Claims
- 1. A method of manufacturing a liquid crystal panel including an active matrix substrate, another substrate facing the active matrix substrate and liquid crystal intervening between the two substrates, comprising:an active matrix substrate preparation step of forming connecting electrodes of aluminum or an alloy mainly composed thereof, forming, in an anodic oxidization or hot water process, an insulating film of aluminum oxide or consisting of a laminate film of aluminum oxide and aluminum hydroxide, forming a protective insulating film on the connecting electrodes, and forming the protective insulating film with terminal contact holes reaching the insulating film formed on the connecting electrodes; the insulating film formed on the connecting portions of the connecting electrodes being selectively removed in a step subsequent to the final step in a subsequent liquid crystal display panel manufacturing process.
- 2. The method of manufacturing a liquid crystal display panel according to claim 1, wherein the insulating film has a thickness of at least 100 nm.
- 3. A method of manufacturing a liquid crystal panel including an active matrix substrate, another substrate facing the active matrix substrate and liquid crystal intervening between the two substrates, comprising:an active matrix substrate preparation step of forming connecting electrodes of aluminum of an alloy mainly composed thereof, and forming, by an anodic oxidization or hot water process, an insulating film of aluminum oxide or an insulating film consisting of a laminate film of aluminum oxide and aluminum hydroxide on the connecting electrodes; the insulating film formed on the connecting portions of the connecting electrodes being selectively removed in a step subsequent to the final step in a subsequent liquid crystal panel manufacturing step.
- 4. The method of manufacturing a liquid crystal display panel according to claim 3, wherein the insulating film has a thickness of at least 100 nm.
Priority Claims (1)
Number |
Date |
Country |
Kind |
10-008718 |
Jan 1998 |
JP |
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Parent Case Info
This is a divisional of application Ser. No. 09/771,654 (Confirmation No. 8400) filed Jan. 30, 2001, the disclosure of which is incorporated herein by reference, which is a divisional of application Ser. No. 09/233,961 filed Jan. 20, 1999 (U.S. Pat. No. 6,259,495).
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