Claims
- 1. A liquid crystal light modulation element comprising:a pair of substrates at least one of which is transparent; and a liquid crystal modulating layer interposed between said substrates, said liquid crystal modulating layer being provided with a liquid crystal material for light modulation and having a phase transition temperature at which said liquid crystal material changes from a liquid crystal phase to an isotropic phase, a plurality of spacers for maintaining a gap between said substrates at a predetermined size, and a plurality of resin structural nodules, a main component of each resin structural nodule being a high molecular material which has a softening temperature higher than said phase transition temperature, said resin structural nodules being arranged within a light modulating region based on a predetermined principle to support and adhere said pair of substrates.
- 2. A liquid crystal light modulation element in accordance with claim 1, wherein the softening temperature of said high molecular material is lower than softening temperatures of said substrates.
- 3. A liquid crystal light modulation element in accordance with claim 1, wherein said high molecular material is a thermoplastic high molecular material.
- 4. A liquid crystal light modulation element in accordance with claim 1, therein each of said resin structural nodules has a size in a range from 10 μm to 200 μm.
- 5. A method for manufacturing a light modulation element which contains a liquid crystal material for light modulation and having a phase transition temperature at which said liquid crystal material changes from a liquid crystal phase to an isotropic phase, said method comprising the steps of:(a) arranging spacers on at least one of a pair of substrates to provide a desired gap between said substrates, and forming resin structural nodules of a high molecular material which are thicker than a thickness of a light modulation layer on at least one of said substrates within a light modulating region based on a predetermined arrangement principle, said high molecular material having a softening temperature higher than said phase transition temperature; (b) overlaying one of said substrates on the remaining one of said substrates, with said spacers and resin structural nodules positioned therebetween, heating said pair of substrates including said resin structural nodules to a temperature above a softening temperature of said high molecular material, and applying pressure on said pair of overlaid substrates; and (c) cooling the thus heated pair of substrates to a temperature less than the softening temperature of said high molecular material.
- 6. A method for manufacturing a light modulation element in accordance with claim 5, wherein the softening temperature of said high molecular material is lower than softening temperatures of said substrates.
- 7. A method for manufacturing a light modulation element in accordance with claim 5, wherein said high molecular material is a thermoplastic high molecular material.
- 8. A method for manufacturing a light modulation element in accordance with claim 5, wherein each of said resin structural nodules has a size in a range from 10 μm to 200 μm.
Priority Claims (1)
Number |
Date |
Country |
Kind |
9-271515 |
Oct 1997 |
JP |
|
CROSS-REFERENCED APPLICATIONS
This application is a division of application Ser. No. 09/163,846, filed Sep. 30, 1998, U.S. Pat. No. 6,226,067 claiming priority from Japanese patent application No. HEI 9-271515 filed Oct. 3, 1997, the entire contents of which are hereby incorporated by reference.
US Referenced Citations (16)
Foreign Referenced Citations (4)
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JP |
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JP |
09-068698 |
Mar 1997 |
JP |
09-197412 |
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JP |