Patent Application
20190033658
The subject matter herein generally relates to displays, and a light crystal display module.
Generally, a liquid crystal display module includes a light source and a liquid crystal display panel. Light emitted from the light source is incident on the liquid crystal display panel. The light source and the liquid crystal display panel are two independent components. The liquid crystal display module with the light source and the liquid crystal display panel has a large thickness. Reducing the thickness of a liquid crystal display module has been problematic.
Implementations of the present technology will now be described, by way of example only, with reference to the attached figures.
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features of the present disclosure.
Several definitions that apply throughout this disclosure will now be presented. The term “comprising” means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in a so-described combination, group, series and the like. The term “coupled” is defined as connected, whether directly or indirectly through intervening components, and is not necessarily limited to physical connections. The connection can be such that the objects are permanently connected or releasably connected.
Referring to
The thin film transistor array substrate 101 has a first surface 101a and a second surface 101b. The thin film transistor array substrate 101 comprises a circuit structure 105 and a plurality of thin film transistors 106. The circuit structure 105 is formed on the first surface 101a. The thin film transistors 106 are formed on the second surface 101b. The circuit structure 105 electrically connects to the thin film transistors 106. In at least one embodiment, the circuit structure 105 can electrically connect to the thin film transistors 106 through wires (not shown). In other embodiments, a plurality of holes (not shown) can be defined in the thin film transistor array substrate and can receive conductors (not shown) for electrically connecting the circuit structure 105 and the thin film transistors 106.
The first surface 101a faces the light emitting diode chips 104. The second surface 101b faces the liquid crystal layer 102. The light emitting diode chips 104 are adhered on the first surface 101a. Each light emitting diode chip 104 has a light emitting surface 104a. Light emitted from the light emitting surfaces 104a of the light emitting diode chips 104 is incident on the first surface 101a of the thin film transistor array substrate 101.
In at least one embodiment, each light emitting surface 104a of the light emitting diode chip 104 faces the first surface 101a. Each light emitting diode chip 104 is electrically connected to the circuit structure 105 by wire bonding.
In at least one embodiment, referring to
The liquid crystal display module 10 further comprises a reflecting board 108. Light emitted from the light emitting diode chip 104 is reflected by the reflecting board 108 to be incident on the first surface 101a of the thin film transistor array substrate 101.
The liquid crystal display module 10 further comprises a plurality of fluorescent covers 107. Each fluorescent cover 107 covers one light emitting diode chip 104. Light emitted from the light emitting diode chip 104 is incident on the fluorescent cover 107 and passes through the fluorescent cover 107, then is incident on the reflecting board 108, and is reflected by the reflecting board 108 to be incident on the first surface 101a of the thin film transistor array substrate 101.
In at least one embodiment, referring to
The fluorescent cover 107 and the fluorescent layer 109 can be made from a light conversion layer. The light conversion layer can comprise quantum dots or at least one of R/G/B phosphors. The R phosphors are red phosphors. The R phosphors can be made of KSF (K2(SiF6):Mn4+), SLA(Sr(LiAl3N4):Eu2+), or SiAlON (SiAlON:Eu2+). The G phosphors are green phosphors. The G phosphors can be made of nitrides phosphor, oxy-Nitrides phosphor, carbo/carbido-nitrides phosphor, silicates phosphor, oxy/ortho-silicates phosphors, or CaAlSiN3:Eu2+. The B phosphors are blue phosphors.
In at least one embodiment, referring to
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It is to be understood, even though information and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the present embodiments, the disclosure is illustrative only; changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the present embodiments to the full extent indicated by the plain meaning of the terms in which the appended claims are expressed.
