Linear light systems are popular for display and architectural applications. Oftentimes linear light sources are used in cove lighting applications. In cove lighting applications, fluorescent lights and neon lights are used for linear lighting because of the long thin tube that emits light in both neon light and fluorescent light systems. Neon lights and fluorescent lights, however, use more energy and do not last as long as light emitting diodes (LEDs).
Light emitting diodes are semiconductor devices that are forward biased to generate light. Because of this forward bias, LEDs are often operated using direct current. Where LED linear light sources have been used to replace fluorescent and neon lights for linear lighting applications, one external power source is provided to deliver DC power to drive the LEDs in a plurality of separate LED modules. This setup can be complicated and time consuming to install.
A linear LED light module and system that overcomes the aforementioned disadvantages includes a heat sink, a printed circuit board, a plurality of LEDs, a power supply housing, a flexible electrical conductor, a first electrical connector, a second electrical connector, and a power supply. The heat sink is elongated in an axial direction along a longitudinal axis that is parallel with a greatest dimension of the heat sink. The PCB is in thermal communication with the heat sink and includes circuitry. The plurality of LEDs mount to the PCB and are in electrical communication with the circuitry of the PCB. The power supply housing connects to the heat sink. The flexible electrical conductor includes at least two wires that are configured to accommodate an AC line voltage of at least 120 VAC. The first electrical connector is at a first end of the electrical conductor. The second electrical connector is at a second end of the electrical conductor. The second connector has a configuration that complements the first connector so that the second connector can connect to an associated adjacent first connector of an associated adjacent LED module to allow a plurality of similar LED modules to be mechanically and electrically connected to one another. The power supply is disposed in the power supply housing and in electrical communication with the circuitry of the PCB and the electrical conductor. The power supply is configured to receive the AC line voltage from the electrical conductor and to convert the received AC line voltage to a lower DC voltage for delivery to the circuitry of the PCB to drive the LEDs mounted on the PCB.
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The optic 38 can be made from a material having a high refractive intex for internally reflecting light entering the optic from the LEDs 16. The material can also result in a high dispersion of reflective light. Alternatively, the elongate optic 38 can be extruded and include a wave optic disposed in the extruded optic. When disposed in the second section 36 of the heat sink channel, the optic 38 is covered by a translucent cover 44 between the optic 38.
The heat sink 12 also includes a plurality of elongate fins 50 that radiate away from the heat sink channel. The fins 50 extend axially from a first end of the heat sink to the second end of the heat sink and provide a larger surface area to promote heat transfer into ambient via convection. Heat from the LEDs 16 dissipates into ambient through the heat sink. The heat sink 12 also includes openings (not visible) for receiving fasteners 52 for attaching the PCB 14 to the heat sink 12. The heat sink also includes openings 54 formed in each end face (the face that is normal to the longitudinal axis 32) for receiving fasteners 56 to attach end plates 58 to each end of the heat sink. Each end place 58 includes corresponding openings 62 that align with the openings 54 in the heat sink to receive the fasteners 56 to attach each end cover 58 to a respective end face of the heat sink 12.
Each end cover 58 includes a vertical section 64 that abuts each end face and includes the opening 62. Each end cap 58 also includes a horizontal section 66 that extends away from the vertical section 64 and is received underneath a lowermost surface 68 of the heat sink 12. The vertical section 64 of each heat sink 58 traps the PCB 14 and the optic 38 in the heat sink channel and precludes the PCB and the optic from moving in the axial direction. The horizontal section 66 of each end cap contacts the power supply housing 26 (see
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The power supply housing 26 includes a planar upper surface 92 that abuts against the lowermost surface 68 of the heat sink 12. Openings 94 are provided through the power supply housing 26 and receive fasteners 96 for attaching the power supply housing 26 to the heat sink 12. An opening 98, which in the depicted embodiment provides access into the hollow compartment of the power supply housing 26, is provided to allow wires 102 (
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The connectors 22 and 24 are configured to accommodate line voltage, e.g. 120 VAC, 220 VAC, which allows the LED module 10 to simply be plugged into a conventional wall outlet via a cord 120 including a plug 122 that is configured to plug into a conventional wall socket and a connector 124 that are interconnected by wires 126. The connector 124 is configured to mechanically and electrically connect to one of the connectors, either the connector 22 or connector 24. Accordingly, the LED module 10 can be driven directly from line voltage, which makes the LED module much simpler to install than known modules.
The first electrical connector includes a plurality of prongs that each attach to a respective wire 112 (
The power supply 28 is configured to convert the higher voltage AC to a lower voltage DC for delivery to the PCB 14. The limiting factors in the design are the current carrying capacity of the wires 102, 112, and 126 and the circuit breaker limit for the breaker box to which the system is electrically connected. The power supply in each module passes the AC bus between the modules which obviates the need for complicated power supply.
A linear light emitting diode module and system have been described with great particularity with reference to aforementioned embodiment. The invention is not limited to only the embodiment disclosed. Instead, the invention is broadly defined by the appended claims and the equivalents thereof.
Number | Name | Date | Kind |
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6283612 | Hunter | Sep 2001 | B1 |
6502952 | Hartley | Jan 2003 | B1 |
20050286265 | Zampini et al. | Dec 2005 | A1 |
Number | Date | Country | |
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20090021936 A1 | Jan 2009 | US |