Field of the Invention
The present invention relates to a liquid ejection head for ejecting liquid and a liquid ejection apparatus including the liquid ejection head.
Description of the Related Art
Examples using a liquid ejection head for ejecting liquid include an inkjet-type liquid ejection apparatus. A liquid ejection head provided in a general inkjet-type liquid ejection apparatus includes a flow path, an ejection energy generation unit provided in a part of the flow path, and a minute ejection port for ejecting liquid by the energy generated therein.
Liquid ejection apparatuses in recent years have been required to provide a higher speed, a higher image quality, and a higher definition. It has been intended to provide ejected droplets providing smaller dots and droplets ejected through ejection ports having more uniform volumes.
Japanese Patent Laid-Open No. 2007-331245 discloses that a slit is provided in a member forming an ejection port to improve the reliability of a liquid ejection head including many ejection ports that can realize a higher speed.
The liquid ejection head of the present invention has an ejection port forming member forming at least two or more ejection ports. A liquid chamber communicating with the ejection ports is formed so as to correspond to the ejection ports. In the liquid ejection head for ejecting liquid through the ejection ports, the ejection port forming member has grooves so as to sandwich the ejection ports and the liquid chamber. A part of the ejection port forming member forming the ceiling unit of the liquid chamber has a thickness t. The groove has a depth h. The groove has a width s. The width of the liquid chamber in a direction sandwiched by the grooves is denoted by W. The width between the liquid chamber and the groove has a thickness L. Based on this assumption, relations of h/t≧1.0, W/L≧4.7, and W/s≧0.8 are satisfied.
Further features of the present invention will become apparent from the following description of exemplary embodiments (with reference to the attached drawings).
Epoxy resin has been generally used as an ejection port forming member that forms an ejection port of a liquid ejection head. In many cases, manufacture steps of a liquid ejection head using epoxy resin have a step of heating the epoxy resin to cure. It has been known that the epoxy resin has a volume contraction due to the cure shrinkage. This volume contraction causes a change in the ejection port area. The change of the ejection port area causes a variation in the droplet ejection amount, which has caused a case where a completed image outputted through the liquid ejection head includes unevenness.
In the case of Japanese Patent Laid-Open No. 2007-331245, it is possible to suppress the occurrence of the peeling at an adhesive interface between epoxy resin and a substrate supporting the epoxy resin due to the volume contraction of the epoxy resin. However, no consideration is given to a change of the opening area of the ejection port due to the volume contraction of the epoxy resin. This consequently causes a risk where the droplet ejection amount may vary to cause an image to include unevenness.
In view of the above, the present invention provides a liquid ejection head and a liquid ejection apparatus by which the variation of the droplet ejection amount can be suppressed and the occurrence of the unevenness can be suppressed.
The following section will describe the first embodiment of the present invention with reference to the drawings.
The ejection port forming member 4 forms at least two or more ejection ports 5 opened at the upper side of the energy generating element 1 and an individual supply path 6 communicating with a liquid chamber 10 connected to the supplying port 3 and the respective ejection ports 5. The liquid chamber 10 is provided so as to communicate with the ejection ports so as to correspond to the ejection ports 5. In the drawing, the arrows represent a direction along which ejected liquid flows. The liquid is ejected through the ejection port 5.
In the liquid ejection head of this embodiment, a groove 9 is provided in the ejection port forming member 4 at a position between neighboring ejection ports 5 and between neighboring liquid chambers 10 between which the energy generated by the energy generating element 1 acts upon liquid. The grooves 9 are formed in the same column as the ejection port array in which the ejection ports 5 are arranged. The grooves 9 are formed so as to sandwich the ejection port 5 and the liquid chamber 10. Furthermore, the grooves 9 are symmetrically provided around the ejection port 5 as a center.
In this embodiment, epoxy resin is used as material of the ejection port forming member 4. When the ejection port forming member 4 includes epoxy resin, the epoxy resin is frequently cured due to heating. It has been known that epoxy resin has a volume contraction due to the cure shrinkage. This volume contraction may cause a change in the opening area of the ejection port 5. However, this phenomenon is not limited to epoxy resin and also may occur in the use of other resins.
To solve this, in this embodiment, the groove 9 is provided as shown in
It is assumed that a direction along which the ejection port 5 and the groove 9 are arranged is a direction Y while a direction orthogonal to the direction Y is a direction X. In this case, the epoxy resin amount around the ejection port in the direction Y to the ejection port 5 is smaller than the epoxy resin amount in the direction X to the ejection port 5. Thus, the deformation amount caused when the ejection port forming member 4 deforms and shrinks is different depending on the direction Y and the direction X to the ejection port 5. Specifically, the direction X to the ejection port 5 requires a large amount of epoxy resin. Thus, the deformation amount in the shrinkage deformation is larger than the deformation amount in the direction Y.
The existence of the groove 9 allows the ejection port forming member 4 to have a region (separation wall 11) providing a free deformation in the vicinity of the liquid chamber 10. When the stress due to the shrinkage deformation of the epoxy resin is sufficiently high, the separation wall 11 can be deflected.
As a result, as shown in
Furthermore, by allowing the separation wall 11 to be deflected during the deformation, with regard to the diameter of the ejection port prior to the deformation, the deformation is caused based on a relation between the deformation to reduce the diameter in the direction X and the direction Y and the deformation to increase the diameter in the direction X and the direction Y. As a result, the ejection port 5 after the deformation has an ellipsoidal shape and has the opening area not significantly different from the opening area of the ejection port 5 prior to the deformation. As described above, this embodiment can more effectively suppress the variation of the opening area of the ejection port 5 due to the volume contraction of the epoxy resin than in the case of a conventional example.
In order to provide the deformation as in this embodiment, it is important to sufficiently deflect the separation wall 11. It is assumed that the groove 9 has a depth h, the groove 9 has a width s, the width of the liquid chamber 10 in a direction sandwiched between the grooves 9 is W, and the width between the liquid chamber 10 and the groove 9 (separation wall 11) has a thickness L (see
h/t≧1.0
W/s≧0.8
W/L≧4.7
The ejection port 5 has a diameter shown by Φ.
The bottom part of the groove 9 is preferably formed at a position closer to the substrate than at the position of the substrate-side face of the ceiling member constituting the liquid chamber 10. By reducing the thickness of the bottom part in the manner as described above, the separation wall 11 can be deflected in an easier manner. Furthermore, by sufficiently increasing the groove width s to the ceiling width W, the separation wall 11 can be easily deflected to the stress to cause the ceiling to contract. Furthermore, by sufficiently reducing the width L of the separation wall to the ceiling width W, the separation wall 11 can be easily deflected to the stress to cause the ceiling member to contract.
By providing the grooves 9 in the same column as the column in which the ejection port 5 is arranged (i.e., by providing the grooves 9 in the ejection port array to sandwich the ejection port 5), the deflection of the separation wall 11 is effectively transmitted as the deformation of the ejection port 5. By providing the grooves 9 in a symmetric manner to the ejection port 5, the symmetricity of the ejection port after the deformation can be maintained in a predetermined direction (groove arrangement direction). By causing the deflection of the separation wall 11 and the volume contraction to occur, the variation of the ejection port opening area after the deformation can be suppressed, thus suppressing the variation of the amount of ejected droplets.
Furthermore, in this embodiment, the grooves 9 are formed to sandwich the ejection port 5. However, the invention is not limited to this. Specifically, any configuration may be used so long as a space is provided so that the ejection port is sandwiched with a reduced resin volume.
In this manner, grooves having a predetermined width and a predetermined depth are formed to sandwich the ejection port in a manner to satisfy the above relations (i.e., h/t≧1.0, W/L≧4.7, and W/s≧0.8). This can consequently realize a liquid ejection head and a liquid ejection apparatus by which the variation of the droplet ejection amount can be suppressed and the occurrence of unevenness can be suppressed.
The following section will describe the second embodiment of the present invention with reference to the drawings. This embodiment has a basic configuration similar to that of the first embodiment. Thus, the following section will describe a characteristic configuration only.
An angle formed by the ejection port array and the groove column may be set within a range within which no adverse effect on the layout is caused. Such a range is preferably 0° to 2°.
In this embodiment, the ejection port after the deformation also has an ellipsoidal shape. However, the ejection port in this embodiment has an ellipsoidal shape in which the long axis and the short axis are inverted when compared with the shape of the first embodiment. This embodiment is similar to the first embodiment in that the deflection of the separation wall 11 and the volume contraction can suppress the variation of the ejection port opening area after the deformation, thus suppressing the variation of the amount of ejected droplets.
The following section will describe the third embodiment of the present invention with reference to the drawings. This embodiment has a basic configuration similar to that of the first embodiment. Thus, the following section will describe a characteristic configuration only.
In this embodiment, the depression region 13 is formed to have a width smaller than that of the ceiling member. The existence of such a depression region 13 causes a stress to lift the ceiling member toward the surface side (the upper side in the drawing). In the first embodiment, when the separation wall 11 deflects, the neighborhood of the ejection port changes in a direction along which the entirety falls to the substrate side (i.e., the neighborhood of the ejection port changes so that the surface of the substrate 2 moves closer to the surface of the ejection port 5 to reduce a distance therebetween). When this change increases, the droplet formation accuracy may decline or the droplet volume may easily change. This may consequently cause an influence on the resultant outputted image.
The configuration of this embodiment has an effect that the deflection of the separation wall 11 is used to reduce the action to fall the ejection port neighborhood 14. This can consequently reduce the change of the ejection port area while a fixed distance between the ejection port 5 and the surface of the substrate.
The following section will describe the fourth embodiment of the present invention with reference the drawings. This embodiment has a basic configuration similar to that of the first embodiment. Thus, the following section will describe a characteristic configuration only.
In the manufacture method as described above, the ejection port is preferably formed to have an ellipsoidal shape so that the long axis direction is substantially parallel to the direction along which the grooves are opposed. According to this configuration, the contraction and deformation of the epoxy resin by the heating step can be used to deform the ellipsoidal ejection port shown by the dotted line of
A plurality types of liquid ejection heads were actually manufactured to actually perform an output, thereby confirming the existence or nonexistence of the unevenness occurring in an output image. The liquid ejection heads were manufactured based on the method of the first embodiment. The liquid ejection heads were manufactured using ejection port forming members of epoxy resin (EHPE3150, made by Daicel). As a final step, in order to promote the curing reaction of the epoxy resin, a burning process was performed in an oven at 200 degrees C. for 1 hour. Table 1 shows the sizes of the respective parts of the respective liquid ejection heads, the changes of the ejection port areas, the size ratio of the respective parts, and the determination result.
The respective examples satisfy the relations of h/t≧1.0, W/L≧4.7, and W/s≧0.8. As a result, the ejection port area change AS could be suppressed to a change of±6% or less. Furthermore, the yield ratios could be improved when compared with Comparison Examples, thus suppressing the unevenness in output images from occurring.
While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
This application claims the benefit of Japanese Patent Application No. 2015-159000 filed Aug. 11, 2015, which is hereby incorporated by reference wherein in its entirety.
Number | Date | Country | Kind |
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2015-159000 | Aug 2015 | JP | national |