Patent Application
20240083170
The present application is based on, and claims priority from JP Application Serial Number 2022-143534, filed Sep. 9, 2022, the disclosure of which is here by incorporated by reference herein in its entirely.
The present disclosure relates to a liquid ejecting apparatus and a maintenance method for a liquid ejecting head.
A liquid ejecting apparatus represented by an ink jet printer generally includes a liquid ejecting head having a plurality of nozzles that eject a liquid such as an ink. In this liquid ejecting apparatus, for example, as disclosed in JP-A-2006-231773, in a state where the liquid ejecting head is not internally filled with the liquid or when an abnormality occurs in the liquid ejecting head, a pressurizing mechanism may be driven to pressurize a supply flow path. In some cases, the liquid ejecting apparatus may perform a filling process or a cleaning process of supplying the liquid to the liquid ejecting head from a tank.
However, as disclosed in JP-A-2006-231773, when the filling process or the cleaning process is performed by pressurizing the supply flow path, there is a possibility that the liquid may be wasted.
According to an aspect of the present disclosure, in order to solve the above-described problem, there is provided a liquid ejecting apparatus including a liquid ejecting head having a first nozzle row that ejects a first liquid, a first tank that stores the first liquid to be supplied to the first nozzle row, a first supply flow path for supplying the first liquid to the first nozzle row from the first tank, a first on-off valve provided in an intermediate portion of the first supply flow path and configured to open and close the first supply flow path, and a first pressurizing mechanism configured to pressurize an inside of the first tank. In a closed state of the first on-off valve, the first pressurizing mechanism is driven to set a pressure inside the first tank to a predetermined positive pressure, and thereafter, the first on-off valve is brought into an open state to perform a discharge process of discharging the first liquid from the first nozzle row. In the discharge process, the first on-off valve is switched from the open state to the closed state at a timing at which the first liquid is being continuously discharged from the first nozzle row.
According to another aspect of the present disclosure, there is provided a maintenance method for a liquid ejecting head having a first nozzle row that ejects a first liquid. The maintenance method includes a pressurizing step of pressurizing an inside of a first tank that stores the first liquid to be supplied to the first nozzle row in a closed state of a first supply flow path for supplying the first liquid to the first nozzle row from the first tank, an opening step of discharging the first liquid from the first nozzle row by opening the first supply flow path after the pressurizing step, and a closing step of closing the first supply flow path at a timing at which the first liquid is being continuously discharged from the first nozzle row by the opening step.
Hereinafter, preferred embodiments according to the present disclosure will be described with reference to the accompanying drawings. In the drawings, dimensions and scales of each portion are appropriately different from actual ones, and some portions are schematically illustrated to facilitate understanding. In addition, the scope of the present disclosure is not limited to the forms unless the present disclosure is particularly limited in the following description.
Hereinafter, for convenience of description, an X-axis, a Y-axis and a Z-axis which intersect each other are appropriately used. In addition, hereinafter, one direction along the X-axis is an X1-direction, and a direction opposite to the X1-direction is an X2-direction. Similarly, directions opposite to each other along the Y-axis are a Y1-direction and a Y2-direction. In addition, directions opposite to each other along the Z-axis are a Z1-direction and a Z2-direction.
Here, typically, the Z-axis is a vertical axis, and the Z2-direction corresponds to a downward direction in a vertical direction. However, the Z-axis may not be the vertical axis. In addition, the X-axis, the Y-axis, and the Z-axis are typically orthogonal to each other. However, without being limited thereto, for example, all of these may intersect each other at an angle within a range of 80° or larger and 100° or smaller.
As illustrated in
The liquid supply mechanism 10 supplies the ink to the liquid ejecting head 50. In an example illustrated in
The liquid supply mechanism 10 includes a first tank 11_1 that stores the first liquid and a second tank 11_2 that stores the second liquid. For example, each specific aspect of the first tank 11_1 and the second tank 11_2 includes a cartridge that can be attached to and detached from the liquid ejecting apparatus 100, a bag-shaped ink pack formed of a flexible film, and an ink-replenishable ink tank. Details of the liquid supply mechanism 10 will be described later with reference to
Each of the first tank 11_1 and the second tank 11_2 may be a sub tank that receives the ink supplied from a main tank. In this case, for example, it is preferable that an on-off valve is provided between the main tank and the sub tank to close the on-off valve during a discharge process (to be described later).
Each of the first liquid and the second liquid is not particularly limited, and for example, a water-based ink in which a coloring material such as a dye or a pigment is dissolved in a water-based solvent may be used, a solvent-based ink in which a coloring material is dissolved in an organic solvent may be used, or an ultraviolet curable ink may be used. alternatively, a clear ink, a white ink, or a process liquid may be used. The clear ink does not contain the coloring material, and is an ink for improving scratch resistance of a printed surface printed with the coloring material by overcoating the printed surface, or for reducing color deviations caused by irregular reflection by reducing unevenness caused by a pigment component. The white ink contains a white pigment, and is an ink for reducing non-whiteness caused by dirt on the medium M. The process liquid has reactivity with a component contained in a coloring material ink, and is an ink for improving fixability of the coloring material ink by coming into contact with the coloring material ink on the medium M. Hereinafter, each of the first liquid and the second liquid may be referred to as the ink in some cases.
For example, the control unit 20 includes a process circuit such as a Central Processing Unit (CPU) or a Field Programmable Gate Array (FPGA) and a storage circuit such as a semiconductor memory, and controls an operation of each element of the liquid ejecting apparatus 100.
The transport mechanism 30 transports the medium M in the Y1-direction under the control of the control unit 20. The moving mechanism 40 causes a plurality of the liquid ejecting heads 50 to reciprocate in the X1-direction and the X2-direction under the control of the control unit 20. In an example illustrated in
Under the control of the control unit 20, the liquid ejecting head 50 ejects the ink supplied from the liquid supply mechanism 10 onto the medium M in the Z2-direction from each of a plurality of nozzles N. The ink is ejected concurrently when the medium M is transported by the transport mechanism 30 and the liquid ejecting head 50 is caused to reciprocate by the moving mechanism 40. In this manner, an image is formed on a surface of the medium M by using the ink.
Here, a drive signal Com for driving the liquid ejecting head 50 and a control signal SI for controlling driving of the liquid ejecting head 50 are supplied to the liquid ejecting head 50 from the control unit 20. The control signal SI is a signal for designating whether or not to supply the drive signal Com to a drive element 51f (to be described later) of the liquid ejecting head 50, and is generated, based on image data Img. The image data Img is information indicating an image, and is supplied to the control unit 20 from a host computer such as a personal computer or a digital camera.
In an example illustrated in
The maintenance mechanism 60 is a mechanism for performing maintenance of the liquid ejecting head 50. In the example illustrated in
The wiping member 61 is a member for wiping an ejecting surface FN of the liquid ejecting head 50. For example, the wiping member 61 is a blade-shaped elastic member made of rubber, or a fiber material such as a woven fabric or a non-woven fabric, or a porous member such as a sponge. From a viewpoint of suitably reducing contamination of the ink inside the nozzle N, it is preferable that the wiping member 61 is the porous member.
The wiping member 61 is disposed at a position deviated from a transport path of the medium M in a width direction (X2-direction) of the medium M. In a state where the wiping member 61 is in contact with the ejecting surface FN of the liquid ejecting head 50, the wiping member 61 is moved relative to the ejecting surface FN in a direction along the X-axis. In this manner, the wiping member 61 wipes off an adhering object of the ejecting surface FN. For example, the deviated position is one end point of the reciprocating movement of the liquid ejecting head 50, and is also referred to as a home position. A typical example of the adhering object is the ink or paper dust.
In the example illustrated in
The liquid receiving member 62 receives the liquid ejected from the liquid ejecting head 50 located at the home position, as waste liquid. For example, the liquid receiving member 62 may be made of an absorbent body such as a fiber material or a sponge capable of absorbing the liquid, or may be a recessed container that opens toward the ejecting surface FN.
The maintenance mechanism 60 is not limited to the example illustrated in
The head chips 51 are configured to be substantially symmetrical to each other in the direction along the X-axis. However, positions of the plurality of nozzles N of the first nozzle row LN1 and the plurality of nozzles N of the second nozzle row LN2 in the direction along the Y-axis may coincide with or may be different from each other. As an example,
As illustrated in
The flow path substrate 51a and the pressure chamber substrate 51b are stacked in this order in the Z1-direction, and form a flow path for supplying the ink to the plurality of nozzles N. The vibration plate 51e, the plurality of drive elements 51f, the protective plate 51g, the case 51h, and the wiring substrate 51i are installed in a region located in the Z1-direction with respect to a stack body formed by the flow path substrate 51a and the pressure chamber substrate 51b. On the other hand, the nozzle plate 51c and the vibration absorbing body 51d are installed in a region located in the Z2-direction with respect to the stack body. Each element of the head chip 51 is schematically a plate-shaped member elongated in the Y-direction, and the elements are joined to each other by using an adhesive, for example. Hereinafter, each element of the head chip 51 will be described in order.
The nozzle plate 51c is a plate-shaped member provided with the plurality of nozzles N of each of the first nozzle row LN1 and the second nozzle row LN2. Each of the plurality of nozzles N is a through-hole through which the ink passes. Here, a surface of the nozzle plate 51c facing the Z2-direction is the ejecting surface FN. The nozzle plate 51c is manufactured in such a manner that a silicon single crystal substrate is processed by a semiconductor manufacturing technique using a processing technique such as dry etching or wet etching, for example. However, other known methods and materials may be appropriately used for manufacturing the nozzle plate 51c. In addition, a cross-sectional shape of the nozzle is typically a circular shape, but the shape is not limited thereto, and may be a non-circular shape such as a polygon or an ellipse, for example.
A space R1, a plurality of individual flow paths Ra, and a plurality of communication flow paths Na are provided in the flow path substrate 51a for each of the first nozzle row LN1 and the second nozzle row LN2. The space R1 is an elongated opening extending in the direction along the Y-axis in a plan view in the direction along the Z-axis. Each of the individual flow path Ra and the communication flow path Na is a through-hole formed for every nozzle N. Each individual flow path Ra communicates with the space R1.
The pressure chamber substrate 51b is a plate-shaped member in which a plurality of pressure chambers C called cavities are formed for each of the first nozzle row LN1 and the second nozzle row LN2. The plurality of pressure chambers C are arranged in the direction along the Y-axis. Each of the pressure chambers C is an elongated space formed for every nozzle N and extending in the direction along the X-axis in a plan view. As in the above-described nozzle plate 51c, each of the flow path substrate 51a and the pressure chamber substrate 51b is manufactured in such a manner that a silicon single crystal substrate is processed by a semiconductor manufacturing technique, for example. However, other known methods and materials may be appropriately used for the manufacturing of each of the flow path substrate 51a and the pressure chamber substrate 51b.
The pressure chamber C is a space located between the flow path substrate 51a and the vibration plate 51e. The plurality of pressure chambers C are arranged in the direction along the Y-axis for each of the first nozzle row LN1 and the second nozzle row LN2. In addition, the pressure chamber C communicates with each of the communication flow path Na and the individual flow path Ra. Therefore, the pressure chamber C communicates with the nozzle N via the communication flow path Na, and communicates with the space R1 via the individual flow path Ra.
The vibration plate 51e is disposed on a surface of the pressure chamber substrate 51b facing the Z1-direction. The vibration plate 51e is a plate-shaped member which can elastically vibrate. For example, the vibration plate 51e includes an elastic film made of silicon oxide (SiO2) and an insulating film made of zirconium oxide (ZrO2), and these films are stacked in this order in the Z1-direction. For example, the elastic film is formed by thermally oxidizing one surface of a silicon single crystal substrate. For example, the insulating film is formed by forming a zirconium layer by sputtering and thermally oxidizing the layer. The vibration plate 51e is not limited to the above-described configuration in which the elastic film and the insulating film are stacked. For example, the configuration may include a single layer, or may include three or more layers.
The plurality of drive elements 51f mutually corresponding to the nozzles N are disposed on a surface of the vibration plate 51e facing the Z1-direction for each of the first nozzle row LN1 and the second nozzle row LN2. Each of the drive elements 51f is a passive element deformed by the supply of the drive signal. Each of the drive elements 51f has an elongated shape extending in the direction along the X-axis in a plan view. The plurality of drive elements 51f are arranged in the direction along the Y-axis to correspond to the plurality of pressure chambers C. The drive element 51f overlaps the pressure chamber C in a plan view.
Each of the drive elements 51f is a piezoelectric element, and although not illustrated, the drive element 51f includes a first electrode, a piezoelectric layer, and a second electrode, which are stacked in this order in the Z1-direction. One electrode of the first electrode and the second electrode is an individual electrode disposed apart from each other for every drive element 51f, and the drive signal Com is supplied to the one electrode. The other electrode of the first electrode and the second electrode is a band-shaped common electrode extending in the direction along the Y-axis to be continuous over the plurality of drive elements 51f, and for example, a constant potential is supplied to the other electrode. For example, a metal material of the electrodes includes metal material such as platinum (Pt), aluminum (Al), nickel (Ni), gold (Au), and copper (Cu). Out of the materials, one type can be used alone, or two or more types can be used in combination in an alloyed or stacked manner. The piezoelectric layer is made of a piezoelectric material such as lead zirconate titanate (Pb(Zr, Ti)O3), and for example, has a band shape extending in the direction along the Y-axis to be continuous over the plurality of drive elements 51f. However, the piezoelectric layer may be integrated over the plurality of drive elements 51f In this case, the piezoelectric layer is provided with a through-hole penetrating the piezoelectric layer to extend in the direction along the X-axis in a region corresponding to a gap between the pressure chambers C adjacent to each other in a plan view. When the vibration plate 51e vibrates in conjunction with deformation of the above-described drive elements 51f, the pressure inside the pressure chambers C fluctuates to eject the ink from the nozzle N.
The protective plate 51g is a plate-shaped member installed on a surface of the vibration plate 51e facing the Z1-direction, protects the plurality of drive elements 51f, and reinforces mechanical strength of the vibration plate 51e. Here, the plurality of drive elements 51f are accommodated between the protective plate 51g and the vibration plate 51e. For example, the protective plate 51g is made of a resin material.
The case 51h is a member for storing the ink to be supplied to the plurality of pressure chambers C. For example, the case 51h is made of a resin material. The case 51h is provided with a space R2 for each of the first nozzle row LN1 and the second nozzle row LN2. The space R2 is a space communicating with the above-described space R1, and functions as a reservoir R that stores the ink to be supplied to the plurality of pressure chambers C together with the space R1. The case 51h is provided with an introduction port IH for supplying the ink to each reservoir R. The ink inside each reservoir R is supplied to the pressure chamber C via each individual flow path Ra.
Here, the introduction port IH corresponding to the first nozzle row LN1 communicates with the first supply flow path SJ_1. Therefore, the first liquid is supplied as the ink to the first nozzle row LN1. On the other hand, the introduction port IH corresponding to the second nozzle row LN2 communicates with the second supply flow path SJ_2. Therefore, the second liquid is supplied as the ink to the second nozzle row LN2. A portion of each of the first supply flow path SJ_1 and the second supply flow path SJ_2 may include a portion of the liquid ejecting head 50. Specifically, each of the first supply flow path SJ_1 and the second supply flow path SJ_2 may include the introduction port IH and the reservoir R of the liquid ejecting head 50. That is, the first supply flow path SJ_1 may be configured as a flow path from the first tank 11_1 to the plurality of individual flow paths Ra. Similarly, the second supply flow path SJ_2 may be configured as a flow path from the second tank 11_2 to the plurality of individual flow paths Ra.
The vibration absorbing body 51d is also referred to as a compliance substrate, is a flexible resin film forming a wall surface of the reservoir R, and absorbs pressure fluctuations of the ink inside the reservoir R. The vibration absorbing body 51d may be a flexible thin plate made of metal. A surface of the vibration absorbing body 51d facing the Z1-direction is joined to the flow path substrate 51a by using an adhesive.
The wiring substrate 51i is mounted on a surface of the vibration plate 51e facing the Z1-direction, and is a mounting component for electrically coupling the head chip 51, the drive circuit 51j, and the control unit 20. For example, the wiring substrate 51i is a flexible wiring substrate such as a chip on film (COF), a flexible printed circuit (FPC) or a flexible flat cable (FFC). The drive circuit 51j is mounted on the wiring substrate 51i of the present embodiment. The drive circuit 51j is a circuit including a switching element for switching whether or not to supply at least a portion of a waveform included in the drive signal Com to the drive element 51f as a drive pulse, based on the control signal SI.
In the above-described head chip 51, since the drive element 51f is driven by the drive signal Com, the pressure inside the pressure chamber C fluctuates, and the ink is ejected from the nozzle N in accordance with the fluctuation. Here, whereas the first liquid is ejected from the first nozzle row LN1, the second liquid having a type different from a type of the first liquid is ejected from the second nozzle row LN2.
Here, a shortest distance Dn between the nozzles of the first nozzle row LN1 and the second nozzle row LN2 is not particularly limited, but is 1.5 mm or shorter, for example. The shortest distance Dn between the nozzles of the first nozzle row LN1 and the second nozzle row LN2 is a distance between the first nozzle row LN1 and the second nozzle row LN2 in an alignment direction (X direction in the present embodiment) of the first nozzle row LN1 and the second nozzle row LN2.
As illustrated in
The first on-off valve 12_1 is a valve mechanism provided in an intermediate portion of the first supply flow path SJ_1 and capable of opening and closing the first supply flow path SJ_1 under the control of the control unit 20. On the other hand, the second on-off valve 12_2 is a valve mechanism provided in an intermediate portion of the second supply flow path SJ_2 and capable of opening and closing the second supply flow path SJ_2 under the control of the control unit 20. Each of the first on-off valve 12_1 and the second on-off valve 12_2 is an electromagnetic valve, a diaphragm valve, or a needle valve, for example.
Here, the first supply flow path SJ_1 is a flow path for supplying the first liquid from the first tank 11_1 to the first nozzle row LN1. Therefore, in an open state of the first on-off valve 12_1, the first supply flow path SJ_1 is in an open state, and the supply of the first liquid from the first tank 11_1 to the first nozzle row LN1 is allowed. On the other hand, in a closed state of the first on-off valve 12_1, the first supply flow path SJ_1 is in a closed state, and the supply of the first liquid from the first tank 11_1 to the first nozzle row LN1 is not allowed.
Similarly, the second supply flow path SJ_2 is a flow path for supplying the second liquid from the second tank 11_2 to the second nozzle row LN2. Therefore, in an open state of the second on-off valve 12_2, the second supply flow path SJ_2 is in an open state, and the supply of the second liquid from the second tank 11_2 to the second nozzle row LN2 is allowed. On the other hand, in a closed state of the second on-off valve 12_2, the second supply flow path SJ_2 is in a closed state, and the supply of the second liquid from the second tank 11_2 to the second nozzle row LN2 is not allowed.
The first pressurizing mechanism 13_1 is a mechanism capable of pressurizing the inside of the first tank 11_1 under the control of the control unit 20. On the other hand, the second pressurizing mechanism 13_2 is a mechanism capable of pressurizing the inside of the second tank 11_2 under the control of the control unit 20. For example, each of the first pressurizing mechanism 13_1 and the second pressurizing mechanism 13_2 is a syringe pump, a diaphragm pump, a tube pump, or a compressor, and generates a positive pressure higher than the atmospheric pressure. Each of the first pressurizing mechanism 13_1 and the second pressurizing mechanism 13_2 may have a regulator for regulating the pressure. In addition, one of the first pressurizing mechanism 13_1 and the second pressurizing mechanism 13_2 may also serve as the other. That is, one pressurizing mechanism that also serves as both the first pressurizing mechanism 13_1 and the second pressurizing mechanism 13_2 may be provided for the first tank 11_1 and the second tank 11_2 in common.
The first pressure sensor 14_1 measures the pressure inside the first tank 11_1. On the other hand, the second pressure sensor 14_2 measures the pressure inside the second tank 11_2. Each of the first pressure sensor 14_1 and the second pressure sensor 14_2 is not particularly limited, and for example, a known diaphragm type pressure sensor can be used.
Information indicating each measurement result of the first pressure sensor 14_1 and the second pressure sensor 14_2 is input to the control unit 20. For example, the control unit 20 controls an operation of the first pressurizing mechanism 13_1 so that the pressure inside the first tank 11_1 becomes a predetermined pressure, based on the measurement result of the first pressure sensor 14_1. Similarly, for example, the control unit 20 controls an operation of the second pressurizing mechanism 13_2 so that the pressure inside the second tank 11_2 becomes a predetermined pressure, based on the measurement result of the second pressure sensor 14_2.
The first atmospheric opening valve 15_1 is a valve mechanism capable of opening and closing the inside of the first tank 11_1 to be open to the atmosphere, under the control of the control unit 20, and opens and closes a portion between the inside of the first tank 11_1 and an external space. That is, the first atmospheric opening valve 15_1 is controlled by the control unit 20 to be switchable between an open state where the inside of the first tank 11_1 is open to the atmosphere and a closed state where the inside of the first tank 11_1 is not open to the atmosphere. On the other hand, the second atmospheric opening valve 15_2 is a valve mechanism capable of opening and closing the inside of the second tank 11_2 to be open to the atmosphere, under the control of the control unit 20, and opens and closes a portion between the inside of the second tank 11_2 and the external space. That is, the second atmospheric opening valve 15_2 is controlled by the control unit 20 to be switchable between an open state where the inside of the second tank 11_2 is open to the atmosphere and a closed state where the inside of the second tank 11_2 is not open to the atmosphere. Each of the first atmospheric opening valve 15_1 and the second atmospheric opening valve 15_2 may be any valve that can be controlled from a device such as the control unit 20, and is a diaphragm valve, an electromagnetic valve, or an electric valve, for example. One of the first atmospheric opening valve 15_1 and the second atmospheric opening valve 15_2 may also serve as the other. That is, one atmospheric opening valve that also serves as both the first atmospheric opening valve 15_1 and the second atmospheric opening valve 15_2 may be provided for the first tank 11_1 and the second tank 11_2 in common.
The liquid supply mechanism 10 described above supplies the first liquid inside the first tank 11_1 to the liquid ejecting head 50, and supplies the second liquid inside the second tank 11_2 to the liquid ejecting head 50, under the control of the control unit 20. Here, the liquid ejecting apparatus 100 operates the liquid supply mechanism 10 under the control of the control unit 20 so that a discharge process SD of discharging the ink from the first nozzle row LN1 and the second nozzle row LN2 as maintenance of the liquid ejecting head 50 can be performed.
More specifically, the liquid ejecting apparatus 100 can perform one or both of a filling process of starting to perform the discharge process SD in a state where the liquid ejecting head 50 is not filled with the ink, and a cleaning process of starting to perform the discharge process SD in a state where the liquid ejecting head 50 is filled with the ink. Details of the discharge process SD will be described later with reference to
In the maintenance method, as illustrated in
First, in Step S11, the control unit 20 brings the on-off valve 12 and the atmospheric opening valve 15 into a closed state. Step S11 is omitted when the on-off valve 12 and the atmospheric opening valve 15 are in the closed state in advance.
After Step S11 above, in Step S12, the control unit 20 performs a pressurizing step SP. In the pressurizing step SP, a predetermined positive pressure is set by pressurizing the inside of the tank 11 in a closed state of the supply flow path SJ. Here, in the pressurizing step SP, the inside of the tank 11 is pressurized by driving the pressurizing mechanism 13 in a closed state of the on-off valve 12. In this case, since the supply flow path SJ is closed, the ink is not supplied to the liquid ejecting head 50.
In the pressurizing step SP of the present embodiment, the pressurizing mechanism 13 is driven in a closed state of the atmospheric opening valve 15. Therefore, the inside of the tank 11 can be efficiently pressurized. A change in the pressure inside the tank 11 will be described later with reference to
After Step S12 above, in Step S13, the control unit 20 performs an opening step SO. In the opening step SO, after the pressurizing step SP, the supply flow path SJ is opened to discharge the ink from the nozzle row LN. Here, in the opening step SO, the on-off valve 12 is brought into an open state in a state where the pressure inside the tank 11 is set to a predetermined positive pressure. In this manner, the ink inside the tank 11 is supplied to the liquid ejecting head 50 via the supply flow path SJ by the pressure inside the tank 11.
The opening step SO of the present embodiment is performed after the pressurizing mechanism 13 is stopped in the pressurizing step SP. That is, before the on-off valve 12 is switched from the closed state to the open state in the opening step SO, the pressurizing mechanism 13 is stopped.
After Step S13 above, in Step S14, the control unit 20 performs a closing step SC. In the closing step SC, the supply flow path SJ is closed at a timing at which the ink is being continuously discharged from the nozzle row LN by the opening step SO. Here, in the closing step SC, the supply flow path SJ is closed by switching the on-off valve 12 from the open state to the closed state. In this manner, the supply of the ink from the tank 11 to the liquid ejecting head 50 via the supply flow path SJ is stopped.
In addition, from a viewpoint of improving efficiency of the discharge process SD or reducing contamination of the ink in the nozzle row LN, in the opening step SO, it is preferable that a period for maintaining the open state of the first supply flow path SJ_1 and a period for maintaining the open state of the second supply flow path SJ_2 at least partially overlap each other, and it is more preferable that these periods coincide with each other.
Here, the period for maintaining the open state of the first supply flow path SJ_1 is the period for maintaining the open state of the first on-off valve 12_1. The period for maintaining the open state of the second supply flow path SJ_2 is a period for maintaining the open state of the second on-off valve 12_2.
In addition, when the period for maintaining the open state of the first supply flow path SJ_1 and the period for maintaining the open state of the second supply flow path SJ_2 coincide with each other, a timing at which the first on-off valve 12_1 is switched from the closed state to the open state and a timing at which the second on-off valve 12_2 is switched from the closed state to the open state are the same as each other, and a timing at which the first on-off valve 12_1 is switched from the open state to the closed state and a timing at which the second on-off valve 12_2 is switched from the open state to the closed state is the same as each other.
After Step S14 above, in Step S15, the control unit 20 performs a wiping step SW. In the wiping step SW, after the closing step SC, that is, after the discharge process SD, a wiping operation for causing the wiping member 61 to wipe the ejecting surface FN is performed in a state where the supply flow path SJ is closed. Here, from a viewpoint of reducing contamination of the ink in the nozzle row LN, it is preferable that the wiping step SW is performed in a state where both the first supply flow path SJ_1 and the second supply flow path SJ_2 are closed. That is, it is preferable that the wiping step SW is performed during a period in which both the first on-off valve 12_1 and the second on-off valve 12_2 are in the closed state.
After Step S15 above, in Step S16, the control unit 20 switches the atmospheric opening valve 15 from the closed state to the open state. In this manner, the pressure inside the tank 11 becomes the atmospheric pressure. Step S16 may be performed while the wiping step SW is performed or before the wiping step SW is performed, as long as Step S16 is performed after the discharge process SD.
After Step S16 above, in Step S17, the control unit 20 switches the on-off valve 12 from the closed state to the open state. In this manner, since the pressure inside the tank 11 is the atmospheric pressure, the pressure of the ink in the nozzle row LN is reduced. Specifically, the pressure of the ink in the nozzle row LN is reduced to a pressure corresponding to a water head difference of the ink between the tank 11 and the liquid ejecting head 50.
In this way, the atmospheric opening valve 15 is switched from the closed state to the open state at a timing after the on-off valve 12 is brought into the closed state in the closing step SC and before the on-off valve 12 is brought into the open state after the wiping operation is performed. Here, the timing at which the atmospheric opening valve 15 is switched from the closed state to the open state may be a timing before at least one of the first on-off valve 12_1 and the second on-off valve 12_2 is brought into the open state after the wiping operation is performed. Here, when the timing at which the first on-off valve 12_1 is brought into the open state and the timing at which the second on-off valve 12_2 is brought into the open state after the wiping operation is performed are the same, “the timing before at least one of the first on-off valve 12_1 and the second on-off valve 12_2 is brought into the open state after the wiping operation is performed” is a timing before both the first on-off valve 12_1 and the second on-off valve 12_2 are brought into the open state. When the timing at which the first on-off valve 12_1 is brought into the open state and the timing at which the second on-off valve 12_2 is brought into the open state after the wiping operation is performed are different, “the timing before at least one of the first on-off valve 12_1 and the second on-off valve 12_2 is brought into the open state after the wiping operation is performed” is a timing before one on-off valve 12 brought into the open state earlier after the wiping operation is performed is brought into the open state in the first on-off valve 12_1 and the second on-off valve 12_2.
After Step S17, in Step S18, the control unit 20 performs a flushing process SF. In the flushing process SF, a flushing operation is performed after the wiping operation is performed. In the flushing operation, the ink is ejected from the nozzle N toward the liquid receiving member 62 in a state where the liquid ejecting head 50 is located at the home position. Here, the ink is ejected from the nozzle N by driving the drive element 51f of the liquid ejecting head 50.
In the flushing operation, from a viewpoint of suitably removing contamination of the ink in the nozzle N, the total amount of the ink ejected from one nozzle N in the plurality of nozzles N is preferably equal to or smaller than the volume of the pressure chamber C communicating with the one nozzle, is more preferably equal to or smaller than the volume of the communication flow path Na and the nozzle N which are flow paths downstream of the pressure chamber C, and is much more preferably equal to or smaller than the volume of the nozzle N.
As described above, the maintenance of the liquid ejecting head 50 is performed. Since the maintenance is performed, printing of the liquid ejecting head 50 is completely prepared. The flushing process SF in Step S18 may be performed and omitted when necessary.
First, the maintenance method including the discharge process SD as a filling process will be mainly described with reference to
As illustrated in
At timing t2 after timing t1, the driving of the pressurizing mechanism 13 is started, and at timing t3 after timing t2, the driving of the pressurizing mechanism 13 is stopped. That is, during a period from timing t2 to timing t3, the pressurizing mechanism 13 is driven over the period (Step S12). In this manner, since the pressurizing step SP is performed, the pressure inside the tank 11 rises to a first pressure P1 which is a predetermined positive pressure. In
At timing t5 after timing t4, the on-off valve 12 is switched from the open state to the closed state. In this manner, the closing step SC is performed (Step S14). In this way, during a period from timing t4 to timing t5, the on-off valve 12 is in the open state over the period. During the period, the ink is discharged from the nozzle N. In addition, even during a period from timing t5 to the timing 21 after timing t5, the ink is discharged from the nozzle N. As illustrated in
In the example illustrated in
In addition, a time length required from timing t4 in Comparative Example 1 to timing t11 at which the pressure inside the tank 11 becomes substantially constant is defined as a first time length T1, and a length of a period from timing t4 to timing t5 is defined as a second time length T2, from a viewpoint of reducing waste of the ink discharged from the nozzle N, the second time length T2 is shorter than the first time length T1, is preferably equal to or shorter than half the first time length T1, is more preferably equal to or shorter than ⅓ of the first time length T1, and is much more preferably equal to or shorter than ⅕ of the first time length T1. In the example illustrated in
During a period from timing t6 to timing t7 after timing t5, the wiping operation is performed over the period (Step S15). Timing t6 is preferably after timing t21 at which the pressure inside the nozzle N reaches the meniscus withstand voltage Pm.
At timing t8 after timing t7, the atmospheric opening valve 15 is switched from the closed state to the open state (Step S16). In this manner, the pressure inside the tank 11 is lowered to the atmospheric pressure. From a viewpoint of shortening a process time of the maintenance process, the switching may be performed during a period in which the wiping operation is performed, that is, during a period from timing t6 to timing t7, or before the wiping operation is performed, that is, before timing t6.
At timing t9 after timing t8, the on-off valve 12 is switched from the closed state to the open state. In this manner, the supply of the ink from the tank 11 to the liquid ejecting head 50 via the supply flow path SJ is allowed. Thereafter, the flushing process SF is performed when necessary (Step S18).
Next, the maintenance method including the discharge process SD as the cleaning process will be described with reference to
When the liquid ejecting apparatus 100 can perform both the filling process and the cleaning process, as illustrated in
Here, the discharge process of Comparative Example 2 will be described. A change in the pressure inside the tank 11 illustrated by a broken line in
The supply flow path SJ communicates with the plurality of nozzles N forming the nozzle row LN, and flow path resistance from the introduction port IH to each nozzle varies. Therefore, there is a variation in time until each of the nozzle N is filled with the ink after the on-off valve 12 is brought into the open state at timing t4. Therefore, in Comparative Example 2, the ink is wastefully discharged from the nozzles N filled with the ink before a timing at which all of the nozzles N are filled with the ink, in the plurality of nozzles N forming the nozzle row LN.
On the other hand, inclination of a pressure change inside the tank 11 during a period from timing t4 to timing t5 of the present embodiment is greater than inclination of a pressure change inside the tank 11 during a period from timing t4 to timing t5 of Comparative Example 2. Therefore, all of the nozzles N forming the nozzle row LN can be instantaneously filled with the ink. Therefore, the amount of the ink wastefully discharged from the nozzles N can be reduced, compared to Comparative Example 2.
Hitherto, the comparison between Comparative Example 2 and the present embodiment has been described with regard to the filling process. However, a relationship between the filling process of Comparative Example 2 and the filling process of the present embodiment is the same as a relationship between the cleaning process of Comparative Example 2 and the cleaning process of the present embodiment. Specifically, in the cleaning process of Comparative Example 2, there is a variation in time until a predetermined amount of the ink required for cleaning is discharged from each of the nozzles N after the on-off valve 12 is brought into the open state at timing t4. Therefore, in the cleaning process of Comparative Example 2, the ink is wastefully discharged from the nozzle N in which the predetermined amount of the ink is discharged before a timing at which the predetermined amount of the ink is discharged from all of the nozzles N, in the plurality of nozzles N forming the nozzle row LN. On the other hand, for the same reason as the filling process of the present embodiment, the cleaning process of the present embodiment can reduce the amount of the ink wastefully discharged from the nozzles N, compared to Comparative Example 2.
As in the filling process of Comparative Example 1 described above, the predetermined positive pressure generated inside the tank 11 by the pressurizing step SP is increased to an extent the same as that in the present embodiment. In this manner, it is conceivable that the plurality of nozzles N forming the nozzle row LN can be instantaneously filled with the ink. However, in the filling process of Comparative Example 1, the on-off valve 12 is not brought into the closed state at timing t5. Therefore, the positive pressure inside the tank 11 which is excessive with respect to the pressure required for filling all of the nozzles N forming the nozzle row LN with the ink acts on the liquid ejecting head 50. As a result, in the filling process of Comparative Example 1, the ink is wastefully discharged from the nozzles N, compared to the filling process of the present embodiment. The same applies to the cleaning process of Comparative Example 1, and the ink is wastefully discharged from the nozzle N, compared to the cleaning process of the present embodiment.
As described above, the liquid ejecting apparatus 100 includes the liquid ejecting head 50, the first tank 11_1, the first supply flow path SJ_1, the first on-off valve 12_1, and the first pressurizing mechanism 13_1. The liquid ejecting head 50 includes the first nozzle row LN1 for ejecting the first liquid. The first tank 11_1 stores the first liquid to be supplied to the first nozzle row LN1. The first supply flow path SJ_1 is a flow path for supplying the first liquid from the first tank 11_1 to the first nozzle row LN1. The first on-off valve 12_1 is provided in the intermediate portion of the first supply flow path SJ_1, and can open and close the first supply flow path SJ_1. The first pressurizing mechanism 13_1 can pressurize the inside of the first tank 11_1.
Moreover, the liquid ejecting apparatus 100 can perform the discharge process SD. In the discharge process SD, the pressure inside the first tank 11_1 is set to the predetermined positive pressure by driving the first pressurizing mechanism 13_1 in the closed state of the first on-off valve 12_1. Thereafter, the first liquid is discharged from the first nozzle row LN1 by bringing the first on-off valve 12_1 into the open state. Here, in the discharge process SD, the first on-off valve 12_1 is switched from the open state to the closed state at a timing at which the first liquid is being continuously discharged from the first nozzle row LN1.
In the above-described liquid ejecting head 50, in the discharge process SD, the pressure inside the first tank 11_1 is set to the predetermined positive pressure by driving the first pressurizing mechanism 13_1 in the closed state of the first on-off valve 12_1. Thereafter, the first on-off valve 12_1 is brought into the open state. Therefore, the first liquid can be supplied to the liquid ejecting head 50 while the pressure for supplying the first liquid to the first nozzle row LN1 is sharply raised. Therefore, the liquid can be instantaneously distributed to all of the nozzles N forming the first nozzle row LN1. In addition, in the discharge process SD, the first on-off valve 12_1 is switched from the open state to the closed state at a timing at which the first liquid is being continuously discharged from the first nozzle row LN1. Therefore, it is possible to shorten a period in which the first liquid is unnecessarily discharged from the first nozzle row LN1. Therefore, the first liquid is prevented from being wastefully discharged from the first nozzle row LN1.
As described above, in the discharge process SD, the first on-off valve 12_1 is switched from the open state to the closed state at timing t5 at which the pressure inside the first tank 11_1 reaches the third pressure P3. Here, the third pressure P3 is the pressure between the first pressure P1 and the second pressure P2. The first pressure P1 is the predetermined positive pressure. The second pressure P2 is the pressure inside the first tank 11_1 when the first on-off valve 12_1 is brought into the open state until the pressure inside the first tank 11_1 becomes substantially constant after the pressure inside the first tank 11_1 is set to the first pressure P1. In this discharge process SD, the amount of the first liquid to be wasted can be reduced.
In addition, as described above, timing t5 is the timing at which the second time length T2 elapses after the first on-off valve 12_1 is brought into the open state in the discharge process SD. That is, in the discharge process SD, the first on-off valve 12_1 is switched from the open state to the closed state at timing t5 at which the second time length T2 elapses after the first on-off valve 12_1 is brought into the open state. Here, the second time length T2 is shorter than the first time length T1. The first time length T1 is the time length required until the pressure inside the first tank 11_1 becomes substantially constant after the first on-off valve 12_1 is brought into the open state when the first on-off valve 12_1 is brought into the open state until the pressure inside the first tank 11_1 becomes substantially constant after the pressure inside the first tank 11_1 is set to the first pressure P1. In this manner, the amount of the first liquid to be wasted can be reduced.
Furthermore, as described above, it is preferable that the second time length T2 is equal to or shorter than half the first time length T1. In this case, in the discharge process SD, the amount of the first liquid to be wastefully consumed can be suitably reduced.
In addition, as described above, the liquid ejecting apparatus 100 can perform one or both of the filling process of starting to perform the discharge process SD in a state where the liquid ejecting head 50 is not filled with the first liquid, and the cleaning process of starting to perform the discharge process SD in a state where the liquid ejecting head 50 is filled with the first liquid. Therefore, the amount of the first liquid to be wasted can be reduced in one or both of the filling process and the cleaning process.
Furthermore, as described above, when the liquid ejecting apparatus 100 can perform both the filling process and the cleaning process, the predetermined positive pressure in the cleaning process is lower than the predetermined positive pressure in the filling process. In the filling process, in order to replace the air inside the liquid ejecting head 50 with the liquid, it is necessary to increase the pressure inside the first tank 11_1, compared to the cleaning process. In addition, when a filter (not illustrated) is disposed in the intermediate portion of the first supply flow path SJ_1, in order to exceed a bubble point of the filter in the filling process, in this respect as well, it is necessary to increase the pressure inside the first tank 11_1, compared to the cleaning process. Therefore, the pressure inside the first tank 11_1 in the cleaning process is decreased, compared to the pressure inside the first tank 11_1 in the filling process. In this manner, the filling process can be performed without any excess or deficiency of the liquid, and the amount of the liquid wastefully consumed in the cleaning process can be reduced.
Furthermore, as described above, the liquid ejecting apparatus 100 includes the first atmospheric opening valve 15_1 that can open and close the inside of the first tank 11_1 to be open to the atmosphere. In the discharge process SD, the inside of the first tank 11_1 is pressurized to the predetermined positive pressure by driving the first pressurizing mechanism 13_1 in a closed state of the first atmospheric opening valve 15_1. Therefore, the inside of the first tank 11_1 can be efficiently pressurized to the predetermined positive pressure by driving the first pressurizing mechanism 13_1 in the closed state of the first atmospheric opening valve 15_1. In addition, when necessary, the inside of the first tank 11_1 can be set to the atmospheric pressure by opening the inside of the first tank 11_1 to the atmosphere. In this manner, for example, the pressure corresponding to a water head difference between the first tank 11_1 and the liquid ejecting head 50 can act on the ink of the nozzle N.
In addition, as described above, in the discharge process SD, the first pressurizing mechanism 13_1 is stopped before the first on-off valve 12_1 is switched from the closed state to the open state. Therefore, even when the first pressurizing mechanism 13_1 is stopped, the pressure inside the first tank 11_1 can be maintained at the predetermined positive pressure. As a result, power saving can be achieved.
Furthermore, as described above, the liquid ejecting head 50 includes the ejecting surface FN including the first nozzle row LN1 and the second nozzle row LN2 for ejecting the second liquid having a type different from a type of the first liquid. The liquid ejecting apparatus 100 includes the second tank 11_2, the second supply flow path SJ_2, the second on-off valve 12_2, and the second pressurizing mechanism 13_2. The second tank 11_2 stores the second liquid to be supplied to the second nozzle row LN2. The second supply flow path SJ_2 is a flow path for supplying the second liquid from the second tank 11_2 to the second nozzle row LN2. The second on-off valve 12_2 is provided in the intermediate portion of the second supply flow path SJ_2, and can open and close the second supply flow path SJ_2. The second pressurizing mechanism 13_2 can pressurize the inside of the second tank 11_2.
Moreover, in the discharge process SD, the pressure inside the second tank 11_2 is set to the predetermined positive pressure by driving the second pressurizing mechanism 13_2 in the closed state of the second on-off valve 12_2, and thereafter, the second liquid is discharged from the second nozzle row LN2 by bringing the second on-off valve 12_2 into the open state. Here, in the discharge process SD, the second on-off valve 12_2 is switched from the open state to the closed state at a timing at which the second liquid is being continuously discharged from the second nozzle row LN2. Moreover, in the discharge process SD, the period for maintaining the open state of the first on-off valve 12_1 and the period for maintaining the open state of the second on-off valve 12_2 at least partially overlap each other. That is, the period from timing t4 to timing t5 of the discharge process SD corresponding to the first nozzle row LN1 and the period from timing t4 to timing t5 of the discharge process SD corresponding to the second nozzle row LN2 at least partially overlap each other. Therefore, when the liquid is discharged from the plurality of nozzle rows LN that eject mutually different types of the liquid in the discharge process SD, each internal pressure of the plurality of nozzle rows LN can be set to a positive pressure. As a result, it is possible to reduce a risk that the first liquid inside the nozzle N of the first nozzle row LN1 may be contaminated by the second liquid mixed into the nozzle N of the first nozzle row LN1, and a risk that the second liquid inside the nozzle N of the second nozzle row LN2 may be contaminated by the first liquid mixed into the nozzle N of the second nozzle row LN2.
In addition, as described above, in the discharge process SD, the timing at which the first on-off valve 12_1 is switched from the closed state to the open state and the timing at which the second on-off valve 12_2 is switched from the closed state to the open state are the same as each other. The timing at which the first on-off valve 12_1 is switched from the open state to the closed state and the timing at which the second on-off valve 12_2 is switched from the open state to the closed state are the same as each other. Therefore, contamination of the liquid in the first nozzle row LN1 and the second nozzle row LN2 can be further reduced.
Furthermore, as described above, the liquid ejecting apparatus 100 further includes the wiping member 61 that wipes the ejecting surface FN. The liquid ejecting apparatus 100 causes the wiping member 61 to perform the wiping operation for wiping the ejecting surface FN during a period in which both the first on-off valve 12_1 and the second on-off valve 12_2 are in the closed state after the discharge process SD. Therefore, since the wiping operation is performed in a state where each internal pressure of the first nozzle row LN1 and the second nozzle row LN2 is the positive pressure, the contamination of the liquid in the first nozzle row LN1 and the second nozzle row LN2 can be suitably reduced.
In addition, as described above, the liquid ejecting apparatus 100 further includes the first atmospheric opening valve 15_1 that can open and close the inside of the first tank 11_1 to be open to the atmosphere, and the second atmospheric opening valve 15_2 that can open and close the inside of the second tank 11_2 to be open to the atmosphere. In the liquid ejecting apparatus 100, after both the first on-off valve 12_1 and the second on-off valve 12_2 are brought into the closed state in the discharge process SD, and at the timing before at least one of the first on-off valve 12_1 and the second on-off valve 12_2 is brought into the open state after the wiping operation is performed, both the first atmospheric opening valve 15_1 and the second atmospheric opening valve 15_2 are switched from the closed state to the open state. Therefore, at the time at which the first on-off valve 12_1 and the second on-off valve 12_2 are brought into the open state, the positive pressure remaining inside the tank 11 by the closing step SC acts on the first nozzle row LN1 and the second nozzle row LN2. In this manner, it is possible to prevent the ink from being wastefully discharged from the nozzle N.
Furthermore, as described above, the liquid ejecting apparatus 100 may switch the first atmospheric opening valve 15_1 and the second atmospheric opening valve 15_2 from the closed state to the open state, while the wiping operation is performed or before the wiping operation is performed. In this case, it is possible to shorten a time required for printing preparation including the filling process or a time required for the cleaning process.
In addition, as described above, the first nozzle row LN1 includes the plurality of nozzles N. The liquid ejecting head 50 includes the plurality of pressure chambers C communicating with every nozzle of the plurality of nozzles N. The liquid ejecting apparatus 100 performs the flushing operation after the wiping operation is performed. Here, the total amount of the first liquid ejected from one nozzle N of the plurality of nozzles N by the flushing operation is equal to or smaller than the volume of the pressure chamber C communicating with the one nozzle of the plurality of pressure chambers C. Since the liquid inside the nozzle N is less contaminated by the discharge process SD and the wiping step SW described above, it is sufficient to discharge the liquid inside the nozzle N by performing the flushing operation on only the vicinity of the meniscus surface of the liquid inside the nozzle N. Therefore, contamination on the meniscus surface of the first liquid inside the nozzle N can be removed with a small amount of the ink.
In addition, as described above, the first nozzle row LN1 and the second nozzle row LN2 are provided in the same nozzle plate 51c. In this case, an effect of reducing the contamination of the liquid in the nozzle row LN is remarkable.
Furthermore, as described above, the shortest distance between the nozzles of the first nozzle row LN1 and the second nozzle row LN2 is preferably 1.5 mm or shorter. In this configuration in which the shortest distance Dn is relatively short, the liquid discharged from one nozzle row LN of the first nozzle row LN1 and the second nozzle row LN2 moves to the other nozzle row LN. Consequently, the liquid inside the nozzle N is likely to be contaminated. Therefore, in this case, the effect of reducing the contamination of the liquid in the nozzle row LN by the discharge process SD and the wiping step SW described above is remarkable.
In addition, as described above, the maintenance method for the liquid ejecting head 50 includes the pressurizing step SP, the opening step SO, and the closing step SC. In the pressurizing step SP, the inside of the first tank 11_1 is pressurized in the closed state of the first supply flow path SJ_1 for supplying the first liquid to the first nozzle row LN1 from the first tank 11_1 storing the first liquid to be supplied to the first nozzle row LN1. In the opening step SO, after the pressurizing step SP, the first liquid is discharged from the first nozzle row LN1 by opening the first supply flow path SJ_1. In the closing step SC, the first supply flow path SJ_1 is closed at a timing at which the first liquid is being continuously discharged from the first nozzle row LN1 by the opening step SO.
In the above-described maintenance method for the liquid ejecting head 50, the above-described discharge process SD is performed. Therefore, while the first liquid is prevented from being wastefully discharged from the first nozzle row LN1, the liquid can be distributed to all of the nozzles N forming the first nozzle row LN1 in a short time.
Here, as described above, in the pressurizing step SP, the inside of the second tank 11_2 is pressurized in the closed state of the second supply flow path SJ_2 for supplying the second liquid to the second nozzle row LN2 from the second tank 11_2 storing the second liquid to be supplied to the second nozzle row LN2. In the opening step SO, the second liquid is discharged from the second nozzle row LN2 by opening the second supply flow path SJ_2. In the closing step SC, the second supply flow path SJ_2 is closed at a timing at which the second liquid is being continuously discharged from the second nozzle row LN2 by the opening step SO. Moreover, in the opening step SO, the period for maintaining the open state of the first supply flow path SJ_1 and the period for maintaining the open state of the second supply flow path SJ_2 at least partially overlap each other. Therefore, when the liquid is discharged from the plurality of nozzle rows LN that eject mutually different types of the liquid in the discharge process SD, each internal pressure of the plurality of nozzle rows LN can be set to a positive pressure. As a result, contamination of the liquid in the first nozzle row LN1 and the second nozzle row LN2 can be suitably reduced.
In addition, as described above, the maintenance method for the liquid ejecting head 50 further includes the wiping step SW for causing the wiping member 61 to wipe the ejecting surface FN in the closed state of both the first supply flow path SJ_1 and the second supply flow path SJ_2 after the closing step SC. Therefore, the wiping step SW is performed in a state where each internal pressure of the first nozzle row LN1 and the second nozzle row LN2 is the positive pressure. Therefore, contamination of the liquid in the first nozzle row LN1 and the second nozzle row LN2 can be suitably reduced.
In the first embodiment, as illustrated in
Here, in a first modification example of the first embodiment, a time length T2b (not illustrated) which is the length of the period during which the opening step SO included in the cleaning process is performed may be shorter than a time length T2a (not illustrated) which is the length of the period during which the opening step SO included in the filling process is performed. In this manner, as in the first embodiment, the filling process can be performed without any excess or deficiency of the ink, and the amount of the ink to be wastefully consumed in the cleaning process can be reduced. In the first embodiment, the first pressure P1b which is the predetermined positive pressure inside the tank 11 after the pressurizing step SP is performed as the cleaning process is lower than the first pressure P1a which is the predetermined positive pressure inside the tank 11 after the pressurizing step SP is performed as the filling process. However, in the modification example of the first embodiment, the first pressure P1b may be lower than the first pressure P1a as in the first embodiment. Alternatively, the first pressure P1b and the first pressure P1a may be the same as each other.
As described above, when the liquid ejecting apparatus 100 can perform both the filling process and the cleaning process, the time length T2b from the open state to the closed state of the first on-off valve 12_1 in the cleaning process is shorter than the time length T2a from the open state to the closed state of the first on-off valve 12_1 in the filling process. Therefore, the filling process can be performed without any excess or deficiency of the liquid, and the amount of the liquid to be wastefully consumed in the cleaning process can be reduced.
Hereinafter, a second embodiment of the present disclosure will be described. In the embodiment described below as an example, the reference numerals used in the description of the first embodiment will be assigned to elements having the same effects and functions as those of the first embodiment, and each detailed description thereof will be appropriately omitted.
The liquid supply mechanism 10A is configured in the same manner as the liquid supply mechanism 10 of the first embodiment except that pressure regulating valves 16_1 and 16_2 are added.
The pressure regulating valve 16_1 is provided between the first on-off valve 12_1 of the first supply flow path SJ_1 and the liquid ejecting head 50, and is opened and closed in response to the pressure of the ink inside the liquid ejecting head 50. On the other hand, the pressure regulating valve 16_2 is provided between the second on-off valve 12_2 of the second supply flow path SJ_2 and the liquid ejecting head 50, and is opened and closed in response to the pressure of the ink inside the liquid ejecting head 50. Each of the pressure regulating valve 16_1 and the pressure regulating valve 16_2 is configured to be forcibly brought into an open state regardless of the pressure inside the liquid ejecting head 50.
The pressure regulating valve 16 includes a valve body 16a, a valve seat 16b, a spring 16c, and a spring 16d. The valve body 16a opens and closes the upstream flow path RJ1 by moving in a W-direction or a direction opposite thereto in the drawing to be closer to or separated from the valve seat 16b.
The valve seat 16b is a portion of a support body 16e which is located between the upstream flow path RJ1 and the downstream flow path RJ2, and faces a portion of a flexible film 16f that seals the downstream flow path RJ2 at an interval. A through-hole K penetrating the support body 16e is provided at substantially the center of the valve seat 16b. The upstream flow path RJ1 and the downstream flow path RJ2 communicate with each other via the through-hole K.
The valve body 16a is installed inside the upstream flow path RJ1. The valve body 16a includes a base portion 16a1, a sealing portion 16a2, and a valve shaft 16a3. The base portion 16a1 is a circular flat plate portion having an outer diameter larger than the inner diameter of the through-hole K. The valve shaft 16a3 coaxially and vertically projects on a surface of the base portion 16a1, and the annular sealing portion 16a2 is installed to surround the valve shaft 16a3 in a plan view. The base portion 16a1 and the sealing portion 16a2 are located inside the upstream flow path RJ1 in a state where an axis O of the valve shaft 16a3 is parallel to the W-direction and the valve shaft 16a3 is inserted into the through-hole K of the valve seat 16b. A gap is formed between an inner peripheral surface of the through-hole K of the valve seat 16b and an outer peripheral surface of the valve shaft 16a3. The spring 16c is installed inside the upstream flow path RJ1 between a surface of the support body 16e facing the valve seat 16b and the base portion 16a1 of the valve body 16a, and biases the valve body 16a toward the valve seat 16b. On the other hand, the spring 16d is installed inside the downstream flow path RJ2 between the valve seat 16b and a pressure receiving plate 16g. The sealing portion 16a2 of the valve body 16a is located between the base portion 16a1 and the valve seat 16b, and functions as a seal for closing the through-hole K by coming into contact with a sealing surface FS of the valve seat 16b.
An atmospheric pressure chamber RC communicating with an external space of the atmospheric pressure is adjacent to the downstream flow path RJ2 via a flexible film 16f. The flexible film 16f is a flexible elastic film, and is made of a film, rubber, or fibers, for example. As illustrated in
In the pressure regulating valve 16, a pressure regulating chamber RV is adjacent to the atmospheric pressure chamber RC via an elastic member 16h. The elastic member 16h is a plate-shaped flexible member, and is made of an elastic material such as rubber. The pressure regulating chamber RV communicates with a gas flow path port DA. A pump (not illustrated) is coupled to the gas flow path port DA. The pump is a pump that can pressurize the pressure regulating chamber RV under the control of the control unit 20. Since the pump pressurizes the pressure regulating chamber RV, the elastic member 16h can be bent and deformed to be pressed toward the flexible film 16f As a result, the sealing portion 16a2 of the valve body 16a can be separated from the sealing surface FS of the valve seat 16b against the biasing force of the spring 16c and the spring 16d. In this way, without depending on the pressure of the downstream flow path RJ2, the upstream flow path RJ1 and the downstream flow path RJ2 can communicate with each other by an operation of the pump.
The pressure regulating valve 16 described above is forcibly brought into the open state over the period of the above-described discharge process SD. In this manner, the same discharge process SD as that in the first embodiment can be performed. In addition, it is preferable that the pressure regulating valve 16 is forcibly brought into the open state even during a period until the wiping step SW is completed after the discharge process SD is performed. In this manner, it is possible to reduce a possibility that the liquid inside the nozzle N may be contaminated during the wiping operation. The forcible open state of the pressure regulating valve 16 is stopped after the wiping step SW is completed and at a timing before timing t9 at which the on-off valve 12 is switched from the closed state to the open state in Step S17. In this manner, the ink can be appropriately supplied from the tank 11 to the liquid ejecting head 50 in response to the pressure inside the liquid ejecting head 50.
According to the second embodiment described above, in the discharge process SD, the amount of the liquid to be wastefully consumed can also be reduced. A configuration of the pressure regulating valve 16 is not limited to an example illustrated in
Each form described above as an example can be modified in various ways. Specific modification aspects will be described below as examples. Any two or more aspects selected from the following examples can be combined as appropriate within a mutually consistent range.
In the above-described form, an aspect in which the first liquid and the second liquid which have types different from each other are used has been described as an example. However, without being limited to this aspect, for example, one type, three, or more types of the liquid may be used. When one type of the liquid is used, the one type of the liquid corresponds to the “first liquid”. When three or more types of the liquid are used, one of two types of the liquid selected in any way from the three types of the liquid corresponds to the “first liquid”, and the other corresponds to the “second liquid”. In addition, the types of the liquid may be different for every head chip 51.
In the above-described form, an aspect in which the pressurizing mechanism 13 is directly coupled to the tank 11 has been described as an example. However, without being limited to this aspect, for example, the pressurizing mechanism 13 may be coupled to a portion between the tank 11 of the supply flow path SJ and the on-off valve 12.
In the above-described form, an aspect in which the pressurizing mechanism 13 pressurizes the inside of the tank 11 by introducing the gas into the tank 11 has been described as an example. However, without being limited to this aspect, for example, when the tank 11 is a flexible bag body, the pressurizing mechanism 13 may be configured to pressurize the inside of the tank 11 by pressing the tank 11 from the outside.
The liquid ejecting apparatus may be configured to circulate the first liquid or the second liquid inside or outside the liquid ejecting head 50. However, from a viewpoint of reducing a usage amount of the liquid as much as possible, such as when the first liquid or the second liquid is expensive, it is preferable to adopt a configuration in which the first liquid or the second liquid is not circulated in this way.
In the above-described form, the pressure of the ink inside the liquid ejecting head 50 is regulated to have the predetermined negative pressure by either the water head difference between the tank 11 and the liquid ejecting head 50 or the pressure regulating valve 16. However, a configuration for regulating the pressure of the ink inside the liquid ejecting head 50 is not limited to the above-described configurations. For example, the pressure of the ink inside the liquid ejecting head 50 may be regulated by driving the pressurizing mechanism 13, based on information on the pressure inside the tank 11 which is measured by the pressure sensor 14.
In the above-described form, the on-off valve 12 is disposed in the intermediate portion of the supply flow path SJ disposed outside the liquid ejecting head 50. However, the present disclosure is not limited thereto. The on-off valve 12 may be disposed inside the liquid ejecting head 50, that is, in the intermediate portion of the supply flow path SJ formed inside the liquid ejecting head 50.
The liquid ejecting apparatus 100 described as an example in each of the above-described embodiments can be adopted for various apparatuses such as a facsimile machine and a copier, in addition to an apparatus dedicated to printing. However, an application of the liquid ejecting apparatus of the embodiments of the present disclosure is not limited to the printing. For example, a liquid ejecting apparatus that ejects a solution or dispersing liquid of a coloring material as the first liquid or the second liquid is used as a manufacturing apparatus for forming a color filter of a liquid crystal display device. In addition, a liquid ejecting apparatus that ejects a solution or a dispersing liquid of a conductive material as the first liquid or the second liquid is used as a manufacturing apparatus for forming wiring or an electrode of a wiring substrate.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2022-143534 | Sep 2022 | JP | national |
