42:0.5:3.0:1.25:0.04, and each weighed material was put into an alumina mortar to grind and mix it for 30 minutes, thereby obtaining a material mixture. A fired substance was obtained by putting the material mixture into an alumina crucible to fire it under N2 atmosphere containing H2 in an amount of 2 to 5% and at a temperature of 800° C. or higher to lower than 1200° C. for 3 hours. The second phosphor was obtained by carefully washing the obtained fired substance with hot pure water.
A material that is transparent with respect to near-ultraviolet light or short-wavelength visible light, i.e., has the transmittance of these light of 90% or higher, and that has a good light resistance property, is used as a binder material. In the first embodiment, a silicone resin was used as the binder material. Specifically, a dimethyl silicone resin (JCR6126 made by Dow Corning Toray Co., Ltd.) having a good light resistance property was used as the binder material. However, the binder material is not limited thereto, but, for example, a fluorine resin, sol-gel glass, acrylic resin, inorganic binder, and glass material, etc., can be used.
In the first embodiment, the binder paste was formed by dispersing silica fine particles into the silicone resin as a thixo agent. Alternatively, other materials may be used as a diffusing agent and a thixo agent, and fine particles, for example, such as silicon dioxide, titanium oxide, aluminum oxide, and barium titanate, may be contained in the binder paste.
(7) Method of Producing Light Emitting Module In producing the light emitting module 10, an electrode pattern including an anode and a cathode was first formed on the supporting substrate 12 by gold evaporation in advance. Subsequently, a silver paste (84-1LMISR4 made by Ablestik Co., Ltd.) was dropped on the anode on the supporting substrate 12 by using a dispenser, and the lower surface of each of the two semiconductor light emitting elements 14 was adhered onto the anode. Thereafter, the silver paste was cured under an environment at 175° C. for one hour. Subsequently, gold wires each having a diameter of 45 μmφ were bonded, by ultrasonic thermocompression bonding, to each of the electrode on the upper side of the semiconductor light emitting element 14 and the cathode on the supporting substrate 12.
In producing the phosphor paste, the first phosphor and the second phosphor were first mixed at a weight ratio of 2:1, and the mixed phosphor was blended into the binder material made of the dimethyl silicone resin in an amount of 1.8% by volume. The phosphor paste was produced by filling an ointment container having a volume of 10 cc with 3 g or more and 5 g or less of the above blended phosphor to mix it at a revolution of 1200 rpm and a rotation of 400 rpm for 90 seconds by using a rotary and revolutionary mixer (MAZERUSTAR made by Kurabo Industries Ltd.).
This phosphor paste was potted by using a syringe having a volume of 2.5 cc (discharge port diameter: 1 mmφ) so as to cover the semiconductor element. The phosphor paste was cured by further subjecting it to a heating treatment at 150° C. for one hour, thereby forming the light wavelength conversion member 16. The light wavelength conversion member 16 after being cured has an indeterminate shape having a width of 2 mm or more to 4 mm or less, a height of 2 mm or more to 3 mm or less, and a length of approximately 7 mm.
As illustrated in
Therefore, according to the light wavelength conversion member 16 of the first embodiment, it becomes possible to emit the light having uniform color from the whole emitting surface of the light wavelength conversion member 16, even if the thickness of the binder paste is not uniform, i.e., the distance between the light emitting surface of the semiconductor light emitting element 14 and the emitting surface of the light wavelength conversion member 16 is not uniform. Accordingly, a light emitting module emitting uniform color can be produced, even when the wavelength conversion member 16 is formed by using a potting method, etc.
The light emitting properties of the light emitting module 10 and the light emitting module according to the comparative example were checked by driving each of them with a current of 700 mA. In
It is known from
As stated above, a light emitting module in which color shade is little can be obtained by performing potting so as to cover the semiconductor light emitting element 14, with the light wavelength conversion member 16 containing a first phosphor and a second phosphor, the wavelength range of the light emitted after the wavelength thereof has been converted by either of the two being approximately different from the excitation wavelength for the other.
The case 32 is formed, with transparent polycarbonate, into a box-shaped rectangular parallelepiped having a length of 45 mm, a width of 8 mm, a height of 5 mm, and a thickness of 0.2 mm, only the upper surface of which is opened. The light emitting element unit 34 includes a supporting substrate 38 and a semiconductor light emitting element 40. The supporting substrate 38 is the same as the supporting substrate 12 according to the first embodiment in that it is formed of aluminum nitride and circuits are formed on the upper surface thereof by gold evaporation. The supporting substrate 38 is formed into a rectangular plate shape having a length of 40 mm, a width of 5 mm, and a thickness of 1 mm.
The semiconductor light emitting element 40 is the same as the semiconductor light emitting element 14 according to the first embodiment. In the second embodiment, the light emitting element unit 34 is configured with the five semiconductor light emitting elements 40 being provided side by side and in series on the supporting substrate 38. The interval between the semiconductor light emitting elements 40 is made to be 5 mm.
The light emitting element unit 34 was housed in the case 32 and fixed to the bottom surface of the case 32. A power supplying cord for supplying a current to the light emitting element unit 34 was pulled out from the side of the case 32.
In producing a phosphor paste, a first phosphor and a second phosphor were first mixed at a weight ratio of 2:1, and the mixed phosphor was blended into a binder material made of the dimethyl silicone resin in an amount of 3.0% by volume. The mixing method was the same as that in the first embodiment.
The case 32, the bottom of which the light emitting element unit 34 had been fixed to, was filled with this phosphor paste by using a syringe having a volume of 2.5 cc (discharge port diameter: 1 mmφ). Thereafter, the upper surface of the phosphor paste was put into a flat state with a squeegee. The phosphor paste was cured by further subjecting it to a heating treatment at 150° for one hour, thereby forming the light wavelength conversion member 36.
The light emitting properties of the light emitting module 30 and the light emitting module according to the comparative example were checked by driving each of them with a current of 700 mA. In
The luminescent chromaticity of the light emitting module 30 was checked in an area corresponding to the semiconductor light emitting element 40 located second from the end. Specifically, assuming that an area on the upper surface of the light wavelength conversion member 36, vertically above the center of the aforementioned light emitting element 40, was the original point, luminescent chromaticity was detected while moving an area where the luminescent chromaticity was to be detected with respect to both on the a axis passing through the original point and parallel to the direction in which the supporting member 38 extended, and on the b axis passing through the original point and perpendicular to the direction in which the supporting substrate 38 extended, thereby the chromaticity distribution was checked with respect to each of the axes. In this case, the chromaticity was detected, with the use of CA 1500 made by Minolta Company Ltd. as a color luminance meter, in an area of 50 μm2 on the upper surface of the light wavelength conversion member 36. Further, the chromaticity was detected at each of the B point vertically above the center of the light emitting element 40 and the Y point on the b axis a predetermined distance (approximately 1 mm) away from the B point. The same check as described above was also performed on the light emitting module according to the aforementioned comparative example.
As known from
As stated above, a light emitting module in which color shade is little can be obtained by performing mold forming so as to cover the semiconductor light emitting element 40, with the light wavelength conversion member 36 containing a first phosphor and a second phosphor, the wavelength range of the light emitted after the wavelength thereof has been converted by either of the two being approximately different from the excitation wavelength for the other.
The present invention should not be limited to the above embodiments, and variations in which each component of the embodiments is appropriately combined are also effective as embodiments of the invention. Various modifications, such as design modifications, can be made with respect to the above embodiments based on the knowledge of those skilled in the art. Such modified embodiments can also fall in the scope of the invention. Hereinafter, such examples will be described.
In a variation, a plurality of semiconductor light emitting elements are scattered on a flat surface, not on a straight line. The plurality of semiconductor light emitting elements are integrally covered with a light wavelength conversion member containing a plurality of phosphors, the wavelength range of the light emitted after the wavelength thereof has been converted by one of the plurality of phosphors being different from the excitation wavelengths for the others. Thereby, it becomes possible to obtain a light emitting module that emits light uniformly across a wide area on the flat surface.
In another variation, a light wavelength conversion member is formed into a shape in which, when semiconductor light emitting elements are covered with the light wavelength conversion member, the distance between the light emitting surface of each of the light emitting elements and the outer surface of the light wavelength conversion member is not uniform. In this case, the light wavelength conversion member may be formed into a cylindrical shape, polygonal column shape, conical shape, or polygonal pyramid shape. As stated above, by using a light wavelength conversion member containing a plurality of phosphors, the wavelength range of the light emitted after the wavelength thereof has been converted by one of the plurality of phosphors being different from the excitation wavelengths for the others, it becomes possible to obtain a light emitting module that emits light having uniform color, independently of the shape of a light wavelength conversion member. Accordingly, a light emitting module in which color shade is little can be provided even when alight wavelength conversion member is formed into various shapes, as stated above.
In still another variation, a light emitting module is provided by covering a semiconductor light emitting element with a light wavelength conversion member containing a first phosphor, a second phosphor, and a third phosphor, the wavelength range of the light emitted after the wavelength thereof has been converted by one of the three being different from the excitation wavelengths for the others. The first phosphor emits blue light by converting the light emitted by the semiconductor light emitting element. The second phosphor emits green light by converting the wavelength of the light emitted by the semiconductor light emitting element. The third phosphor emits red light by converting the wavelength of the light emitted by the semiconductor light emitting element. Also, in this embodiment, a light emitting module that emits uniform white light by additive color mixing of the blue light, green light, and red light can be provided.
In still another variation, a light emitting module is provided by integrally covering a plurality of semiconductor light emitting elements with a light wavelength conversion member containing a plurality of phosphors, the wavelength range of the light emitted after the wavelength thereof has been converted by one of the plurality of phosphors being different from the excitation wavelengths for the others. Although the plurality of semiconductor light emitting elements are not the same as each other, they are provided to emit the light in a common wavelength range. Each of the plurality of phosphors is provided to convert the wavelength of the light in the common wavelength range. Thereby, a light emitting module in which color shade is little can be provided even when a plurality of semiconductor light emitting elements, each of which emits ultraviolet light in a wavelength range slightly different from the others, are integrally covered.
The present invention can be used in a light emitting module, and be particularly used in a light emitting module comprising a light emitting element and a light wavelength conversion member configured to convert the wavelength of the light emitted by the light emitting element and to emit the light.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2009-149112 | Jun 2009 | JP | national |
| Filing Document | Filing Date | Country | Kind | 371c Date |
|---|---|---|---|---|
| PCT/JP2010/003462 | 5/24/2010 | WO | 00 | 12/22/2011 |
