Patent Grant
7621658
The invention relates to a light-emitting module.
One object is to specify a light-emitting module that is particularly easy to manufacture.
According to at least one embodiment of the light-emitting module, the light-emitting module comprises a light source mounted on a carrier. Said light source can be, for example, one or more light-emitting diode (LED) chips.
The carrier has, for example, contact points and conductive traces for electrically contacting the light source. In addition, the carrier is preferably suitable for dissipating heat produced during the operation of the light source. The carrier therefore preferably has good thermal conductivity. For example, the carrier is a printed circuit board (PCB) or a metal-core board.
According to at least one embodiment of the light-emitting module, the module comprises an optical element with dowel pins. That is, at least one dowel pin is mounted on the optical element or the optical element is integrally configured with at least one dowel pin. The dowel pins of the optical element preferably engage in corresponding recesses in the carrier. That is, the carrier has recesses—e.g., bores—in which the dowel pins of the optical element can engage. The optical element is then preferably arranged on the carrier such that at least a portion of the electromagnetic radiation generated by the light source when in operation passes through the optical element and is optically influenced thereby.
According to at least one embodiment of the light-emitting module, the light-emitting module contains a light source, a carrier for the light source, and an optical element, wherein the optical element comprises dowel pins that engage in the corresponding recesses in the carrier.
According to at least one embodiment of the light-emitting module, the dowel pins are provided for aligning the optical element on the carrier. That is, the dowel pins act as alignment pins, by means of which the optical element can be aligned relative to the light source. The optical element is, for example, centered relative to the light source. Preferably, the shape, size and arrangement of the recesses in the carrier and the shape, size and arrangement of the dowel pins of the optical element are calibrated to one another such that precise alignment of the optical element relative to the light source is effected merely by inserting or pressing the dowel pins into the recesses.
This configuration of the light-emitting module makes it possible to mount the optical element on a carrier with little technical expenditure and high precision. Mechanical connection between the optical element and the carrier can be mediated for example by means of an adhesive, such as a glue, which is disposed between the optical element and the carrier.
According to at least one embodiment of the light-emitting module, the dowel pins mediate a mechanical connection between the optical element and the carrier. This can be achieved, for example, by press-fitting the dowel pins of the optical element into the recesses in the carrier. In this case, the lateral extent of the recess—i.e., for example, the diameter of the recess—is selected to be just slightly smaller than the lateral extent—for example, the diameter—of the dowel pin. Mechanically pressing the dowel pins into the corresponding recesses in the carrier then creates a mechanically firm connection between the optical element and the carrier. In addition, an adhesive, for example, can further be provided between the optical element and the carrier to additionally mediate a mechanical connection between these two elements of the light-emitting module.
According to at least one embodiment of the light-emitting module, the dowel pins of the optical element are provided for aligning the light-emitting module. To this end, the dowel pins are preferably configured as sufficiently long that they project through the recess in the carrier to the opposite side of the carrier from the optical element. In this way, the dowel pins of the optical element are able to function as dowel pins for the entire module. The module can then, for example, be aligned relative to a module holder.
The module holder can be, for example, a heat sink that can also include cooling fins. On at least one of its surface[s] provided for mounting the light-emitting module, the module holder has recesses in which the dowel pins of the optical element engage. An adhesive can be disposed between the light-emitting module and the module holder to mechanically attach the light-emitting module to the module holder. It is also possible, however, for the light-emitting module to be attached to the module holder by means of at least one screw.
By precisely aligning the light-emitting module relative to a module holder, it is also possible simultaneously to align the light-emitting module relative to a further optical element that can be connected to the module holder.
According to at least one embodiment of the light-emitting module, the dowel pins are provided for mechanically attaching the module. That is, the dowel pins project through the recesses in the carrier to the opposite side of the carrier from the optical element. The light-emitting module is then placed on a module holder having recesses that correspond to the dowel pins and in which the dowel pins engage. In this case, the lateral extent of the recess and that of the dowel pin are adapted to each other such that by pressing the light-emitting module against the module holder, a mechanically firm connection is created between the module holder and the light-emitting module. That is, the light-emitting module can be connected to the module holder via the dowel pins by press-fitting. Furthermore, it is possible for the light-emitting module to be attached to the module holder additionally by means of a bonding agent, such as a glue, for example, or by means of at least one screw.
According to at least one embodiment of the light-emitting module, the dowel pins of the optical element are further suitable for aligning a further optical element that is disposed after the module. Said further optical element can be a secondary optic, such as, for example, a projection lens. At least a portion of the radiation that passes through the optical element of the light-emitting module then subsequently passes through the secondary optic and is optically influenced thereby.
In this embodiment, the optical element of the light-emitting module preferably comprises at least one dowel pin, which extends in the direction of the secondary optic—i.e., away from the carrier, for example. The secondary optic then has a corresponding recess in which the dowel pin can engage. The dowel pin can in this case also extend both in the direction of the carrier and in the direction of the secondary optic, so that the same dowel pin serves both to align the optical element relative to the carrier and to align the secondary optic relative to the light-emitting module. It is also possible, however, for the optical element to comprise dowel pins suitable for aligning the optical element and other dowel pins provided for aligning the secondary optic.
According to at least one embodiment of the light-emitting module, dowel pins of the optical element are provided for mechanically attaching the further optical element. This can be effected, for example, via a press fit, as described earlier hereinabove.
According to at least one embodiment of the light-emitting module, further dowel pins are provided for mounting the light-emitting module on a module holder, for example a heat sink, and/or dowel pins for mounting an optic body of the optical element in a holder of the optical element. Moreover, these dowel pins can be provided separately, they can be formed onto the optical element, the optic body or the holder, or alternatively they can coincide with the above-described dowel pins of the optical element.
The described light-emitting module as a whole makes use of the idea, inter alia, that especially precise alignment of the optical element relative to a light source can be achieved by means of dowel pins that are mounted on the optical element or integrally configured therewith. It is further possible to use the same dowel pins or additional dowel pins to align the light-emitting module relative to a module holder and/or a secondary optic. All in all, a very precisely aligned optical arrangement in which a light source is followed by a first optical element and, optionally, a further optical element can thus be manufactured in a particularly simple manner.
According to at least one embodiment of the light-emitting module, the dowel pins of the optical element are configured as star-shaped in cross section. That is, at least that end of a dowel pin that engages in a corresponding recess in the carrier has a star-shaped cross-sectional area. Variations in dimensional accuracy, i.e., for example variations in the lateral extent of the recesses in the carrier or the lateral extent of the dowel pins, can be compensated for particularly well in this way. This choice is based on the realization, inter alia, that a dowel pin that is configured as star-shaped is better able to adapt to a recess into which it is pressed than if the dowel pin is configured, for example, as a solid cylinder with smooth lateral surfaces.
According to at least one embodiment of the light-emitting module, at least one dowel pin of the optical element has a diameter that varies along the dowel pin. The diameter can be, for example, varied longitudinally to the dowel pin such that it is adapted to different diameters of the recesses in the carrier, in the module holder and/or in the secondary optic. It is further possible for the dowel pins to be configured such that the optical element stands on legs, as it were, that extend along the optical element. The end of such a dowel pin, which for example engages in the recess of a carrier, can have a smaller diameter than the rest of the dowel pin. It is further possible for the cross section of the dowel pins to vary continuously in the axial direction. The dowel pin is then fashioned as a truncated pyramid or a truncated cone.
According to at least one embodiment of the light-emitting module, a reservoir, for example for an adhesive, is disposed around at least one of the dowel pins. The reservoir can be configured for example in the form of a circumferential channel around the dowel pin. If the optical element is attached to the carrier by means of an adhesive, such as a glue, for example, the channel is suitable for receiving excess adhesive.
According to at least one embodiment of the light-emitting module, the optical element includes a holder and an optic body. Such a holder is suitable for mechanically holding the optic body. The dowel pins of the optical element are preferably mounted on the holder or integrally configured with the holder. The optic body represents the optical component proper of the optical element. The optic body is, for example, suitable for beam-shaping the radiation that passes through it. The holder is preferably mounted on or connected to the optic body in such a way that it has little or, insofar as possible, no influence on the optical properties of the optic body.
According to at least one embodiment of the light-emitting module, the optic body is configured as an optical concentrator that tapers toward the light source. According to at least one embodiment of the module, the optic body can be formed at least locally in the manner of at least one of the following basic optical elements: a compound parabolic concentrator (CPC), a compound elliptic concentrator (CEC), a compound hyperbolic concentrator (CHC). That is, the lateral faces of the optical element are formed at least locally in the manner of one of these basic optical elements. It is further possible for the optical concentrator to be formed at least locally in the manner of a truncated cone or truncated pyramid that tapers toward the light source. The optic body can be configured as a solid body. It is also possible, however, for the optic body to be a hollow body whose inner surfaces are implemented as reflective, for example are reflectively coated.
According to at least one embodiment of the light-emitting module, the optic body of the optical element includes a radiation exit face that can be curved in one of the following ways: spherically, aspherically, elliptically.
According to at least one embodiment of the light-emitting module, the optic body of the optical element is configured as a solid body. The optic body then preferably contains a transparent material. Reflections at the lateral faces of the optic body then preferably occur by total reflection. The optic body preferably contains or is made of a transparent synthetic material. Particularly preferably, the optic body contains or is made of one of the following materials: PMMA, PMMI, PC, Makrolon, APEC, glass.
According to at least one embodiment of the light-emitting module, the holder of the optical element laterally embraces the optic body. In this case, the holder is, for example, fashioned in a frame shape around the light source. The optic body then sits on the holder, is formed onto the holder, or is otherwise attached to the holder. The holder can be configured with dowel pins that engage in the corresponding recesses in the carrier. The holder and the optic body can be configured in one piece. That is, they are integrally connected to each other. It is also possible, however, for the optical element to be configured in more than one piece. The holder is then a separate element into which the optic body can be plugged, placed, snapped or glued.
According to at least one embodiment of the module, the holder of the optical element has locally curved lateral faces. For this purpose, the holder can for example be configured at least locally in the manner of a hollow cylinder. “In the manner of a hollow cylinder” means here that the side walls of the holder are curved at least locally in the manner of a cylinder having a circular, elliptical or oval base. The side walls of the holder can then also, however, be configured locally as planar, i.e. without curvature. Such planar areas of the side walls of the holder can, for example, simplify the mounting and production of the optical element.
The frame-shaped holder makes use of the realization, inter alia, that thermal tensions in the optical element can be compensated for particularly well by such a holder. Should the optical element become heated during the operation of the light source, then the holder attached to the carrier expands in a direction away from the carrier. The optic body is preferably attached to the holder in at least two locations at the upper side of the holder, i.e., the side facing away from the carrier. It therefore expands away from the upper side of the holder, in the direction of the carrier. The holder and the optic body preferably have matched temperature expansion coefficients. To this end, the holder and the optic body can, for example, be made of the same material.
In this way, the thermal expansion of the holder away from the carrier and the thermal expansion of the optic body toward the carrier balance each other out. The distance of a light entrance face of the optic body from the light source thereby remains at least roughly constant.
If the holder of the optical element additionally has lateral faces that are at least locally curved, then thermal tensions in the optical element are compensated for particularly efficiently in a plane parallel to the carrier. This construction for the optical element then makes it possible to position the optical element especially precisely relative to a light source in a plane parallel to the carrier, even in the event of heating of the module.
According to at least one embodiment of the light-emitting module, the optical element is configured as box-like. That is, for example the holder of the optical element is shaped in the manner of a box, which can also have curved lateral faces. The holder surrounds the light source disposed on the carrier, preferably on at least four sides. That is, the optical element, in addition to its optical properties, constitutes a protection for the light source against mechanical stress and dirt.
According to at least one embodiment of the light-emitting module, the optical element is configured in one piece. That is, all components of the optical element, such as the dowel pins, the holder and the optic body, are integrally connected to one another. All parts of the optical element are then preferably made of the same material. The optical element can in this case preferably be produced via an injection molding process.
According to at least one embodiment of the light-emitting module, the optical element is configured in more than one piece. That is, at least one part of the optical element, such as a dowel pin, the optic body or the holder, is produced separately from other components of the optical element. In this case as well, the individual components can be made via an injection molding process. However, it is also possible in this case to make different components out of different materials. It is further possible, for example, for the holder not to be implemented as transparent, but to be colored or blackened.
According to at least one embodiment of the light-emitting module, the light source includes at least one LED chip. Particularly preferably, the light source includes a plurality of LED chips of thin-film construction.
A thin-film LED chip can be distinguished particularly by the following features:
Particular advantageously, as a result, the carrier element can be relatively freely selected compared to a growth substrate. For instance, the carrier can be better suited to the component with respect to many properties, such for example electrical and/or thermal conductivity or stability, than growth substrates, which are subject to tight constraints in the production of high-quality epitaxially grown layer sequences. For instance, in order to obtain high-quality epitaxial layers, the epitaxially deposited material must, for example, be lattice-matched to the growth substrate.
A basic principle of a thin-film LED chip is described, for example, in I. Schnitzer et al., “30% external quantum efficiency from surface textured LEDs,” Appl. Phys. Lett., October 1993, Vol. 63, pp. 2174-2176, whose disclosure content is hereby incorporated by reference.
According to at least one embodiment of the light-emitting module, the LED chips are free of potting compound. This is possible in particular when the optical element is configured as box-like and surrounds the LED chips on at least four sides. The LED chips are thereby protected against mechanical stress and dirt even when no potting compound is used.
According to at least one embodiment, a gap is disposed between an LED chip of the light source and a light entrance face of the optical element. The gap is for example filled with a gas, preferably with air.
According to at least one embodiment of the light-emitting module, the optical element of the light-emitting module has an area of contact with an encapsulant of an LED chip of the light source. To bring this about, a light entrance face of the optical element can be pressed into an encapsulant of the LED chip. Said encapsulant of the LED chip either can be hardened after the optical element is put in place, or it can be a soft, gel-like encapsulant that does not have to be hardened.
It is also possible, however, for the LED chip initially to be potted with a potting compound that hardens. The potted LED chip can then be encased in another potting compound that is gel-like. This potting compound preferably does not harden completely. The light entrance face of the optical element is then pressed into this gel-like potting compound during the mounting of the optical element on the carrier. The gel-like encapsulant can be, for example, a coupling gel or an index matching gel. Such a potting compound is particularly well suited to create optical coupling between the LED chip and the optical element, so that only a small refractive index step or none at all occurs as electromagnetic radiation from the light source enters the optical element.
According to at least one embodiment, the distance between the light entrance face of the optical element and the light exit face of the LED chip is no more than 250 μm, preferably no more than 200 μm. Such a small distance between the optical element and the LED chip makes it possible to couple the largest possible portion of the electromagnetic radiation emitted by the LED chip into the optical element.
According to at least one embodiment, the light-emitting module is provided as a light source in an optical projection apparatus or in a motor vehicle projection lamp, for example a headlight.
According to at least one embodiment, the optical element comprises at least two dowel pins that engage in corresponding recesses in the carrier. This is a particularly efficient means of preventing the optic from twisting relative to the light source during the mounting of the optical element. The optical element preferably has three or four dowel pins that engage in corresponding recesses in the carrier.
According to at least one embodiment, the optical element is glued onto the carrier in order to attach the optical element. It is further possible for the dowel pins to be hot-stamped and for the optical element to be mechanically attached to the carrier in this fashion.
Further advantages, preferred embodiments and improvements of the light-emitting module and its constituent parts will emerge from the exemplary embodiment described below in conjunction with the figures. Therein:
a and 9b are schematic perspective representations of an exemplary embodiment of a preferably one-piece optical element in the nature of an optical concentrator, comprising dowel pins configured as “legs” for mounting on the carrier, said dowel pins being disposed laterally on the light exit face of the optical element,
a and 10b are schematic perspective representations of an exemplary embodiment of a preferably multi-piece optical element in the nature of an optical concentrator, comprising an optic body and a holder,
a, 13b, 13c, 13d, 13e and 13f are schematic perspective representations of an exemplary embodiment of a preferably multi-piece optical element in the nature of an optical concentrator comprising an optic body and a holder or in the nature of a corresponding light-emitting module,
a, 14b and 14c are schematic perspective representations of an exemplary embodiment of a light-emitting module with a multi-piece optical element comprising an optic body and a holder,
a, 15b, 15c, 15d, 15e and 15f are schematic perspective representations of an exemplary embodiment of a light-emitting module with a multi-piece optical element comprising an optic body and a holder, said light-emitting module being disposed on a module holder in the form of a heat sink,
a, 16b, 16c, 16d and 16e are schematic perspective representations of an exemplary embodiment of a light-emitting module with a multi-piece optical element comprising an optic body and a holder,
a, 17b, 17c, 17d, 17e and 17f are schematic perspective representations of two variants of an exemplary embodiment of a preferably multi-piece optical element in the nature of an optical concentrator, with a frame-shaped holder comprising dowel pins formed onto it on the light exit side,
a, 18b, 18c and 18d are schematic perspective representations of two variants of an exemplary embodiment of a preferably one-piece optical element in the nature of an optical concentrator, with a frame-shaped holder comprising dowel pins formed onto it on the light exit side,
a and 19b are schematic representations of a light-emitting module that includes a light source in the form of LED chips disposed on a carrier.
In the exemplary embodiments and figures, like or like-acting elements are provided with the same respective reference numerals. The illustrated elements in the figures are not necessarily to be considered true to scale, but rather, individual elements may be depicted in part as exaggeratedly large for the sake of better understanding.
The light sources are, for example, LED chips 9. Said LED chips 9 can be placed on a ceramic substrate. The ceramic substrate preferably comprises through-contacts, e.g. vias, by means of which the LED chips 9 are connected electrically conductively to the conductive traces of the carrier. The ceramic substrate then preferably contains at least one of the following materials: aluminum nitrite, aluminum oxide, glass-ceramic, glass, metal.
The optical element comprises a holder 5 and an optic body 6. In the exemplary embodiment of
As described earlier hereinabove, the lateral faces of the optic bodies 6 can be configured at least locally in the manner of at least one of the following optical elements: CPC, CHC, CEC, truncated pyramidal optic, truncated conical optic. The optic body 6 can be configured as a hollow body whose inner surfaces are coated with a reflective material suitable for reflecting at least a large proportion of the electromagnetic radiation generated by the LED chip 9 during operation. The inner surfaces of the optic body 6 are preferably coated with a metal in that case.
The optic bodies 6 can serve to reduce the divergence of, to beam-shape, and/or to intermix the radiation passing through it.
The optic bodies 6 are followed in the beam direction by a light exit face 3 of the optical element 1. The light exit face is constituted for example by a transparent plate, which is preferably made from a material having the same thermal expansion coefficient as the holder 5 and the optic bodies 6. The plate is preferably made from the same material as the other components of the optical element. For this purpose, the light exit face 3 can, for example, be configured in one piece with the other elements of optical element 1.
Optical element 1 comprises dowel pins 2. The dowel pins 2 are preferably configured integrally with holder 5. They are preferably produced in an injection molding process together with the holder 5 and the optic bodies 6.
In the exemplary embodiment of
In the exemplary embodiment of
Advantageously, the optic body 6 can be adapted particularly well to the LED chips in this case. The optic body 6 can for example be brought especially close to the LED chips 9, thus making it possible to choose a smaller height for the optic. The distance between a light entrance face 4 of the optic body 6 and the radiation exit face of an LED chip 9 is preferably between 100 and 300 μm, particularly preferably between 150 and 250 μm. In this exemplary embodiment, the distance between the entrance face 4 of the optical element and the respective radiation exit faces of the LED chips 9 is limited only by any bonding wires used to contact the LED chips 9, for example on the n side. In this exemplary embodiment, a gap, which is filled with a gas, for example air, is preferably present between the respective radiation exit faces of the LED chips 9 and the light entrance face 4 of the optical element 1.
In the exemplary embodiment of
Such a lensoidally shaped light exit face 3 is preferably configured in one piece with holder 5 and optic bodies 6. The entire optical element 1 is preferably fabricated in one piece in an injection molding or transfer molding process.
The optical element 1 further comprises dowel pins 2 that serve to align the optical element 1 on and/or attach it to a carrier 8 and are also formed as a single piece with the optical element 1.
Holder 5 surrounds the optic bodies 6 at their respective upper sides, i.e., in the vicinity of the light exit opening 3 of optical element 1. This ensures that the optical properties of the optic bodies 6 will be influenced as little as possible by holder 5. For example, radiation can be coupled into optic bodies 6 at the respective light entrance openings 4 of optic bodies 6 without any interfering reflections from a holder of the optic bodies 6.
Optical element 1 is, for example, attached to a carrier 8, as shown in the exemplary embodiment of
To bring this about, a light entrance face 4 of the optical element 1 can be pressed into the encapsulant of the LED chip 9. The encapsulant of the LED chip 9 can in this case either be hardened after the optical element 1 is put in place, or it can be a soft, gel-like encapsulant that does not have to be hardened.
It is also possible, however, for the LED chip 9 first to be potted with a potting compound that hardens. The potted LED chip 9 can then be encased in another potting compound that is gel-like. This potting compound preferably does not harden completely. The light entrance face 4 of the optical element 1 is then pressed into this gel-like potting compound during the mounting of the optical element 1 on the carrier 8. The gel-like encapsulant is for example a coupling gel or an index matching gel. Such a potting compound is particularly well suited to create optical coupling between the LED chip 9 and the optical element 1, so that only a small refractive index step or none at all occurs as electromagnetic radiation from the light source 9 passes into the optical element 1.
a and 9b show schematic perspective representations of an exemplary embodiment of a further optical element. In the exemplary embodiments of
a and 10b show schematic perspective representations of two exemplary embodiments of an optical element configured in more than one piece. In the exemplary embodiment of
b shows an optical element 1 that is preferably disposed after a multiplicity of LED chips 9. As the optic body 6, an optical concentrator is snapped into side walls of the holder 5. The side walls of the holder 5 are held together by a sleeve 5b, which, for example, is slipped over the side walls and locally embraces them. The snapped-in optic body 6 can be either a hollow body whose inner surfaces are reflectively coated or a solid body.
a to 13f show schematic perspective representations of a further exemplary embodiment of optical element 1. In this exemplary embodiment, optical element 1 is configured in more than one piece. Optical element 1 comprises an optic body 6 depicted in
Exemplarily, a plurality of LED chips 9 can be arranged at the light entrance face 4 of the optic body 6. For example, five LED chips 9 are arranged in a straight line at light entrance face 4. Optic body 6 preferably has on its light entrance face 4 an area of contact with an encapsulant of the LED chips 9. That is, the optical element 1 is pressed by its light entrance face 4 for example into the encapsulant of the LED chips 9.
The optic body 6 illustrated in
c and 13d show a holder 5 for the optic body 6 of
f and 13g show the optical element 1, comprised of an optic body 6 and a holder 5, disposed on a carrier 8 constituted for example by a carrier 8 of the kind described in connection with
a to 14c show schematic perspective representations, in different perspectives, of the optical element 1 of
a to 15f show schematic perspective representations of an exemplary embodiment of a light-emitting module comprising an optical element 1, mounted on a module holder 7.
Optical element 1 is, for example, a multi-piece optical element as described in connection with
a to 16e show schematic perspective representations of a further exemplary embodiment of a light-emitting module.
The module comprises an optic body 6 similar to the optic bodies illustrated in
a to 17f show further exemplary embodiments of an optical element 1. Optical element 1 comprises an optic body 6 configured similarly to the optic body 6 of
a to 17d show an optic body 6 for a wide light distribution, and
The optical element 1 is integrally connected in two places to a holder 5. Optical element 1 is preferably connected to holder 5 on the side thereof facing away from the carrier 8. The holder 5 is preferably implemented as at least locally curved. That is, the holder 5 has at least locally curved side walls. The holder 5 of
The curved shape of the holder 5 also operates to compensate for thermal stresses in the plane parallel to the carrier 8. Carrier 8 is, for example, a metal-core board, which expands more than the optical element 1 when heated. The at least locally curved holder 5 illustrated is suitable for compensating for stresses in the plane parallel to the carrier 8. In this way, the light entrance face 4 of the optical element 1 stays particularly exactly aligned with the LED chips 9 in this plane even when said LED chips 9 are operating.
The wall thickness of the side walls of the optical element 1 is, for example, between 1 and 3 mm, preferably between 1.3 and 1.7 mm. For example, the light entrance face 4 of the optical element 1 is in this case disposed after five LED chips 9 arranged along a straight line.
The optic body 6 of the exemplary embodiments of
The optic body 6 of the exemplary embodiments of
a to 18d show a further exemplary embodiment of an optical element 1. In contrast to the optical elements 1 of
Said planar lateral faces 11 are joined to each other by curved lateral faces of the holder 5, which are shaped in plan for example in the manner of a circle or an ellipsis. As described above, the thus locally curved holder has proven particularly advantageous in compensating for thermal expansion during the operation of the LED chips 9.
Also in contrast to the exemplary embodiment of
The optic body 6 of the exemplary embodiments of
The optic body 6 of the exemplary embodiments of
The light source 9 on carrier 8 as illustrated in
The LED chips 22 are disposed on a carrier, for example on the floor 24 of a housing 23. The housing 23 can be formed for example of a ceramic material. The housing 23 preferably has inner walls that are configured as at least locally reflective.
The LED chips 22 are contacted outside the housing 23 at contact areas 25a and 25b. Conductive traces 26 connect the contact areas 25a, 25b to connection points 30, by means of which the light source 20 can be contacted from the outside. For example, the light source can be connected to the electric power system of a motor vehicle by joining a connector to mating connector 28. At least one varistor 27 functions as overvoltage protection for the light source 20. Mating connector 28, varistor 27 and housing 23 are arranged, for example, on a metal-core board 29 that functions both as a circuit board and as a heat-conducting element for the heat generated by the LED chips 22 during operation.
It is possible in this case to provide a device for dimming the LED chips 22 on the metal-core board 29 or outside the light-emitting module. In this way, the emission characteristic of the module can additionally be adapted, by varying the intensity, to external conditions such as weather or lighting conditions. It is also possible to vary the intensity of the light emitted by the light source by selectively turning individual LED chips 22 on and off.
This patent application claims the priorities of German Patent Applications 102005012486.0-11 and 102005033709.0-54, whose disclosure content is hereby incorporated by reference.
The invention is not limited by the description made with reference to the exemplary embodiments. Rather, the invention encompasses any novel feature and any combination of features, including in particular any combination of features recited in the claims, even if that feature or combination itself is not explicitly mentioned in the claims or exemplary embodiments.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10 2005 012 486 | Mar 2005 | DE | national |
| 10 2005 033 709 | Jul 2005 | DE | national |
This application is a continuation of and claims the benefit of priority of International Application No. PCT/DE2006/000362, filed Feb. 28, 2006, which claims priority to German Patent Application Serial No. 10 2005 012 486.0, filed Mar. 16, 2005, and German Patent Application Serial No. 10 2005 033 709.0, filed Jul. 19, 2005. The contents of the prior applications are hereby incorporated by reference in their entirety.
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| Number | Date | Country | |
|---|---|---|---|
| 20080151547 A1 | Jun 2008 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/DE2006/000362 | Feb 2006 | US |
| Child | 11853129 | US |
