Patent Application
20070068172
The present invention relates generally to heat dissipating devices, and more particularly to a liquid cooling system.
Electronic components such as semiconductor chips are becoming progressively smaller, while at the same time heat dissipation requirements thereof are increasing. For most contemporary applications, a liquid cooling system is the most efficient system which can be used to dissipate heat.
A conventional liquid cooling system generally includes a heat-absorbing unit, a heat-dissipating unit, at least one pipe and coolant circulating between the heat-absorbing unit, the heat-dissipating unit and the pipes. In order to ensure the effective operation of the liquid cooling system, the coolant of liquid cooling system must have high thermal conductivity. Using coolants with high thermal conductivity, the liquid cooling system can decrease the thermal resistance between the coolant and the heat-absorbing unit and also the thermal resistance between the coolant and the heat-dissipating unit.
Conventional liquid cooling systems generally adopt pure liquids to act as the coolants. However, for many applications, the thermal conductivity of these coolants are too low and the rate of heat transfer is too slow, and thus the operating efficiency of the liquid cooling system is unsatisfactory.
What is needed, therefore, is a liquid cooling system with better operating efficiency.
In accordance with an embodiment, a liquid cooling system includes a heat-absorbing unit, a heat-dissipating unit, at least one pipe, a coolant and a magnetic field generator for generating a magnetic field. The pipe interconnects the heat-absorbing unit and the heat-dissipating unit, thereby the heat-absorbing unit, the heat-dissipating unit and the pipe cooperatively form a circulatory channel. The coolant is received in the circulatory channel, the coolant comprises a liquid and a plurality of magnetic particles dispersed in the liquid. The coolant includes a liquid and a plurality of magnetic particles dispersed in the liquid. At least one of the heat-absorbing unit and the heat-dissipating unit is located in the magnetic field.
Other advantages and novel features will become more apparent from the following detailed description of present liquid cooling system, when taken in conjunction with the accompanying drawings.
Many aspects of the present liquid cooling system can be better understood with reference to the following drawings. The components in the drawings are not necessarily to scale, the emphasis instead being placed upon clearly illustrating the principles of the present liquid cooling system. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
Embodiments of the present liquid cooling system will now be described in detail below and with reference to the drawings.
Referring to
The coolant 50 is generally a suspension, and includes a liquid and a plurality of magnetic particles dispersed in the liquid. The liquid can be selected from the group consisting of water, alcohol, ketone, and any combination thereof. The magnetic particles are comprised of a material selected from the group consisting of iron, cobalt, nickel, and any combination alloy thereof. Preferably, the magnetic particles are nano-sized particles. A diameter of each nano-sized particle is in the range from 1 to 100 nanometers. A percent by mass of the magnetic particles to the coolant is in the range from 0.1 percent to 3 percent.
The coolant 50 further includes a plurality of thermally conductive particles. The thermally conductive particles are comprised of a material selected from the group consisting of copper, aluminum, gold, silver, zinc oxide, copper oxide, aluminum oxide, aluminum nitride, boron nitride, and any combination thereof. Preferably, the thermally conductive particles are nano-sized particles. The coolant 50 further includes a dispersant for preventing aggregation of the thermally conductive particles and the magnetic particles.
The heat-absorbing unit 20 is thermally coupled to a heat-generating component 60. In operation, the heat-generating component 60 generates heat. The coolant 50 flows through the pipe 40 to cool the heat-absorbing unit 20 and then discharges heat in the heat-dissipating unit 30, and the cycle repeats. The heat-generating component 60 can be an electronic component such as a CPU (central processing unit) or an IC (integrated chip) package. The heat-dissipating unit 30 can be a heat exchanger.
Referring to
The electromagnets 24, 24′ can provide a magnetic field surrounding the heat-absorbing unit 20. The magnetic particles of the coolant 50 in the heat-absorbing unit 20 are moved along the direction of the magnetic field by a magnetic force. The movement of the magnetic particles also causes the coolant 50 to move. Thereby, the coolant 50 flows turbulently and thus improves conductivity in the coolant 50 by improving the probability of collision between the molecules. The thermal conductivity of the coolant 50 is thus improved and the thermal resistance between the coolant 50 and the heat-absorbing unit 20 is thus decreased. Accordingly, the efficiency of the liquid cooling system 10 is increased.
The electromagnets 24, 24′ are configured for generating a magnetic field, they also can be arranged at opposite sides of the heat-dissipating unit 30. The electromagnets 24, 24′ can be replaced by other magnetic field generator, such as a permanent magnet or a device which can generate a varying electrical field. The number of the magnetic field generators can be one or more. The position of the electromagnets 24, 24′ is not limited, they only need to generate a magnetic field surrounding the heat-absorbing unit 20. Preferably, the magnetic field generator is configured for providing a variable magnetic field.
Referring to
The liquid cooling system 100 is similar to the liquid cooling system 10. The difference is that two electromagnets 310, 310′ are secured to two opposite surfaces 320, 320′ of the heat-dissipating unit 300 respectively instead of the electromagnets 24, 24′ as in the first embodiment.
The electromagnets 310, 310′ can provide a magnetic field surrounding the heat-dissipating unit 300. The magnetic particles of the coolant 500 in the heat-dissipating unit 300 are moved along the direction of the magnetic field by magnetic force. The liquid molecules contiguous with the magnetic particles move together with the magnetic particles, thus setting up a flow cycle. The coolant 500 flows turbulently, thus improving the probability of collision between molecules. The thermal conductivity of the coolant 500 can be improved and the thermal resistance between the coolant 500 and the heat-absorbing unit 200 can be decreased. Accordingly, the efficiency of the liquid cooling system 100 can be increased.
In another embodiment, the heat-absorbing unit and the heat dissipating unit can be disposed in the magnetic fields and such configuration should be considered to be within the scope of the present invention.
It is understood that the above-described embodiments are intended to illustrate rather than limit the invention. Variations may be made to the embodiments and methods without departing from the spirit of the invention. Accordingly, it is appropriate that the appended claims be construed broadly and in a manner consistent with the scope of the invention.
| Number | Date | Country | Kind |
|---|---|---|---|
| 200510037495.6 | Sep 2005 | CN | national |
