Patent Grant
10527273
Field of the Invention
The present invention relates generally to lighting fixtures, and in particular to high bay lighting fixtures with one or more enhanced thermal dissipation features.
Description of the Related Art
Industrial or commercial buildings are often illuminated by free-standing lighting fixtures that may be suspended from the ceiling. Certain types of commercial or industrial environments, such as store aisles or warehouses, require lighting that is designed to provide a high degree of luminosity, while still maintaining control over glare. The type of lighting fixture that satisfies these requirements is commonly referred to as bay lighting.
Bay lighting may be classified as high bay or low bay, depending on the height of the lighting fixture, which is usually the distance between the floor of the room seeking to be illuminated and the fixture itself. Naturally, large industrial or commercial buildings with overhead lighting are typically illuminated with high bay lighting fixtures.
In order to sufficiently illuminate this type of environment, a high bay lighting fixture with a high intensity discharge can be used. Yet high intensity lighting fixtures often use light sources such as incandescent, halogen, or fluorescent bulbs, which can have short life spans, difficulty maintaining their intensity, and/or high maintenance costs. The advent of solid state lighting devices with longer life spans and lower power consumption presented a partial solution to these problems.
One example of a solid state lighting device is a light emitting diode (LED). LEDs convert electric energy to light, and generally comprise one or more active layers of semiconductor material sandwiched between oppositely doped layers. When a bias is applied across the doped layers, holes and electrons are injected into the active layer where they recombine to generate light. Light is emitted from the active layer and from all surfaces of the LED.
In comparison to other light sources, LEDs can have a significantly longer operational lifetime. Incandescent light bulbs have relatively short lifetimes, with some having a lifetime in the range of about 750-1000 hours. Fluorescent bulbs can also have lifetimes longer than incandescent bulbs such as in the range of approximately 10,000 to 20,000 hours, but provide less desirable color reproduction. In comparison, LEDs can have lifetimes between 50,000 and 70,000 hours. The increased efficiency and extended lifetime of LEDs is attractive to many lighting suppliers and has resulted in LED lights being used in place of conventional lighting in many different applications. It is predicted that further improvements will result in their general acceptance in more and more lighting applications. An increase in the adoption of LEDs in place of incandescent or fluorescent lighting would result in increased lighting efficiency and significant energy saving.
As mentioned above, high bay lighting fixtures usually require a high intensity light source, based on the illumination requirement of their industrial or commercial environment. Yet a problem with most high intensity lighting devices is that they can draw large currents, which in turn generates significant amounts of heat. High intensity LEDs are no exception. The type of high intensity LEDs used in high bay lighting fixtures likewise produce a large amount of heat. Even if an LED is particularly efficient, the amount of heat that it produces can still be substantial. Without an effective way to dissipate heat that is produced, LED light sources can suffer elevated operating temperatures, which can increase their likelihood of failure. Therefore, in order to operate most effectively and reliably, LED light sources need an efficient method to dissipate heat.
One common method that LED high bay lighting fixtures use for heat dissipation is a heat sink. A heat sink is essentially an element that is in thermal contact with a light source, so that it dissipates heat from the light source. Whenever the heat dissipation ability of the basic lighting device is insufficient to control its temperature, a heat sink is desirable. Some common heat sink materials are aluminum alloys, but other materials or combinations of materials with good thermal conductivity and heat dissipation potential will suffice.
Many common LED high bay lighting fixtures include a heat sink that is in thermal contact with the light source.
Typically and as shown in
Based on the aforementioned issues, there is an increasing demand for options within high bay lighting that can effectively dissipate the heat generated by the light source more effectively.
One embodiment of a lighting fixture according to the present invention can include an array of emitters on a heat sink. The fixture can include a driver box for holding drive electronics to drive the array of emitters. The driver box can be horizontally offset from the array.
Another embodiment of a fixture according to the present invention can include one or more emitters mounted on a heat sink, with the emitters having a primary dissipation path. The fixture can also include a driver box which has a primary dissipation path. The dissipation paths of the emitter(s) and the driver box can be different.
One embodiment of a heat sink according to the present invention can include a plurality of inner level spokes and a plurality of outer level spokes. At least two of the outer level spokes can emanate from each of the inner level spokes.
These and other aspects and advantages of the invention will become apparent to those skilled in the art from the following detailed description and the accompanying drawings, which illustrate by way of example the features of the invention.
Embodiments of the present invention have similarities to embodiments described in commonly assigned utility application U.S. patent application Ser. No. 14/145,355 to Lui et al., entitled “Lighting Fixture with Reflector and Template PCB” and filed concurrently on the same day as the present application. This application is fully incorporated by reference herein in its entirety.
Embodiments of the present invention have similarities to embodiments described in commonly assigned design application U.S. Pat. App. No. 29/478,149 to Lui et al., entitled “Bay Lighting Fixture” and filed concurrently on the same day as the present application. This application is fully incorporated by reference herein in its entirety.
The present invention is directed to different embodiments of lighting fixtures comprising one or more of various improved features which can, among other things, improve the thermal dissipation of the fixture. One of these features can be driver electronics which are horizontally displaced from an emitter and/or emitter arrays. As discussed above, the presence of driver electronics in the thermal dissipation path of emitters can cause decreased functionality, such as a loss of emitter intensity. In one embodiment of the present invention, the driver electronics are moved to an off-center location, such as to the periphery of the heat sink. The driver box(es) containing the driver electronics can be horizontally displaced from the emitters. Heat from the driver box(es) can dissipate into the ambient instead of through the thermal dissipation path used by the emitters, which can lead to lower emitter operating temperatures and, therefore, higher emitter intensity and longer emitter lifespans.
Another feature of some embodiments of the present invention is a heat sink specially designed for improved or enhanced thermal dissipation. The heat sink can include thermally conductive spokes emanating from the heat sink's center. As these spokes move further away from the center of the heat sink, they can branch into multiple spokes. The heat sink can comprise different levels of spokes, such as an original level of 18 spokes, a secondary level of 36 spokes (two each emanating from one of the 18 original level spokes), a tertiary level of 108 spokes (three each emanating from the secondary level spokes), and so on. Other embodiments can have different levels with different numbers of spokes, such as, for example, a tertiary level of 72 spokes (two each emanating from the secondary level spokes). One spoke can branch into two, three, four, or more spokes in a subsequent level, and any number of levels is possible.
In some embodiments of heat sinks according to the present invention, spaces remain between the spokes. Air can access some or all of these spaces, such as air from the bottom side of the heat sink. This can improve convective cooling of the heat sink. Air can pass through the heat sink and toward its center, which is typically the hottest area. This can increase overall thermal dissipation.
Embodiments of the invention are described herein with reference to different views and illustrations that are schematic illustrations of idealized embodiments of the invention. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances are expected. Embodiments of the invention should not be construed as limited to the particular shapes of the regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing.
Throughout this description, the preferred embodiment and examples illustrated should be considered as exemplars, rather than as limitations on the present invention. As used herein, the term “invention,” “device,” “method,” or “present invention” refers to any one of the embodiments of the invention described herein, and any equivalents. Furthermore, reference to various feature(s) of the “invention,” “device,” “method,” or “present invention” throughout this document does not mean that all claimed embodiments or methods must include the referenced feature(s).
The present invention is described below in regards to certain lamps and/or fixtures having one or multiple LEDs or LED chips or LED packages in different configurations, but it is understood that the present invention can be used for many other lamps having many different configurations. The term “source” can be used as all-encompassing to describe a single light emitter or multiple light emitters. The embodiments below are described with reference to LED or LEDs and/or source or sources, but it is understood that this is meant to encompass LED chips and LED packages as well as other solid state emitters. The components can have different shapes and sizes beyond those shown and different numbers of LEDs can be included. It is also understood that some of the embodiments described below utilize co-planar light sources, but it is understood that non co-planar light sources can also be used. It is also understood that the lamp's LED light source may be comprised of one or multiple LEDs, and in embodiments with more than one LED, the LEDs may have different emission wavelengths. Similarly, some LEDs may have adjacent or contacting phosphor layers or regions, while others may have either adjacent phosphor layers of different composition or no phosphor layer at all.
It is also understood that when an element or feature is referred to as being “on” or “adjacent” to another element or feature, it can be directly on or adjacent the other element or feature or intervening elements or features may also be present. In contrast, when an element is referred to as being “directly on” or extending “directly onto” another element, there are no intervening elements present other than, in some cases, an adhesive. Additionally, it is understood that when an element is referred to as being “connected” or “coupled” to another element, it can be directly connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as being “directly connected” or “directly coupled” to another element, there are no intervening elements present unless stated.
Relative terms such as “outer,” “above,” “lower,” “below,” “horizontal,” “vertical” and similar terms may be used herein to describe a relationship of one feature to another. It is understood that these terms are intended to encompass different orientations in addition to the orientation depicted in the figures.
Although the terms first, second, etc. may be used herein to describe various elements or components, these elements or components should not be limited by these terms. These terms are only used to distinguish one element or component from another element or component. Thus, a first element or component discussed below could be termed a second element or component without departing from the teachings of the present invention. As used herein, the term “and/or” includes any and all combinations of one or more of the associated list items.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises,” “comprising,” “includes” and/or “including” when used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
One possible array 200 of emitters 202 which can be used in embodiments of the present invention is shown in
The emitters can be mounted on a heat sink, such as the heat sink 104 and/or the mount area 104a. Many different types of emitters can be used in embodiments of the present invention. For example, in the embodiment shown the Cree® XLamp® CXA 2530 LED array can be used for each of the emitters 202. This particular array delivers high lumen output and efficacy. The data sheet of the CXA 2530 is incorporated herein by reference in its entirety. Other Cree® emitters can be used in the present invention, including but not limited to any of the Cree CXA series such as the CXA 1520, CXA 2520, and CXA 3590, MC-E, MK-R, ML-B, ML-C, ML-E, MP-L, MT-G, MT-G2, MX-3, MX-6, XB-D, XM-L, XM-L2, XP-C, XP-E, XP-E2, XP-G, XP-G2, XR-C, XR-E, and XT-E. This list should not be construed as limiting, as many different solid state emitters, emitter arrays, LEDs, and/or LED arrays can be used.
Further, while the emitters 202 can all emit the same color (e.g., white), in other embodiments different color emitters can be used. Further, color mixing optics can be used to efficiently mix the light emitted by these emitters. The use of multicolor arrays in SSL fixtures is discussed in detail in U.S. patent application Ser. No. 13/828,348 to Edmond et al. and entitled “Door Frame Troffer”, and U.S. patent application Ser. No. 13/834,605 to Lay et al. and entitled “Indirect Linear Fixture”, each of which is commonly assigned with the present application and each of which is fully incorporated by reference herein in its entirety.
In yet other embodiments, the emitters 202 can emit all the same color while a remote phosphor is used to convert at least some source light to a different wavelength, with the fixture emitting a combination of converted and unconverted light. One embodiment emits a combination of blue light from the sources and yellow light from the remote phosphor for a white light combination. Another embodiment emits a combination of blue light from the sources and yellow and red light from phosphor for a warmer white light combination. Some examples of source and remote phosphor configurations and types which can be used in embodiments of the present invention are described in U.S. patent application Ser. No. 13/034,501 to Le et al. and entitled “Solid State Lamp and Bulb”, which is fully incorporated by reference herein in its entirety.
The fixture 100 from
Referring back to
The driver box 108 can be horizontally offset from one or more elements, including the array 200, such that the driver box 108 is not centered above the array 200. In the specific case shown, the driver box 108 is mounted to, on, and/or around the periphery or side surface(s) of the heat sink 104, although many different locations are possible. For instance, the driver box 108 could be on a top surface of the heat sink. The driver box can be completely, primarily, substantially, and/or partially horizontally offset from any one or ones of the fixture 100, light engine 102, heat sink 104, mounting area 104a, and/or array 200. In some embodiments the driver box 108 does not share a central vertical axis with any one or more of these elements. In some embodiments the driver box 108 is off-center from any one of these elements.
In some embodiments the driver box 108 can be outside the perimeter of the array 200, such that when looking down upon the fixture 200 no portion of the array overlaps any portion of the driver box 108. In some embodiments, the driver box 108 can be primarily outside the perimeter of the array 200 or can be substantially outside the perimeter of the array 200. In some embodiments the driver box 108 can be completely, primarily, substantially, and/or partially outside the mounting area 104a. In some embodiments the driver box 108 can be horizontally remote to the array 200 and/or the mounting area 104a such that there is one or more intervening elements in a substantially horizontal plane running through both the driver box 108 and the array 200 and/or mounting area 104a.
The driver box 108 can have an inner shape that matches the outer shape of the heat sink 104, such as, in the embodiment shown, a circular shape. The driver box 108 can include one or more attachment portions 108a which can be on the top surface of the heat sink 104. As will be discussed in detail below, the heat sink 104 can be shaped to define various openings which can allow air to flow vertically through the heat sink. The driver box 108 can block as little open area as possible on the top and/or bottom surfaces of the heat sink 104 in order to allow as much air as possible to flow through these openings. In some embodiments no open areas on the top of the heat sink 104 are blocked by the driver box 108. Features such as fans can be used to increase airflow.
By placing a driver box off-center from a light engine and/or emitter array, and/or in any of the positions described above with regard to the present invention, the thermal dissipation paths of an array and a driver box can be separated. In one embodiment the primary thermal dissipation path of the array does not pass through the driver box.
As can be seen, the majority of heat generated by the fixture 300 is generated by an emitter array, such as the emitter array 200, mounted on the heat sink. The thermal path of this heat can pass through a heat sink before being primarily dissipated in a vertical direction which can emanate from the center of the heat sink. One possible reason for this is that heat generally tends to rise. However, the driver electronics in the driver box 308 also generate a noticeable amount of heat, such as around 10% or more of the total heat generated by the fixture 300. As can be seen from
The separation of the thermal dissipation paths achieved by the above embodiments can result in emitters operating at a lower temperature and/or emitting brighter light. This can also result in a longer emitter lifespan. In a model holding all other elements constant, an embodiment of the fixture 30 from
As can be seen from Table 1, in an embodiment of the present invention the temperature of the driver box, such as the driver box 308, may be higher than that of a driver box in the prior art vertically separated from the emitters by six feet, such as the driver box 32. However, the temperature of the emitters can be 2-3° C. lower. These differences in temperature can be due to the fact that the thermal dissipation paths are separated. The driver box 308 may in some embodiments be hotter than in the prior art due to the fact that heat from the driver box may not be dissipated using a main thermal dissipation path used by the emitters. However, because the two main heat sources in one embodiment do not share a thermal dissipation path, the influence of the heat from the driver box 308 on the emitters and/or the influence of the heat from the emitters on the driver box 308 can be reduced, minimized, or eliminated. This can result in a device having emitters with a lower operating temperature as shown, for example, in Table 1 above. In some embodiments, the emitters can be free from the thermal influence of any non-emitter structures including driver electronics. In some embodiments, the emitters and the driver electronics may produce some thermal overlap but can have different primary thermal dissipation paths. In some embodiments these paths are completely separate.
Referring back to
Many other embodiments of fixtures according to the present invention are possible. For instance,
While the above embodiments shown in
Many different variations of the heat sink 500 are possible. While the spokes 501 can be planar, in other embodiments the spokes 501 are not planar and/or are tilted either symmetrically or asymmetrically. While the spokes 501 shown branch symmetrically, in other embodiments the spokes can branch asymmetrically. The spokes 501 can be rectangular, or can have many different cross-sections. The cross-sections need not be constant, as described in detail below. Many different embodiments are possible.
The heat sink 500 can at least partially comprise a thermally conductive material, and many different thermally conductive materials can be used including different metals such as copper or aluminum, or metal alloys. Copper can have a thermal conductivity of up to 400 W/m-k or more. In some embodiments the heat sink can comprise high purity aluminum that can have a thermal conductivity at room temperature of approximately 210 W/m-k. In other embodiments the heat sink structure can comprise die cast aluminum having a thermal conductivity of approximately 200 W/m-k. The heat sink structure 500 can also comprise other heat dissipation features such as heat fins that increase the surface area of the heat sink to facilitate more efficient dissipation into the ambient. In some embodiments, the spokes 501 can be made of material with higher thermal conductivity than the remainder of the heat sink. In still other embodiments, the heat sink can comprise active cooling elements, such as fans, to further increase convective thermal dissipation. Some heat dissipation arrangements and structures are described in parent application U.S. patent application Ser. No. 13/840,887 to van de Ven et al.
In the embodiment shown, the inner level 510a can be said to have a branching factor of two, meaning that each spoke 502 splits into two spokes 504 in the intermediate level 510b and/or upon reaching a certain distance from the center of the heat sink 500. Two spokes 504 can emanate and/or directly emanate from a respective first level spoke 502. The second level 510b can also be said to have a branching level of two, since each spoke 504 splits into two spokes 506 in the third level 510c and/or upon reaching a certain distance from the center of the heat sink 500. These third level spokes emanate and/or directly emanate from their respective second level spoke, and emanate and/or indirectly emanate from their respective first level spoke.
The junctions 512 between spokes of successive levels can take many different forms. For example, a junction such as the junction 512a can comprise a solid or hollow cylinder which can connect one spoke to two spokes branching therefrom. In another embodiment, the junction can be a Y-shape, such as the junction 512b, or take many other shapes, such as a U-shape or V-shape for example. In yet another embodiment, each of the spokes from one level, such as the inner level 510a, can connect to a ring, such as the ring's inner wall, which serves as a junction between levels. The spokes of the next successive level can also connect to this ring, such as to the ring's outer wall.
The number of spokes 502 in each level and in total can vary based on many factors, one of which can be the amount of physical space available. This calculation can take into account the amount of surface area desired for dissipation as well as the amount of space desired to be left open to allow for convective cooling, which will be discussed in detail below. In the embodiment shown, the heat sink 500 can include 18 inner spokes 502, 36 intermediary spokes 502, and 72 outer spokes 502. Many different embodiments are possible, including fewer or more spokes in any of the levels 510a,510b,510c. Some embodiments of heat sinks according to the present invention have 8 or more inner spokes and/or 32 or more outer spokes, such as one embodiment with 32 outer spokes and another embodiment with 48 outer spokes (e.g., if the branching factor of an intermediary level is 2 and of an outer level is 3).
Spokes used in heat sinks according to the present invention can operate similarly to heat fins. The use of different types of heat fins has been described, for example, in commonly assigned U.S. patent application Ser. No. 13/358,901 to Progl and entitled “Lamp Structure with Remote LED Light Source”, and commonly assigned U.S. patent application Ser. No. 13/441,567 to Kinnune et al and entitled “LED Light Fixture with Inter-Fin Air-Flow Interrupters”, each of which is fully incorporated by reference herein in its entirety. Generally speaking, increasing the surface area of a heat sink such as the heat sink 500 can facilitate higher and/or more efficient dissipation of heat into the ambient. Again generally speaking, anytime one of the spokes 502 splits into two spokes 502, the surface area is doubled or almost doubled. Thus, more heat can be dissipated.
As a spoke 502 moves away from the center of the heat sink 500, the physical distance between adjacent spokes 502 can grow (as opposed to an angular distance in degrees, which would stay constant other than for the branching described herein). The branching of the spokes 502 can take advantage of this space by filling it with more spokes 504, which can add extra heat dissipating surface area and/or increase the overall thermal dissipation of the heat sink 500. Other embodiments where the physical distance between spokes stays the same are possible.
While the heat sink 500 has three levels 510a,510b,510c, and a branching factor for both the inner and middle levels 510a,510b of two, many other embodiments are possible. Any combination of the number of levels and branching factors is possible. Further, the same number of levels and/or the same branching factor need not apply to an entire heat sink. For instance, a left half of a heat sink can have four levels while a right side has five levels. In another instance, adjacent spokes can have alternating branching factors which can remain constant or change as the spokes move to outer levels. Many different embodiments are possible. While the embodiments specifically shown and described herein include levels with branching factors of 2 or over, branching factors equal to or under 1 are also possible. For instance, two or more spokes in an inner level can rejoin into fewer spokes in a subsequent level in order to encourage convective thermal dissipation, which will be discussed in detail below.
The heat sink 500 can include various openings or spaces, such as the spaces 514 which can allow for airflow over the spokes and/or between the bottom and top of the heat sink 500. These openings will be discussed in more detail below. In some embodiments, such as that shown in
Generally speaking, the center of the heat sink 500 can be hotter than other portions. This can be because arrays mounted on heat sinks in fixtures such as high bay fixtures are mounted in the center of the bottomside of the heat sink, as shown and described above and in application U.S. patent application Ser. No. 14/145,355 to Lui et al. and entitled “Lighting Fixture with Reflector and Template PCB”.
Each successive level 510 of spokes can have spokes with the same cross-sectional area as spokes of the previous level. Alternatively, the spokes of successive levels 510 can have smaller or larger cross-sectional area. In one embodiment, the cross-sectional area of each of the spokes 502 grows as the spoke moves further away from the center of the heat sink 500 until eventually reaching another branching point such as a junction 512. In one such embodiment, one spoke can branch into multiple spokes cumulatively having approximately equal or greater cross-sectional area than the original spoke. In another embodiment, one spoke can branch into multiple spokes each having approximately equal cross-sectional area to the original spoke. Many different embodiments are possible. In one embodiment, the spokes do not branch, but instead grow in cross-sectional area as they move further from the center of the heat sink.
The heat sink 500 can also include a through-hole 509. This through-hole can provide a conduit for providing electrical connection and/or a connection between driver electronics and emitters and/or PCB. For example, as best seen in
As best seen in
The air being drawn toward the center 708 of the heat sink 700 can exit the top of the heat sink 700 at various points, as shown by
Air exiting a heat sink, such as the heat sink 700, at different points can have different velocities, and thus the percentage of air does not necessarily directly correlate to the area of the openings in each successive level. For example, air nearer the center 708 of the heat sink 700 can have a higher velocity and/or buoyancy, meaning that in such an embodiment while only one in four spaces reaches the center 708, the percentage of air reaching the center 708 can be above 25%.
The airflow 734 can enter the heat sink 700 and/or the spaces 714, such as through the side openings 718 and/or from above the heat sink 700. Some of the airflow 734 can exit the top surface of the heat sink 700 as part of the airflow 736, described above. This air may have entered a space 714c, which may not pass into the intermediate or inner levels 710b,710a before encountering a junction 712. Another portion of the airflow 736, such as the portion that enters spaces 714b,714a, may pass further into the heat sink 700. Airflow in the spaces 714b may be forced out the top of the heat sink 700 and become part of the airflow 738 upon, for example, encountering a junction that can prevent it from passing into the inner level 710a. As can be seen from the thermal imaging, the airflow 738 is hotter than the airflow 736, indicating that 1) more heat from the heat sink 700 was dissipated into the airflow as the air traveled further within the heat sink, and/or 2) more central portions of the heat sink 700 give off more heat than outer portions. A combination of these two factors can occur.
Finally, some airflow may reach the center portion 708 of the heat sink 700, as best shown in
Heat sinks according to the present invention can comprise a safety ring such as the safety ring 520 shown above in
In some embodiments, one or more of the outer level spokes can extend past the safety ring (if present) or otherwise stick out from the other spokes and/or remainder of the heat sink. These spokes can serve as an attachment means for, for example, a driver box such as the driver box 108 from
Embodiments of the present invention can be used to retrofit prior art bay fixtures. For example, driver boxes of a prior art arrangement could be retrofitted with one of the driver box arrangements described above. The above disclosure describes manners of heat dissipation devices and techniques, while the disclosure of application U.S. patent application Ser. No. 14/145,355 to Lui et al. and entitled “Lighting Fixture with Reflector and Template PCB” describes other issues prevalent in SSL lighting, such as heat dissipation issues not described herein, emitter connection methods and structures and emission distribution tailoring. This application is fully incorporated herein by reference.
It is understood that embodiments presented herein are meant to be exemplary. Embodiments of the present invention can comprise any combination of compatible features shown in the various figures, and these embodiments should not be limited to those expressly illustrated and discussed.
Although the present invention has been described in detail with reference to certain configurations thereof, other versions are possible. Therefore, the spirit and scope of the invention should not be limited to the versions described above.
The foregoing is intended to cover all modifications and alternative constructions falling within the spirit and scope of the invention as expressed in the appended claims, wherein no portion of the disclosure is intended, expressly or implicitly, to be dedicated to the public domain if not set forth in the claims.
This application is a continuation-in-part of U.S. patent application Ser. No. 13/840,887 to van de Ven et al., filed Mar. 15, 2013 and entitled “Aluminum High Bay Design,” which is fully incorporated by reference herein in its entirety.
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| Cree® XLamp® CXA2530 LED Product Family Data Sheet, 15 pages. |
| Cree® XLampe® CXA2520 LED Product Family Data Sheet, 15 pages. |
| “Cree Reflector Leaflet”, Rev. 7 (available at http://www.nata.cn/images/newsletter/pdf/Cree%20Leaflet%20%28rev-7%29.pdf. retrieved Dec. 11, 2013). |
| “Optimizing PCB Thermal Performance for Cree® XLamp® LEDs” (available at http://www.cree.com/xlamp_app_notes/PCB_Thermal). |
| Office Action from U.S. Appl. No. 13/840,887; dated Mar. 4, 2016. |
| Office Action from U.S. Appl. No. 14/145,559; dated Mar. 8, 2016. |
| Office Action for U.S. Appl. No. 13/840,887; dated Oct. 18, 2016. |
| Office Action for U.S. Appl. No. 14/145,355; dated Oct. 18, 2016. |
| Office Action for U.S. Appl. No. 14/145,355; dated May 31, 2017. |
| Office Action for U.S. Appl. No. 13/840,887; dated Jun. 15, 2017. |
| Office Action for U.S. Appl. No. 14/145,355; dated Oct. 19, 2017. |
| Office Action for U.S. Appl. No. 13/840,887; dated Jan. 22, 2018. |
| Office Action for U.S. Appl. No. 14/145,355; dated Mar. 27, 2018. |
| Number | Date | Country | |
|---|---|---|---|
| 20140268730 A1 | Sep 2014 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 13840887 | Mar 2013 | US |
| Child | 14145559 | US |
