Field of the Invention
The present invention relates to liquid ejection heads and methods of producing the same.
Description of the Related Art
A liquid ejection head used in a liquid ejection apparatus such as an inkjet recording apparatus may include a structure configured to prevent entry of bubbles or foreign substances in a liquid. Japanese Patent Laid-Open No. 2000-94700 discloses a method of forming a membrane filter, which is configured to prevent entry of bubbles and foreign substances, in a liquid ejection head, concurrently with an ink supply portion. In the invention described in Japanese Patent Laid-Open No. 2000-94700, an ink passes through openings in the membrane filter, i.e., the openings in the membrane filter serve as liquid supply openings. The openings are desired to have the smallest possible diameter and to be arranged at the smallest possible intervals to prevent entry of foreign substances, for example.
An aspect of the invention provides a liquid ejection head including a liquid ejection board and a liquid ejection head component. The liquid ejection board includes a substrate, an energy generating device on a first surface of the substrate, a channel defining member defining a liquid channel and having a liquid ejection opening in communication with the liquid channel, a liquid supply passage in communication with the liquid channel, a liquid supply opening in communication with the liquid supply passage, and an opening in communication with the liquid channel. The liquid channel allows a liquid to be in contact with the energy generating device. The liquid ejection opening allows a liquid to be ejected therethrough. The liquid supply opening has a smaller opening cross-sectional area taken in a direction perpendicular to a flow direction of a liquid than the liquid supply passage. The opening is included in addition to the liquid ejection opening and the liquid supply passage. The liquid ejection head component is disposed on the liquid ejection head so as to close at least a portion of the opening.
Another aspect of the invention provides a method of producing a liquid ejection head including forming a liquid ejection board and disposing a liquid ejection head component on the liquid ejection board. The forming the liquid ejection board includes forming an energy generating device on a first surface of a substrate, forming a channel defining member defining a liquid channel and having a liquid ejection opening in communication with the liquid channel on the first surface of the substrate, forming a liquid supply passage in communication with the liquid channel, forming a liquid supply opening in communication with the liquid supply passage, and forming an opening in the liquid ejection board so as to be in communication with the liquid channel. The channel defining member allows a liquid to be in contact with the energy generating device. The liquid ejection opening allows a liquid to be ejected therethrough. The liquid supply opening has a smaller opening cross-sectional area taken in a direction perpendicular to a flow direction of the liquid than the liquid supply passage. The opening is formed in addition to the liquid ejection opening and the liquid supply passage. The disposing the liquid ejection head component on the liquid ejection board includes disposing the liquid ejection head component so as to close at least a portion of the opening.
Further features of the present invention will become apparent from the following description of exemplary embodiments with reference to the attached drawings.
A liquid ejection head may include a structure such as a membrane filter configured to prevent entry of bubbles and foreign substances or a member for separating a liquid channel, for example. Such a component may reduce an opening area of the liquid ejection head, making it difficult for a liquid to be replaced or released. As a result, a residue is readily generated in steps of producing the liquid ejection head. The residue lowers the quality of the liquid ejection head or decreases the yield of the liquid ejection head. The present invention provides a liquid ejection head configured to reduce generation of residues, for example, in the steps of producing the liquid ejection head so as to improve the quality and the yield.
Hereinafter, embodiments of the present invention are described with reference to the drawings. A material, structure, and production method, for example, of the present invention are not limited to those described below.
As illustrated in
The liquid ejection head illustrated in
Liquid Ejection Board 20
Substrate 1
The substrate 1 includes a substrate able to have a semiconductor device such as a transistor or a circuit. Examples of a material of the substrate include Si, Ge, SiC, GaAs, InAs, GaP, a diamond, an oxide semiconductor such as ZnO, a nitride semiconductor such as InN or GaN, a mixture thereof, and a semiconductor material such as an organic semiconductor. The substrate 1 may include a substrate formed of glass, Al2O3, resin, or metal, for example, and a circuit including a thin film transistor, for example. The substrate may be an SOI substrate, or a substrate including plastic and metal layers bonded together, for example. Among them, the substrate 1 can particularly include a silicon substrate formed of Si.
Liquid Supply Passage 3
The liquid supply passages 3 are at least a portion of through holes in the substrate 1. The through holes are in communication with the liquid channels 6 and extend between the front surface 5 (first surface) of the substrate 1 and the rear surface 12 (second surface) opposite the front surface 5. In
Energy Generating Device 4
The energy generating devices 4 and connecting terminals (not illustrated) are disposed on the front surface 5 (first surface) of the substrate 1. The energy generating devices 4 may be energy generating devices commonly used in the art. Examples of the energy generating device 4 include a heater element including TaSiN, for example, an electromagnetic wave heating element, which generates thermal energy, a piezoelectric element and an ultrasonic element, which generate mechanical energy, an element that generates electric energy, and an element that generates magnetic energy. The generated energy is used to eject the liquid. The energy generating devices 4 may be in contact with the front surface 5 of the substrate 1, or the energy generating devices 4 each may partly be in non-contact with the front surface 5 of the substrate 1. The energy generating devices 4 may be covered with an insulating layer or a protective layer.
Channel Defining Member 2
The channel defining member 2, which constitutes walls of the liquid channel 6, is disposed on the front surface 5 of the substrate 1. The channel defining member 2 is formed of a resin material such as a photosensitive resin. The photosensitive resin may be any one of a negative photosensitive resin and a positive photosensitive resin. The channel defining member 2 can be particularly formed of a negative photosensitive resin. Examples of the negative photosensitive resin include an epoxy resin. Examples of a commercially available epoxy resin include EHPE-3150, which is a product name available from Daisel Corporation. The photosensitive resin may include one kind of the resin materials or two or more kinds of the resin materials. The material of the channel defining member 2 is not limited to the resin material, and may be a metal material, a semiconducting material, an insulating material, or any combination thereof. The channel defining member 2 may include at least one layer formed of the above-described material. The channel defining member 2 may further include a contact layer for enhancing the contact, a planarizing layer, or an antireflection layer. Such layers may be disposed between the channel defining member 2 and the substrate 1 or may be disposed between any two of the layers of the channel defining member 2 if the channel defining member 2 includes two or more layers.
Liquid Channel 6 and Liquid Ejection Opening 7
The channel defining member 2 includes the liquid channels 6, which allow a liquid to be in contact with the energy generating devices 4, and has the liquid ejection openings 7 in communication with the liquid channels 6. The liquid is ejected through the liquid ejection openings 7. The size, shape, number, and position of the liquid channels 6 and the size, shape, number, and position of the liquid ejection openings 7 may be determined without limitations, and are not limited to those illustrated in the drawings. However, the liquid ejection openings 7 are typically configured to have a smaller opening cross-sectional area, which is taken in a direction perpendicular to a flow direction of the liquid (hereinafter, may be simply referred to as an opening cross-sectional area), than the liquid supply passages 3 and the liquid channels 6.
Liquid Supply Opening Member 8 and Liquid Supply Opening 9
The liquid ejection board 20 has the liquid supply openings 9 in communication with the liquid supply passages 3. The shape, number, and position of the liquid supply openings 9 may be determined without limitations as long as the liquid supply openings 9 have a larger opening cross-sectional area, which is taken in a direction perpendicular to a flow direction of the liquid, than the liquid supply passages 3, and are not limited to those illustrated in the drawings. In the configuration illustrated in
The liquid supply openings 9 may be portions of the through holes in the substrate 1 as the liquid supply passages 3. The portions are adjacent to the rear surface 5 of the substrate 1. In the case that the liquid ejection head includes the liquid supply opening member 8, the liquid supply openings 9 may be formed in the liquid supply opening member 8. The liquid supply openings 9 may be formed in the substrate 1 at a position adjacent to the front surface 5. In such a case, the openings 11 may be formed in the channel defining member 2 to reduce the generation of residues, for example, in the steps of producing the liquid ejection head. The liquid supply openings 9 may be used to filter bubbles and foreign substances, to separate the liquid so as to flow into different liquid supply passages 3, or to adjust resistance applied to the liquid, for example. The liquid supply openings 9 can have a smaller opening area than the liquid ejection openings 7 to reduce entry of foreign substances, which may cause clogging of the liquid ejection openings 7. The liquid supply openings 9 having the smaller opening area can provide filtering effect.
The liquid supply opening member 8 may be disposed on the rear surface 12 (second surface) of the substrate 1 as illustrated in
The liquid supply opening member 8 may be formed of a metal material, a semiconducting material, an insulating material, or a resin material, for example. Examples of the metal material include, Al, Cu, Ni, Ti, Fe, Mn, Mo, Sn, Cr, Ca, Pt, Au, Ag, Pd, W, Be, Na, Co, Sc, Zn, Ga, V, Nb, Ir, Hf, Ta, Hg, Bi, Pb, and a mixture thereof. Further examples of the metal material include La, Ce, Nd, Sm, and a mixture thereof. The liquid supply opening member 8 may be formed of SUS, which is a widely used alloy, or a metal glass, for example. The liquid supply opening member 8 may be formed of an oxide, nitride, nitrogen oxide, carbide, fluoride, boride of the above-described metal, or a mixture thereof. Examples of the semiconducting material include Si, Ge, SiC, GaAs, InAs, GaP, GaN, SiN, and BN. The liquid supply opening member 8 may further include a carbon material such as diamond-like carbon, graphite, or a carbon nanotube. Examples of the resin material include an acrylic resin, polyimide, polyamide, polyurethane, polycarbonate, polyethylene terephthalate, fluororesin, polystyrene, polypropylene, polyvinyl chloride, and biodegradable plastic. The liquid supply opening member 8 may have a layered structure including layers formed of the above-described materials, and may include a device or liquid passage, for example. The liquid supply opening member 8 formed of the above-described materials may be coated to improve resistance against chemicals, to prevent reflection, or to enhance the contact between the liquid supply opening member 8 and the other components.
The liquid supply opening member 8 may be attached to the substrate 1 after processed, or may be processed after attached to the substrate 1. In the case that the processed liquid supply opening member 8 is attached to the substrate 1, misalignment may occur during the attachment, and thus the positioning with high accuracy may be difficult. In addition, an additional member such as a support may be required in the step of forming the liquid supply openings 9, for example, in the liquid supply opening member 8. This may increase the number of steps, leading to an increase in the production cost. In the case that the liquid supply opening member 8 is processed to have the liquid supply openings 9, for example, after the liquid supply opening member 8 is attached to the substrate 1, positioning accuracy is improved. In addition, the substrate 1 may be used as a support for transporting, for example, reducing an increase in the production cost. A method of forming the liquid supply openings 9 and the openings 11 in the liquid supply opening member 8 is not limited, and may be suitably determined depending on the material of the liquid supply opening member 8. Examples of the method include photolithography, laser ablation, and mechanical boring using a drill. The liquid supply opening member 8 may be formed of a porous material or mesh material including holes. Some of the holes in communication with the liquid supply passages 3 may be used as liquid supply openings 9. Thus, only the openings 11 need to be formed. In addition, the liquid supply opening member 8 may have a multi-layered structure and may have grooves as passages in communication with the liquid supply openings 9.
A contact layer may be formed on a joint surface of at least one of the substrate 1 and the liquid supply opening member 8, or a plasma treatment or a treatment with a primer may be performed on a joint surface of at least one of the substrate 1 and the liquid supply opening member 8 in order to enhance the contact between the substrate 1 and the liquid supply opening member 8. The liquid supply opening member 8 may be connected to the substrate 1 by using an adhesive such as a thermosetting adhesive, a light curing adhesive, a moisture reactive adhesive, or a low-melting-point metal. The adhesive may be in a liquid form, a solid form such as a film form, or a form of mist. Further examples of the adhesive include a thermally releasable adhesive film, a photo-releasable adhesive film, and an adhesive film releasable with force. The liquid supply opening member 8 may be welded with heat or ultra-sonic sound waves, or may be connected by surface activated bonding with plasma or ion beams. A material for connection between the substrate 1 and the liquid supply opening member 8 may be applied on the substrate 1. The surface of the substrate 1 may be flattened. The liquid supply opening member 8 may be formed on the substrate 1 by coating, deposition, chemical vapor deposition (CVD), sputtering, or plating, for example. The liquid supply opening member 8 may include a circuit. The circuit in the liquid supply opening 8 and the circuit in the substrate 1 may be connected to each other.
The liquid supply opening member 8 may be formed of a photosensitive resin. The photosensitive resin enables the liquid supply opening member 8 to be processed with high accuracy. The photosensitive resin can be a negative photosensitive resin. A resin having high resistance to heat and chemicals can provide a wider range of freedom in the production steps and can improve reliability of the production. The photosensitive resin can include at least one of a polyimide resin, polyamide resin, epoxy resin, polycarbonate resin, acrylic resin, and fluorine resin. Among them, an epoxy resin can be particularly used. The photosensitive resin may further include a photo acid generator, a sensitizer, a reducing agent, an adhesion improving additive, a water repellent, or an electromagnetic wave absorber, for example. The photosensitive resin may further include a thermoplastic resin, a resin for controlling a softening point, or a resin for improving strength, for example. The photosensitive resin may include an inorganic filler, or a carbon nanotube, for example. In addition, the photosensitive resin may further include a conducting material as a countermeasure against static electricity, for example.
Opening 11
The liquid ejection board 20 includes the openings 11 in communication with the liquid channels 6. The openings 11 are included in addition to the liquid ejection openings 7 and the liquid supply passages 3. At least a portion of the openings 11 is closed by the liquid ejection head component 10. The position of the openings 11 is not limited as long as the openings 11 are in communication with the liquid channels 6. The openings 11 may be formed in the rear surface 12 (second surface) of the substrate 1, may be formed in the liquid supply opening member 8 as illustrated in
The size, shape, number, and position of the openings 11 are determined without limitations and are not limited to those illustrated in the drawings. As illustrated in
In the case that the liquid supply passage 3 includes a plurality of liquid supply passage 3, the openings 11, which are in communication with the liquid supply passages 3, may be provided for not all of the liquid supply passages 3. Such a configuration also provides the advantages of the invention. However, at least one opening 11 can be provided for each of the liquid supply passages 9 to obtain more advantages. Specifically, at least one of the openings 11 and at least one of the liquid supply openings 9 can be provided for each of the liquid supply passages 3.
If the liquid supply opening member 8 and the substrate 1 have different coefficients of thermal expansion, the openings 11 reduce the stress. This may reduce wafer warpage, and may reduce the possibility that the liquid supply opening member 8 may be detached from the substrate 1.
Liquid Ejection Head Component 10
In the liquid ejection head illustrated in
In the steps of development, release, cleaning, and drying in the steps of producing the liquid ejection head, residues or a takt time (measure time) may cause an issue. After the liquid supply openings 9 and the openings 11 are formed, the liquid ejection head component 10 closes at least a portion of the openings 11. This configuration reduces the possibility that a defect is caused by insufficient drying in the production steps or by residues, improving the quality of the nozzle and the yield. In addition, this configuration shortens the drying time, for example, and thus the productivity is improved. A portion of the liquid supply openings 9 may also be closed in addition to the openings 11 if the misalignment, for example, occurs in the step of closing the openings 11. The liquid supply openings 9 may be partly closed as long as the supply of the liquid such as an ink is not disturbed. As described above, a portion of the openings 11 may remain open due to misalignment, for example, in the step of closing the openings 11.
The openings 11 may be formed in any member other than the liquid supply opening member 8 of the liquid ejection board 20, as long as the openings 11 are in communication with the liquid channels 6. The openings 11 may be indirectly in communication with the liquid supply passages 3, and may be formed in the channel defining member 2, for example.
The openings 11 may be used as identification marks such as numbering marks and alignment marks. The liquid ejection head may be configured to use the openings 11 to perform a function. Examples of the function includes a function of evaluating the liquid, a function of exchanging energy with the liquid, a function of controlling a state of the liquid, and a function of controlling a state of the liquid ejection head. The evaluation of the liquid by using the openings 11 is performed through a temperature, an electric potential, an absorption spectrum, or appearance, for example. A material having high electromagnetic wave transmission may be used to form the liquid ejection head component 10 such that reflection or absorption, for example, of the electromagnetic wave is used for the evaluation. A terminal for determining the temperature or the electric potential, for example, may be disposed in the opening 11. The opening 11 may be used to heat the liquid. A piezoelectric element, for example, may be disposed in the opening 11 such that energy for ejection is mechanically applied to the liquid. An electric potential of the liquid, for example, may be controlled by using the opening 11, such that a metal member of the liquid ejection head does not melt, for example.
Examples of the function of exchanging energy with the liquid by using the opening 11 include a function of exchanging thermal energy to adjust the temperature of the liquid and a function of exchanging kinetic energy to transmit force that moves the liquid, for example. Examples of the function of controlling the state of the liquid by using the opening 11 include a function of controlling the temperature of the liquid to an optimum value and a function of modifying the composition of the liquid, for example, based on the evaluation of the state of the liquid. Examples of the function of controlling the state of the liquid ejection head by using the opening 11 include a function of adjusting the temperature of the liquid ejection head or an energy amount applied to the energy generating devices 4, for example, based on the evaluation of the state of the liquid.
As described above, the liquid ejection head according to the invention can have the function of evaluating the liquid by using the opening 11 or the function of exchanging energy with the liquid by using the opening 11 while the opening 11 is closed by the liquid ejection head component 8. The function of controlling the state of the liquid by using the opening 11 or the function of controlling the state of the liquid ejection head by using the opening 11 can be particularly employed in the liquid ejection head of the invention.
In the liquid ejection head according to the invention, the openings 11 lower a resistance against a fluid. This improves ejection properties determined by an amount of ejection or a speed of ejection, for example, and reduces stagnation of the liquid. The reduction in the stagnation of the liquid enables a causative substance of residues to be readily ejected, leading to a reduction in generation of residues, for example, in the steps of producing the liquid ejection board 20. As a result, the quality and the yield rate of the liquid ejection heads are improved.
A component dissolved in the stagnant liquid may become a residue when changed to be in a solid state by drying and may become attached to the liquid supply passages 3 or the liquid channels 6, for example, or a foreign substance may become a residue when not ejected and remains in the liquid supply passages 3 or the liquid channels 6, for example. The component dissolved in the liquid may be a material of the channel defining member 2 or the liquid supply opening member 8, a resist, or other materials used in the production of the liquid ejection head. The foreign substance may be a particle entered the liquid supply passages 3 or the liquid channels 6 from the outside during the steps of producing the liquid ejection head. A new foreign substance may be generated during the steps of forming the liquid ejection head. During the step of forming the liquid supply passage 3, a substance attached to the liquid supply passage 3 or burr, for example, may be detached and become a foreign substance in some cases.
An example of a method of producing the liquid ejection head according to the invention is described. The method of producing the liquid ejection head according to the invention includes a step A of forming the liquid ejection board 20 and a step B of forming the liquid ejection head component 10 on the liquid ejection board 20. The step A includes the following steps (a) to (d):
(a) forming an energy generating device 4 on a front surface 5 (first surface) of a substrate 1;
(b) forming a channel defining member 2 defining a liquid channel 6 and having a liquid ejection opening 7 in communication with the liquid channel 6 on the front surface of the substrate 1, the channel defining member 2 allowing a liquid to be in contact with the energy generating device 4, the liquid ejection opening through which the liquid is ejected;
(c) forming a liquid supply passage 3 in communication with the liquid channel 6; and
(d) forming a liquid supply opening 9 in communication with the liquid supply passage 3, the liquid supply opening 9 having a smaller opening cross-sectional area taken in a direction perpendicular to a flow direction of the liquid than the liquid supply passage 3.
The step A of forming the liquid ejection board 20 further includes forming an opening 11 in the liquid ejection board 20 so as to in communication with the liquid channel 6. The opening 11 is formed in addition to the liquid ejection opening 7 and the liquid supply passage 3. Furthermore, in the step B of forming the liquid ejection head component 10, the liquid ejection head component 10 closes at least a portion of the opening 11.
The order of the above-described steps is not limited to the above-described order, and the order may be changed as appropriate. In the step A, the step (b) of forming a channel defining member 2 on the substrate 1 may be performed before or after the step (c) of forming a liquid supply passage 3 in the substrate 1. The method of forming the liquid ejection head according to the invention may further include forming a liquid supply opening member 8 on the rear surface 12 (second surface) of the substrate 1 opposite the front surface 5. In the step (d) of the step A, the liquid supply opening 9 may be formed in the liquid supply opening member 8. In such a case, the order of this step and the above-described steps is not limited. In the case that the liquid supply opening member 8 is formed after the formation of the channel defining member 2, an issue of residues, for example, is likely to occur in the steps of development, release, cleaning, or drying, for example, in the steps of forming the liquid supply opening member 8. In the case that the liquid supply opening member 8 is formed after the formation of the channel defining member 2, an issue of residues, for example, is likely to occur in the steps of development, release, cleaning, or drying, for example, in the step of forming the channel defining member 2.
An example of the method of producing the liquid ejection head according to the invention is described in detail with reference to
The liquid supply opening member 8 may be formed before the channel defining member 2 and the energy generating devices 4 are formed. Before the liquid supply opening member 8 is formed, a protective film may be provided to reduce damage to the channel defining member 2. The protective film may be formed of resin, metal, semiconductor, or insulating material, for example. The protective film may be a film formed by spin coating or a dry film, for example. A protective tape, for example, may be attached as the protective film. The protective film may fill liquid ejection openings 7, the liquid channel 6, or the liquid supply passage 3. The filling of the protective film may be performed in a vacuum state. The protective film may be formed of a combination of materials, and may include a plurality of layers. An apparatus configured to cause less damage to the liquid channel defining member 2 may be employed, instead of the protective film, to reduce damage to the channel defining member 2.
When the liquid ejection head including the opening 11 according to the invention is produced, a fluid can be allowed to flow from the liquid ejection openings 7 or the liquid supply openings 9 toward the opening 11 during the step of forming the liquid supply openings 9 or after the step of forming the liquid supply openings 9. A foreign substance having a larger size than the liquid ejection openings 7 and the liquid supply openings 9 and a smaller size than the opening 11 may be in the liquid supply passage 3 and the liquid channel 6. In such a case, the flow of the fluid forces the foreign substance to be ejected to the outside, reducing defects caused by the foreign substances. Even when the liquid ejection openings 7 are desired to be away from the fluid, the fluid flowing from the liquid supply openings 9 toward the opening 11 forces the foreign substances in the liquid channel 6 and the liquid supply passage 3 to be ejected. The fluid may be a liquid for development, release, or cleaning, a gas for drying, a solid such as dry ice, which can change from a solid to a gas, or a mixture thereof, for example. The fluid may be sucked through the opening 11.
The liquid ejection head according to the invention may constitute a liquid ejection system. Examples of the liquid ejection system include a printer, a copier, a facsimile including a communication system, a word processor including a printer section, a mobile device, and a multi-functional industrial apparatus including a processing apparatus. A subject to which the liquid is ejected may be a two-dimensional structure, or a three-dimensional structure. The liquid may be ejected into a space. The liquid ejection system may be applied to semiconductor manufacturing apparatuses, medical devices, or modeling devices such as a 3D printer.
Hereinafter, the invention is described in detail by using examples, but the invention is not limited to the examples.
As illustrated in
Then, as illustrated in
Then, as illustrated in
A comparative example is illustrated in
The liquid ejection heads of the first example and the comparative example were subjected to appearance inspection using a metallurgical microscope (available from Olympus Corporation, AL1100) to determine whether a residue was generated. It was found that the residue was generated in the comparative example, and the residue was not generated in the example.
The result shows that the employment of the liquid ejection head having the openings according to the invention reduces the generation of the residue in the steps of development, cleaning, and drying.
While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
This application claims the benefit of Japanese Patent Application No. 2015-151547, filed Jul. 31, 2015, which is hereby incorporated by reference herein in its entirety.
Number | Date | Country | Kind |
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2015-151547 | Jul 2015 | JP | national |
Number | Name | Date | Kind |
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7325310 | Kim | Feb 2008 | B2 |
Number | Date | Country |
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2000-094700 | Apr 2000 | JP |
Number | Date | Country | |
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20170028730 A1 | Feb 2017 | US |