Descriptions will be given below of a first embodiment of the present invention with reference to the accompanying drawings.
As shown in
Switching elements 14 are formed on a transparent insulating substrate 11 in the array substrate 110. The first colored layers 24a, the second colored layers 24b and the third colored layers 24care disposed on the switching elements 14. Transparent pixel electrodes 30 are formed on each of the colored layers 24a, 24b and 24c, and are connected to the switching elements 14 via corresponding through holes 15. In addition, an unillustrated alignment layer is disposed on the transparent pixel electrodes 30.
The opposite substrate 120 includes: a transparent insulating substrate 21; a transparent electrode 22 made of ITO (tin-doped iridium oxide: a transparent conductive film) and disposed on the transparent insulating substrate 21; and an alignment film (not illustrated) disposed on the transparent electrode 22. With above-described structure, a display area 40 for displaying an image is formed, and a BM (black matrix) layer 27 is formed on the outer periphery of the display area 40.
It should be noted that a pixel (not illustrated) is disposed on each of intersections of a plurality of scanning lines and a plurality of signal lines in the display area 40 of the liquid crystal display device. Each pixel includes the first colored layer 24a, the second colored layer 24b and the third colored layer 24c, and the display area 40 is configured of an aggregate of the pixels each taken as the minimum unit.
Next, descriptions will be given of a process for manufacturing the liquid crystal display device according to the embodiment.
Firstly, a process for manufacturing the array substrate 110 will be described.
The switching elements are formed on the transparent insulating substrate 11, and then a red liquid resist is applied by spin coating to the surface of the transparent insulating substrate 11 with the switching elements formed thereon. The resultant substrate thus coated is pre-baked at a temperature of approximately 90° C. for approximately 5 minutes. The resultant substrate thus pre-baked is then exposed to ultraviolet rays with an intensity of 150 mJ/cm2 by using a predetermined mask pattern.
In the mask pattern of this embodiment shown in
Specifically, when (n, m) denotes the coordinates of a pixel having a grid square formed therein, grid squares are not formed, that is, grids are omitted from pixels of (n−1, m−2), (n−1, m−1), (n−1, m), (n−1, m+1), (n−1, m+2), (n+1, m−2) (n+1, m−1), (n+1, m), (n+1, m+1) and (n+1, m+2).
In terms of the application of a color liquid resist by spin coating, when the size of the transparent insulating substrate 11 is approximately 400 mm square, it is possible to obtain a favorable coating result. Moreover, the size of the transparent insulating substrate 11 is sometimes larger than the above one in accordance with the application of the liquid crystal display device. In such a case, it is preferable that the size of the transparent insulating substrate 11 be approximately 800 to 900 mm square or more.
Subsequently, the resist thus applied is developed for approximately 40 minutes by using an aqueous solution of approximately 0.1 percent by weight of TMAH (tetramethylammonium hydroxide). Then, the resultant resist thus developed is washed with water, and is then post-baked for approximately 1 hour at a temperature of approximately 200° C., so that a red colored layer, which is the first colored layer 24a, is formed.
After that, the second colored layer 24b and the third colored layer 24c are formed respectively by use of a blue liquid resist and a green liquid resist in the same process as that of the case of the first colored layer 24a.
Thereafter, ITO (tin-doped indium oxide: a transparent conductive film) is deposited on the colored layers 24a, 24b and 24c by means of a sputtering method, followed by patterning, so that the transparent pixel electrodes 30 are formed.
A light shield (the BM layer) is formed by using a black resin in the same way as those of the colored layers 24a, 24b and 24c, and columnar spacers 31 are then formed by using a transparent resin. Thereafter, a material for the alignment layer, which is made of polyimide, is applied to the entire surface of the substrate, and the alignment layer is formed by performing an alignment treatment thereon. Consequently, the array substrate 110 is manufactured.
Next, descriptions will be given below of a process for manufacturing the opposite substrate 120.
ITO is deposited on the transparent insulating substrate 21 by means of the sputtering method so as to form the transparent electrode 22. Then, the material for the alignment layer, which is made of polyimide, is applied to the entire surface of the substrate, and the alignment layer is formed by performing the alignment treatment thereon. Consequently, the opposite substrate 120 is manufactured.
Next, the seal 26 is applied to a vicinity of the outer periphery of the opposite substrate 120 except the portion of the inlet 32 for injecting a liquid crystal (refer to
Subsequently, a nematic liquid crystal material to which a chiral material is added is injected into the cell from the inlet 32 in a vacuum state. After the injection, the inlet 32 is sealed by using an ultraviolet curing resin serving as the sealing material 33, and then polarizing plates are disposed on both sides of the cell. Consequently, the liquid crystal display device is completed.
Specifically, the first colored layer 24a is formed with the stripe pattern in the first process for manufacturing a liquid crystal display device, and then the second colored layer 24b is formed on the first colored layer 24a by using the spin coater (the spin coating method) in the next process. At this time, as shown in
In particular, on a chip disposed on a vicinity of a resist substrate, as shown in
In addition, suppose a case where the first colored layer has the grid pattern expanding in the vertical and horizontal directions, as shown in
The angle at which the coating unevenness occurs is largely affected by the alignment and the pixel pitch of the grid pattern. This is because the number of grid squares to be run over by the resist in each unit distance increases. In the case of the grid pattern shown in
When a color resist is applied by the spin coater, as shown in
On the other hand, the liquid crystal display device according to this embodiment has a structure in which some of grid squares of the first colored layer are omitted, and in which each of the grid squares is thus not adjacent to other grid squares. With this structure, this embodiment makes it possible to prevent the coating unevenness as shown in
In the case of the mask pattern of the first colored layer in which the pixel pitch is 70 μm, when a color liquid resist having a low viscosity is used, the type (1) of the normal grid pattern has an occurrence rate of unevenness of 35%, while the type (2) of this embodiment has an improved occurrence rate of unevenness of 12.00%.
Even when a color liquid resist having a high viscosity is used, the type (1) of the normal grid pattern has an occurrence rate of unevenness of 35%, while the type (2) of this embodiment has an improved occurrence rate of unevenness of 19.00%.
Even the type (3) of the normal grid pattern in which the pixel pitch is 75 μm has an occurrence rate of unevenness of 33.00% when a color liquid resist having a low viscosity is used, and has an occurrence rate of unevenness of 30% when a color liquid resist having a high viscosity is used. On the other hand, the type (2) of this embodiment has the improved occurrence rates of unevenness of 12.00% and 19.00%.
Incidentally, by setting the pixel pitch at a large value, such as 80 μm of the type (4), or 90 μm of the type (5), it is also possible to reduce the occurrence rate of unevenness to a low value, such as 7.00% and 0.50%. However, when the pixel pitch is set at a large value, it is difficult to achieve a fine image quality, which can be achieved by using a fine pixel pitch, such as 70 μm.
In the first embodiment, the mask pattern of the first colored layer 24a shown in
Alternatively, another mask pattern may be used, in which grid squares are omitted in at least pixels of (n−1, m), (n+1, m), (n−1, m−1), (n−1, m+1), (n+1, m−1) and (n+1, m+1) when (n, m) denotes the coordinates of a pixel having a grid square formed therein.
Even by using one of these patterns, it is possible to prevent coating unevenness of colored layers from occurring as in the case of the first embodiment. Accordingly, it is possible to prevent deterioration of image quality, and to thus provide a liquid crystal display device with a high yield.
In the mask pattern of this embodiment, as shown in
Specifically, when (n, m) denotes the coordinates of a pixel having a grid square formed therein, grid squares are omitted in pixels of (n−1, m−2), (n−1, m−1), (n−1, m), (n−1, m+1), (n−1, m+2), (n−1, m+3), (n+1, m−2), (n+1, m−1), (n+1, m), (n+1, m+1), (n+1, m+2) and (n+1, m+3), and concurrently grid squares are formed in pixels of (n, m+1).
Since the configuration and manufacturing method of a liquid crystal display device of the second embodiment are the same as those of the first embodiment, descriptions of those are omitted.
The liquid crystal display device of the second embodiment has a structure in which some of grid squares of the first colored layer are omitted, and that each of the grid squares is thus not adjacent to other grid squares. With this structure, this embodiment makes it possible to prevent the coating unevenness as shown in
In the second embodiment, the mask pattern of the first colored layer 24a shown in
Alternatively, another mask pattern may be used, in which grid squares are omitted in at least pixels (n−1, m), (n+1, m), (n−1, m−1), (n−1, m+1), (n−1, m+2), (n−1, m+3), (n+1, m1), (n+1, m+1), (n+1, m+2) and (n+1, m+3) when (n, m) denotes the coordinates of a pixel having a grid square formed therein, and concurrently in which grid squares are formed in pixels of (n, m+1) and (n, m+2).
Otherwise, still another mask pattern may be used, in which grid squares are omitted in at least pixels of (n−1, m), (n+1, m), (n−1, m−1), (n+1, m−1), (n−1, m+1), (n−1, m+2), . . . , (n−1, m+a (a is an integer not less than 3)), (n−1, m+a+1), (n+1, m+1), (n+1, m+2), . . . , (n+1, m+a) and (n+1, m+a+1) when (n, m) denotes the coordinates of a pixel having a grid square formed therein, and concurrently in which grid squares are formed in pixels of (n, m+1), (n, m+2), . . . , (n, m+a).
Even by using one of these patterns, it is possible to prevent coating unevenness of colored layers from occurring as in the cases of the first and second embodiments. Accordingly, it is possible to prevent deterioration of image quality, and to thus provide a liquid crystal display device with a high yield.
Number | Date | Country | Kind |
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2006-235963 | Aug 2006 | JP | national |