This application claims benefit of priority of European Patent Application No. 11009025.5, filed Nov. 14, 2011, in the name of Cressal Resistors Ltd.; which application is incorporated herein by reference.
The present invention relates to resistor devices; and more particularly to liquid-cooled resistor devices.
Liquid-cooled resistor devices known from the prior art can be employed in a wide variety of applications, including regenerative braking of devices using an inverter-driven electric motor which can also function as a generator.
DE 3933956 discloses a liquid-cooled resistor device for use in electric vehicles, with a flat resistor mounted between two liquid-cooled, electrically insulated blocks. The resistor is kept in place simply by rigid connection between the two blocks. GB2478547 discloses a liquid-cooled brake resistor device for use in electric vehicles, with a flat resistor is disposed between a liquid-cooled, electrically insulated block and a blocking plate or a further liquid-cooled block. The resistor is kept in place by rigid connection between the block and the blocking plate, or between the two blocks, as well as by expansion guide means at last partially surrounding the resistor to confine expansion in its main plane.
One of the drawbacks of the devices of the prior art is that the thermal contact resistance at the resistor-block or resistor-insulation layer interface limits the efficiency and efficacy of the heat transfer. Moreover, the low heat capacity of the block relative to the cooling liquid limits the overall rate of heat dissipation from the resistor.
Further, for use of the devices for braking inverter-driven electric motors, relatively large resistors and liquid-cooled blocks are required in order to manage the high energy dissipation requirements involved, which can in practice render the devices bulky and heavy.
A technical task proposed by the present invention is therefore that of providing a liquid-cooled resistor device that overcomes the noted technical drawbacks of the prior art.
Within the scope of this technical task, an advantage of the present invention is that of providing a liquid-cooled resistor device having improved efficiency and efficacy of heat dissipation from the resistor.
Another advantage is that of providing a liquid-cooled resistor device that is compact and lightweight.
A last but not least advantage of the invention is that of providing a liquid-cooled resistor device that is safe and economical.
These and other technical tasks, as well as these and other advantages, are achieved according to various embodiments of liquid-cooled resistor device according to present invention.
In one embodiment, a liquid-cooled resistor device includes a block that includes a liquid inlet, a liquid outlet and a cavity. The cavity can have a liquid flow path between the liquid inlet and the liquid outlet, and can further have an open side. A thermally conductive, electrically insulating flat layer is also included. The flat layer can be configured along a plane, with the flat layer covering the open side of the cavity. Also included is a resistor, also configured in a plane, where the plane of the resistor can be positioned parallel to the plane of the flat layer. An electrically insulating blocking plate, fastenable to the block, can be included, and can face the resistor to hold the resistor against the flat layer. Lastly, an elastic pressing device can exist between the block and the flat layer, the elastic pressing device forcing the flat layer against the resistor.
The use of a elastic pressing device to force the thermally conductive, electrically insulating flat layer against the resistor ensures improved heat transfer between the resistor and the flat layer. Moreover, the closure of the cavity of the block by the flat layer and the placement of the elastic pressing device in the cavity improves the heat transfer from the layer to the liquid. The overall heat transfer efficiency and efficacy improvement allows the device of the invention to be smaller and lighter than those of the noted prior art.
Furthermore, the use of elastic pressing device increases the stiffness of the device in a direction perpendicular to the plane of the resistor, thereby bringing it substantially above the characteristic vibration frequencies of vehicles and rolling stock. Hence, the device is better able to withstand vibration and shock during use.
In one aspect of the invention, the liquid flow path can be defined by partitioning walls within the cavity. The partitioning walls can have a height, relative to that of the cavity, so that the partitioning walls are spaced apart from the flat layer to allow a small bypass of liquid to flow over a top of the partitioning walls, between the top of the partitioning walls and the flat layer, during liquid flow in the liquid flow path (where liquid flows between the liquid inlet and the liquid outlet) to prevent dry areas of the flat layer.
In another embodiment of the invention, a liquid-cooled resistor device includes two blocks, fastenable to one another, each block including a liquid inlet, a liquid outlet and a cavity, where each cavity has a liquid flow path between the liquid inlet and the liquid outlet, with each cavity further having an open side. Two thermally conductive, electrically insulating flat layers are also included. Each flat layer can be configured along a plane, where each flat layer covers a respective open side of a cavity. A resistor can be positioned in a middle thereof, configured in a plane, with the plane of the resistor positioned parallel to respective planes of the two flat layers. Lastly, two elastic pressing devices can also be included, with each positioned between a respective block and flat layer, where each elastic pressing device forces its respective flat layer against the resistor.
Other characteristics of the present invention are moreover defined in the subsequent claims. Further characteristics and advantages of the present invention will be more evident from the description of a preferred, but not exclusive, embodiment of the liquid-cooled resistor device according to the finding, illustrated in the attached non-limiting drawing, wherein:
With reference to
The resistor (2) rests on a thermally conductive, electrically insulating flat layer (7), disposed such that their main planes are parallel to one another. The flat layer (7) is preferably made of aluminium nitride ceramic and comprises a rigid sheet.
At least one block (3) is provided, preferably made of an electrically and thermally insulating material, in particular preferably moulded thermoset plastic. It is provided with a liquid inlet (4) and a liquid outlet (5), preferably disposed parallelly and as a function of the width of said block. The block further has a cavity provided with a liquid flow path (6) between the inlet (4) and the outlet (5). Advantageously, the cavity can be machined in the face of the block (6) that is oriented towards the resistor (2), such that the cavity has an open side that can be closed by the thermally conductive, electrically insulating flat layer (7).
Preferably, the cavity has a peripheral shoulder on which said flat layer (7) rests. In this way the liquid flow path (6) is closed and the liquid cannot contact the resistor (2).
Preferably, the flow path (6) covers the same footprint as the maximum area of the resistor (2) in order to maximise energy dissipation. Advantageously, the liquid used for cooling can be water and it is preferably introduced into the flow path (6) at a flow rate sufficiently high to sustain turbulent flow throughout the flow path.
Preferably, the peaks of the partitioning walls defining the liquid flow path (6) within the cavity are spaced apart from the layer (7) such that a small bypass of liquid over said peaks is possible. This prevents dry regions on the flat layer (7) in the footprint of the resistor (2), in turn avoiding hot spots that could impair heat transfer and the integrity of the device.
An electrically insulated blocking plate is provided, rigidly fastenable to the block (3), with the resistor (2) being blocked between the blocking plate and the flat layer (7). Preferably, the blocking plate comprises a further block (3) with a further thermally conductive, electrically insulating layer (7) disposed between the further block (3) and the resistor (2), as shown in
An elastic pressing device is disposed between the block (3) and the thermally conductive, electrically insulating flat layer (7), subjecting said flat layer (7) to a force against resistor (2). In particular, the elastic pressing device is housed in the cavity of the block (3). Preferably, the elastic pressing device is configured to force the flat layer (7) against the resistor (2) with an almost uniform contact pressure at the contact area between the flat layer (7) and the resistor (2). In one embodiment, the elastic pressing device comprises a plurality of springs (8) disposed in the internal liquid flow path (6) of the block (3). Preferably, each of the springs (8) is disposed with its axis perpendicular to said internal liquid flow path (6). Preferably the springs (8) are made of stainless steel.
In the arrangement wherein a block (3) is present on each side of the resistor (2) as shown in
Overall, the presence of the elastic pressing device provides a 200-300% increase in heat transfer from the resistor (2), in turn enabling the device to be made smaller and lighter than those of the prior art. The use of thermoset plastic for the block (3) further aids the compact and lightweight construction of the device.
Optionally, the device comprises expansion guide means (not shown) disposed between fins of the resistor (2) to confine the expansion of the resistor in its main plane in order to prevent mutual contact between the fins of the resistor and subsequent short-circuiting. Preferably, the expansion guide means comprise at least one mica paper strip. The thickness of this at least one strip is advantageously no more than that of the resistor (2) so as to not impede the contact between the resistor (3) and the insulating layer (7).
The liquid-cooled resistor device thus conceived is susceptible to numerous modifications and variations, all falling within the scope of the inventive concept; furthermore, all details may be substituted by technically equivalent elements.
In practice, any material type or size may be used, according to the needs and the state of the art.
These and other advantages of the present invention will be apparent to those skilled in the art from the foregoing specification. Accordingly, it will be recognized by those skilled in the art that changes or modifications may be made to the above described embodiments without departing from the broad inventive concepts of the invention. Any specific dimensions provided for any particular embodiment of the present invention are for illustration purposes only. It should therefore be understood that this invention is not limited to the particular embodiments described herein, but is intended to include all changes and modifications that are within the scope and spirit of the invention and claims, and of the problems solved by illustrated embodiments.
Number | Date | Country | Kind |
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11009025 | Nov 2011 | EP | regional |
Number | Name | Date | Kind |
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4420739 | Herren | Dec 1983 | A |
4434417 | Beriger et al. | Feb 1984 | A |
5353005 | Salanki | Oct 1994 | A |
7200007 | Yasui et al. | Apr 2007 | B2 |
7360582 | Olesen | Apr 2008 | B2 |
Number | Date | Country |
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3204683 | Aug 1983 | DE |
3933956 | Apr 1991 | DE |
0454904 | Nov 1991 | EP |
2000252101 | Sep 2000 | JP |
WO2005041627 | May 2005 | WO |
Entry |
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European Search Report; EP Application No. EP11009025.5; European Filing Date: Nov. 14, 2011; 4 pages. |
English Abstract of Japanese Patent No. 2000252101; Publication Date: Sep. 14, 2000; 1 page. |
English Abstract of European Patent No. EP0454904; Publication Date: EP0454904; 1 page, Nov. 6, 1991. |
English Abstract of German Patent No. DE3933956; Publication Date: Apr. 25, 1991; 1 page. |
English Abstract of German Patent No. DE3204683; Publication Date: Aug. 18, 1983; 1 page. |
Number | Date | Country | |
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20130120103 A1 | May 2013 | US |