The present disclosure relates to a liquid ejection head and a method for manufacturing the liquid ejection head.
A typical example of a liquid ejection head is an inkjet head included in an inkjet printer. The liquid ejection head ejects small drops (droplets) of liquid, such as ink, through ejection ports to form an image or the like on a recording medium.
The liquid ejection head generally includes an element substrate, a support member, and an electric wiring board. The element substrate has ejection ports through which liquid is ejected, and includes energy-generating elements. The support member supports the element substrate. The electric wiring board is used to supply electric signals for ejecting liquid to the energy-generating elements. A cover member having an opening at which the element substrate is exposed may be connected to the support member such that at least a portion of the electric wiring board is held between the cover member and the support member. The support member and the cover member are connected to each other with an adhesive, and the adhesive fills the gap between the support member and the cover member of the liquid ejection head. Thus, the electric wiring board disposed between the support member and the cover member is prevented from coming into contact with ink, and the electric reliability is improved.
When a thermosetting sealing material is used as the above-described adhesive, the adhesive needs to be applied without leaving air bubbles therein.
When the adhesive is applied such that closed spaces, such as air bubbles, are formed between the support member and the cover member, the adhesive may break as a result of thermal expansion of the closed spaces in a process of curing the adhesive by applying heat. Even after the liquid ejection head is manufactured, the adhesive may similarly break as a result of thermal expansion of the closed spaces when the adhesive is influenced by heat generated during use of the liquid ejection head or when the liquid ejection head is stored in a high-temperature environment. When the adhesive serving as the sealing material that seals the gap between the support member and the cover member breaks as described above, the electric reliability of the liquid ejection head may be affected.
Japanese Patent Laid-Open No. 2000-177134 describes a liquid ejection head having a structure in which a sealing material is applied over the entire region of a gap between a support member and a wiring board that serves as the above-described cover member. According to this structure, air bubbles (closed spaces) are not formed between the support member and the wiring board, and a liquid ejection head having a high degree of electric reliability can be obtained.
In recent years, a size of the element substrate of the above-noted typical example of a liquid ejection head has been increased to improve the quality of the recorded images and increase the print speed. As the substrate size increases, the support member and the cover member continue to be connected to each other with adhesive, but a greater amount of adhesive is used when the adhesive is applied over the entire region between the members to be bonded together as described above. This leads to an increase in cost.
The present disclosure provides a liquid ejection head that has a higher degree of electric reliability and in which a smaller amount of adhesive is used and a method for manufacturing the liquid ejection head.
According to an aspect of the present disclosure, a liquid ejection head includes an element substrate having an ejection port through which liquid is to be ejected and having a pressure chamber configured to supply the liquid to the ejection port, an electric wiring board configured to supply an electric signal for ejecting the liquid to the element substrate, a support member supporting the element substrate and the electric wiring board on a support surface, and having a first through hole and a second through hole, and a cover member having an opening at which the element substrate is exposed, wherein the cover member is joined to the support surface of the support member with a first adhesive, wherein the first through hole serves as a flow passage through which the liquid is supplied to the pressure chamber and the second through hole opens in the support surface, wherein the first adhesive is disposed in an outer peripheral region of the support surface of the support member, and wherein a space surrounded by the cover member, the support member, and the first adhesive communicates with the second through hole.
Further features of the present disclosure will become apparent from the following description of exemplary embodiments with reference to the attached drawings.
Embodiments of the present disclosure will now be described with reference to the drawings. However, sizes, materials, shapes, relative arrangements, etc., of components described in the embodiments are not intended to limit the scope of the present disclosure unless specified otherwise. A liquid ejection head according to the present disclosure is suitable for application to an inkjet recording head configured to eject ink serving as liquid. The inkjet recording head is included in a liquid ejection apparatus (hereinafter referred to as also as an apparatus body) serving as an inkjet recording apparatus.
The liquid ejection head 1 according to the present disclosure includes an element substrate 2 including elements for ejecting liquid; the electric wiring board 3 electrically connected to the element substrate 2; the support member 5 that supports the element substrate 2 and the electric wiring board 3; and a cover member 4. The cover member 4 has an opening 41 at which the element substrate 2 is exposed, and is disposed to face the support member 5 with at least a portion of the electric wiring board 3 disposed therebetween. The liquid ejection head 1 having the above-described structure ejects liquid, such as ink, stored in a tank 81. The tank 81 is simplified in
The element substrate 2 is, for example, a silicon substrate, and has ink supply ports 6 extending therethrough. The ink supply ports 6 communicate with flow passages 52 formed in the support member 5 described below. Ink supplied from the outside of the head flows through the flow passages 52 and is supplied to the ink supply ports 6. The element substrate 2 includes energy-generating elements 21 that apply discharge energy to the ink and electric wires 14 electrically connected to respective ones of the elements. The element substrate 2 also includes a nozzle plate 7 at a side opposite to the side at which the element substrate 2 is connected to the support member 5. The nozzle plate 7 has ejection ports 71 through which the ink is discharged. The nozzle plate 7 and the element substrate 2 define pressure chambers 22 in which the energy-generating elements are disposed. The ink is supplied from the ink supply ports 6 to the pressure chambers 22, and is discharged through the ejection ports 71. The nozzle plate 7 may be formed integrally with the element substrate 2.
In the present embodiment, the element substrate 2 substantially has an elongated rectangular shape. Assuming that W is a length of short sides of the element substrate 2 and L is a length of long sides of the element substrate 2, the effects of the present disclosure can be obtained when L/W≥2 is satisfied. Preferably, L/W≥3 is satisfied, and more preferably, L/W≥3.5 is satisfied.
The electric wiring board 3 may be, for example, a flexible board. Electrode terminals 23 on the element substrate 2 are electrically connected to electrode terminals 31 on the electric wiring board 3 serving as an electric wiring member by, for example, wire bonding. Thus, the element substrate 2 is electrically connected to an apparatus body (for example, an inkjet printer) outside the head, and electric signals are transmitted from the apparatus body to the element substrate 2. The electric wiring board 3 having the above-described structure has a function of supplying electric signals for ejecting liquid to the element substrate 2.
The element substrate 2 and the electric wiring board 3 are fixed to a support surface of the support member 5 with an adhesive 9. The shape and material of the support member 5 are not particularly limited as long as the support member 5 is large enough to allow the element substrate 2 and the electric wiring board 3 to be mounted thereon. The material may be selected from a wide variety of materials including resins, ceramics, and metals. When the material of the adhesive 9 is a thermosetting adhesive, the support member 5 may be composed of, for example, a plate made of alumina, which has a high heat resistance and a low coefficient of linear expansion. The support member 5 has the flow passages 52 (first through holes) through which liquid flows to the ink supply ports 6 in the element substrate 2.
The cover member 4 is bonded to the electric wiring board 3 and the support member 5 with the adhesive 9 and an adhesive 10. In the opening 41 of the cover member 4, the space between the element substrate 2 and the cover member 4 is filled with a sealing material 11.
The liquid ejection head 1 is configured to be in a standby state, in which the liquid ejection head 1 is sealed by a cap unit included in the apparatus body, when the apparatus is not used. Therefore, a surface of the liquid ejection head that faces in a liquid ejection direction and that comes into in contact with the cap unit needs to be flat. In the structure according to the present disclosure, the liquid ejection head 1 includes the cover member, and therefore includes a flat region to come into contact with the cap unit.
The shape and material of the cover member 4 are not particularly limited as long as the cover member 4 has a flatness and size such that the cover member 4 can be installed in an apparatus (for example, inkjet printer) on which the liquid ejection head 1 is to be mounted. The material may be selected from a wide variety of materials including resins, ceramics, and metals. When the materials of the adhesive 9 and the adhesive 10 are a thermosetting adhesive, the material of cover member 4 may be, for example, alumina, which has a high heat resistance and a low coefficient of linear expansion.
In the present embodiment, as described above, the element substrate 2 substantially has an elongated rectangular shape, and the size thereof is greater than that in the related art. Accordingly, the electric wiring board 3 is required to have a greater allowable current. Therefore, as illustrated in
As illustrated in
A method for manufacturing the liquid ejection head according to the present disclosure will be described with reference to
Next, as illustrated in
Subsequently, an adhesive 9b (second adhesive) used to fix the electric wiring board 3 is applied.
The material of the adhesive 9b may be the same as that of the adhesive 9a. The adhesive 9b is applied along three sides of a rectangle surrounding the through holes 53. In
Subsequently, as illustrated in
Then, the adhesive 9 (adhesive 9a and adhesive 9b) is cured while load is applied to the element substrate 2 and the electric wiring board 3 so that the adhesive 9 is spread and reduced in thickness. In the present embodiment, the adhesive 9 is, for example, a thermosetting epoxy-based adhesive. Therefore, the adhesive 9 is cured by applying heat.
Next, the element substrate 2 and the electric wiring board 3 are electrically connected to each other. The electrode terminals 23 of the element substrate 2 are connected to the electrode terminals 31 of the electric wiring board 3 with the electric wires (wires) 14 by wire bonding. Thus, a wire group that serves as an electrical connection portion is provided (see
Next, as illustrated in
Next, as illustrated in
Next, the electrical connection portion is covered with a sealing material 12 to protect the electrical connection portion. The sealing material 12 is applied to a region above the wire group covered in the sealing material 11 (see
The dotted lines in
Unlike a comparative example (
In the structure of the present disclosure, the air in the space 15 surrounded by the support member 5 and the cover member 4 can flow downward from the support member 5 through the recess 13 formed in the electric wiring board 3 and one of the through holes 53. Therefore, breakage of the sealing material due to expansion of the air can be prevented. This effect of the present disclosure can be obtained as long as the space 15 communicates with one of the through holes 53 that open in the support surface 51 of the support member 5. In the present embodiment, the through holes 53 are provided to accommodate the capacitors 8. However, the capacitors 8 may be omitted as long as the liquid ejection head 1 has the through holes 53. Even when the recess 13 is not provided, when the electric wiring board 3 is disposed such that the electric wiring board 3 does not entirely cover the through holes 53, as illustrated in
Description of elements that are the same as those in the first embodiment will be omitted.
Although the recess 13 is formed in one of the electric wiring board 3 and the support member 5 in the first and second embodiments, the recess 13 is not limited to this as long as the recess 13 connects the space 15 to a through hole formed in the support member 5. As illustrated in
Description of elements that are the same as those in the above-described embodiments will be omitted.
Description of elements that are the same as those in the above-described embodiments will be omitted.
The present disclosure provides a liquid ejection head that has a higher degree of electric reliability and in which a smaller amount of adhesive is used and a method for manufacturing the liquid ejection head.
While the present disclosure has been described with reference to exemplary embodiments, it is to be understood that the disclosure is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
This application claims the benefit of Japanese Patent Application No. 2022-159883 filed Oct. 4, 2022, which is hereby incorporated by reference herein in its entirety.
Number | Date | Country | Kind |
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2022-159883 | Oct 2022 | JP | national |