Patent Grant
11247459
The present disclosure relates to nanoimprint technology including electrical charging of liquids.
In the semiconductor fabrication field, the use of advanced semiconductor lithography is fast becoming the standard. Nanoimprint lithography techniques are known to possess remarkable replication capability with its resolution approaching molecular scale.
More specifically, in a step-and-repeat nanoimprint lithography process an imprint resist is used in the form of small volume droplets dispensed onto a substrate. Typical range of the dispensed drops is from 0.1 pL to 10 pL. In this configuration, the drops spread and merge when a template comes in contact with the resist drops and substrate during imprinting. The advantages of the resist being dispensed in small droplets rather than as a continuous film is the control of the local resist volume required for a specific area by means of changing the number of droplets dispensed in an area. The local volume requirements come from the pattern to be filled. Thus, a pattern can be located on template only, on substrate only, or on both. The patterns are typically made by an etch process that can be dry or wet etch.
For each different template/substrate pattern the distribution of the resist drops (droplets) on the substrate can be different. Each different distribution corresponds to a different resist drop pattern that need to be dispensed. Fluid resist droplets are dispensed by an inkjet type fluid dispenser that uses the resist as a dispense liquid instead of ink.
However, in these configurations liquid drops adapt a shape due to many external factors. These factors include: surface tension balance, resist viscosity, surface roughness, and electric charge of the liquid drops. For example, liquid drops of the same sign electric charge that are near each other, cause repulsion in respect to each other. Thus, liquid drop spread and distribution on a substrate depends on the electric charge of the droplets.
The various embodiments of the present liquid-ejecting apparatus and method, have several features, no single one of which is solely responsible for their desirable attributes. Without limiting the scope of the present embodiments as expressed by the claims that follow, their more prominent features now will be discussed briefly. After considering this discussion, and particularly after reading the section entitled “Detailed Description of the Embodiments,” one will understand how the features of the present embodiments provide the advantages described herein.
In a first embodiment, a liquid-ejecting apparatus includes a reservoir for storing a liquid, an electrically conductive faceplate for ejecting the liquid, a plurality of channels connecting the reservoir to the electrically conductive faceplate, and a voltage source to change and maintain an electric potential difference between the liquid and the electrically conductive faceplate during ejection from the electrically conductive faceplate.
In another embodiment, a method for controlling a liquid-ejecting apparatus includes, storing a liquid in a reservoir, moving the liquid from the reservoir to an electrically conductive faceplate through a plurality of channels connecting the reservoir to the electrically conductive faceplate, changing and maintaining an electric potential difference, via a voltage source, between the liquid and the electrically conductive faceplate, and ejecting, from the electrically conductive faceplate, the liquid with the electric potential difference applied.
Example devices, methods and systems are described herein. Any example embodiment or feature described herein is not necessarily to be construed as preferred or advantageous over other embodiments or features. The example embodiments described herein are not meant to be limiting. It will be readily understood that certain aspects of the disclosed systems and methods can be arranged and combined in a wide variety of different configurations, all of which are contemplated herein.
Furthermore, the particular arrangements shown in the figures should not be viewed as limiting. It should be understood that other embodiments might include more or less of each element shown in a given figure. Further, some of the illustrated elements may be combined or omitted. Yet further, an example embodiment may include elements that are not illustrated in the figures.
Because there is a need to control an electric charge of ejected liquid from a faceplate, exemplary embodiments of the present disclosure provide for electrically controlling a charge of an ejected liquid droplet by electrically charging and maintaining an electrical potential difference of a liquid stored in a reservoir during ejection. This improves the distribution of the ejected liquid dispensed on a substrate.
Fluid dispenser 1, moves a liquid 2 to be ejected from the reservoir 8 where the liquid 2 is temporarily stored, through a plurality of liquid channels 3 to the faceplate 4 with channel openings at the edge of the fluid dispenser 1. Examples of the liquid 2 stored in the reservoir 8 can be, but is not limited to, a liquid resist, a formable material, or a curable composition. Upon reaching the faceplate 4, the liquid 2 in the plurality of liquid channels 3 is ejected with a specific electric charge which originates from a double charged layer naturally existing between the liquid and the faceplate material. This is similar to the triboelectric effect where dynamic friction and charge separation from an electrical double layer leads to electrization of both participating bodies. This explains the electric charge of the plurality of liquid droplets 5 ejected from the faceplate 4.
Due to the electric charges of the plurality of liquid droplets 5, the electric charge of an applied liquid droplet 7 on a positionally-adjacent applied liquid droplet 7 affects the drop spreading onto the substrate 6. Moreover, the spreading of the applied liquid droplets 7 onto the substrate 6 is also contingent on surface tension balance of the substrate 6 and the applied liquid droplets 7, the viscosity of liquid 2 and/or surface roughness of substrate 6. Thus, controlling the electric charge of the plurality of liquid droplets 5 ejected from the faceplate 4 controls the spreading of the applied liquid droplets 7 on the substrate 6.
In this embodiment, the applied liquid droplets 13 are of a liquid resist and the majority applied on the substrate 6 are square in shape. This is due to factors acting upon the applied liquid droplets 13, wetting and electrostatic repulsion. The electrostatic repulsion prevents drops from moving closer to each other. Thus, the electric charge of each resist drops prevents the applied liquid droplets 13 from merging.
However, applied liquid droplet 14 on substrate 6 is a liquid resist droplet with a significantly higher electric charge than the surrounding droplets. As such, applied liquid droplet 14 is prevented from spreading and retains its round shape after being applied to substrate 6. Moreover, the electric charge of applied liquid droplet 14 limits the spreading of surrounding applied droplets 13 as well.
Voltage source V1 can be, but is not limited to, a DC voltage supply and is controlled by a control unit. Voltage source V1 has two terminals with opposing polarities for connection to the fluid ejecting system. Conductive layer 9 can be, but is not limited to, a coating applied to commonly non-conductive faceplate 4. Conductive layer 9 is able to conduct an electric current applied by voltage source V1 and to apply required electric potential with respect to the liquid 2. In another embodiment conductive layer 9 can be applied to the sidewalls of the plurality of liquid channels 3 to also provide an electric potential difference applied by voltage source V1 to the interface between liquid 2 and the conductive layer 9 while in the plurality of liquid channels 3. Moreover, conductive layer 9 has a connector 10 that is connected to a terminal of voltage source V1 to carry an electric current from voltage source V1 to define required electric potential in the conductive layer 9. In another embodiment, the electric current from voltage source V1 is carried to the plurality of liquid channels 3 that are in contact with conductive layer 9 to establish a required electric potential difference in the interface between the conductive layer 9 and the liquid 2.
In this embodiment, connector 11 is connected to fluid dispenser 1 and to the opposing terminal of voltage source V1 not connected to connector 10. This connection carries an electric current from voltage source V1 to define potential difference between the liquid 2 and conductive layer 9. Additionally, connector 11 may share a common ground with fluid dispenser 1.
In this configuration, voltage source V1 is able to control the electric potential difference between liquid 2 to be ejected from the plurality of liquid channels 3 and conductive layer 9. Moreover, the control unit controls voltage source V1 to apply a necessary voltage to achieve specific electric charges of the liquid droplets 7 to achieve corresponding spreading characteristics of the applied liquid droplets 7 on the substrate 6. This can be done by, but is not limited to, controlling and changing the electric potential difference between the liquid in the plurality of channels 3 and conductive layer 9 during multiple ejection applications.
As mentioned above, conductive layer 9 has a connector 10 connected to a terminal of voltage source V1 to carry an electric current from voltage source V1 throughout the conductive layer 9. In another embodiment conductive layer 9 can be applied to the sidewalls of the plurality of liquid channels 3 and the electric current from voltage source V1 is carried to the conductive layer 9 on sidewalls of the plurality of liquid channels 3.
In this embodiment, electrode 12 is connected to the opposing terminal of voltage source V1 not connected to connector 10. This allows an electric current to flow from voltage source V1 to electrode 12. Thus, voltage source V1 is able to control the electric potential difference between liquid 2 to be ejected and conductive layer 9.
Accordingly, the control unit controls voltage source V1 to apply a necessary voltage to achieve specific electric charges of the applied liquid droplets 7 according to
In this exemplary embodiment the liquid is an imprint resist and voltage is measured in volts with values in the range from −30V to +30V.
In this exemplary embodiment, the liquid 2 is a liquid resist and the fluid dispenser 1 has two separate arrays of channels 3 with two separate faceplates, positionally-adjacent to one another to eject the liquid resist stored in a reservoir 8 from faceplates 4. Here, each of the liquid channels 3 terminates with a nozzle at a faceplate 4 for ejection.
Accordingly, the first nozzle array ejecting the liquid 2 as applied liquid droplets 7 on a substrate 6 will be referred to as r1 and the second nozzle array ejecting the liquid 2 to as applied liquid droplets 7 on a substrate 6 will be referred to as r2. In the graph as shown, different voltages were applied to r1 and r2 to find an optimal electric charge combination for liquid droplets to reduce spread time of the applied liquid droplets 7. In some cases the voltages at r1 and r2 were of opposite signs to effectively determine effects of electrostatic attraction of r1 on r2 and vice versa.
In this example, different voltages are applied to r1 and r2 and the time interval is measured from the time drops are dispensed until the moment when the drops form a continuous film after being applied on a substrate 6. As shown, as the applied voltage to r1 becomes more negative the time interval reduces. The time interval of the drop spreading is also sensitive to the variations of the voltage applied to r2. From the results the voltages −100 V applied to r1 and 30 V applied to r2 (−100,30) achieves the least local spread time when applied to substrate 6. Therefore, the dependence of local resist spread time when applied to a substrate 6 is a function of the applied voltages to both rows and the right combination of voltages can reduce the spread time significantly.
Lastly, a manufacturing method of a device (a semiconductor device, a magnetic storage media, a liquid crystal display element, or the like) serving as an article will be described. The manufacturing method includes a step of forming a pattern on a substrate (a wafer, a glass plate, a film-like substrate, or the like) using a liquid-ejecting apparatus or liquid-ejecting method described above. The manufacturing method further includes a step of processing the substrate on which the pattern has been formed. The processing step can include a step of removing the residual film of the pattern. The processing step can also include another known step such as a step of etching the substrate using the pattern as a mask. The method of manufacturing the article according to this embodiment is superior to a conventional method in at least one of the performance, quality, productivity, and production cost of the article.
While the present disclosure has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation to encompass all modifications, equivalent structures and functions.
| Number | Name | Date | Kind |
|---|---|---|---|
| 4668959 | Jochimsen | May 1987 | A |
| 4854506 | Noakes | Aug 1989 | A |
| 5221050 | Jeffries | Jun 1993 | A |
| 5825383 | Abe | Oct 1998 | A |
| 7066582 | Deguchi | Jun 2006 | B2 |
| 7156045 | Ueno | Jan 2007 | B2 |
| 7290868 | Sakamoto | Nov 2007 | B2 |
| 7506974 | Hirakawa | Mar 2009 | B2 |
| 7641316 | Sakai | Jan 2010 | B2 |
| 7874659 | Silverbrook | Jan 2011 | B2 |
| 20020130926 | Yamada | Sep 2002 | A1 |
| 20030189167 | Schultz | Oct 2003 | A1 |
| 20040174414 | Tanikawa | Sep 2004 | A1 |
| 20160207311 | Tamai | Jul 2016 | A1 |
| 20180009223 | Poulikakos | Jan 2018 | A1 |
| Number | Date | Country | |
|---|---|---|---|
| 20210023840 A1 | Jan 2021 | US |
