The present application is based on, and claims priority from JP Application Serial Number 2021-140979, filed Aug. 31, 2021, the disclosure of which is hereby incorporated by reference herein in its entirety.
The present disclosure relates to a liquid ejecting head and a liquid ejecting apparatus.
JP-A-2015-42482 describes a liquid ejecting head that ejects a liquid from a nozzle by a pressure change in a pressure chamber. The liquid ejecting head includes a pressure chamber substrate and a communication plate, and the pressure chamber is formed by laminating these substrates. In addition, the top surface of the pressure chamber is provided with an diaphragm that is displaced according to variation of a piezoelectric element. The pressure chamber substrate is, for example, manufactured by performing wet etching on a silicon single crystal substrate whose surface is a (110) plane. Accordingly, the shape of the pressure chamber is a parallelogram when viewed in the laminating direction, and two acute angle portions are formed at corners on a diagonal line of the parallelogram. On the communication plate, an individual communication hole that supplies a liquid to the pressure chamber and a nozzle communication hole that discharges the liquid toward a nozzle from the pressure chamber are formed. The pressure chamber substrate and the communication plate are bonded together using a liquid adhesive.
However, in the liquid ejecting head described in JP-A-2015-42482, breakage of the diaphragm may be caused by the adhesive. Specifically, in the bonding process of the pressure chamber substrate and the communication plate, a part of the adhesive escapes from a bonding surface, enters the pressure chamber from the two acute angle portions formed in the pressure chamber, and flows along the boundary of each surface constituting the pressure chamber by a capillary force. In addition, a part of the adhesive that has escaped flows toward the communication plate side from the individual communication hole and the nozzle communication hole. In this way, since the flow path of the adhesive diverges into many branches, the amount of adhesive attached to the diaphragm near the piezoelectric element is likely to become uneven. As a result, when the piezoelectric element is driven, the load concentrates on a part of the diaphragm, and the diaphragm sometimes breaks.
The present disclosure is a liquid ejecting head including a pressure chamber substrate in which wall surface portions of a pressure chamber in communication with a nozzle are formed, an diaphragm that is provided on a first surface side of the pressure chamber substrate in a laminating direction and forms a top surface portion of the pressure chamber, a piezoelectric element that is provided on the diaphragm, and a communication plate that is provided on a second surface side opposite to the first surface of the pressure chamber substrate in the laminating direction and forms a bottom surface portion of the pressure chamber, in which a third surface of the communication plate is bonded to the second surface of the pressure chamber substrate by an adhesive and forms the bottom surface portion, the third surface is provided with a supply opening that supplies a liquid to the pressure chamber and a discharge opening that guides a liquid in the pressure chamber to the nozzle, the pressure chamber is longitudinal in a first direction when viewed in the laminating direction, at one end of the bottom surface portion in the first direction, a first acute angle portion is formed by the wall surface portions that mutually form an acute angle, at another end of the bottom surface portion in the first direction, a second acute angle portion is formed by the wall surface portions that mutually form an acute angle, the first acute angle portion does not overlap with the supply opening and the discharge opening when viewed in the laminating direction, and the second acute angle portion does not overlap with the supply opening and the discharge opening when viewed in the laminating direction.
A liquid ejecting apparatus includes the above-described liquid ejecting head.
Hereinafter, a first embodiment will be described with reference to the accompanying drawings. Although various limitations are imposed on the embodiments described below as preferable examples, as long as there is no description to limit the present disclosure in particular in the following description, the present disclosure is not limited to these embodiments. In addition, in the following description, a printer mounted with an ink jet type liquid ejecting head is exemplified as a liquid ejecting apparatus.
The configuration of a printer 1 will be described with reference to
The above-described carriage moving mechanism 5 includes a timing belt 8. The timing belt 8 is driven by a pulse motor 9 such as a DC motor. Accordingly, when the pulse motor 9 operates, the carriage 4 is guided by a guide rod 10 installed in the printer 1 and reciprocates in the main scanning direction.
Next, the recording head 3 will be described.
As illustrated in
The case 18 is a box-shaped member made of a synthetic resin and the communication plate 16, to which the pressure generating unit 13 is bonded, is fixed on the bottom surface side. In the central portion of the case 18 in plan view, a penetrating hollow portion 25 having an elongated rectangular opening in the Y direction is formed while penetrating the case 18 in the Z direction. In the penetrating hollow portion 25, one end portion of a head cable (not illustrated) is accommodated. In addition, on the lower surface side of the case 18, an accommodating hollow portion 27 recessed in a rectangular parallelepiped shape from the lower surface to the middle of the case 18 in the Z direction is formed. In the accommodating hollow portion 27, the pressure generating unit 13 is accommodated. Moreover, in the case 18, an ink introduction path 28 is formed. The ink introduction path 28 is a flow path whose lower end is in communication with a common liquid chamber 39 of the communication plate 16 described later and introduces ink from the ink cartridge 7 to the common liquid chamber 39. As described later, in the nozzle plate 15 in the present embodiment, two nozzle lines, each of which includes a plurality of nozzles 45, that eject ink are formed in the Y direction, and the ink introduction path 28 is provided for each ink line.
The pressure chamber substrate 20, which is a constituting member of the pressure generating unit 13, is manufactured from a silicon single crystal substrate. In the pressure chamber substrate 20, a plurality of the pressure chambers 19 in communication with the nozzles 45 is formed in correspondence with each nozzle 45 of the nozzle plate 15. In the present embodiment, two lines of the pressure chambers 19 are formed in the Y direction in correspondence with the two nozzle lines. After the pressure chamber substrate 20 is bonded while being positioned with respect to the communication plate 16 described later, one end portion in the X direction of each pressure chamber 19 is in communication with the individual communication hole 40 of the communication plate 16 described later. In addition, the other end portion in the X direction of the pressure chamber 19 is in communication with the nozzle communication hole 41 of the communication plate 16.
On an upper surface 20A of the pressure chamber substrate 20, that is, a surface on a side opposite to a lower surface 20B, which is a bonding surface with the communication plate 16, the diaphragm 21 that functions as a vibration plate is formed while sealing the upper end side opening of the pressure chamber 19. This means that the diaphragm 21 forms a top surface portion of the pressure chamber 19. The diaphragm 21 is configured by, for example, silicon dioxide having a thickness of approximately 1 μm. The upper surface 20A of the pressure chamber substrate 20 corresponds to a first surface, and the lower surface 20B of the pressure chamber substrate 20 corresponds to a second surface.
In addition, on the diaphragm 21, the piezoelectric element 22 is formed via an insulating film (not illustrated). The piezoelectric element 22 of the present embodiment is the piezoelectric element 22 in a so-called flexure mode, and after an individual electrode as a first electrode, a piezoelectric body laminate, and a common electrode film as a second electrode (none of which is illustrated) are sequentially laminated, the piezoelectric element 22 is patterned for each pressure chamber 19. In addition, as illustrated in
The pressure chamber 19 is made by performing etching on the pressure chamber substrate 20 made of a silicon single crystal substrate, whose surface is a (110) plane, from the side of the lower surface 20B, which is the bonding surface with the communication plate 16, so as to penetrate a plate thickness. In the pressure chamber substrate 20, a wall surface portion defining the pressure chamber 19 is formed of a crystal orientation plane made of a (111) plane. In the present embodiment, as illustrated in
As illustrated in
Moreover, when a virtual straight line that passes through the center of the vibrating section 62 in the Y direction and extends in the X direction is a central line 60, the interval between the boundary portion 34A and the central line 60 in the Y direction does not decrease and is substantially constant from the supply section 61 to the vibrating section 62, that is, within a range from the acute angle portion 30A to the discharge section 63. Similarly, the interval between the boundary portion 34B and the central line 60 in the Y direction does not decrease and is substantially constant from the discharge section 63 to the vibrating section 62, that is, within a range from the acute angle portion 30B to the supply section 61. In addition, the acute angle portion 30A and the acute angle portion 30B are located on a diagonal line of the parallelogram formed by the outer edge of the pressure chamber 19 and provided on mutually opposite sides with respect to the central line 60.
The communication plate 16, which is a constituting member of the flow path unit 14, is a substrate pinched between the pressure chamber substrate 20 and the nozzle plate 15. This means that the pressure chamber substrate 20 is bonded on an upper surface 16A side of the communication plate 16, and the nozzle plate 15 is bonded on a lower surface 16B side of the communication plate 16. In this manner, the communication plate 16 is provided on the lower surface 20B side of the pressure chamber substrate 20 and forms the bottom surface portion of the pressure chamber 19. A liquid adhesive is used for bonding of these substrates. Note that the upper surface 16A of the communication plate 16, which is bonded together with the lower surface 20B of the pressure chamber substrate 20, corresponds to a third surface. The communication plate 16 of the present embodiment is made by performing etching on a silicon single crystal substrate whose surface is formed of a (110) plane. In the communication plate 16, the common liquid chamber 39, the individual communication hole 40, and the nozzle communication hole 41 are formed. In addition, the individual communication hole 40 also has a function as a flow path resistance portion for improving efficiency when ink is ejected from each nozzle 45, and the flow path resistance value is adjusted according to the opening area and the length in the Z direction of the individual communication hole 40.
As illustrated in
In addition, the upper end of the nozzle communication hole 41 is coupled to the other end side in the X direction of the pressure chamber 19, specifically the end portion on the central line 12 side. The lower end of the nozzle communication hole 41 is coupled to the nozzle 45. This means that the nozzle communication hole 41 is in communication with the nozzle 45 and guides the ink in the pressure chamber 19 to the nozzle 45. Note that as illustrated in
In the present embodiment, since the communication plate 16 is formed by performing etching on a silicon single crystal substrate whose surface is a (110) plane, wall surface portions defining the individual communication hole 40 and the nozzle communication hole 41 are formed of crystal orientation planes made of (111) planes. This means that the supply opening 43 and the discharge opening 44 each are formed into a parallelogram in plan view. In addition, the supply opening 43 and the discharge opening 44 of the present embodiment are formed so as to have a narrower width in the Y axis direction than the outer edge of the pressure chamber 19 on the lower surface 20B of the pressure chamber substrate 20, and in plan view, each end portion in the Y direction is disposed on an inner side of the outer edge of the pressure chamber 19. This means that in plan view, the supply opening 43 and the discharge opening 44 do not overlap with the outer edge of the pressure chamber 19 on the lower surface 20B of the pressure chamber substrate 20.
Moreover, on the upper surface 16A of the communication plate 16, the supply opening 43 and the discharge opening 44 are disposed so as not to overlap, in plan view, with the acute angle portions 30A and 30B formed on each end in the X direction of the pressure chamber 19. Specifically, as illustrated in
The nozzle plate 15 is a plate member formed of a silicon single crystal substrate and the like on which a plurality of the nozzles 45 is opened and provided in lines with a pitch corresponding to a dot formation density. In the present embodiment, the nozzle lines are configured by arranging 360 nozzles 45 with a pitch corresponding to 360 dpi. In addition, in the present embodiment, two nozzle lines are formed in the Y direction on the nozzle plate 15.
In the recording head 3 having such a configuration, by capturing ink from the ink cartridge 7 through the ink introduction path 28, a flow path such as the common liquid chamber 39 and the pressure chamber 19 in the recording head 3 is filled with ink. In addition, by supplying a control signal from the control unit to the piezoelectric element 22, the piezoelectric element 22 is bent. Accordingly, the vibrating portion 37 of the diaphragm 21 is displaced, and a pressure change is generated in the ink in the pressure chamber 19. The pressure change causes the ink in the pressure chamber 19 to be ejected from each nozzle 45 via the nozzle communication hole 41.
Next, a manufacturing method of the recording head 3 will be described. In particular, a bonding process of the pressure chamber substrate 20 and the communication plate 16 will be described in detail.
The pressure chamber substrate 20, the communication plate 16, the nozzle plate 15, and the like are manufactured by performing etching on a silicon wafer using a prescribed mask pattern and cutting the silicon wafer into individual substrates. In addition, as illustrated in
Next, the nozzle plate 15, the communication plate 16, and the pressure generating unit 13 are bonded together using a liquid adhesive. Note that an instant adhesive, a UV adhesive, and the like are used for the adhesive. First, the adhesive is substantially uniformly applied, by an application method such as transferring, to a portion, of the upper surface 16A of the communication plate 16, corresponding to the pressure generating unit 13. In this state, as illustrated in
Next, the adhesive is substantially uniformly applied to the entire surface of the lower surface 16B of the communication plate 16. In this state, as illustrated in
Finally, as illustrated in
As described above, in the present embodiment, since, in plan view, the supply opening 43 of the individual communication hole 40 and the discharge opening 44 of the nozzle communication hole 41 are formed so as not to overlap with the acute angle portions 30A and 30B of the pressure chamber 19, respectively, the adhesive that has escaped from the acute angle portions 30A and 30B as the starting points flows along the boundary portions 34A and 34B. This means that the escaped adhesive is suppressed from flowing to the individual communication hole 40 and the nozzle communication hole 41, and the flow paths are limited to being inside the pressure chamber 19. Accordingly, the amount of adhesive flowing in the boundary portions 34A and 34B becomes stable, and the amount of adhesive attached to the peripheral portion of vibrating section 62 is made uniform on each side in the Y direction. As a result, even when stress is applied to the boundary portions 34A and 34B of the vibrating section 62 as the piezoelectric element 22 is bent and deformed, since the amount of adhesive is uniform, the load on the boundary portions 34A and 34B of the vibrating section 62 is dispersed. This means that when the piezoelectric element 22 is driven, the load is unlikely to concentrate on a part of the diaphragm 21, and the diaphragm 21 can be suppressed from being destroyed. On the other hand, in a case where the supply opening 43 of the individual communication hole 40 and the discharge opening 44 of the nozzle communication hole 41 are formed so as to overlap with the acute angle portions 30A and 30B of the pressure chamber 19 in plan view, respectively, the adhesive that has escaped from the acute angle portions 30A and 30B as the starting points flows along the boundary portions 34A and 34B and flows into the individual communication hole 40 and the nozzle communication hole 41. This means that the amount of adhesive flowing in the boundary portions 34A and 34B becomes unstable, and the amount of adhesive attached to the peripheral portion of the vibrating section 62 is likely to be non-uniform on each side in the Y direction. In such a case, compared to the present embodiment, when the piezoelectric element 22 is driven, the load is likely to concentrate on the diaphragm 21, and the diaphragm 21 may not be suppressed from being destroyed.
In addition, since the supply opening 43 and the discharge opening 44 are formed so as not to overlap with the outer edge of the pressure chamber 19 in plan view, the entire portions of the supply opening 43 and the discharge opening 44 are located in the opening portion of the pressure chamber 19. This means that the supply opening 43 and the discharge opening 44 are not adjacent to a region, of the upper surface 16A of the communication plate 16, that is bonded to the lower surface 20B of the pressure chamber substrate 20. Accordingly, since acute angle portions formed in the supply opening 43 and the discharge opening 44 do not become the starting points of entry of the adhesive, the adhesive is further suppressed from flowing into the individual communication hole 40 and the nozzle communication hole 41. As a result, the amount of adhesive flowing in the boundary portions 34A and 34B can be further stabilized.
In addition, since the acute angle portions 30A and 30B, which are the two starting points of the capillary force, are formed on mutually opposite sides with respect to the central line 60 in plan view, the amount of adhesive attached to each side in the Y direction of the vibrating portion 37 can be made further uniform. This is because, in the obtuse angle portions 31A and 31B, the capillary force is less likely to act, compared to the acute angle portions 30A and 30B, and the amount of adhesive that advances, from the obtuse angle portions 31A and 31B as the starting points, along the boundary portions 34A and 34B by the capillary force, respectively, to the upper surface 20A side of the pressure chamber substrate 20 may be less than the amount of adhesive that advances from the acute angle portions 30A and 30B as the starting points.
In addition, since the interval in the Y direction between the boundary portion 34A and the central line 60 does not decrease from the acute angle portion 30A to the vibrating section 62, and the interval in the Y direction between the boundary portion 34B and the central line 60 does not decrease from the acute angle portion 30B to the vibrating section 62, the flow path of the adhesive does not become complicated, and the adhesive can be suppressed from staying in the middle of the path.
In addition, since the active portion 35 of the piezoelectric element 22 is not disposed in the supply section 61, in which the acute angle portion 30A is formed, and the discharge section 63, in which the acute angle portion 30B is formed, even if the adhesive stays in the acute angle portions 30A and 30B, the adhesive can be suppressed from affecting vibration of the vibrating portion 37.
In the above-described embodiment, various modifications can be made based on the description of the scope of claims.
For example, in the above-described embodiment, the individual communication hole 40 functions as a flow path resistance portion by adjusting the opening area and the length of the individual communication hole 40 in the Z direction, but the configuration of the flow path resistance portion is not limited thereto. In a second embodiment illustrated in
In addition, the interval in the Y direction between the boundary portion 34A of the constricted portion 57A and the central line 60 is equal to the interval in the Y direction between the boundary portion 34B of the constricted portion 57B and the central line 60. This means that the increase in width of the interval in the Y direction between the boundary portion 34A and the central line 60 in the supply section 61 is equal to the interval in the Y direction between the boundary portion 34B and the central line 60 in the discharge section 63. By so doing, the flow path resistance value can be adjusted by the length in the X direction of the constricted portion 57A without making shapes of the boundary portions 34A and 34B so complicated. As a result, the adhesive attached to the vibrating section 62 can be made uniform, and as described in the first embodiment, the load caused by bending and deformation of the piezoelectric element 22 on the boundary portions 34A and 34B of the vibrating section 62 is dispersed, and the diaphragm 21 can be suppressed from being destroyed. Furthermore, larger flow path resistance can be held.
Note that in
In addition, in the above-described embodiment, the individual communication hole 40 and the constricted portion 57A have a function as a flow path resistance portion, but the present disclosure is not limited thereto. In a third embodiment illustrated in
Thereafter, as illustrated in
In addition, in the above description, the ink jet type recording head 3, which is a type of a liquid ejecting head, is exemplified, but the present disclosure can be applied to a liquid ejecting head that ejects a liquid other than ink. For example, the present disclosure can be applied to a color material ejecting head used for manufacturing a color filter of a liquid crystal display and the like, an electrode material ejecting head used for forming an electrode of an organic electro luminescence (EL) display, a field emission display (FED) (surface emission display), and the like, a bioorganic substance ejecting head used for manufacturing a biochip, and the like.
Number | Date | Country | Kind |
---|---|---|---|
2021-140979 | Aug 2021 | JP | national |
Number | Name | Date | Kind |
---|---|---|---|
6502928 | Shimada | Jan 2003 | B1 |
20030117041 | Kurihara | Jun 2003 | A1 |
20060038859 | Sugahara | Feb 2006 | A1 |
20140362142 | Takaai et al. | Dec 2014 | A1 |
Number | Date | Country |
---|---|---|
2004-166463 | Jun 2004 | JP |
2015-042482 | Mar 2015 | JP |
Number | Date | Country | |
---|---|---|---|
20230066192 A1 | Mar 2023 | US |