Number | Date | Country | Kind |
---|---|---|---|
11-272034 | Sep 1999 | JP |
Number | Name | Date | Kind |
---|---|---|---|
4576896 | Suzuki et al. | Mar 1986 | A |
5687465 | Hinata et al. | Nov 1997 | A |
6208397 | Shimodaira et al. | Mar 2001 | B1 |
6288840 | Perkins et al. | Sep 2001 | B1 |
6407183 | Shimada et al. | Jun 2002 | B1 |
Number | Date | Country |
---|---|---|
02-058527 | Feb 1990 | JP |
WO 9739380 | Oct 1997 | WO |
Entry |
---|
“HDBU (High Density Build Up) Organic Package Technology that is first in the industry to employ “Laser Via” method”, Kyocera Corporation, Feb. 15, 1999. |