A portion of the disclosure of this patent document contains material that is subject to copyright protection. The copyright owner has no objection to the reproduction of the patent document or the patent disclosure, as it appears in the U.S. Patent and Trademark Office patent file or records, but otherwise reserves all copyright rights whatsoever.
The present disclosure relates generally to power supplies that provide a DC voltage to a load, such as, for example, light-emitting diodes. More particularly, the present disclosure relates to an apparatus and method for controlling and maintaining negative feedback of a power supply when running into an over-load condition.
Constant-power tunable LED drivers are very popular in the lighting market because of their flexibility to drive different LED loads at different current levels. A single constant-power driver, for example, a 220-Watt constant-power LED driver can drive any load from 2-Amps at 110-Volts to 1.4-Amps at 157-Volts. The current provided by the driver is tunable using a programming tool.
One such constant-power tunable driver which may be used to drive an LED load is a half-bridge resonant type DC-DC converter. A half-bridge resonant type DC-DC converter is a very good candidate for driving an LED load because it has a high efficiency and a wide load range. The typical half-bridge resonant type DC-DC converter includes a feedback loop which utilizes negative feedback control to control an output current. The half-bridge resonant type DC-DC converter can operate on both sides of the converter's resonant frequency. However, negative feedback control only works when the operating frequency is above the resonant frequency. Under certain circumstances, such as an overload condition, the operating frequency may drop below the resonant frequency, lose negative feedback control, and get stuck at a minimum frequency. The half-bridge resonant type DC-DC converter has no way to automatically pull the operating frequency back up above the resonant frequency in order to reestablish negative feedback control.
Accordingly, a need exists for methods and associated circuitry which is configured to regain negative feedback control when a power converter gets stuck in an overload condition, e.g., when the operating frequency gets stuck at a minimum frequency below the resonant frequency.
One embodiment of a power converter as disclosed herein to address the above-referenced problem comprises first and second switching elements coupled across a direct current (DC) power source, and a resonant circuit coupled between an isolation transformer primary winding and an output node between the first and second switching elements. A current sensing circuit is coupled between an output load and a secondary winding of the isolation transformer, and provides a sensor output signal representative of an output current through the load. A feedback circuit generates an error signal corresponding to a difference between the sensor output signal and a reference signal. A controller is provided which comprises a frequency control input terminal, and is configured to generate drive signals to the first and second switching elements at a determined operating frequency. A frequency control circuit is coupled between the feedback circuit and the frequency control input terminal of the controller and, responsive to the error signal, determines the operating frequency of the controller with respect to defined minimum and maximum frequencies. A current reference control circuit is provided to control the error signal of the feedback circuit when the error signal is greater than a reference error signal of the current reference control circuit.
In one exemplary further aspect of the above-referenced embodiment, the current reference control circuit may include a slow charge path and a quick discharge path in parallel between the output terminal of the feedback circuit and an integrator capacitor of the current reference control circuit. The quick discharge path may be configured to discharge the integrator capacitor at a first rate when the error signal is greater than the reference error signal, wherein the slow charge path is configured to charge the integrator capacitor at a second rate slower than the first rate when the error signal is less than the reference error signal.
For example, the slow charge path may include a first resistor having a first resistance, and the quick discharge path may include a diode in series with a second resistor having a second resistance smaller than the first resistance.
In another exemplary aspect of the above-referenced embodiment, the integrator capacitor may be coupled between an inverting input terminal of an operational amplifier and an output terminal of the operational amplifier, and the slow charge path and the quick discharge path may be coupled to the inverting input terminal of the operational amplifier.
In another exemplary aspect of the above-referenced embodiment, the feedback circuit may include a buffer resistor coupled between the reference signal and the first input terminal, and a buffer capacitor coupled between the first input terminal and a secondary side ground reference. The current reference control circuit may further include an output control diode coupled in series with an output control resistor between the output terminal of the operational amplifier and the first input terminal of the feedback circuit.
In another exemplary aspect of the above-referenced embodiment, the operational amplifier may be configured to generate a reference control signal at the output terminal, and voltage across the buffer capacitor may be controlled by the reference control signal when the reference control signal is lower than the reference signal.
In another exemplary aspect of the above-referenced embodiment, voltage across the buffer capacitor may be controlled by the reference signal when the reference control signal is greater than the reference signal.
In another exemplary aspect of the above-referenced embodiment, the output control diode may be reverse biased when the reference control signal is greater than the reference signal.
In another exemplary aspect of the above-referenced embodiment, the reference error signal may be received at a non-inverting input terminal of an operational amplifier of the current reference control circuit.
In another exemplary aspect of the above-referenced embodiment, the feedback circuit may include a buffer resistor coupled between the reference signal and the first input terminal, and a buffer capacitor coupled between the first input terminal and a secondary side ground reference. The current reference control circuit may be configured to control a voltage across the buffer capacitor when a reference control signal generated by the current reference control circuit is less than the reference signal.
In another exemplary embodiment, an LED driver as disclosed herein comprises a DC-DC converter with a plurality of switching elements configured to produce an output voltage across first and second output terminals and an output current through an LED load coupled thereto, based on a DC input and an operating frequency. A current sensor is coupled in series with the LED load. A first circuit is provided for regulating the operating frequency based on an error signal derived at least in part from output signals from the current sensor relative to a reference value. A second circuit is provided for controlling the error signal in response to the error signal exceeding a reference error signal for regaining negative feedback control of the first circuit.
In one exemplary aspect of this embodiment, the second circuit may manipulate the reference value in order to temporarily affect the error signal.
In another exemplary aspect of this embodiment, the second circuit may include a quick discharge means for quickly reducing the error signal in response to the error signal exceeding the reference error signal, and a slow charge means slowly increasing the error signal in response the error signal being reduced.
In another exemplary aspect of this embodiment, the slow charge means may give the LED load time to warm up in order to transition from a cold operational state to a normal operational state.
While the making and using of various embodiments of the present invention are discussed in detail below, it should be appreciated that the present invention provides many applicable inventive concepts that can be embodied in a wide variety of specific contexts. The specific embodiments discussed herein are merely illustrative of specific ways to make and use the invention and do not delimit the scope of the invention.
The following detailed description of embodiments of the present disclosure refers to one or more drawings. Each drawing is provided by way of explanation of the present disclosure and is not a limitation. Those skilled in the art will understand that various modifications and variations can be made to the teachings of the present disclosure without departing from the scope of the disclosure. For instance, features illustrated or described as part of one embodiment can be used with another embodiment to yield a still further embodiment.
The present disclosure is intended to cover such modifications and variations as come within the scope of the appended claims and their equivalents. Other objects, features, and aspects of the present disclosure are disclosed in the following detailed description. One of ordinary skill in the art will understand that the present discussion is a description of exemplary embodiments only and is not intended as limiting the broader aspects of the present disclosure.
Referring to
The converter 100 includes a primary circuit 102 and a secondary circuit 104, which are electrically isolated as described below. The converter includes a first switch Q1 and a second switch Q2 in a half-bridge switching circuit 110. The switches may be, for example, metal oxide semiconductor field effect transistors (MOSFETs) or bipolar junction transistors (BJTs). In the illustrated embodiment, the two switches are n-channel MOSFETs. The half-bridge switching circuit is connected between a DC input bus VRAIL and a primary circuit ground reference GNDP. The DC input bus VRAIL may be considered as a first voltage rail; and the primary circuit ground reference may be considered as a second voltage rail. The drain of the first switch is connected to the DC input bus. The source of the first switch is connected to the drain of the second switch at a common switched node 112 of the half-bridge switching circuit. The source of the second switch is connected to the primary circuit ground reference.
In the illustrated embodiment, the voltage on the DC input bus 120 is provided by a first DC voltage source 120. In the illustrated embodiment, the first DC voltage source is illustrated as a battery; however, it should be understood that the voltage on the DC input bus may be provided by other sources, such as, for example, a power factor correction (PFC) stage, the DC output of a bridge rectifier, or the like, which are supplied from an AC source (not shown). The battery is representative of a variety of voltage sources that provide a substantially constant voltage on the DC input bus.
Each of the first switch Q1 and the second switch Q2 has a respective control input terminal. In the illustrated embodiment incorporating MOSFETs, the control input terminals are the gates of the two transistors. The control input terminals are driven by a self-oscillating half-bridge gate driver integrated circuit (IC) 130, which may also be referred to as a switch controller. In an illustrated embodiment, the driver IC (switch controller) 130 may be, for example, an NCP1392B high-voltage half-bridge driver with inbuilt oscillator, which is commercially available from ON Semiconductor Company of Phoenix, Ariz. The driver IC 130 is powered by a second DC voltage source 122 via an input terminal VCC_T of the driver IC 130. In
The driver IC (switch controller) 130 is responsive to a timing resistance connected to a timing terminal RT to alternately apply an upper drive voltage on an upper drive terminal MUT and apply a lower drive voltage to a lower drive terminal MLT. The upper output drive voltage is applied to the control input terminal of the first switch Q1. The lower output drive voltage is applied to the control input terminal of the second switch Q2. When the resistance applied to the timing terminal RT of the driver IC 130 increases, the current flowing out of the timing terminal decreases, which causes the frequency of the drive voltages applied to the two switches to decrease. When the resistance applied to the timing terminal RT of the driver IC 130 decreases, the current flowing out of the timing terminal increases, which causes the frequency of the drive voltages to increase. A ground terminal GNDT of the driver IC 130 is coupled to the primary circuit ground GNDP. The driver IC 130 may include other terminals that are not shown in
The common switched node 112 of the half-bridge switching circuit 110 is connected to a half bridge connection terminal HBT of the driver IC 130. The first and second switches Q1, Q2 provide a high frequency AC voltage input to a resonant circuit 140. The resonant circuit 140 may also be referred to herein as a partially clamped resonant circuit 140. The common switched node 112 is also connected to a first terminal of a resonant inductor LRES of the resonant circuit 140. A second terminal of the resonant inductor LRES is connected to a first terminal of a first resonant capacitor CRES_1 at an output node 142 in the resonant circuit 140. A second terminal of the first resonant capacitor CRES_1 is connected to a first terminal of a second resonant capacitor CRES_2. A second terminal of the second resonant capacitor CRES_2 is connected to the primary circuit ground reference GNDP. The voltage on the second resonant capacitor CRES_2 is clamped by a first clamping diode DC1 and a second clamping diode DC2. The cathode of the first clamping diode DC1 is coupled to the DC input bus VRAIL. The anode of the first clamping diode DC1 is coupled to the second terminal of the resonant inductor LRES. The cathode of the second clamping diode DC2 is coupled to the second terminal of the resonant inductor LRES. The anode of the second clamping diode DC2 is coupled to the primary circuit ground reference GNDP. The first resonant capacitor CRES_1 is specifically designed so that the resonant circuit 140 will always have soft-switching within a certain frequency range (i.e., between a minimum frequency fmin and a maximum frequency fmax).
The output node 142 of the resonant circuit 140 is connected to a first terminal of a DC blocking capacitor CBLOCK. A second terminal of the DC blocking capacitor CB is connected to a first terminal of a primary winding TP of an output isolation transformer 150. A second terminal of the primary winding TP of the output isolation transformer 150 is connected to the primary circuit ground reference GNDP. The foregoing components on the primary circuit 102 of the half-bridge switching circuit 110 operate as a DC to AC inverter to produce an AC voltage across the primary winding TP of the output isolation transformer 150.
The output isolation transformer 150 includes a first secondary winding TS1 and a second secondary winding TS2. The two secondary windings TS1, TS2 are electrically isolated from the primary winding TP. As illustrated, the primary winding TP is electrically part of the primary circuit 102, and the secondary windings TS1, TS2 are electrically part of the secondary circuit 104. The two secondary windings TS1, TS2 have respective first terminals, which are connected at a center tap 152. Respective second terminals of the first and second secondary windings TS1, TS2 are connected to input terminals of a half-bridge rectifier 160. The half-bridge rectifier 160 comprises a first rectifier diode DRECT1 and a second rectifier diode DRECT2. The second terminal of the first secondary winding TS1 is connected to the anode of the first rectifier diode DRECT1. The second terminal of the second secondary winding TS2 is connected to the anode of the second rectifier diode DRECT2. The cathodes of the two rectifier diodes are connected together at an output node 162 of the half-bridge rectifier 160. The center tap 152 of the first and second secondary windings TS1, TS2 is connected to a secondary circuit ground reference GNDS. In other embodiments having a single, non-center-tapped secondary winding (not shown), the half-bridge rectifier with the two rectifier diodes may be replaced with a full-bridge rectifier with four rectifier diodes.
The output node 162 of the half-bridge rectifier 160 is connected to a first terminal of an output filter capacitor CF. A second terminal of the output filter capacitor is connected to the secondary circuit ground reference GNDS. An output voltage (VOUT) is developed across the output filter capacitor at the output node 162 of the half-bridge rectifier 160. The output node 162 of the half-bridge rectifier 160 is also connected to a first terminal of a load RLOAD, which may comprise, for example, one or more light-emitting didoes (LEDs) that emit light when sufficient current passes through the LEDs. A second terminal of the load is connected to a current sensing node 164 and to the first terminal of a current sensing resistor R1_SENSE. A second terminal of the current sensing resistor R1_SENSE is connected to the secondary circuit ground reference GNDS. When current flows through the load RLOAD, the same current flows through the current sensing resistor R1_SENSE. Accordingly, a voltage develops on the current sensing node 164 that has a magnitude with respect to the secondary circuit ground reference GNDS that is proportional to the current flowing through the load RLOAD. In one embodiment, the current sensing resistor R1_SENSE has a resistance of, for example, 0.1 ohm such that the effect of the resistance of the current sensing resistor R1_SENSE on the load current is insignificant.
When the driver IC 130 operates to apply alternating drive voltages to the first switch Q1 and the second switch Q2, an AC voltage develops across the first and second resonant capacitors CRES1, CRES2. The voltage across the first and second resonant capacitors CRES1, CRES2 may include a DC component; however, the DC blocking capacitor CBLOCK transfers only the AC component of the energy stored in the first and second resonant capacitors CRES1, CRES2 to the primary winding TP of the output isolation transformer 150. The transferred energy is magnetically coupled from the primary winding TP to the electrically isolated first and second secondary windings TS1, TS2. The first and second rectifier diodes DRECT1, DRECT2 in the half-bridge rectifier 160 rectify the AC energy from the first and second secondary windings TS1, TS2 into DC energy, which is provided on the output node 162. The DC energy is stored in the output filter capacitor CF at a voltage determined by the amount of stored energy. Current from the output filter capacitor CF is provided to the load RLOAD at a magnitude determined by the voltage on the half-bridge rectifier output node and the resistance of the load.
Because the intensity of the light emitted by the LEDs in the load RLOAD is dependent on the magnitude of the current flowing through the LEDs, the current is controlled closely. The current sensing resistor R1_SENSE senses the current ILOAD going through the load RLOAD and develops a sensor voltage V1_SENSE on the current sensing node 164 proportional to the load current ILOAD. The sensor voltage V1_SENSE may also be referred to herein as a sensor output signal. The sensor voltage V1_SENSE representing the sensed current ISENSE is fed back to a feedback circuit 170 to provide current regulation.
The feedback circuit 170 is configured to regulate the output current ILOAD through the load RLOAD at a reference current IREF. The feedback circuit 170 may also be referred to herein as a proportional integral (PI) current control loop 170 or a PI negative feedback control loop 170. The reference current IREF may also be referred to herein as a reference signal IREF. The output current ILOAD can also be referred to herein as a load current ILOAD. The feedback circuit 170 includes an operational amplifier (OPAMP) 172 having an inverting (−) input terminal, having a non-inverting (+) input terminal, and having an output (OUT) on an output terminal. The current sensing node 164 is connected to the inverting input of the OPAMP 172 via a first series resistor RS1. A feedback resistor RFB and a feedback capacitor CFB are connected in series between the output terminal of the OPAMP 172 and the inverting input. The feedback resistor RFB may also be referred to herein as a gain control resistor. The feedback capacitor CFB may also be referred to herein as an integration capacitor. The first series resistor RS1 and the feedback resistor RFB determine the proportional gain of the feedback circuit 170. The first series resistor RS1 and the feedback capacitor CFB determine the crossover frequency of the feedback circuit 170.
The reference current IREF is connected to the non-inverting input of the OPAMP 172 via a buffer resistor RBUFF and a buffer capacitor CBUFF. The buffer resistor RBUFF and the buffer capacitor CBUFF are used to buffer the reference current IREF. The buffer resistor RBUFF is connected between a reference current node 174 where at the reference current IREF is received and the non-inverting input of the OPAMP 172. The buffer capacitor CBUFF is connected between the non-inverting input of the OPAMP 172 and the secondary circuit ground reference GNDS. The reference current IREF is transmitted through the buffer resistor and is used to charge up a voltage VC_BUFF across the buffer capacitor CBUFF, which is sensed or received by the non-inverting input of the OPAMP 172. The voltage VC_BUFF may also be referred to herein as a current control voltage VC_BUFF.
The magnitude of the reference current IREF is selected to produce a desired load current ILOAD through the load RLOAD. The reference current IREF may be a fixed reference current to provide a constant load current. A tuning interface 174, such as, for example, a dimmer, can be provided for adjusting the magnitude of the reference current IREF whenever is necessary to drive a specific load. If the reference current IREF changes to a new magnitude, the load current ILOAD is adjusted and maintained constant relative to the new magnitude. The OPAMP 172 is responsive to a difference in the magnitudes of the reference current IREF and the sensor voltage V1_SENSE at the current sensing node 164 to generate an error signal VERROR. The error signal VERROR is used to control the operating frequency fop of the driver IC 130 as described below. The OPAMP 172 may also be considered as a comparator because the OPAMP 172 compares the magnitudes of the two input signals and generates an output signal having a magnitude responsive to a difference between the magnitudes of the two input signals.
During operation of the OPAMP 172, when the output current ILOAD is lower than the reference current IREF the error signal VERROR at the output terminal will increase. When the output current ILOAD is greater than the reference current IREF the error signal VERROR at the output terminal will decrease. The error signal VERROR is fed to a current control circuit 180 to achieve close loop frequency control in order to maintain a constant output current when the load RLOAD changes.
The output terminal of the OPAMP 172 is connected to the input stage of an optocoupler 182 of the current control circuit 180 via a second series resistor RS2. The optocoupler 182 may also be referred to herein as an opto isolator, or an optical isolator. The input stage of the optocoupler 182 has an internal light generation device (e.g., an LED) coupled to the input of the optocoupler. The light generation device is responsive to a voltage (e.g., the error signal VERROR) applied to the input stage to generate light. The applied voltage is referenced to the secondary circuit ground reference GNDS to which the light generation stage is connected. The generated light is propagated internally to a light-responsive base of a phototransistor in an output stage within the same component. The phototransistor has an emitter and a collector. The emitter is connected to the primary circuit ground reference GNDP through an optocoupler capacitor COPTO. The impedance of the phototransistor between the collector and the emitter in the output stage of the optocoupler is responsive to the light generated by the input stage. Thus, the impedance of the output stage is responsive to the voltage applied to the input stage. In the illustrated embodiment, increasing the voltage applied to the input stage decreases the impedance of the output stage, and decreasing the voltage applied to the input stage increases the impedance of the output stage. The optocoupler electrically isolates the secondary circuit voltages and the secondary circuit ground reference GNDS in the secondary circuit 104 from the primary circuit voltages and the primary circuit ground reference GNDP in the primary circuit 102.
In the example shown, the collector of the phototransistor in the output stage of the optocoupler 182 is connected to the second DC voltage source 122 through an optocoupler resistor ROPTO.
The emitter of the phototransistor of the output stage of the optocoupler 182 is further connected to an input node of a frequency control block 190 of the current control circuit 180. The frequency control block 190 includes a minimum frequency resistor RMIN coupled between the timing terminal RT of the driver IC 130 and the primary circuit ground reference GNDP. The frequency control block 190 further includes a first diode D1, second diode D2, a first maximum frequency resistor RMAX1, and a second maximum frequency resistor RMAX2. An anode of the first diode D1 is coupled to the timing terminal RT of the driver IC 130. The first and second maximum frequency resistors RMAX1, RMAX2 are coupled in series between a cathode of the first diode D1 and the primary circuit ground reference GNDP. A node defined between the first and second maximum frequency resistors is coupled to a cathode of the second diode D2 of the frequency control block. An anode of the second diode D2 is coupled to the input node of the frequency control block.
The current control circuit 180 receives the error signal VERROR from the feedback circuit 170 and adjusts the operating frequency fop of the driver IC 130. The frequency control driver IC is directly proportional to the current that flows out the timing terminal RT of the driver IC 130, which is internally connected to a reference voltage VREF. The operating frequency fop follows the equation:
RTOTAL is the total resistance connected to the timing terminal Rt.
Before the feedback circuit 170 starts working, the error signal VERROR is zero. Accordingly, the second diode D2 doesn't conduct any current and the emitter of the optocoupler 182 is open. As a result, there is no voltage across the optocoupler capacitor COPTO which causes the second diode D2 to be negatively biased and thus not conduct any current. This is when the maximum frequency fmax of the driver IC 130 happens.
If the error voltage VERROR is too high, it will drive too much current through the second diode D2. This will in turn saturate the emitter of the optocoupler 182 and will force the emitter resistance to be very close to zero. As a result, there will be a large voltage across the second maximum frequency resistor RMAX2. If the voltage across the second maximum frequency resistor RMAX2 is greater than the reference voltage VREF, for example VREF may equal 3.5 volts, then the first diode D1 will stop conducting current. This is when the minimum frequency fmin of the driver IC 130 happens.
The minimum operating frequency fmin when the reference voltage VREF is equal to 3.5 volts can be defined based on the discussion above as follows:
The maximum operating frequency fmax when the reference voltage VREF is equal to 3.5 volts can be defined based on the discussion above as follows:
Referring to
When the operating frequency fop is between the resonant frequency fres and the minimum operating frequency fmin, the output current ILOAD decreases when the operating frequency fop decreases. This is associated with an open loop operating mode. The open loop operating mode may also be referred to herein as an open loop mode, a frequency-clamp operating mode, or a frequency-clamp mode. In this mode, close-loop negative feedback control through the feedback circuit 170 is lost.
When operating the converter 100 in the close loop operating mode (i.e., associated with normal conditions), the operating frequency fop is greater than the resonant frequency fres in order to maintain close-loop negative feedback control through the feedback circuit 170. The following control sequence relationships of the converter 100 are true only in the close loop mode. When the output current ILOAD is less than the reference current IREF, the error signal VERROR increases and thus supplies more current to the input stage of the optocoupler 182, the impedance of the output stage of the optocoupler 182 decreases, the voltage across the second maximum frequency resistor RMAX2 increases, the current at the timing terminal RT increases, the operating frequency fop decreases, and finally the load current ILOAD increases. When the output current ILOAD is greater than the reference current IREF, the error signal VERROR decreases and thus supplies less current to the input stage of the optocoupler 182, the impedance of the output stage of the optocoupler 182 increases, the voltage across the second maximum frequency resistor RMAX2 decreases, the current at the timing terminal RT decreases, the operating frequency fop increases, and finally the load current ILOAD decreases.
As shown in
If by chance the operating frequency fop is pushed below the resonant frequency fres (i.e., open loop operating mode) and the output current ILOAD is less than the reference current IREF, the feedback circuit 170 will continue to push the operating frequency down to the minimum frequency fmin in an attempt to increase the load current ILOAD. However, because the operating frequency fop is less than the resonant frequency fres, a decrease to the operating frequency fop will cause the load current ILOAD to also decrease. Accordingly, the operating frequency fop will get stuck at the minimum frequency fmin forever, unless the reference current IREF is changed, for example, by a dimming controller. This situation is associated with a loss of close-loop negative feedback control.
Referring to
One instance in which the loss of close-loop negative feedback control could happen is when the DC-to-DC converter attempts to provide power to a cold LED load. The cold LED load could have a cold load voltage VLOAD_COLD that is 30% greater than a normal load voltage VLOAD_NORM.
The converter 100 is a constant power driver. This means that the output current ILOAD can be programmed for different loads. For different loads, the current gain curve is different, as shown in
As can best be seen in
The maximum gain of each curve is different. When the load is at a minimum associated with the minimum output voltage VLOAD_MIN, the current has the highest current gain as shown by the current gain curve graph 400A. When the load is at a maximum associated with the maximum output voltage VLOAD_MAX, the current has the lowest current gain as shown by the current gain curve graph 400C. When the load is at an intermediate associated with the intermediate output voltage VLOAD_INT, the current has an intermediate current gain as show by the current gain curve graph 400B.
The current gain curve graph 400A includes a resonant frequency fres_1 and a first operating frequency fop_1 corresponding to a maximum load current ILOAD_MAX. The current gain graph 400B includes a resonant frequency fres_2 and a second operating frequency fop_2 corresponding to an intermediate load current ILOAD_INT. The current gain curve graph 400C includes a resonant frequency fres_3 and a third operating frequency fop_3 corresponding to a minimum load current ILOAD_MAX. As illustrated, the self-resonant frequency decreases when the load voltage VLOAD decreases.
In the closed loop mode, or the normal operating mode, the resonant circuit 140 operates at a frequency below its self-resonant frequency. The minimum operating frequency fop_min of the driver IC 130 is typically set to be slighter greater than resonant frequency fres_1 when the load RLOAD is at a minimum output voltage VLOAD_MIN, which is associated with the maximum output current ILOAD_MAX, as shown by current gain curve graph 400A. Accordingly, the maximum output current ILOAD_MAX can be clamped by the minimum operating frequency fop_min. With regard to the current gain curve graphs 400B, 400C, however, the respective output currents ILOAD at the minimum operating frequency fop_min are less than a target current associated with the maximum output current ILOAD_MAX. As a result, if the operating frequency fop of the converter 100 has been pushed to the minimum operating frequency fop_min by the control loop, then the converter 100 will be stuck there (e.g., in the open loop mode) until or unless the reference current IREF is adjusted to be lower than the output current ILOAD at the minimum operating frequency fop_min in order to reset the control loop (e.g., to transition it back into the close loop mode).
For a specific LED load, there might be a 30% voltage difference between cold LEDs (VLOAD_COLD) and warm LEDs (VLOAD_NORM). As a result, the current gain curve will be different for cold and warm LEDs, as shown in
As can best be seen in
As can best be seen in
When the power is initially turned on, the driver IC 130 operates at the maximum frequency fmax, shown by the operating frequency waveform 600D between time to and time t1 of
At time t1, the error signal VERROR, represented by the error signal waveform 600C, increases to the breakdown voltage VTH of the opto-diode in the input stage of the optocoupler 182, as shown in
At time t2, the operating frequency fop is a high enough frequency fstart, associated with a starting error signal VERROR_START, to cause the resonant circuit 140 to output a voltage that breaks down the LEDs of the load RLOAD, as shown in
Since the output current ILOAD is smaller than the voltage VC_BUFF across the buffer capacitor CBUFF between time t2 and time t3, the error signal VERROR will keep increasing until the output current ILOAD matches the reference current IREF which is associated with a steady state output current ILOAD_STEADY, as shown in
As we can see, when the load RLOAD is normal, or warm, the operating frequency fop will not be pushed over the hump of the current gain curve graph 500A. In other words, the operating frequency fop is always greater than the self-resonant frequency fres and close-loop negative feedback control through the feedback circuit 170 works well (i.e., the converter 100 is maintained in the close loop mode).
However, when the load RLOAD is cold, the current gain curve graph 500B is different, as shown in
As can best be seen in
Just as for a load RLOAD comprising warm LEDs, when the load RLOAD comprises cold LEDs, the reference current input of the OPAMP 172 (e.g., the voltage VC_BUFF across the buffer capacitor CBUFF, represented by the current control voltage waveform 700A) is charged up slowly by the reference current IREF, as shown in
When the load RLOAD comprises cold LEDs, the error signal VERROR, shown in
When the error signal is at a maximum VERROR_MAX, the opto-diode in the input stage of the optocoupler 182 conducts enough current to saturate the emitter of the phototransistor in output stage of the optocoupler 182, which causes the voltage across the second maximum frequency resistor RMAX2 of the frequency control block 190 of the current control circuit 180 to be greater than the reference voltage VREF at the timing terminal RT of the driver IC 130. Since the voltage across the second maximum frequency resistor RMAX2 is greater than the reference voltage VREF, the first diode D1 of the frequency control block 190 of the current control circuit 180 stops conducting current. As a result, the only component that connects to the timing terminal RT is the minimum frequency resistor RMIN. As a result, the operating frequency fop of the driver IC 130 will be set at the minimum frequency fmin.
The error signal VERROR will be maintained at the maximum error signal VERROR_MAX so long as the output current ILOAD is less than the reference current IREF.
When the LEDs comprising the load RLOAD warm up, the current gain curve shifts to the current gain curve graph 500A, shown in
As discussed above, in the open loop mode, the output current ILOAD will have a big ripple whose peak could be greater than the maximum rated current of the LEDs of the load RLOAD. This may cause LED over current damage. Accordingly, it is very desirable to be able to automatically recover, or get back into the close loop mode, when the converter 100 gets stuck in the open loop mode.
To solve this problem, a current reference control circuit 810 is added to the original converter 100 of
The current reference control circuit 810 includes a current control operational amplifier (OPAMP) 812 having an inverting (−) input terminal, having a non-inverting (+) input terminal, and having an output (OUT) on an output terminal. The current control OPAMP 812 is used to control the error signal VERROR from the feedback circuit 170. A reference error signal VERROR_REF is connected to the non-inverting input terminal of the current control OPAMP 812 and is the setpoint for the current control OPAMP 812 to start protecting.
The current reference control circuit 812 includes an integrator capacitor CINT connected between the inverting input terminal and the output terminal. The current reference control circuit 812 further includes two branches connected between the inverting input terminal of the current control OPAMP 812 and the output terminal of the OMAMP 172 of the feedback circuit 170. The first branch includes a discharge diode DDIS in series with a discharge resistor RDIS to provide a quick discharge path for the integrator capacitor CINT when the error signal VERROR is greater than the reference error signal VERROR_REF. The second branch includes a slow charge resistor RSC, which is designed to have a very larger resistance, for providing a very slow charge path to the integrator capacitor when the error signal VERROR is less than the reference error signal VERROR_REF.
The current reference control circuit 812 further includes a control diode DCON and a control resistor RCON connected in series between the output terminal of the current control OPAMP 812 and the and the non-inverting input terminal of the OPAMP 172 of the feedback circuit 170. The control diode DCON and the control resistor RCON are used to control the voltage across the buffer capacitor CBUFF of the feedback circuit 170. The output terminal of the current control OPAMP 812 generates a reference control output signal IREF_CTL.
During operation, when the reference control output signal IREF_CTL of the current control OPAMP 812 is higher than the reference current IREF, then the control diode DCON doesn't conduct and the control resistor RCON is effectively out of the circuit. When the reference control output signal IREF_CTL of the current control OPAMP 812 is lower than the reference current IREF, then the voltage VC_BUFF across the buffer capacitor CBUFF is controlled by the output of the current control OPAMP 812.
As can best be seen in
The cold LED current gain curve, shown in
Between time t3 and time t4, the error signal VERROR will continue to increase to the maximum error signal VERROR_MAX since the output current ILOAD is less than the reference signal IREF during that period of time, as shown in
At time t4, the voltage VC_BUFF across the buffer capacitor CBUFF, represented by the current control voltage waveform 900A, decreases to the cold output clamping current ILOAD_COLD_CLAMP which is the same as the real output current ILOAD, shown in
Right after time t4, the voltage VC_BUFF across the buffer capacitor CBUFF will continue to be pulled down to be smaller than the cold output clamping current ILOAD_COLD_CLAMP, which is smaller than the real output current ILOAD, shown in
At time t5, the reference control output signal IREF_CTL reaches zero, as shown in
The time interval between time t3 and time t5 could be very small due to the fast discharging path of the integrator capacitor CINT through the discharge resistor RDIS and discharge diode DDIS. As the slow charge resistor RSC resistance is very large for charging the integrator capacitor CINT, the current control OPAMP 812 will have a delay to its negative input. As shown in
At time t5, the current reference control circuit 810 reaches its steady state at control current IREF/2, as shown in
If during the time interval between t5 and t6, the LEDs comprising the load RLOAD warm up enough, their voltage will be normal again, rather than cold. The current gain control of the improved converter 800 will switch to the current gain control graph 500A associated with of a warm or normal LED load, shown in
The charging of the integrator capacitor CINT is designed to be very slow so that it takes a very long time for the reference control output signal IREF_CTL of the current control OPAMP 812 to reach the reference current IREF. Typically, during the time period from t5 to t6, the LED of the load RLOAD will warm up enough to transition to operation in the normal voltage range in accordance with the current gain control graph 500A of
If the LEDs comprising the load RLOAD are still cold at time ter, the time at which the voltage VC_BUFF across the buffer capacitor CBUFF reaches the cold output clamping current ILOAD_COLD_CLAMP, then the feedback circuit 170 will lose control again after time ter. As a result, the control sequence during the time interval between t3 and t5, shown in
To facilitate the understanding of the embodiments described herein, a number of terms are defined below. The terms defined herein have meanings as commonly understood by a person of ordinary skill in the areas relevant to the present invention. Terms such as “a,” “an,” and “the” are not intended to refer to only a singular entity, but rather include the general class of which a specific example may be used for illustration. The terminology herein is used to describe specific embodiments of the invention, but their usage does not delimit the invention, except as set forth in the claims. The phrase “in one embodiment,” as used herein does not necessarily refer to the same embodiment, although it may.
The term “circuit” means at least either a single component or a multiplicity of components, either active and/or passive, that are coupled together to provide a desired function. Terms such as “wire,” “wiring,” “line,” “signal,” “conductor,” and “bus” may be used to refer to any known structure, construction, arrangement, technique, method and/or process for physically transferring a signal from one point in a circuit to another. Also, unless indicated otherwise from the context of its use herein, the terms “known,” “fixed,” “given,” “certain” and “predetermined” generally refer to a value, quantity, parameter, constraint, condition, state, process, procedure, method, practice, or combination thereof that is, in theory, variable, but is typically set in advance and not varied thereafter when in use.
The terms “controller,” “control circuit” and “control circuitry” as used herein may refer to, be embodied by or otherwise included within a machine, such as a general purpose processor, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed and programmed to perform or cause the performance of the functions described herein. A general purpose processor can be a microprocessor, but in the alternative, the processor can be a controller, microcontroller, or state machine, combinations of the same, or the like. A processor can also be implemented as a combination of computing devices, e.g., a combination of a DSP and a microprocessor, a plurality of microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration.
Conditional language used herein, such as, among others, “can,” “might,” “may,” “e.g.,” and the like, unless specifically stated otherwise, or otherwise understood within the context as used, is generally intended to convey that certain embodiments include, while other embodiments do not include, certain features, elements and/or states. Thus, such conditional language is not generally intended to imply that features, elements and/or states are in any way required for one or more embodiments or that one or more embodiments necessarily include logic for deciding, with or without author input or prompting, whether these features, elements and/or states are included or are to be performed in any particular embodiment.
The previous detailed description has been provided for the purposes of illustration and description. Thus, although there have been described particular embodiments of a new and useful invention, it is not intended that such references be construed as limitations upon the scope of this invention except as set forth in the following claims.
This application claims benefit under 35 USC. § 119(e) of U.S. Provisional Patent Application No. 62/832,355, filed Apr. 11, 2019, entitled “A Method to Regain Negative Feedback Control from Power Clamping Mode in Over-Load Condition,” and which is hereby incorporated by reference in its entirety.
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