The present invention relates to a lighting device, a display device and a television receiver.
A liquid crystal panel included in a liquid crystal display device such as a liquid crystal television receiver does not emit light. Therefore, a backlight unit that is required as a separate lighting unit. The backlight unit is arranged behind the liquid crystal panel (on an opposite side from the display surface). It includes a chassis, a number of cold cathode tubes, a multiple pieces of optical members (e.g., diffusers) and an inverter board. The chassis has an opening in a surface on the liquid crystal panel side. The cold cathode tubes are housed in the chassis. The optical members are arranged so as to cover the opening of the chassis and configured to effectively direct rays of light emitted from the cold cathode tubes toward the liquid crystal panel. The inverter board is provided for supplying power to the cold cathode tubes.
Patent Document 1 discloses an example configuration for making electrical connection between an inverter board and cold cathode tubes. In this configuration, the cold cathode tubes are arranged on the front side inside the chassis and the inverter board is arranged on the rear side outside the chassis. Relay connectors are mounted to the chassis so as to penetrate through the chassis. The cold cathode tubes are connected to internal ends of the relay connectors. The inverter board is connected to external ends of the relay connectors.
Patent Document 1: Japanese Unexamined Patent Publication No. 2007-280955
When the inverter board is connected to the relay connectors in the above configuration, the inverter board is held so as to face the rear surface of the chassis and slid in the horizontal direction toward the relay connectors. Then, the inverter board is inserted into the relay connectors. The rear surface of the chassis may not be a flat surface and may have protrusions. Moreover, some parts may project from the surface of the inverter board opposite the chassis. For example, various kinds of chips may be mounted on the surface of the inverter board. If the inverter board is not properly positioned relative to the chassis with respect to a planer direction, the parts projecting from the inverter board may hit the protrusions of the chassis in the connecting process described above. If that happens, the inverter board or the chassis may be damaged.
The present invention was made in view of the foregoing circumstances. An object of the present invention is to reduce damages during assembly.
To solve the above problem, a lighting device of the present invention includes a light source, a chassis, a power supply board, a relay connector and a positioning structure. The chassis houses the light source. The power supply board is arranged on a side of the chassis opposite from the light source and configured to supply drive power to the light source. The relay connector is mounted to the chassis and configured to relay power supply from the power supply board to the light source. The power supply board can be moved along a board surface of the power supply board between a non-inserted position and an inserted position. The power supply board is separated from the relay connector at the non-inserted position and inserted in the relay connector at the inserted position. The positioning structure positions the power supply board relative to the chassis in at least one of a first direction and a second direction. The first direction is along an insertion direction of the power supply board in the relay connector. The second direction is substantially perpendicular to the first direction.
During connection of the power supply board to the relay connector, the power supply board is placed on a side of the chassis opposite from the light source and set to the non-inserted position. Then, it is moved in a direction along the board surface thereof to the inserted position. When the power supply board is set at the non-inserted position, it is positioned with respect to the first direction or the second direction by the positioning structures along the board surface thereof. Therefore, the components mounted on the power supply board at the non-inserted position or during the movement from non-inserted position to the inserted position are less likely to hit the parts on the chassis side.
The first embodiment of the present invention will be explained with reference to
As illustrated in
Next, the liquid crystal panel 11 and the backlight unit 12 included in the liquid crystal display device 10 will be explained. The display panel 11 has a rectangular plan-view shape. As illustrated in
As illustrated in
The chassis 14 is made of metal, for instance, aluminum. The chassis 14 includes a bottom plate 14a having a rectangular plan-view shape similar to the liquid crystal panel 11. The long-side direction and the short-side direction of the bottom plate 14a match the X-axis direction and the Y-axis direction indicated in the drawings, respectively. The bottom plate 14a has connector insertion holes 14b in end areas of the long dimension thereof. The connector insertion holes 14b are through holes in which the relay connectors 21 are inserted. A plurality of them (the number required for the cold cathode tubes 18 and the relay connectors 21) are arranged along the Y-axis direction (the short sides of the bottom plate 14a) so as to be parallel to each other. The reflection sheet 15 is made of white synthetic resin having high light reflectivity. It is placed over the inner surface of the chassis 14 so as to cover substantially an entire area and configured to reflect rays of light from the cold cathode tubes 18 toward the optical members 16 (the light exit side). The reflection sheet 15 has holes continue into the connector insertion holes 14b.
Each optical member 16 has a rectangular shape similar to the bottom plate 14a of the chassis 14 or the liquid crystal panel 11. The optical members 16 include a diffuser plate, a diffuser sheet, a lens sheet and a brightness enhancement sheet arranged in this order from the rear side. They are configured to convert light emitted from each cold cathode tube, which is a linear light source, into planar light.
The frame 17 is formed in a frame shape along the outer edges of the liquid crystal panel 11 and the optical members 16. The frame 17 is arranged in front of the optical members 16. The outer edges of the optical members 16 are sandwiched between the frame 17 and the holders 19. The frame 17 supports the liquid crystal panel 11 from the rear side. The liquid crystal panel 11 is sandwiched between the frame 17 and the bezel 13 that is arranged in front of the liquid crystal panel 11.
The cold cathode tubes 18 are one kind of linear light sources (tubular light sources). As illustrated in
The cold cathode tubes 18 are one kind of discharge tubes. Each of them includes an elongated glass tube 18a, a pair of electrodes (not shown) and a pair of outer leads 18b. The glass tube 18a has a circular cross section and closed ends. The electrodes are enclosed in the glass tube 18a and located at the respective ends of the glass tube 18a. The outer leads 18b project from the respective ends of the glass tube 18a to the outside. Mercury that is a luminescent material is sealed in the glass tube 18a and a fluorescent material is applied to the inner walls of the glass tube 18a (neither the luminescent material nor the fluorescent material are shown). Each outer lead 18b is made of metal having electrical conductivity and formed in an elongated round post-like shape. It projects outward (in an opposite direction to the electrode) from the end of the glass tube 18a and extends along the axial direction (the X-axis direction). The internal end of the outer lead 18b is connected to the electrode inside the glass tube 18a and thus the outer lead 18b and the electrode are at the same potential,
Each holder 19 is made of white synthetic resin having high light reflectivity. As illustrated in
Each inverter board 20 includes a base plate made of synthetic resin (e.g., a paper phenol or a glass epoxy resin) on which wiring patterns are formed and various electronic components are mounted. Specifically, lead components 20a including power transformers and capacitors are mounted on the rear surface (the surface away from the chassis 14). On the front surface (the surface close to the chassis 14), wiring patterns (not shown) are formed and chip components 20b including resistors, diodes and capacitors are mounted. Lead of the lead components 20a are passed through the inverter board 20 so as to project from the front surface via the through holes and soldered to the wiring patterns. The chip components 20b are surface-mounted on the wiring patterns on the front surface of the inverter board 20. The inverter board 20 is connected to the power source P of the liquid crystal display device 10. It is configured to step up an input voltage from the power source P and to output a voltage higher than the input voltage. The output voltage is applied to each cold cathode tube 18. The inverter board 20 controls on-and-off of the cold cathode tubes 18. In
As illustrated in
Each inverter board 20 has connector connecting portions 20c at a front end with respect to the insertion direction of the inverter board 20 to the relay connector 21. The connector connecting portions 20c are inserted in the relay connectors 21 and connected thereto. A plurality of the connector connecting portions 20c are provided along the long side of the inverter board 20 (one for each relay connector 21) by cutting out some part of the front end of the inverter board 20. Namely, the front end of the inverter board 20 is formed in a comb-like shape. As illustrated in
The inverter board 20 can be moved between a non-inserted position (see
Next, the relay connectors 21 will be explained. As illustrated in
As illustrated in
As illustrated in
Next, the covers 22 will be explained. Each cover 22 is made of synthetic resin having insulation properties. As illustrated in
Specifically, as illustrated in
The front part 22a of each cover 22 overlaps the area of the chassis 14, in which the relay connectors 21 are arranged, in plan view. The front part 22a of the cover 22 has connector holes 25 that are through holes for receiving the relay connectors 21. Specifically, a plurality of the connector holes 25 are formed in the front part 22a along the Y-axis direction so as to parallel to each other. Each connector hole 25 is formed so as to continue to the corresponding connector insertion hole 14b of the chassis 14. As illustrated in
As illustrated in
As illustrated in
As illustrated in
As illustrated in
As illustrated in
As illustrated in
As described above, the inverter board 20 is moved from the non-inserted position to the inserted position while the Z-axis position thereof relative to the chassis 14 and the cover 22 is maintained and connected to the relay connectors 21. On the surface of the inverter board 20 opposed to the chassis 14 and the cover 22, the chip components 20b are mounted. Moreover, the leads of the lead components 20a project from the surface. During setting of the inverter board 20 to the non-inserted position, the inverter board 20 may be displaced from proper X-axis position and Y-axis position relative to the chassis 14 and the cover 22. If the displacement occurs, the chip components 20b and the leads may hit parts of the chassis 14 or the cover 22. Furthermore, if the inverter board 20 is displaced from the proper non-inserted position, the same problem may occur when it is moved from the displaced position to the inserted position.
In this embodiment, the cover 22 and the inverter board 20 mounted to the chassis 14 have positioning structures for positioning the cover 22 and the inverter board 20 relative to each other along the board surface directions thereof (the X-axis direction and the Y-axis direction). Two kinds of the positioning structures are provided for different directions in which the inverter board 20 is positioned. The positioning structures for positioning the cover 22 and the inverter board 20 in the X-axis direction (the first direction) along the insertion direction of the inverter board 20 are the first positioning structures. The positioning structures for positioning them in the Y-axis direction (the second direction) perpendicular to the X-axis direction are the second positioning structures. The first positioning structures and the second positioning structures are provided at the ends of the Y-axis dimensions of the chassis 14 and the inverter board 20.
The first positioning structures include the first positioning protrusions 31 and the first positioning recesses 32. The first positioning protrusions 31 are provided on the cover 22 that is located on the chassis 14 side. The first positioning recesses 32 are provided in the inverter board 20 for receiving the first positioning protrusions 31. As illustrated in
Furthermore, each first positioning recess 32 has the X-axis dimension larger than the diameter of the first positioning protrusion 31. When the first positioning protrusions 31 is inserted in the first positioning recess 32, clearances are provided in the X-axis direction between the first position protrusions 31 and the edges of the first positioning recess 32. The first positioning protrusion 31 can be moved relative to the first positioning recess 32 in the front-rear direction with in a range corresponding to the clearances. The first positioning protrusion 31 hits the front edge 32a or the rear edge 32b of the first positioning recess 32 and thus the relative movement of the first positioning protrusion 31 is restricted. When the inverter board 20 is at the non-inserted position, the front end portions 31a of the first positioning protrusions 31 are in contact with the front edges 32a of the respective first positioning recesses 32 as illustrated in
Next, the second positioning structures will be explained in detail. The second positioning structures include the second positioning parts 33. As illustrated in
Each cover 22 in this embodiment includes board stoppers 34 in addition to the above positioning structures. The board stoppers 34 hold the inverter board 20 from the rear (from a side opposite from the chassis 14). As illustrated in
This embodiment has the above configuration. Next, functions of this embodiment will be explained. The liquid crystal panel 11 and the backlight unit 12 prepared separately are fixed together by the bezel 13, and the liquid crystal display device having the above configuration is prepared. Assembly of the backlight unit 12 will be explained.
In the assembly of the backlight unit 12, the reflection sheet 15 is placed over the front inner surface of the chassis 14 and the covers 22 are attached to the rear outer surface of the chassis 14. The relay connectors 21 are mounted to the chassisl4 from the inner side of the chassis 14 and fitted in the connector holes of the covers 22. The relay connectors 21 are held by the covers 22. Then, the cold cathode tubes 18 are installed in the chassis 14. The outer leads 18b at the ends thereof are inserted in the light source holding portions 23a of the relay connectors 21 so as to elastically in contact with the light source contacts 24a of the terminal fixtures 24. The holders 19, the optical members 16 and the frame 17 are mounted to the chassis 14 from the front (see
On the rear side of the chassis 14, the inverter boards 20 are mounted to the chassis 14 and the covers 22. The inverter boards 20 are moved close to the chassis 14 and the covers 22 from the non-inserted positions illustrated in
When the inverter board 20 is moved from the removal position to the non-inserted position, the side surfaces 20e of the inverter board 20 are positioned to the second positioning parts 33 of the cover 22 as illustrated in
The inverter board 20 is two-dimensionally positioned to proper X-axis position and Y-axis position when it is set at the non-inserted position. During the movement of the inverter board 20, the chip components 20b and the leads of the lead components 20a project toward the chassis 14 or the cover 22 are less likely to hit parts of the chassis 14 or the cover 22 (e.g., screws for fixing the inverter board 20).
Next, each inverter board 20 is moved from the non-inserted position to the inserted position. When the inverter board 20 is moved from the non-inserted position to the front along the X-axis direction, the connector connecting portions 20c are board holding holes 23c of the board holding portions 23 of the relay connectors 21. When the inverter board 20 is moved to the inserted position, the board contacts 24b of the terminal fixtures 24 of the relay connectors 21 are elastically in contact with the terminals of the connector connecting portions 20c as illustrated in
During the movement of the inverter board 20 in the non-inserted position illustrated in
When the inverter board 20 is set at the inserted position, the front-end portion thereof is held by the board stoppers 34 from the rear as illustrated in
When the inverter board 20 is moved from the removal position to the non-inserted position, the position thereof changes between the non-inserted position and the inserted position even when the inverter board 20 is mounted at a position more to the front than the non-inserted position. Therefore, the components of the inverter board 20 are less likely to hit the parts of the chassis 14 or the cover 22.
As described above, the backlight unit 12 in this embodiment includes the cold cathode tubes 18, the chassis 14, the inverter boards 20 and the relay connectors 21. The chassis 14 houses the cold cathode tubes 18. The inverter boards 20 are arranged on the opposite side of the chassis 14 from the cold cathode tubes 18 and configured to supply drive power to the cold cathode tubes 18. The relay connectors 21 are mounted to the chassis 14 and configured to relay power supply from the inverter boards 20 to the cold cathode tubes 18. Each inverter board 20 is movable from the non-inserted position to the inserted position in one direction along the board surface thereof. At the non-inserted position, the inverter board 20 is not inserted in the relay connecters 21. At the inserted position, the inverter board 20 is inserted in the relay connectors 21. The positioning structures are provided for each inverter board 20 to position the inverter board 20 in the non-inserted position relative to the chassis 14 in at least one direction along the board surface.
During connection of the inverter boards 20 to the relay connectors 21, each inverter board 20 is set at the non-inserted position on the opposite side of the chassis 14 from the cold cathode tubes 18. Then, it is moved in the direction along the board surface thereof to the inserted position. The inverter board 20 at the non-inserted position is positioned relative to the chassis 14 in at least one direction along the board surface of the inverter board 20. Therefore, when the inverter board 20 is at the non-inserted position or moved from the non-inserted position to the inserted position, the components mounted on the inverter board 20 are less likely to hit the parts of the chassis 14.
The positioning structures includes the first positioning structures for positioning the inverter boards 20 in the first direction along the respective insertion directions of the inverter boards 20 to the respective relay connectors 21. With this configuration, the inverter boards 20 at the non-inserted positions can be positioned in the respective first directions along the respective insertion directions of the inverter boards 20.
The first positioning structures include the first positioning protrusions 31 and the first positioning recesses 32. The first positioning protrusions 31 are provided on either one of each inverter board 20 and the chassis 14. The first recesses 32 are provided in the other one of each inverter board 20 and the chassis 14 so as to receive the first positioning protrusions 31. The clearances are provided between the first positioning protrusions 31 and the edges of the respective first positioning recesses 32 with respect to the insertion direction. When the inverter board 20 is at the non-inserted position, the front-end portions 31a of the first protrusions 31 with respect to the insertion direction are in contact with the front-end edges 32a of the respective first positioning recesses 32. Moreover, the rear-end portions 31b of the first protrusions 31 with respect to the insertion direction are separated from the rear-end edges 32b. With this configuration, during setting of each inverter board 20 to the non-inserted position, the inverter board 20 is less likely to move relative to the chassis 14 toward the rear with respect to the insertion direction. Furthermore, the movement of each inverter board 20 is allowed within the range corresponding to the clearances between the first positioning protrusions 31 and the edges of the first positioning recesses 32.
The first positioning protrusions 31 and the first positioning recesses 32 are formed such that the rear-end portions 31b are in contact with the respective rear edges 32b when the inverter boards 20 are at the inserted positions. When each inverter board 20 is moved from the non-inserted position to the inserted position, the inverter board 20 is less likely to move relative to the chassis 14 toward the front with respective to the insertion direction.
The first positioning protrusions 31 are provided on the chassis 14 and the first positioning recesses 32 are provided in the inverter boards 20. If the first positioning protrusions are provided on the inverter boards 20, special design is required. In comparison to such a configuration, the inverter boards 20 can be provided with positioning structures at low cost.
The first positioning recesses 32 are formed by cutting parts of the inverter boards 20. By viewing the inverter boards 20 from the opposite side from the chassis 14, the positions of the first protrusions 31 inserted in the first positioning recesses 32 can be confirmed. Therefore, the inverter boards 20 are precisely positioned.
The positioning structures further include the second positioning structures. The second positioning structures are provided for positioning each inverter board 20 in the second direction perpendicular to the first direction that is along the insertion direction of the inverter board 20 in the relay connectors 21. With this configuration, each inverter board 20 at the non-inserted position is properly positioned with respect to the second direction perpendicular to the first direction that is along the insertion direction of the inverter board 20.
The second positioning structures are provided on the chassis 14. The second positioning structures include the second positioning parts 33 that are in contact with the inverter board 20. With this configuration, when each inverter board 20 is moved between the non-inserted position and the inserted position, the movement thereof is guided by the second positioning parts 33. Therefore, the inverter board 20 can be stably moved.
The second positioning parts 33 are in contact with the side surfaces 20e of the inverter boards 20. With this configuration, the inverter boards 20 do not require special processing and thus they can be prepared at low cost.
The positioning structures include the first positioning structures for positioning each inverter board 20 with respect to the first direction that is along the insertion direction of the inverter board 20 in the relay connectors 21. The second positioning structures are connected to the first positioning structures. Namely, the first positioning structures and the second positioning structure are collectively arranged in one area. This is preferable for reducing the size and improving flexibility in design.
The board stoppers 34 are provided on the chassis 14. The board stoppers 34 hold the inverter boards 20 from the side opposite from the chassis 14. With the board stoppers 34, the inverter boards 20 are less likely to be deformed in the direction opposite to the chassis 14.
The board stoppers 34 are arranged so as to be in contact with the front-end portions of the inverter boards 20 at the inserted positions. The front-end portion of each inverter board 20 is located at the front end with respect to the insertion direction of the inverter board 20. Because the front-end portions of the inverter boards 20 at the inserted positions are held by the board stoppers 34, reliability in connections between the inverter boards 20 and the relay connectors 21 improves.
The positioning structures are arranged away from each other at the front position and at the rear position located at the front and the rear of the insertion direction of each inverter board 20 in the relay connectors 21. With this configuration, each inverter board 20 can be precisely positioned. Furthermore, the positioning structures may be arranged such that a person working on them can visually confirm the positions thereof. With such a configuration, they are easily viewed.
The positioning structures are arranged at the ends with respect to the second direction perpendicular to the first direction that is along the insertion direction of the inverter board 20 in the relay connectors 21. In comparison to positioning structures arranged at the middle with respect to the second direction, limitations in design of layouts of wiring patterns and components are few.
The positioning structures are provided at the ends with respect to the second direction perpendicular to the first direction that is along the insertion direction of the inverter board 20 in the relay connectors 21. In comparison to positioning structures arranged at the middle with respect to the second direction, limitations in design of layouts of wiring patterns and components are few. Furthermore, with the positioning structures provided at the ends with respect to the second direction, each inverter board 20 is precisely positioned.
The lead components 20a are mounted to the surface of each inverter board 20 away from the chassis 14. The wiring patterns are formed on the surface close to the chassis 14 and the chip components 20b are mounted on the surface. Each inverter board 20 is positioned relative to the chassis 14 by the positioning structures. Therefore, the wiring patterns formed on the surface of the inverter board 20 close to the chassis 14 and the chip components 20b mounted on the same surface are less likely to be damaged. Furthermore, even when the leads of the lead components 20a mounted on the surface of each inverter board 20 away from the chassis 14 project from the surface close to the chassis 14, the leads are less likely to be damaged.
The covers 22 are mounted to the chassis 14 between the respective inverter boards 20 and the chassis 14. Each cover 22 includes the positioning structures on the chassis 14 side. In comparison to the positioning structures provided at the chassis 14, flexibility in design of shapes or layouts of the positioning structures improves.
The chassis 14 has the connector insertion holes 14b that are through holes through which the relay connectors 21 are passed. Each cover 22 has connector holes 25 that are through holes in which the relay connectors 21 are fitted. The connector holes 25 continue to the respective connector insertion holes 14b. The relay connectors 21 are mounted while they are passed through the respective connector insertion holes 14b of the chassis 14 and the respective connector holes 25 of the cover 22.
Each connector insertion hole 14b is larger than the connector hole 25. Therefore, each relay connector 21 is sufficiently separated from the edges of the corresponding connector insertion hole 14b of the chassis 14. Even when a high-voltage current runs through the relay connector 21, the current is less likely to leak to the chassis 14 side.
Each cover 22 includes the holding protrusions 26 that are fitted in the respective connector insertion holes 14b. Each holding protrusion 26 is located between the edge of the corresponding connector insertion hole 14b of the chassis 14 and the corresponding relay connector 21. Therefore, the relay connectors 22 are properly isolated from the chassis 14. Furthermore, the covers 22 are positioned relative to the chassis 14.
A plurality of the connector holes 25 are provided in each cover 22 in a parallel layout along the second direction perpendicular to the first direction that is along the insertion direction of the inverter board 20 in the relay connectors 21. The block wall portion 28 is provided in each area of each cover 22 between the adjacent connector holes 25. The block wall portion 28 projects from the area toward the inverter board 20 and is in contact with the inverter board 20 that is at the inserted position. The block wall portions 28 block foreign substances that intend to enter through spaces between the adjacent relay connectors 21.
The block wall portions 28 are arranged so as to be in contact with the front ends of the inverter board 20 that are at the inserted positions with respect to the insertion directions. With this configuration, foreign substances are properly blocked and not in contact with the inverter boards 20.
The ribs 27 project from the edges of the connector holes 25 toward the inverter boards 20. The block wall portions 28 are connected to the respective ribs 27. By connecting the block wall portions 28 to the respective ribs 27, no gaps are present when viewed from the front in the insertion direction. Foreign substances are properly blocked. Furthermore, the strength increases.
Each cover 22 includes the board support portions 30 that project toward the corresponding inverter board 20 and are in contact with the inverter board 20. They support the inverter board 20 at least when it is at the inserted position. With this configuration, the chassis 14 and the inverter board 20 can be maintained at the preferable relative positions with respect to the direction perpendicular to the board surface of the inverter board 20.
The board support portions 30 include the support protrusions 30a, the center vertical support walls 30b and horizontal support walls 30d. The support protrusions 30a are center support portions that support the central area of each inverter board 20 with respect to the second direction perpendicular to the first direction that is along the insertion direction of the inverter board 20 in the relay connectors 21. Because the central area of each inverter board 20 is supported by the support protrusions 30a, the center vertical support walls 30b, and the horizontal support walls 30d, a deformation of the inverter board 20 including a warp is less likely to occur. Especially, if the backlight unit 12 is prepared in a large size, the inverter boards 20 may be also prepared in a large size and thus the deformation including the warp is more likely to occur. Therefore, this configuration is especially effective for the backlight unit 12 in a large size.
The support protrusions 30a of the center support portions are arranged in the parallel layout along the second direction. With this configuration, the deformation of each inverter board 20 including the warp is further less likely to occur. This configuration is more effective for the inverter boards 20 in a large size.
The support protrusions 30a of the center support portions are arranged adjacently to the relay connectors 21. With this configuration, the deformation of each inverter board 20 including the warp around the areas adjacent to the relay connectors 21 is further less likely to occur. Therefore, the reliability in connection between the inverter boards 20 and the relay connectors 21 improves.
The board support portions 30 include the end vertical support walls 30c and the rear vertical support walls 30e. The vertical support walls 30c support the ends of the inverter board 20 with respect to the second direction perpendicular to the first direction that is along the insertion direction of the inverter board 20 in the relay connectors 21. The ends of the inverter board 20 are supported by the end vertical support walls 30c and the rear vertical support walls 30e.
The end vertical support walls 30c and the rear vertical support walls 30e of the end support portions are provided in pairs so as to support the ends of the inverter board 20. The ends of the inverter board 20 are supported by the pairs of the end support portions.
The first positioning protrusions 31 are connected to the end vertical support walls 30c and the rear vertical support walls 30e. The first positioning protrusions 31 are the positioning structures on the chassis 14 side. The end vertical support walls 30c, the rear vertical support walls 30e, and the first positioning protrusions 31 are collectively arranged in respective areas. This is preferable for reducing the size and improving flexibility in design.
The second embodiment of the present invention will be explained with reference to
As illustrated in
When each inverter board 20 is moved from the removal position illustrated in
As described above, each first positioning protrusion 310 is provided integrally with the board stopper 340 that in contact with the inverter board 20 from an opposite side from the chassis 14. Each first positioning recess 32 is formed in a size so as to allow the board stopper 340 to pass through. The board stoppers 340 restrict a deformation of the inverter board 20 toward the opposite side from the chassis 14. By providing each board stopper 340 integrally with the first positioning protrusion 310, they are collectively arranged in one area. This is preferable for reducing the size and improving flexibility in design.
Each board stopper 340 projects from the first positioning protrusion 310 to the rear. If the board stopper projects from the positioning protrusion 310 in the Y-axis direction, it may be an obstacle for mounting of the inverter board 20. Because the board stopper 340 projects from the first positioning protrusion 310 to the rear along the insertion direction, such a problem is less likely to occur.
The rear-end portion of each board stopper 340 is in contact with the rear edge of the corresponding first positioning recess 32 with respect to the insertion direction during setting of the inverter board 20 to the non-inserted position. During setting of the inverter board 20 to the non-inserted position, the front end of the first positioning protrusion 310 is in contact with the front edge of the first positioning recess 32 with respect to the insertion direction. Moreover, the rear end of the board stopper 340 is in contact with the rear edge of the first positioning recess 32 with respect to the insertion direction. Therefore, the front and the rear of the inverter board 20 are positioned with respect to the insertion direction.
The present invention is not limited to the above embodiments explained in the above description. The following embodiments may be included in the technical scope of the present invention, for example.
(1) In the above embodiment, the first positioning structures and the second positioning structures are provided as positioning structures for positioning the inverter boards. However, only the first positioning structures may be provided for positioning the inverter boards only in the X-axis direction, or only the second positioning structures may be provided for positioning the inverter boards only in the Y-axis direction.
(2) In the above embodiments, the first positioning protrusions are provided on the covers on the chassis side and the first positioning recesses are provided in the inverter boards as the first positioning structures. However, the first positioning recesses may be provided in the covers on the chassis side, and the first positioning protrusions may be provided on the inverter boards.
(3) In the above embodiments, the first positioning recesses are formed by cutting parts of the inverter boards. However, the first positioning recesses may be formed by denting parts of the surfaces of the inverter boards. To form the first positioning recesses in the covers on the chassis side, they are formed in the same manner as above. Namely, the first positioning recesses may be formed by denting parts of the rear surfaces of the covers.
(4) In the above embodiments, when each inverter board is set at the inserted position, the rear-end portions of the first positioning protrusions are in contact with the rear edges of the first positioning recesses. However, the rear-end portions may not be in contact with the rear edges. In such a case, the front-end surfaces of the connector connecting portions are pressed against the extending portions of the front wall portions. Therefore, the movement of the inverter board to the front is still restricted.
(5) In the second embodiment, the board stoppers are provided integrally only with the front first positioning protrusions. However, the board stoppers may be provided integrally with the front first positioning protrusions and the rear first positioning protrusions, or provided integrally only with the rear first positioning protrusions.
(6) In the second embodiment, the rear-end portion of each board stopper is in contact with the rear edge of the first positioning recess during setting the inverter board at the non-inserted position. However, they may not be in contact with each other.
(7) In the above embodiments, the second positioning parts are in contact with the respective side surfaces of the inverter board. However, the inverter board may have recesses (including cutouts) in which the second positioning parts are inserted, and side walls of the recesses may be in contact with the second positioning parts.
(8) In the above embodiments, the first positioning protrusions are connected to the second positioning parts. However, they may be separated and independently provided.
(9) In the above embodiments, the board stoppers are connected to the second positioning parts or the first positioning protrusions. However, they may be separated and independently provided.
(10) In the above embodiments, the first protrusions are connected to the respective vertical support walls of the board support portions. However, they may be separated and independently provided.
(11) In the above embodiments, the board stoppers are in contact with the front-end portion of the inverter board. However, the board stoppers may be arranged at different locations so as to be in contact with another part of the inverter board.
(12) In the above embodiments, the first positioning structures and the second positioning structures are provided at different locations away from each other in the front-rear direction. However, the first positioning structures or the second positioning structures may be provided at an X-axis position (the X-axis along the first direction).
(13) In the above embodiments, the first positioning structures and the second positioning structures are provided at the ends of the Y-axis dimension (along the second direction). However, the first positioning structures or the second positioning structures may be provided at only one of the ends of the Y-axis dimension of the inverter board. The first positioning structures or the second positioning structures may be provided around the middle of the Y-axis dimension of the inverter board.
(14) Different kinds of components from those in the above embodiments may be mounted on the inverter boards.
(15) In the above embodiments, the covers are mounted to the chassis. However, the covers may not be included and the chassis may include the positioning structures.
(16) In the above embodiments, each connector insertion hole of the chassis is larger than the connector hole of the cover. However, the connector insertion hole and the connector holes may be formed in the same size or having an opposite size-relationship. In that case, the holding protrusions of the cover may not be provided.
(17) In the above embodiments, the block wall portions of the covers are connected to the ribs. However, they may be separated and independently provided. In that case, each block wall portion may be arranged in a part of an area between the adjacent connector holes.
(18) In the above embodiments, the covers include the support protrusions, the front vertical support walls, the rear vertical support walls and the horizontal support walls as the board support portions. However, one or more, even all, of them may not be included. The number, shapes, and arrangements of the board support portions may be altered as necessary.
(19) In the above embodiments, each inverter board is directly connected to the relay connectors. However, a relay board electrically connected to the inverter board via an FPC may be connected to the relay connectors such that the inverter board is indirectly connected to the relay connecters.
(20) In the above embodiments, each inverter board is provided for the electrodes at the respective ends of the cold cathode tubes. However, one of the inverter boards may not be provided and the cold cathode tubes may be driven by a single inverter board on one side. In that case, the relay connectors on a side on which the inverter board is not provided (i.e., on a lower potential side) may be connected to a grounding circuit.
(21) In the above embodiments, each cold cathode tube includes the outer lead extending from the ends of the glass tube, and the outer leads are connected to the connectors. However, ferrules connected to the outer leads may be fitted onto the glass tube, and the ferrules may be connected to the connectors.
(22) In the above embodiments, the cold cathode tubes that are one kind of fluorescent tubes are used as light sources. However, other types of fluorescent tubes including hot cathode tubes can be used. Furthermore, discharge tubes (e.g., mercury lamps) other than the fluorescent tubes can be used.
(23) In the above embodiments, the TFTs are used as switching components of the liquid crystal display device. However, the technology described herein can be applied to liquid crystal display devices using switching components other than TFTs (e.g., thin film diodes (TFDs)). Furthermore, it can be applied to white-and-black liquid crystal display devices other than the color liquid crystal display device.
(24) In the above embodiments, the liquid crystal display device including the liquid crystal panel as a display component is used. However, the present invention can be applied to display devices including other types of display components.
(25) In the above embodiments, the television receiver including the tuner is used. However, the technology can be applied to a display device without the tuner.
Number | Date | Country | Kind |
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2009-015819 | Jan 2009 | JP | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/JP2009/067703 | 10/13/2009 | WO | 00 | 6/23/2011 |