Claims
- 1. A multi-segment potentiometer board, comprising a top layer of conductive polymeric resin, a bottom layer of conductive polymeric resin and a center layer of non-conductive polymeric resin, and sliding contacts, the board being formed into potentiometer segments defined by notches separating the conductive layers and slots passing through said top, center, and bottom layers, said slots receiving said sliding contacts for the top and bottom conductive resin layers.
- 2. A multi-segment potentiometer board, comprising a top layer of conductive polymeric resin, a bottom layer of conductive polymeric resin and a center layer of nonconductive polymeric resin, and sliding contacts, the board being formed into potentiometer segments defined by parallel notches separating the conductive layers and slots passing through said top, bottom and center layers and formed along a portion of the length of the notches and receiving said sliding contacts for the top and bottom conductive resin layers wherein the conductive layers comprise polyethylene terephthalate resin, mesophase pitch carbon fibers exhibiting essentially a lamellae microstructure randomly disposed throughout at least the outer surface of the conductive layers and fiberglass fibers, the board being compression molded from selected layers of batting containing said pitch based fibers, fiberglass fibers and resin, or fiberglass and resin.
CROSS REFERENCE TO RELATED APPLICATIONS
This application is a continuation in part of pending U.S. application Ser. No. 08/599,463, filed as PCT/US95/11206 Sep. 1, 1995, which is a continuation in part of U.S. application Ser. No. 08/485,717 filed Jun. 7, 1995, now abandoned, which is a continuation in part of U.S. application Ser. No. 08/157,906 now abandoned, filed Nov. 24, 1993.
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Continuation in Parts (3)
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Number |
Date |
Country |
Parent |
599463 |
Jan 1996 |
|
Parent |
485717 |
Jun 1995 |
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Parent |
157906 |
Nov 1993 |
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