1. Field of the Invention
The present invention relates to a light-emitting screen which is used for an image displaying apparatus.
2. Description of the Related Art
Conventionally, a field emission display (FED) has been known as an image displaying apparatus. The FED has a vacuum container which is formed by bonding a rear plate and a light-emitting screen through a frame member. Further, plural electron-emitting devices are arranged in matrix on the rear plate. Furthermore, red (R), green (G) and blue (B) light-emitting members which respectively emit visible light in response to electrons emitted by the electron-emitting devices, black members each of which is positioned between the light-emitting members, and anode electrodes which are to accelerate the electrons are arranged on the light-emitting screen. Here, a metal back which consists of a metal film such as Al or the like has been generally known as the anode electrode.
In the FED of such a constitution, a phenomenon that, in a case where the electrons emitted from the electron-emitting devices enter the metal backs and the light-emitting members on the light-emitting screen, a part of the emitted electrons are reflected has been confirmed. That is, the electrons reflected by the metal backs and the light-emitting members (called the reflected electrons hereinafter) are again accelerated toward the side of the light-emitting screen due to the voltage between the anode electrodes and the electron-emitting devices, and the accelerated electrons reenter the light-emitting members, whereby a phenomenon called halation occurs.
Here, it should be noted that the halation is the phenomenon that the electrons reflected by the metal backs and the light-emitting members enter the light-emitting members in another region adjacent. More specifically, if the halation occurs, since the light-emitting members in the region not selected emit light, contrast and color purity wholly deteriorate, whereby image quality deteriorates. For this reason, measures against the halation have been considered so far.
Incidentally, Japanese Patent Application Laid-Open No. 2008-097861 (corresponding to United States Patent Publication No. 2008/084160) discloses that a rib is provided between light-emitting members on a light-emitting screen so as to control occurrence of halation by interrupting reflected electrons.
However, as for the rib disclosed in Japanese Patent Application Laid-Open No. 2008-097861, it has been requested to further reduce the halation occurring due to the reflected electrons. In this connection, the present invention aims to provide a new light-emitting screen which can reduce halation occurring due to reflected electrons and an image displaying apparatus which uses the new light-emitting screen.
The present invention which solves such a problem as described above is characterized by a light-emitting screen which comprises: a substrate; anode electrodes positioned on the substrate; plural light-emitting members adapted to emit light in response to irradiation of electrons; and rib members, positioned among the plural light-emitting members, adapted to mutually separate the plural light-emitting members, wherein the rib member has an aperture portion between the adjacent light-emitting members mutually separated by the rib member.
According to the present invention, it is possible to further reduce the halation occurring due to the reflected electrons, and it is thus possible to display a high-quality image.
Further features of the present invention will become apparent from the following description of the exemplary embodiments with reference to the attached drawings.
Hereinafter, the exemplary embodiment of the present invention will be described with reference to
In the present embodiment, as illustrated in
In
Note that height of the rib members 21 can be properly set in accordance with the specification of the image displaying apparatus. It is preferable that the height of the rib members 21 is set to a range from ½ to 10 times as much as the width (length in the X or Y direction in
The relationship between a ratio of a project area of the aperture portions 23 projected to the face substrate 1 for a project area obtained by summing up project areas formed when the phosphor layers 10, the rib members 21 and the aperture portions 23 were projected on the face substrate 1 (hereinafter, called an aperture ratio) and the reflected electron amount is indicated in
Additionally, respective constitutive members for constituting the light-emitting screen will be described in detail.
It is preferable that the rib member 21 is constituted by the material composed of the inorganic mixture having the resistance nearly equal to the dielectric resistance such as a glass material of containing the metal oxides such as a lead oxide, a zinc oxide, a bismuth oxide, a boric oxide, an aluminum oxide, a silicon oxide and a titanium oxide. A method such as a sand blasting method, a photosensitive paste method, an etching method or the like can be used for the patterning of the rib member 21 including the formation of the aperture portion 23.
A phosphor crystal of emitting the light by the electron beam excitation can be used for the phosphor layer of constituting the light-emitting member. As the specific material of the phosphor layer, for example, the phosphor material or the like used in the conventional CRT described in “Phosphor Handbook” (Phosphor Research Society, Ohmsha, Ltd.) can be used. The thickness of the phosphor layer can be properly set according to the acceleration voltage, a grain size of the phosphor and the phosphor-filled density. In a case that the acceleration voltage is in a level from 5 kV to 15 kV, the thickness of the phosphor layer is set to such the thickness of 4.5 μm to 30 μm which is 1.5 to 3 times as many as 3 μm to 10 μm corresponded to the average grain size of the general phosphor and more preferably set to such the thickness of 5 μm to 15 μm. As a method of forming the phosphor layer on a portion between the rib members 21, a screen printing method, a precipitation method, an inkjet method, a micro-dispenser method or the like can be used. The fine patterning of the phosphor layer can be performed by combining a photolithography method, an etching method or the like with the above-described method.
An anode electrode is preferably formed by a metal film as represented by the metal back. The metal film which constitutes the anode electrode has both a function of serving as the anode electrode used for applying the acceleration voltage used for injecting electrons to the phosphor layer by accelerating the electrons and a light reflecting function of reflecting the light emitted to the electron-emitting device side among the luminous flux non-directionally generated at the phosphor layer to the atmosphere side. Therefore, the metal film is placed closer to the electron-emitting device side than the phosphor layer. Since electrons are required to be reached the phosphor layer passing through the metal film, a thickness of the metal layer is properly set in consideration of the energy loss of electrons, the set acceleration voltage and a reflection efficiency of the light. A thickness of the metal film is set to a range from 50 nm to 300 nm for the acceleration voltage in a level from 5 kV to 15 kV. As a material of the metal film, aluminum is generally used. It is allowed that barium or titanium is laminated on a surface of the metal film for the purpose of the gas adsorption and carbon (graphite) or boron nitride is laminated for the purpose of the reduction of reflected electrons. The metal film is deposited by a vacuum vapor deposition method or a sputtering method after depositing an acrylic resin film, a cellulosic resin film or a film of mixing both the acrylic resin and the cellulosic resin on the phosphor layer by a spin coating method, a screen printing method, a spray coating method, a micro-dispenser method or the like. According to a method of forming a resin film, a process of applying a water film on the phosphor layer is sometimes accompanied before forming the resin film. In a baking process after formation of the metal film, the resin film is burned out or decomposed to be eliminated. Note that the anode electrode is not limited to the aluminum positioned closer to the electron-emitting device side than the phosphor layer but may be constituted by a transparent electrode such as an ITO (Indium Tin Oxide) arranged between the phosphor layer and the face substrate.
As the anode electrodes, the constitution of having the plural metal films 11 serving as conductive members separately positioned by the rib members 21 and resistive members 24 of connecting the plural metal films serving as the conductive members each other is preferable as illustrated in
A film thickness (thickness in the Z direction indicated in
Next, the constitution of the rear plate will be described with reference to
The above-described light-emitting screen and the rear plate are oppositely arranged having a predetermined distance (for example, distance in a range from 0.5 nm to 2.0 nm) due to the interposition of a distance defining member 3. Peripheries of the face substrate 1 of the light-emitting screen and the rear substrate 4 of the rear plate are bonded with each other due to the interposition of a rectangular side wall 7 to constitute a vacuum container of which the inside is depressurized.
In an image displaying apparatus 15 of using the above-described vacuum container, in case of displaying an image, the voltage is supplied to the electron-emitting devices 8 through the row-directional wirings 5 and the column-directional wirings 6 to emit electrons, which are accelerated by the anode voltage applied to the anode electrodes to be irradiated to the phosphor layers 10. Herewith, the desired phosphor layer 10 is excited to emit the light and an image is displayed.
In the above-described image displaying apparatus, the light-emitting members are separated each other by the rib members, and the rib members have an aperture portion on a part between the light-emitting members. According to this constitution, as illustrated in
Hereinafter, the example of the present invention will be described.
(Process-a)
A black photo-paste is printed at a desired region in a light-emitting region by a screen printing method on a surface of a cleaned soda lime glass. Thereafter, a drying process is executed at the temperature 90° C. and the black photo-paste is exposed in an optimum pattern by using a photolithography technology. Next, the exposed black photo-paste is developed by the sodium carbonate solution of which the concentration is 0.4 Wt %, and unexposed portions are eliminated and the exposed portions are remained. Next, the product material after performing the development is dried.
(Process-b)
The pattern formed in the (Process-a) is baked at the temperature 550° C., and a black matrix layer 12 which is a black member having the thickness 2 μm, was formed. The shape of the black matrix layer is made to be corresponded to the shape of phosphor layers which are light-emitting members to be formed later. In particular, the black matrix is formed on a position between the phosphor layers to contact with the phosphor layers such that pitches of the phosphor layers become 615 μm in the X direction (in the depth direction on a page space) and 205 μm in the Y direction and the size of the respective phosphor layers becomes 295 μm in the Y direction and 145 μm in the X direction (
(Process-c)
Next, a zinc oxide insulation paste is applied by a slit-coater and baked at the temperature 120° C. for ten minutes such that a film thickness after the baking process becomes 150 μm, and a rib material layer 30 was formed (
(Process-d)
Next, a dry film resist (DFR) 31 is pasted by using a laminator apparatus. Further, a chrome mask to be used for exposure is aligned to a predetermined position and then the DFR is pattern exposed. The shape of a mask to be used for exposure is set to a pattern form similar to that in the above-described black matrix and an aperture corresponding to the aperture portion 23, of which size is 210 μm in the Y direction and 155 μm in the X direction, is further provided such that a part of the black matrix is exposed.
An exposure of the DFR, a developing process, a showering process for the rinse liquid and a drying process are further executed by using this mask to be used for exposure, and a mask (DFR mask), which is to be used for the sand blasting, having apertures on desired positions was formed (
(Process-e)
Next, portions of an unnecessary rib material layer are eliminated so as to correspond to apertures of the DFR by a sand blasting method, where SUS grains were treated as grinding grains (
(Process-f)
Next, the DFR is stripped off by a remover liquid, and the rib material layer was cleaned.
(Process-g)
Next, the rib material layer is baked at the temperature 530° C., and rib members 21 having apertures 23 were formed.
(Process-h)
Next, a phosphor layer was printed on a portion between the rib members 21 by a screen printing method by using a paste in which phosphors P22, which are used in a technical field of CRT, are dispersed (
(Process-i)
Next, an acrylic emulsion was applied by the spray coating method and dried, and spaces in the powder phosphors were infilled by the acrylic resin (
(Process-j)
Next, aluminum was vapor deposited on a whole surface of the face substrate, to which the above-described (Process-i) was executed, as a metal film 11 which constitutes anode electrodes. In this case, a thickness of the aluminum was set to 300 nm (
(Process-k)
Next, the acrylic resin layer was decomposed to be eliminated by baking it at the temperature 450° C.
The image displaying apparatus was formed by sealing the light-emitting screen formed as mentioned above with the electron source described in the above-described embodiment. And, electrons are emitted by driving the electron-emitting devices through the row-directional wirings and the column-directional wirings, and image was displayed. In this example, the new reflected electrons (secondary reflected electrons) due to the reflected electrons which were incident to the apertures can be shielded as indicated in
In this example, a point that the constitution illustrated in
(Process-j)
A resistive member 24 which constitutes the anode electrode was formed on a top of the rib member 21, which positions between the phosphor layers 10 adjacent to each other in the X direction and at a portion of extending in the Y direction in the drawing. This constitution is illustrated in
(Process-k)
Next, aluminum was vapor deposited as metal films 11 serving as the conductive members which constitute anode electrodes. In this case, a mask having aperture portions is used such that the aluminum is vapor deposited from a region, where the phosphor layers 10 serving as the light-emitting members are formed, to side surfaces of the rib members 21 and upper surfaces of the resistive members 24, and a vapor depositing process was executed from the diagonal direction for the face substrate 1. The film thickness of the aluminum was set to 300 nm (
(Process-l)
Next, the acrylic resin layer was decomposed to be eliminated by baking it at the temperature 450° C. Also in this example, similar to another example, the new reflected electrons (secondary reflected electrons indicated by a dot-line arrow in
In the above-described respective examples, although the configuration that each of the rib members between the light-emitting members has the aperture at the cross-section along the line 1B-1B indicated in
While the present invention has been described with reference to the exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
This application claims the benefit of Japanese Patent Laid-Open No. 2008-169324, filed Jun. 27, 2008, which is hereby incorporated by reference herein in its entirety.
Number | Date | Country | Kind |
---|---|---|---|
2008-169324 | Jun 2008 | JP | national |