The present application claims priority from Japanese Patent Application No. 2019-015392 filed on Jan. 31, 2019, the disclosure of which is incorporated herein by reference in its entirety.
The present disclosure relates to a liquid discharge head provided with two pressure chamber groups, and a return channel provided between pressure chambers included in the two pressure chamber groups.
There is a publicly known liquid discharge head provided with two pressure chamber groups, and a return channel provided between pressure chambers of the two pressure chamber groups. This publicly known liquid discharge head is provided with return connecting channels which are provided for the pressure chambers, respectively, and each of which connects one of the pressure chambers to the return channel.
In the above-described liquid discharge head, the height of an upper surface of each of the return connecting channels is lower than the height of an upper surface of one of the pressure chambers. In this configuration, in a case that the liquid flows from each of the pressure chambers to the return channel via one of the return connecting channels, any air bubble(s) in the liquid might be caught at any stepped portion between the upper surface of each of the pressure chambers and the upper surface of one of the return connecting channels, and might remain inside each of the pressure chambers.
An object of the present disclosure is to provide a liquid discharge head capable of suppressing the problem of the air bubble(s) remaining inside the pressure chamber.
According to an aspect of the present disclosure, there is provided a liquid discharge head including: a plurality of pressure chambers forming a first pressure chamber group and a second pressure chamber group, the first pressure chamber group including a part of the pressure chambers aligned in a first direction orthogonal to a vertical direction, and the second pressure chamber group including another part of the pressure chambers aligned in the first direction, the second pressure chamber group being arranged side by side relative to the first pressure chamber group in a second direction orthogonal to the vertical direction and crossing the first direction; a return channel extending in the first direction between, in the second direction, the pressure chambers included in the first pressure chamber group and the pressure chambers included in the second pressure chamber group; and a plurality of return connecting channels each connecting the return channel and one of the plurality of pressure chambers to each other. A height of an upper surface of each of the plurality of return connecting channels is not less than a height of an upper surface of one of the plurality of pressure chambers which is connected to the return channel by each of the plurality of return connecting channels.
At first, the overall configuration of a printer 100 provided with a head 1 according to a first embodiment of the present disclosure will be explained, with reference to
The printer 100 is provided with a head unit 1X including four heads 1, a platen 3, a conveying mechanism 4, and a controller 5.
A paper sheet (sheet) 9 is placed on the upper surface of the platen 3.
The conveying mechanism 4 has a pair of two conveying rollers 4a and 4b arranged side by side in a conveyance direction, with the platen 3 being sandwiched between the pair of conveying rollers 4a and 4b in a conveyance direction. In a case that a conveying motor 4m (see
The head unit 1x is elongated in a paper width direction (which is a direction orthogonal to both of the conveying direction and a vertical direction); the head unit 1x is a line head which discharges or jets an ink from nozzles 21 (see
The controller 5 has a ROM (Read Only Memory), a RAM (Random Access Memory), and an ASIC (Application Specific Integrated Circuit). The ASIC executes a recording processing, etc., based on a program stored in the ROM. In the recording processing, the controller 5 controls a driver IC 1d of each of the heads 1 and a conveying motor 4m (see
Next, the configuration of each of the heads 1 will be explained, with reference to
As depicted in
The channel substrate 11 is formed with a first supply channel 31, a second supply channel 32, a return channel 33, a plurality of pressure chambers 20, a plurality of supply connecting channels 25, a plurality of return connecting channels 26 and a plurality of nozzles 21.
The plurality of pressure chambers 20 are arranged (aligned) in a staggered manner in the paper width direction (first direction) as depicted in
The first supply channel 31, the second supply channel 32 and the return channel 33 each extend in the first direction. The return channel 33 is arranged between the first supply channel 31 and the second supply channel 32, in the second direction. The pressure chambers 20 included in the plurality of pressure chambers 20 and belonging to the first pressure chamber group 20A are arranged between the first supply channel 31 and the return channel 33 in the second direction. The pressure chambers 20 included in the plurality of pressure chambers 20 and belonging to the second pressure chamber group 20A are arranged between the return channel 33 and the second supply channel 32 in the second direction. In the second direction, the return channel 33 is arranged between the pressure chambers 20 included in the plurality of pressure chambers 20 and belonging to the first pressure chamber group 20A and the pressure chambers 20 included in the plurality of pressure chambers 20 and belonging to the second pressure chamber group 20A.
A width W33 of the return channel 33 is greater than any one of a width W31 of the first supply channel 31 and a width W32 of the second supply channel 32. The width W31 of the first supply channel 31 and the width W32 of the second supply channel 32 are same to each other (mutually same). This configuration is made while considering that the number of the pressure chambers 20 communicating with the return channel 33 is twice the numbers of the pressure chambers 20 communicating with each of the first and second supply channels 31 and 32; and that an amount of the ink flowing through the return channel 33 is twice an amount of the ink flowing through each of the first and second supply channels 31 and 32.
The first supply channel 31 and the second supply channel 32 are communicated with a storage chamber 7a of a subs tank 7 via a supply port 31x and a supply port 32x, respectively. The return channel 33 is communicated with the storage chamber 7a via a return port 33x. The supply ports 31x and 32x are formed in end parts, respectively, on one side in the first direction (lower side in
The storage chamber 7a is communicated with a main tank (not depicted in the drawings) configured to store an ink, and stores the ink supplied from the main tank.
Each of the plurality of pressure chambers 20 has a substantially rectangular shape which is elongated in the second direction, in a plane orthogonal to the vertical direction. One of the plurality of nozzles 21 is formed in a substantially central part, of each of the plurality of pressure chambers 20A, in this plane. Further, one of the plurality of supply connecting channels 25 and one of the plurality of return connecting channels 26 are connected to one end and the other end in the second direction, respectively, of each of the plurality of pressure chambers 20.
Each of the plurality of supply connecting channels 25 connects one of the plurality of pressure chambers 20 and the first supply channel 31 or the second supply channel 32 to each other. Each of the return connecting channels 26 connects one of the plurality of pressure chambers 20 and the return channel 33 to each other. Each of the pressure chambers 20 included in the plurality of pressure chambers 20 and belonging to the first pressure chamber group 20A is communicated with the first supply channel 31 via one of the plurality of supply connecting channels 25. Each of the pressure chambers 20 included in the plurality of pressure chambers 20 and belonging to the second pressure chamber group 20B is communicated with the second supply channel 32 via one of the plurality of supply connecting channels 25. The pressure chambers 20 belonging to the first pressure chamber group 20A and the pressure chambers 20 belonging to the second pressure chamber group 20B are each communicated with the return channel 33 via the plurality of return connecting channels 26, respectively.
Here, each of the plurality of supply connecting channels 25 extends in the second direction, whereas each of the plurality of return connecting channels 26 extends in an oblique direction (a direction orthogonal to the vertical direction and crossing with respect to both of the first and second directions). Further, a width W25 of each of the supply connecting channels 25 and a width W26 of each of the return connecting channels 26 are smaller than a width W20 of each of the pressure chambers 20. The width W25 of the supply connecting channel 25 and the width W26 of the return connecting channel 26 are mutually same.
The channel substrate 11 has three plates 11a, 11b and 11c, and two nozzle plates 11d1 and 11d2, as depicted in
The three plates 11a, 11b and 11c are stacked on top of one another in the vertical direction. The nozzle plates 11d1 and 11d2 are adhered to the plate 11c which is the lowermost layer among the three plates 11a, 11b and 11c. The nozzle plates 11d1 and 11d2 are separated from each other, and are each constructed of a plate having a substantially rectangular shape which extends in the first direction.
Each of the plurality of nozzles 21 is constructed of one of through holes formed in the nozzle plate 11d1 or 11d2, and is open in the lower surface of the channel substrate 11. The nozzle plate 11d1 is formed with nozzles 21 which are included in the plurality of nozzles 21 and which correspond respectively to the pressure chambers 20 belonging to the first pressure chamber group 20A. The nozzle plate 11d2 is formed with nozzles 21 which are included in the plurality of nozzles 21 and which correspond respectively to the pressure chambers 20 belonging to the second pressure chamber group 20B.
The actuator substrate 12 includes, in an order from the lower side, a vibration plate 12a, a common electrode 12b, a plurality of piezoelectric bodies 12c and a plurality of individual electrodes 12d.
The vibration plate 12a is arranged substantially on the entirety of the upper surface of the channel substrate 11, and covers all of the plurality of pressure chambers 20, the plurality of supply connecting channels 25, the plurality of return connecting channels 26, the first supply channel 31 and the second supply channel 32 which are formed in the channel substrate 11. The common electrode 12b and the plurality of piezoelectric bodies 12c are provided on each of the pressure chamber groups 20A and 20B, and are arranged so as to straddle over the pressure chambers 20 belonging to each of the pressure chamber groups 20A and 20B. The plurality of individual electrodes 12d are provided on the plurality of pressure chambers 20, respectively, and overlap with the plurality of pressure chambers 20, respectively, in the vertical direction.
The common electrode 12b and the plurality of individual electrodes 12d are electrically connected to the driver IC 1d (see
The protective substrate 13 is adhered to the upper surface of the vibration plate 12, and is arranged at a position at which the protective substrate 13 sandwiches the actuator substrate 12 in the vertical direction between the channel substrate 11 and the protective substrate 13. The protective substrate 13 is constructed of a material (Silicon, etc.) of which rigidity is higher than any one of the plates 11a, 11b, 11c, 11d1 and 11d2 constructing the channel substrate 11.
Two concave parts 13x are formed in the lower surface of the protective substrate 13. The two concave parts 13x each extend in the first direction; one of the two concave parts 13x overlaps, in the vertical direction, with the pressure chambers 20 belonging to the pressure chamber group 20A, and the other of the two concave parts 13x overlaps, in the vertical direction, with the pressure chambers 20 belonging to the pressure chamber group 20B. Actuators 12x which are included in the plurality of actuators 12x and which correspond to the pressure chamber group 20A and actuators 12x which are included in the plurality of actuators 12x and which correspond to the pressure chamber group 20B are accommodated or stored in the two concave parts, respectively.
In the lower surface of the protective substrate 13, a convex part 13y is formed at a location which is between the two concave parts 13x in the second direction. The convex part 13y extends in the first direction, and overlaps, in the vertical direction, with the returning channel 33 and the plurality of return connecting channels 26 corresponding to both of the first pressure chamber group 20A and the second pressure chamber group 20B.
In a part of the convex part 13y and a part of the vibration plate 12a, which overlap with the return channel 33 in the vertical direction, are subjected to cutting by means of an etching processing, etc. This cut part of the vibration plate 12a is formed with a through hole, and the cut part of the convex part 13y is formed with a recessed part 13ya.
For example, in a production step of the head 1, the vibration plate 12a is formed with a film of silicon dioxide by using, as the plate 11a, a substrate made of a silicon single crystal and by oxidizing a surface of the silicon single crystal substrate. Afterwards, through holes are formed in the silicon single crystal substrate and the vibration plate 12a at locations thereof, respectively, corresponding to the recessed part 13ya. Then, the common electrode 12b is formed on the vibration plate 12a present in the surface of the silicon single crystal substrate, the piezoelectric bodies 12c are formed on the common electrode 12b, and the individual electrodes 12d are formed on the piezoelectric bodies 12, respectively. Further, after forming a protective film and a wiring for the electrodes 12a and 12b, the protective substrate 13 having the recessed part 13ya previously formed therein by means of the etching processing, etc., is adhered to the vibration plate 12a arranged on the surface of the silicon single crystal substrate. Note that in a case of forming the recessed part 13ya, it is preferred that the depth (length in the vertical direction) of the recessed part 13ya is not too deep, so as to suppress any decrease in the rigidity of the protective substrate 13. For example, it is preferred to performing the cutting to form the recessed part 13ya so that the depth of the recessed part 13ya is not deeper than the depth (in a range of approximately 120 μm to approximately 30 μm) of the pressure chamber 20. Then, in a state that the surface, in the silicon single crystal substrate, formed with the vibration plate 12, is supported by the protective substrate 13, the back surface of the silicon single crystal substrate is polished until the silicon single crystal substrate has a predetermined thickness; and then through holes constructing the pressure chambers 20, etc., are formed by the etching processing, etc. With this, the plate 11a is completed, and the head 1 is completed by further adhering the plates 11b, 11c, 11d1 and 11d2 which have been subjected to the etching processing, etc., to the lower surface of the plate 11a.
The return channel 33 is constructed of the through holes formed in the plates 11a, 11b and 11c, the above-described through hole formed in the vibration plate 12, and the recessed part 13ya formed in the convex part 13y. The upper surface of the return channel 33 is defined by the bottom surface of the recessed part 13ya in the convex part 13y. The lower surface of the return channel 33 is defined by a return damper film 33d.
Each of the first supply channel 31 and the second supply channel 32 is constructed of through holes formed in the plates 11a, 11b and 11c, respectively. The upper surfaces of the first supply channel 31 and the second supply channel 32 are defined by the vibration plate 12. The bottom surface of the first supply channel 31 and the bottom surface of the second supply channel 32 are defined by a first supply damper film 31d and a second supply damper film 32d, respectively.
The return damper film 33d is located, in the second direction, between the nozzle plate 11d1 and the nozzle plate 11d2. The first supply damper film 31d and the second supply damper film 32d sandwich, in the second direction, the nozzle plates 11d1 and 11d2 and the return damper film 33d therebetween.
In the production step of the head 1, the nozzle plates 11d1 and 11d2 for which a high positional precision is required are firstly adhered to the lower surface of the plate 11c, and then the damper films 31d, 32d and 33d are adhered to the lower surface of the plate 11c.
The damper films 31d, 32d and 33d cover the entireties of the lower surfaces of the channels 31, 32 and 33, respectively. Here, since the width W33 of the return channel 33 is greater than any one of the width W31 of the first supply channel 31 and the width W32 of the second supply channel 32, a size (width) of the return damper film 33d is made greater than any one of a size (width) of the first supply damper film 31d and a size (width) of the second supply damper film 32d. Further, although the damper films 31d, 32d and 33d are formed of a same material (polyimide, etc.), the thickness of the return damper film 33d is smaller than any one of the thickness of the first supply damper film 31d and the thickness of the second supply damper film 32d. Therefore, the Young's module of the return damper film 33d is lower than any one of the Young's module of the first supply damper film 31d and the Young's module of the second supply damper film 32d.
Each of the plurality of pressure chambers 20 is constructed of through holes formed in the plates 11a, 11b and 11c, respectively. The upper surface of each of the plurality of pressure chambers 20 is defined by the vibration plate 12a. The lower surfaces of the pressure chambers 20 belonging to the first pressure chamber group 20A are defined by the nozzle plate 11d1. The lower surfaces of the pressure chambers 20 belonging to the first pressure chamber group 20B are defined by the nozzle plate 11d2.
The plurality of supply connecting channels 25 are defined by through holes, respectively, formed in the plate 11a. The upper surfaces of the plurality of supply connecting channels 25 are defined by the vibration plate 12a. The lower surfaces of the plurality of supply connecting channels 25 are defined by the plate 11b.
The plurality of return connecting channels 26 are defined by through holes, respectively, formed in the plate 11a. The upper surfaces of the plurality of return connecting channels 26 are defined by the vibration plate 12a. The lower surfaces of the plurality of return connecting channels 26 are defined by the plate 11b.
The heights of the upper surfaces are constant or uniform from each of the supply channels 31 and 32, the plurality of supply connecting channels 25, the pressure chambers 20 and up to the plurality of return connecting channels 26, whereas the height of the upper surface of the return channel 33 is made to be higher than the heights of the upper surfaces of the pressure chambers 20, etc.
The supply channels 31 and 32, and the pressure chambers 20 have depths (lengths in the vertical direction) which are same to one another (mutually same), and have the heights of the upper surfaces and the heights of the lower surfaces which are mutually same. The plurality of supply connecting channels 25 and the plurality of return connecting channels 26 have depths (lengths in the vertical direction) which are mutually same, have the depths which are smaller than those of the supply channels 31 and 32 and the pressure chambers 20, and the lower surfaces which are located at positions, respectively, higher than those of the supply channels 31 and 32 and the pressure chambers 20. The return channel 33 has a depth greater than those of the supply channels 31 and 32 and the pressure chamber 20, and the height of the lower surface of the return channel 33 is same to those of the supply channels 31 and 32 and the pressure chambers 20. The return channel 33, however, has a height of the upper surface which is higher than those of the supply channel 31 and 32 and the pressure chambers 20.
Each of the nozzles 21 is located immediately below one of the pressure chambers 20, and is provided on a part, in the lower surface of one of the pressure chambers 20 (in the present embodiment, each of the nozzles 21 is located at a central part in the second direction in the lower surface of one of the pressure chamber 20), which is separated away from an end in the second direction in the lower surface of one of the pressure chambers 20 (an end, in the second direction in the lower surface of one of the pressure chambers 20, to which each of the plurality of return connecting channels 26 is connected).
In a case that the ink is circulated between the sub tank 7 and the channel substrate 11 in the above-described channel configuration, the ink flows inside the channel substrate 11 in the following manner. Bold arrows in
The circulation pump 7p is driven by the control performed by the controller 5, thereby causing the ink inside the storage chamber 7a to be supplied to the first supply channel 31 and the second supply channel 32 via the supply port 31x and the supply port 32x, respectively. The ink supplied to each of the supply channels 31 and 32 moves inside each of the supply channels 31 and 32 from one side (lower side in
By allowing the ink to circulate between the sub tank 7 and the channel substrate 11 in such a manner, it is possible to realize the removal of any air bubble(s) in the channel(s) formed in the channel substrate 11 and/or to prevent any increase in the viscosity of the ink in the channel(s) formed in the channel substrate 11. Further, in a case that the ink contains a sediment component (a component which might sediment or settle; a pigment, etc.), such a sediment component is agitated, which in turn prevents any sedimentation of the sediment component from occurring.
As described above, according to the present embodiment, the height of the upper surface of each of the plurality of return connecting channels 26 is not less than (in the present embodiment, at the same height as) the height of the upper surface of a pressure chamber 20 included in the plurality of pressure chambers 20 and corresponding thereto (a pressure chamber 20 included in the plurality of pressure chambers 20 and to which each of the plurality of return connecting channels 26 is connected; or a pressure chamber 20 included in the plurality of pressure chambers 20 and which is connected to the return channel 33 by each of the plurality of return connecting channels 26) (see
The height of the upper surface of the return channel 33 is higher than any of the heights of the upper surfaces of the plurality of pressure chambers 20 (see
The protective substrate 13 has the rigidity which is higher than that of the channel substrate 11, and has the convex part 13y at the part thereof overlapping, in the vertical direction, with the return channel 33 (See
The convex part 13y overlaps not only with the return channel 33 but also with the plurality of return connecting channels 26 in the vertical direction (see
Each of the plurality of return connecting channel 26 extends in the oblique direction (the direction orthogonal to the vertical direction and crossing both of the first and second directions) (see
The width W26 of each of the return connecting channels 26 is smaller than the width W20 of one of the pressure chambers 20 corresponding thereto (see
The head 1 is provided with the return damper film 33d defining the return channel 33 (see
The area of the return damper film 33d is greater than the area of the first supply damper film 31d and greater than the area of the second supply damper film 32d (see
The Young's module of the return damper film 33d is lower than any one of the Young's module of the first supply damper film 31d and the Young's module of the second supply damper film 32d. In the present embodiment, the return damper film 33d is formed of silicon, and the Young's module of the return damper film 33d is approximately 70 GPa. In contract, the first supply damper film 31d and the second supply damper film 32d are each formed of SUS, and the Young's module of each of the first and second supply damper films 31d and 32d is approximately 200 GPa. In this case, the Young's module of the return damper film 33d provided on the one return channel 33 is allowed to be low and thus makes the return damper film 33d to be easily bendable (flexible), thereby making it possible to adjust, in a more ensured manner, the balance of the damping performance(s) in the channels 31 to 33 as a whole.
The thickness of the return damper film 33d is smaller than any one of the thickness of the first supply damper film 31d and the thickness of the second supply damper film 32d. In this case, it is possible to easily realize the requirement that the Young's module of the return damper film 33d is low.
The return damper film 33d defines the lower surface of the return channel 33 (see
The nozzles 21 communicating respectively with the pressure chambers 20 belonging to the first pressure chamber group 20A, and the nozzles 21 communicating respectively with the pressure chambers 20 belonging to the second pressure chamber group 20 are individually formed in the two nozzle plates 11d1 and 11d2, respectively (see
The height of the lower surface of each of the plurality of return connecting channels 26 is higher than the height of the lower surface, of one of the plurality of pressure chambers 20, to which each of the plurality of return connecting channels 15 corresponds; and each of the plurality of nozzles 21 is provided on a part, in the lower surface of one of the plurality of pressure chambers 20, to which each of the plurality of nozzles 21 corresponds, the part in the lower surface being separated away from the one end in the second direction (one end to which one of the plurality of return connecting channels 26 is connected) in the lower surface of one of the plurality of pressure chambers 20 with which each of the plurality of nozzles 21 corresponds (see
Next, a head 201 according to a second embodiment of the present disclosure will be explained, with reference to
The second embodiment is different from the first embodiment in the configuration of the channels formed in the channel substrate.
In the following, only a part or portion, a configuration, etc., which are different from those of the first embodiment will be explained, whereas an explanation for a part, element or component of which configuration is similar to that in the first embodiment will be omitted.
In the second embodiment, as depicted in
Each of the plurality of connecting channels 222 extends downward from one end in the second direction of one of the plurality of pressure chambers 220, and connects one of the pressure chambers 220 and one of the plurality of nozzles 221 to each other. Each of the plurality of nozzles 221 is positioned immediately below one of the plurality of connecting channels 220, rather than immediately below one of the plurality of pressure chambers 220. Further, as depicted in
As depicted in
An actuator substrate 212 has, in an order from the lower side, a vibration plate 212a, a common electrode 12b, a plurality of piezoelectric bodies 12c and a plurality of individual electrodes 12d, similarly to the actuator substrate 12 of the first embodiment. The protective substrate 213 has a convex part 213y, similarly to the protective substrate 13 of the first embodiment. Note, however, that in the convex part 213y and the vibration plate 212a of the second embodiment, parts thereof overlapping with the return channel 33 in the vertical direction are not subjected to the cutting.
The channel substrate 211 has three plates 211a, 211b and 211c, and one nozzle plate 211d. The three plates 211a, 211b and 211c are stacked on top of one another in the vertical direction. The nozzle plate 211d is adhered to the lower surface of the plate 211c which is the lowermost layer among the three plates 211a, 211b and 211c.
Each of the plurality of nozzles 221 is constructed of one of through holes formed in the nozzle plate 211d, and is open in the lower surface of the channel substrate 111. The nozzle plate 211d is formed with the plurality of nozzles 221 which correspond, respectively, to both of pressure chambers 20 included in the plurality of pressure chambers 20 and belonging to the first pressure chamber group 20A and pressure chambers 20 included in the plurality of pressure chambers 20 and belonging to the second pressure chamber group 20B.
The return channel 233 is constructed of a through hole formed in the plate 211a. The upper surface of the return channel 233 is defined by the vibration plate 212a. The lower surface of the return channel 233 is defined by the plate 211b. Any return damper film is not provided in the second embodiment.
Each of the first supply channel 231 and the second supply channel 232 is constructed of through holes formed in the plates 211a, 211b and 211c, respectively. The upper surfaces of the first supply channel 231 and the second supply channel 232 are defined by the vibration plate 212a. The bottom surface of the first supply channel 231 and the bottom surface of the second supply channel 232 are defined by a first supply damper film 231d and a second supply damper film 232d, respectively. The first supply damper film 231d and the second supply damper film 232d cover the entireties of the lower surfaces of the first supply channel 231 and the second supply channel 232, respectively, and sandwich the nozzle plate 211d therebetween in the second direction.
In the production step of the head 201, the nozzle plate 211d for which a high positional precision is required is firstly adhered to the lower surface of the plate 211c, and then the damper films 231d and 232d are adhered to the lower surface of the plate 211c.
Each of the plurality of pressure chambers 220 and each of the plurality of return connecting channels 226 are constructed of through holes, respectively, which are formed in the plate 211a. The upper surfaces of the pressure chambers 220 and the upper surfaces of the return connecting channels 226 are defined by the vibration plate 212a. The lower surfaces of the pressure chambers 220 and the lower surfaces of the return connecting channels 226 are defined by the plate 211b.
The horizontal part 225a of each of the plurality of supply connecting channels 225 is constructed of a through hole formed in the plate 211c. The vertical part 225b of each of the plurality of supply connecting channels 225 is constructed of a through hole formed in the plate 211b. The upper surface of the horizontal part 225a is defined by the plate 211b, and the lower surface of the horizontal part 225a is defined by the first supply damper film 231d or the second supply damper film 232d. Specifically, the lower surface of the horizontal part 225a connected to each of the pressure chambers 220 belonging to the first pressure chamber group 220A is defined by the first supply damper film 231d; the lower surface of the horizontal part 225a connected to each of the pressure chambers 220 belonging to the second pressure chamber group 220B is defined by the second supply damper film 232d.
Although the heights of the upper surfaces are changed from each of the supply channels 231 and 232 up to an outlet port of one of the supply connecting channels 225 (a connection part at which the supply connecting channel 225 is connected to the pressure chamber 220), the heights of the upper surfaces are constant from each of the pressure chambers 220 up to the return channel 233 via one of the return connecting channels 226. Namely, the height of the upper surface of each of the pressure chambers 220, the height of the upper surface of one of the return connecting channels 226, and the height of the upper surface of the return channel 233 are same to one another. Further, the depth (length in the vertical direction) of each of the pressure chamber 220, the depth of each of the return connecting channels 226 and the depth of the return channel 233 are same to one another; and the height of the lower surface of each of the pressure chamber 220, the height of the lower surface of each of the return connecting channels 226 and the height of the lower surface of the return channel 233 are same to one another, as well. The depth of each of the supply channels 231 and 232 is greater than the depth of one of the pressure chambers 220, the depth of one of the return connecting channels 226 and the depth of the return channel 233; and the height of the upper surface of each of the supply channels 231 and 232 is same as the height of the upper surface of one of the pressure chamber 220, the height of the upper surface one of the return connecting channels 226 and the height of the upper surface of the return channel 233; whereas the lower surface of each of the supply channels 231 and 232 is at a location lower than the lower surface of one of the pressure chambers 220, the lower surface of one of the return connecting channels 226 and the lower surface of the return channel 233.
In a case that the ink is circulated between the sub tank 7 (see
The ink supplied to each of the supply channels 231 and 232 moves inside each of the supply channels 231 and 232 from one side (lower side in
As described above, according to the second embodiment, the following effect can be obtained, in addition to the effect based on the configuration similar to that of the first embodiment.
The height of the upper surface of each of the pressure chambers 220, the height of the upper surface of each of the return connecting channel 226, the height of the upper surface of the return channel 33 are same to one another. In this case, the pressure chambers 220, the return connecting channels 226 and the return channel 233 can be formed in a same step. For example, in the second embodiment, the pressure chambers 220, the return connecting channels 226 and the return channel 233 can be formed by forming the vibration plate 212a in the upper surface of the plate 211a, then by forming the through holes constructing the pressure chambers 220, the return connecting channels 226 and the return channel 233, respectively, in the plate 211a, and then by adhering the plate 211b to the lower surface of the plate 211a, without requiring any other steps (the step of performing the cutting for forming the convex part 213y, etc.). In such a manner, the pressure chambers 220, the return connecting channels 226 and the return channel 233 can be formed easily.
The height of the lower surface of each of the return connecting channels 226 is same as the height of the lower surface of one of the pressure chambers 220 corresponding thereto (a pressure chamber 220 which is included in the plurality of pressure chambers 220 and to which each of the return connecting channels 226 is connected; or a pressure chamber 220 included in the plurality of pressure chambers 220 and which is connected to the return channel 233 by each of the plurality of return connecting channels 226). In a case that the height of the lower surface of a certain return connecting channel 226 which is included in the plurality of return connecting channels 226 is higher than the height of the lower surface of a certain pressure chamber 220 included in the plurality of pressure chambers 220 and which corresponds to the certain return connecting channel 226, any stagnation might easily occur at one end in the second direction (one end to which one of the return connecting channels 226 is connected) in the lower surface of the certain pressure chambers 220. This in turn might make it difficult to obtain the effect of preventing any increase in the viscosity of the ink and/or the agitation effect for any sediment component. For example, in a case that the ink contains a sediment component, such a sediment component might remain and sediment in the above-described one end in the lower surface of each of the pressure chambers 220. In view of this, in the second embodiment, there is not any stepped part or portion between the lower surface of each of the pressure chambers 220 and the lower surface of one of the return connecting channels 226, which in turn prevents any sedimentation of the sediment component from occurring. Thus, it is possible to obtain, in an ensured manner, the effect of preventing any incase in the viscosity of the ink and/or the agitation effect for any sediment component.
<Modifications>
Although the embodiments of the present disclosure have been explained in the foregoing, the present disclosure is not limited to or restricted by the above-described embodiments; it is allowable to make a various kind of design changes to the present disclosure, within the scope described in the claims.
It is allowable that the second direction crosses the first direction, and the second direction is not limited to being orthogonal to the first direction.
In the above-described embodiments, each of the first pressure chamber group and the second pressure chamber group is constructed of pressure chambers aligned in a row (array). It is allowable, however, that each of the first pressure chamber group and the second pressure chamber group is constructed of pressure chambers aligned in (so as to form) a plurality of rows.
In the above-described embodiments, the height of the upper surface of each of the return connecting channels is same as the height of the upper surface of one of the pressure chambers corresponding thereto (a pressure chamber which is included in the plurality of pressure chambers and to which each of the return connecting channels is connected or a pressure chamber included in the plurality of pressure chambers and which is connected to the return channel by each of the plurality of return connecting channels). It is allowable, however, that the height of the upper surface of each of the return connecting channels is higher that the height of the upper surface of one of the pressure chambers corresponding thereto. In such a case, although there is a stepped part or portion exists between the upper surface of each of the pressure chambers and the upper surface of one of the return connecting channels, any air bubble(s) flow smoothly from each of the pressure chambers toward one of the return connecting channels, without being caught at the stepped part.
In the above-described embodiment, although the two supply channels are provided with respect to the one return channel, it is allowable that one supply channel is provided with respect to one return channel.
The direction of flow of the liquid in the supply channel and the direction of the flow of the liquid in the return channel may be opposite (reverse) to each other. For example, in the above-described embodiment (see
The return damper film is not limited to or restricted by being defining the lower surface of the return channel, and may define, for example, the upper surface of the return channel, etc. Similarly, the supply damper film is not limited to or restricted by being defining the lower surface of the supply channel, and may define, for example, the upper surface of the supply channel, etc.
The return damper film and the supply damper film are not limited to being composed of a single member such as polyimide, etc., and may be composed of a composite material (for example, a composite material including a metal material defining the damper space and a polyimide member fixed to the metal material so as to close or seal the damper space).
The return damper film and the supply damper film may be composed of mutually different materials. In such a case, the requirement that the Young's module of the return damper film is lower than the Young's module of the supply damper film may be realized by the materials of the damper films, rather than by the thicknesses of the damper films.
Both of the return damper film and the supply damper film may be omitted.
Each of the return connecting channels is not limited to being extending in the oblique direction, and may extend in the second direction.
In the first embodiment, each of the nozzles 21 is provided on the central part in the second direction in the lower surface of one of the pressure chambers 20. It is allowable, however, that each of the nozzles 21 is provided on the other end in the second direction (an end which is opposite to the end to which one of the return connecting channels 26 is connected) in the lower surface of one of the pressure chambers 20.
In the first embodiment, the height of the upper surface of the return channel 33 is made to be high by performing the cutting for the convex part 13y of the protective substrate 13 and for the vibration plate 12a. The present disclosure, however, is not limited to this configuration. For example, it is allowable to perform the cutting only for the vibration plate 12a, without performing the cutting for the convex part 13y of the protective substrate 13.
The protective substrate may be omitted.
Although the number of the nozzle communicating with one pressure chamber is 1 (one) piece in the above-described embodiments, the number may be not less than 2 (two). Also, in the above-described embodiments, although one pressure chamber is provided with respect to one nozzle, it is allowable that two or more pressure chambers are provided with respect to one nozzle.
The actuator is not limited to being an actuator of the piezoelectric system using the piezoelectric element, and may be of another system (for example, of the thermal system using a heating device or element, of the electrostatic system using the electrostatic force, etc.).
The head is not limited to the line head, and may also be a serial head (head which is configured to discharge an ink from the nozzle toward a target or object of discharge, while moving in a scanning direction parallel to the paper width direction).
The object of the discharge is not limited to the paper (paper sheet) and may be, for example, cloth, a substrate, etc.
The liquid discharged from the nozzles is not limited to the ink, and may be any liquid (for example, a treatment liquid which causes a component in an ink to aggregate or deposit, etc.).
The present disclosure is not limited being applicable to the printer, and is applicable also to a facsimile machine, a copying machine, a multi-function peripheral, etc. Further, the present disclosure is also applicable to a liquid discharge apparatus which is usable for a usage which is different from performing recording of an image (for example, a liquid discharge apparatus which discharges a conductive liquid onto a substrate so as to form a conductive pattern on the substrate, etc.).
Number | Date | Country | Kind |
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2019-015392 | Jan 2019 | JP | national |