Patent Application
20100014308
The field of the invention relates to lighting devices and methods of manufacturing these devices.
Different types of lighting devices are used today. These devices are deployed in a wide range of settings and include indoor lamps, outdoor lamps, and lighting devices used on or in vehicles to name a few examples.
Some of these previous vehicular lighting systems have used light emitting diodes (LEDs) or similar lighting elements. For instance, vehicles frequently use LEDs in lighting devices such as tail lamps, stopping lamps, or turning lamps. In these lighting systems, a printed circuit board is typically used to hold the LEDs. To protect the LEDs from exposure to moisture or other elements, a very thin coating of protective material typically less than approximately 1 mm in thickness is sometimes applied over the printed circuit board including the LEDs.
Unfortunately, these previous systems suffer from a variety of problems and shortcomings. For example, even though a thin coating is applied, the protective coating can be pierced or eroded by the high levels of moisture (or other contaminants) typically encountered in many environments thereby exposing the LEDs to these contaminants. Additionally, areas of the protective coating sometimes become removed or fail due to age or other factors thereby exposing the LEDs to the contaminants.
These previous approaches also provide inadequate protection of the printed circuit board components from vibration, shock, and/or other forces. More specifically, previous systems are often susceptible to the components breaking off the printed circuit board when the circuit board experiences even moderate shocks or jolts. For example, jolts and other forces are often encountered by vehicles and absorbed by their lighting systems. In fact, these forces sometimes break the LEDs or other components free from the board or otherwise damage the LEDs in place thereby disabling the operation of the lighting device or otherwise causing these devices to malfunction. Disabled or malfunctioning lighting devices lead to safety concerns for the driver and occupants of the vehicle. Additionally, when the device became disabled, the driver is required to replace the device leading to further safety concerns and inconvenience.
The components of previous lighting devices are also not easily interchangeable amongst a number of different types of assemblies. More specifically, the circuit boards of previous systems are typically designed to specifically fit the shape or configuration of particular housings. Consequently, the circuit boards are not interchangeable amongst different lighting devices and this leads to increased manufacturing costs for these systems.
Reliable lighting devices that are substantially protected from the effects of shocks, vibrations, dirt, moisture, water, and/or other hazards or contaminants are provided. Methods of manufacturing lighting devices are also provided. In some examples, these manufacturing approaches include utilizing injection molding techniques to form a lighting subassembly. Furthermore, lighting devices with modular components are provided according to the present approaches and these modular components can be employed in a wide variety of different types of devices having different shapes and configurations. In so doing, manufacturing efficiency and ease of assembly of the lighting device are increased. Manufacturing costs associated with producing light devices are reduced. The operating life and user satisfaction for the devices described herein are also increased compared to previous approaches.
In many of these embodiments, a lighting apparatus includes a lighting subassembly, an electrical coupler, a base portion, and a lens portion. The lighting subassembly includes one or more light emitting devices that are embedded in a solid, light-transmitting material. The one or more light emitting devices and the solid, light-transmitting material form a separate and distinct structure from the other elements of the apparatus. The electrical coupler is configured and arranged to supply energy to the at least one light emitting device from an energy source. The base portion is attached to the lighting subassembly and the lens portion is coupled to the base portion and at least partially covers the lighting subassembly. The lighting subassembly may additionally include a frame. In some examples, the frame is integral with the solid, light-transmitting material.
The light emitting devices may be any type of light-emitting device of any suitable size or configuration. In one example, the light emitting devices are light emitting diodes (LEDs). Other examples of light emitting devices are possible.
The lighting apparatus can be used in a variety of different locations. To take one example, the lighting apparatus may be configured and sized to be disposed in or on a vehicle. Additionally, the lighting apparatus may be used to provide a variety of functions. For example, the lighting apparatus may be used as an out door lighting device, a clearance lamp, a stopping lamp, a tail lamp, a back-up lamp, a turning lamp, a utility lamp, a reading lamp, a license plate lamp, or an interior lamp. Other examples of uses for the lighting apparatus are possible.
The lighting subassembly of the lighting apparatus may further include a printed circuit board that is embedded in the solid, light-transmitting material. In one example, the light emitting devices are coupled to the printed circuit board.
In many of these embodiments, the assembled lens portion and base portion provide a seal to prevent intrusion of external environmental elements from entering the lighting apparatus. For example, an air-tight or moisture-tight seal may be provided.
Various materials can be used for the solid, light-transmitting material. In one example, the solid, light-transmitting material comprises a resin. Other examples of materials may also be used.
In others of these embodiments, a lighting apparatus is manufactured. One or more light emitting devices, a base portion, and a lens portion are provided. The light emitting devices are positioned in a mold. The mold is of suitable structure so as to be injected with a formable material that forms a single-piece subassembly that includes and is formed around the light emitting devices. The single-piece subassembly is cured and removed from the mold. The subassembly is attached to the base portion and the lens portion is attached to the base portion such that the lens portion at least partially covers the subassembly.
In other of these examples, a frame is provided and the light emitting device is positioned so as to be secured by the frame. In other examples, an electrical connector is coupled to the light emitting device and the connector is extended through the base portion and from the subassembly.
In still others of these embodiments, a lighting subassembly includes at least one light emitting device, a solid, light transmitting material, and a mating arrangement. The solid, light-transmitting material at least partially surrounds the at least one light emitting device. The mating arrangement communicates with the solid, light transmitting material and is configured to be attachable to a corresponding base assembly. In some examples, the lighting subassembly further includes a frame and the frame is integral with the solid, light-transmitting material.
Thus, reliable lighting devices are provided that ensure the protection of the lighting apparatus or its components from the effects of shock, vibration, dirt, moisture, water, or other hazards. These approaches increase the life of the lighting devices thereby leading to greater user convenience and satisfaction. The lighting devices described herein can be formed at least partially from modular components and these modular components can be used in a wide variety of different lighting devices having various different shapes and configurations. In so doing, manufacturing flexibility and the ease of assembly are increased and manufacturing costs are reduced. Methods of manufacturing subassemblies are also provided that, in some examples, utilize injection molding techniques.
Skilled artisans will appreciate that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. For example, the dimensions and/or relative positioning of some of the elements in the figures may be exaggerated relative to other elements to help to improve understanding of various embodiments of the present invention. Also, common but well-understood elements that are useful or necessary in a commercially feasible embodiment are often not depicted in order to facilitate a less obstructed view of these various embodiments of the present invention. It will further be appreciated that certain actions and/or steps may be described or depicted in a particular order of occurrence while those skilled in the art will understand that such specificity with respect to sequence is not actually required. It will also be understood that the terms and expressions used herein have the ordinary meaning as is accorded to such terms and expressions with respect to their corresponding respective areas of inquiry and study except where specific meanings have otherwise been set forth herein.
Referring now collectively to
The base portion 104 is, in one example, a molded plastic component that includes the base-holder portion 108. The base holder portion 108 may be integrally formed with the base portion 108 and is configured with dimensions such that it holds and secures the subassembly 110. The subassembly 110 fits into the base holder portion 108 and may be secured used adhesive, or some other fastening arrangement. Alternatively, the subassembly may be secured within the base-holder portion 108 at least partially by some other fastening arrangement (e.g., screws or the like) or the base holder portion 108 may be eliminated altogether and the subassembly 110 directly secured to the base portion 104.
In one example, the lens portion 102 is formed of a light-transmitting material (e.g., plastic or glass) that may be colored according to the intended use of the lighting apparatus 100. For example, if used as a stopping lamp, the lens portion may be colored red. In another example, if used as a turning lamp, the lens portion 102 may be colored orange.
The lens portion 102 is coupled to the base portion 104 in the direction shown by the arrows 112 along edge portions 106 and at least partially covers the lighting subassembly 110. Electrical leads 114 extend through an opening 118 and into the lighting subassembly 110. Openings 120 in the base portion 104 may be used to insert a screw or similar fastener arrangements to secure the assembled lighting apparatus 100 to a variety of different locations such as within or on the outside of a vehicle.
In some examples, the lighting subassembly 110 may further include a frame (not shown in
The electrical leads 114 supply power to the elements of the subassembly 110. However, in other examples, the electrical leads 114 may be omitted and the lighting apparatus is a self-contained unit and includes a battery or similar power device. In other example, a transformer-like arrangement may be used to communicate electrical energy to the components of the assembly 110. The electrical leads 114 may include seals or other structures that prevent the intrusion of moisture or other elements from reaching the light emitting elements in the subassembly.
The light emitting devices may be any type of light-producing component. In one example, the light emitting devices are one or more one light emitting diodes (LEDs). The light emitting devices may also be of any suitable form, dimensions, color, or have any suitable operational characteristic (e.g., power consumption). Other examples of light emitting devices are possible.
The lighting apparatus 100 can be used in a variety of different locations. To take one example, the lighting apparatus 100 is configured and sized to be disposed in a vehicle. The lighting apparatus 100 may also be used to provide a variety of different functions. For example, the lighting apparatus may be used as an out door lighting device, a clearance lamp, a stopping lamp, a tail lamp, a back-up lamp, a turning lamp, a utility lamp, a reading lamp, a license plate lamp, or an interior lamp. Other functions may be provided by the lighting apparatus 100.
The lighting subassembly 110 may further include a printed circuit board that is embedded in the solid, light-transmitting material. In this example, light emitting devices are coupled to the printed circuit board. The printed circuit board may provide other components (e.g., resistors, diodes, capacitors, and controllers) that operate or control the light emitting devices.
In many of these embodiments, the assembled lens portion and base portion provide a seal to prevent intrusion of external environmental elements from entering the lighting apparatus. For example, the lens portion may be tightly secured to the base portion to prohibit the introduction of elements (e.g., provide an air-tight or moisture proof seal or the like). The solid, light transmitting material of the subassembly 110 also prevents the intrusion of these elements from reaching the light emitting devices of the assembly 110 since the solid, light transmitting material surrounds and conformably secures and protects these elements. The solid, light transmitting material of the subassembly 110 also acts as a cushion to prevent shocks or jolts from dislodging or otherwise damaging the light emitting elements or other components of the circuit board.
Various materials can be used for the solid, light-transmitting material. In one example, the solid, light-transmitting material comprises a resin. For example, a clear acrylic or clear polycarbonate resin may be used. Alternatively, the resin may be colored. For example, a red acrylic or red polycarbonate resin may be used. Other examples of materials are possible.
In many of these approaches, the solid, light transmitting materials fits conformably and snuggly around the subassembly components (e.g., the light emitting devices and printed circuit board). The material may be initially in a liquid or semi-liquid form and then poured or applied around these components and thereafter allowed to harden or cure. Consequently, and as mentioned above, moisture and other components cannot access these elements. On the other hand, the light emitting elements and other components of the subassembly are free to operate and light produced by these components is transmitted through the solid, light transmitting material.
Referring now to
The frame 401 functions to hold printed circuit board 410 and its associated components in place in a mold or similar arrangement when a material is applied to surround these components. The material may originally be liquid and the frame 401 may be placed in the mold. Afterward, the material solidifies to form a solid, light transmitting material 417.
Although the subassembly 402 in these examples includes a frame 401, it will be appreciated that in other examples a frame 401 is not used. For example, a printed circuit board including light emitting elements 414 may be encompassed or surrounded by the solid, light transmitting material without the use of a frame 401. In one example of this approach, the printed circuit board 410 is placed in a mold and injection molding techniques are used to inject a light transmitting material (e.g., initially in a liquid or semi-liquid form) in to the mold. In still other examples, other molding or non-molding techniques (e.g., manually constructing the subassembly from separate components) are used to from the subassembly 402.
As shown if
As also mentioned herein, injection molding techniques may be used to inject a liquid form of the material 417 into a mold and around the components. After pouring or injecting the material, the material may be allowed to solidify, for example, using a curing process. Consequently, the material 417 becomes solid and possesses properties facilitating the transmission of light.
Also as shown in
Although the shape, configuration, and dimensions of the subassembly 402 formed of the solid, light transmitting material may vary, in one example the subassembly 402 is block shaped and has dimensions of approximately 3.2 cm in length, 0.8 cm in height, and 2 cm in thickness. In any case, the thickness of the solid, light transmitting material is substantially greater than the very thin coatings applied in prior approaches.
The subassembly 402 can then be used in a lighting assembly. Also, multiple subassemblies can be used in the same assembly. Additionally, the subassembly 402 is of suitable shape and dimensions so it can fit within a variety of different base portions in a variety of different devices that are used to provide a variety of different functions. Consequently, the subassembly 402 is a modular component that is interchangeable amongst a variety of assemblies having different shapes and dimensions and is not limited to a single application, assembly, housing, environment, or device type.
Referring now to
At step 704, the mold is injected with a formable material to form a single-piece subassembly that includes and is formed around the one or more light emitting devices. For example, the material may be a resin that transmits light. Other examples of materials are possible. As mentioned the material may be injected in liquid or semi-liquid form. Also as mentioned, the material may be selected to transmit certain types of light (e.g., visible light, infrared light, or ultraviolet light). In so doing, the injected material provides a snug, tight, and conforming fit around the components while at the same time allowing these components to operate. In one example, the injected material is a hot material that has a temperature of between approximately 350-400 degrees Fahrenheit. Other examples of temperature may also be used.
At step 706, the mold is cured. For example, the mold (including the subassembly) may be allowed to cool for, in one example, between approximately 10-15 seconds. This allows the mold to cool to between room temperature and 100 degrees Fahrenheit in order to cure (or set-up) the subassembly. After this step is performed, the subassembly is in a solid form. Although the shape and dimensions of the subassembly formed of the solid, light transmitting material may vary, in one example the subassembly is block shaped and has dimensions of approximately 3.2 cm in length, 0.8 cm in height, and 2 cm in thickness. In any case, the thickness of the solid, light transmitting material is substantially greater than the coatings applied in prior approaches. At step 708, the subassembly is removed from the mold.
At step 710, after removal from the mold the subassembly is attached to the base portion. At step 712, a lens portion is attached to the base portion such that the lens portion at least partially covers the subassembly.
Although the above examples are described with respect to utilizing injection molding techniques to form the subassembly, it will be appreciated that other types of manufacturing techniques may also be used. For instance, other conventional molding techniques may also be used to form the subassembly.
Thus, lighting devices are provided that provide reliable lighting and that are protected from shock, vibration, dirt, moisture, water, or other hazards. These approaches increase the life of the lighting elements used to provide illumination and thereby lead to greater user convenience and satisfaction with these system. The devices provided herein can be constructed from modular components and these modular components can be used in a wide variety of devices having different shapes, dimensions, and configurations. In so doing, manufacturing flexibility and the ease of assembly are increased while manufacturing costs are reduced. Methods of manufacturing subassemblies are also provided utilizing injection molding techniques.
Those skilled in the art will recognize that a wide variety of modifications, alterations, and combinations can be made with respect to the above described embodiments without departing from the spirit and scope of the invention, and that such modifications, alterations, and combinations are to be viewed as being within the scope of the invention.
