1. Field of the Invention
The present invention relates to a liquid ejection head for ejecting liquid, a liquid ejection device and a method of electrically connecting a liquid ejection head and a liquid container that the liquid ejection device includes.
2. Description of the Related Art
Various methods of electrically connecting a liquid container and a liquid ejection head arranged in a liquid ejection device have been proposed to date for the purpose of supplying liquid from the liquid container to the liquid ejection head. Japanese Patent Application Laid-Open No. 2013-540066 discloses a technique of supplying liquid from a liquid container to a liquid ejection head by sticking a hollow joint needle arranged on the liquid ejection head into the liquid container. Japanese Patent Application Laid-Open No. 2013-540066 also discloses a technique of electrically connecting a liquid container to a liquid ejection head by bringing the contact substrate arranged in the liquid container into contact with the corresponding connector arranged in the liquid ejection head. Information on the liquid stored in the liquid container is recorded in the contact substrate. The information is transmitted to the connection substrate arranged in the liquid ejection head by way of the connector.
With the latter technique described in Japanese Patent Application Laid-Open No. 2013-540066, the connector is inevitably arranged on a lateral surface of the liquid ejection head because the contact substrate is arranged on a lateral surface of the liquid container. The connection substrate that receives the information recorded in the contact substrate by way of the connector is normally arranged on the rear surface of the liquid ejection head for the purpose of communicating with the main body of the liquid ejection device. Therefore, the connector and the connection substrate cannot be connected to each other directly and hence an additional connection/wiring means such as a flexible cable needs to be provided. Then, as a result, the overall configuration of the liquid ejection device will become a complex one. Furthermore, there is a newly found fact that the electrical connection between the liquid ejection head and the liquid container is adversely affected by oxidization of the contact area of the contact substrate arranged in the liquid container.
In an aspect of the present invention, there is provided a liquid ejection device including: a liquid ejection head for ejecting liquid; and a liquid container storing liquid to be supplied to the liquid ejection head and adapted to be loaded in the liquid ejection head; the liquid container having a contact substrate arranged on the surface thereof located close to the liquid ejection head at the time of being loaded in the liquid ejection head; the liquid ejection head having a connector arranged at a position located vis-à-vis the contact substrate of the loaded liquid container and a connection substrate to be electrically connected to the connector; the connector including a contact spring having a front end section contacting the contact substrate of the loaded liquid container and a rear end section contacting the connection substrate, the surface of the contact substrate being inclined relative to the axial direction of the contact springs so as to displace the front end section of the contact spring in a state of being held in contact with the surface of the contact substrate during the operation of loading the liquid container in the liquid ejection head.
In another aspect of the present invention, there is provided a method of electrically connecting a liquid ejection head for ejecting liquid and a liquid container storing liquid to be supplied to the liquid ejection head after being loaded in the liquid ejection head; the liquid container having a contact substrate arranged on the surface thereof located close to the liquid ejection head at the time of being loaded in the liquid ejection head; the liquid ejection head having a connector arranged at a position located vis-à-vis the contact substrate of the liquid container at the time of being loaded in the liquid ejection head and a connection substrate electrically connected to the connector; the connector including contact springs having a rear end section contacting the connection substrate and a front end section designed to be brought into contact with the contact substrate; by moving the liquid container toward the liquid ejection head while keeping the surface of the contact substrate in a state of being inclined relative to the axis direction of the contact spring so as to displace the front end section of the contact spring along the surface of the contact substrate while being held in contact with the surface of the contact substrate.
In still another aspect of the present invention, there is provided a liquid ejection head including: a recording element substrate for ejecting liquid; a mounting section to be loaded with a liquid container; and a connector equipped with a contact spring to be brought into contact with the contact substrate provided on the liquid container; the axial direction of the contact spring being inclined relative to the direction of loading the liquid container in the mounting section.
Further features of the present invention will become apparent from the following description of exemplary embodiments with reference to the attached drawings.
Now, an embodiment of the present invention will be described below. The liquid ejection device of this embodiment includes a liquid ejection head for ejecting liquid and liquid containers containing in the inside thereof liquid to be supplied to the liquid ejection head.
The liquid ejection head 1 illustrated in
As illustrated in
As illustrated in
A contact substrate 6 (memory substrate) that is mounted by an IC chip is arranged at an upper part of the front surface 3a of the liquid container 3 (the front surface as viewed from the liquid ejection head 1 when the liquid container 3 is loaded in the liquid ejection head 1). A plurality of gold-plated contacts 16 (
While each of the contact springs 13 is realized by two springs that are brought into contact with each other under pressure in the connector 12, each of the contact springs 13 may alternatively be formed by a single spring. In such an instance, each of the contact springs is connected at an end thereof to the connection substrate 4 arranged in the liquid ejection head and connectable at the other end 13a (
As the liquid container 3 is inserted in the loading direction A in the state illustrated in
Besides, in this embodiment, the connector 12 is arranged at a position where the connector 12 is disposed opposite relative to both the contact substrate 6 of the liquid container 3 and the connection substrate 4 of the liquid ejection head 1. With this arrangement, then, the connector 12 can directly be connected to the connection substrate 4 to allow the entire wiring arrangement of the liquid ejection head 1 to be a simple and compact one.
Furthermore, in this embodiment, four connectors are provided to correspond respectively to the four liquid containers 3 to be loaded in the liquid ejection head 1. In other words, the number of connectors 12 provided in the liquid ejection head is the same as the number of liquid containers 3 to be loaded in the liquid ejection head. Each of the connectors is electrically connected to the connection substrate 4. As a connector 12 is provided to correspond to a single liquid container, the contact springs 13 of the connector 12 that corresponds to a liquid container already loaded in the liquid ejection head 1 are less liable to be deformed by the external force that arises when another liquid container 3 is loaded. Therefore, the positional accuracy of the points of connection between the contact springs 13 of each of the connectors and the contact substrate 6 of the liquid container to be loaded in the liquid ejection head 1 at the position corresponding to the connector is ensured.
While the connectors 12 are fixed to the housing 14 in this embodiment, the present invention is by no means limited to such an arrangement. For example, the connectors 12 may alternatively be fitted to the housing 14 by means of a snap fit joint structure. An exemplar connector having a snap fit joint structure will be described below.
With a connector 12 having a snap fit joint structure as described above, the front end section 13a of each of the contact springs 13 can scrape off the oxidized area, if any, of the contact substrate 6 that corresponds to the contact spring 13 as the front end section 13a of the contact spring 13 is pressed and displaced by the contact substrate 6. Therefore, the electrical connection between the contact substrate 6 and the contact springs is made reliable.
Additionally the contact springs 13 of a connector 12 having a snap fit joint structure represent a large stroke in the axial direction B of the contact springs 13 if compared with the contact springs 13 of a connector 12 that is fixed to the housing 14. Therefore, when a liquid container 3 is loaded in the liquid ejection head 1 and the connector having a snap fit joint structure is arranged in the liquid ejection head to correspond to the liquid container 3, each of the contact springs 13 of the connector can exert strong resilient force to the contact point between the front end section 13a of the spring contact 13 and the contact substrate 6 of the liquid container 3 if compared with a connector 12 that does not have any snap fit joint structure. Then, as a result, the contact substrate 6 contacts the contact springs 13 of the connector 12 having a snap fit structure with stronger force if compared with a connector that does not have any snap fit joint structure so that the oxidized area, if any, of the contact substrate 6 can advantageously be scraped off to make the electrical contact between the liquid ejection head 1 and the liquid container 3 even more reliable.
While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
This application claims the benefit for Japanese Patent Application No. 2014-112194, filed May 30, 2014, and Japanese Patent Application No. 2015-090381, filed Apr. 27, 2015, which are hereby incorporated by reference herein in their entirety.
Number | Date | Country | Kind |
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2014-112194 | May 2014 | JP | national |
2015-090381 | Apr 2015 | JP | national |
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Number | Date | Country |
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2013-540066 | Oct 2013 | JP |
Entry |
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Co-pending, unpublished U.S. Appl. No. 14/721,246 to Kyosuke et al., dated May 26, 2015. |
Number | Date | Country | |
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20150343771 A1 | Dec 2015 | US |