1. Field of the Invention
The present invention relates to a liquid ejection head.
2. Description of the Related Art
A typical liquid ejection head is disclosed in Japanese Patent Laid-Open No. 2002-019120.
The liquid ejection head 100 can be mounted in a recording apparatus main body (not shown) that performs recording on a recording medium such as paper. As shown in
The liquid ejection head 100 includes an electric contact substrate 16 and an electric wiring substrate 11 for transmitting electric pulse signals from the recording apparatus main body to the recording element substrates 1a and 1b when the liquid ejection head 100 is mounted in the recording apparatus main body. The electric wiring substrate 11 is supported by the supporting substrate 8.
As shown in
A recess 17 is formed between the four sides of the recording element substrate 1a and a supporting plate 9. A groove 28 narrower than the recess 17 is formed in part of the supporting substrate 8 corresponding to the recess 17. Thus, the recording element substrate 1a is completely surrounded by the recess 17 and the groove 28.
As shown in
When the liquid ejection head 100 is manufactured, first sealing resin 18 is injected in an uncured state into the recess 17 by a dispense method. The uncured first sealing resin 18 injected into the recess 17 flows owing to capillary action along the groove 28 and fills the recess 17. The first sealing resin 18 filling the recess 17 is cured by being heated.
In the liquid ejection head 100, the corrosion of the supporting substrate 8 by ink and a short circuit between the recording element substrate 1a and the electric wiring substrate 11 due to ink can be prevented by the first sealing resin 18.
In addition, as shown in
In the liquid ejection head 100, the electrode terminals 13 can be protected by the second sealing resin 19, and the corrosion or the like of the electrode terminals 13 by ink can be prevented.
When the liquid ejection head 100 shown in
In such a case, after the recess 17 is filled with the uncured first sealing resin 18, air remains in the uncured first sealing resin 18. The air in the uncured first sealing resin 18 forms bubbles, and sometimes the bubbles grow up to 1 mm or more in diameter.
If the bubbles burst in the uncured first sealing resin 18, the uncured first sealing resin 18 may be scattered about and may adhere to the recording element substrate 1a and the like. This may prevent the recording element substrate 1a from appropriately ejecting ink.
When the first sealing resin 18 and the second sealing resin 19 are heated to cure them, sometimes the bubbles in the first sealing resin 18 move into the second sealing resin 19. In this case, a gap may be formed between the electrode terminals 13 and the second sealing resin 19 covering them and may cause defective sealing of the electrode terminals 13. The liquid ejection head described in Japanese Patent Laid-Open No. 2002-019120 has such problems.
In an aspect of the present invention, a liquid ejection head includes a recording element substrate including an ejection port that ejects liquid, and an energy generating element that generates energy used to eject liquid, an electric wiring substrate including wiring for transmitting electric power for driving the energy generating element, and an opening that exposes the recording element substrate, a plurality of connecting portions that electrically connect the recording element substrate and the electric wiring substrate, a recess formed between the recording element substrate and the electric wiring substrate, and at least one groove formed in the bottom of the recess corresponding to at least one part where the connecting portions are formed. The at least one groove includes a first portion formed along an arranging direction of the plurality of connecting portions, and a second portion formed in a direction intersecting with the arranging direction.
Further features of the present invention will become apparent from the following description of exemplary embodiments with reference to the attached drawings.
Next, an embodiment of the present invention will be described with reference to the drawings.
A tank holder H2000 that holds an ink tank (not shown) that stores ink to be supplied to the recording element unit H1002 is detachably attached to the ink supply unit H1003. The ink supply unit H1003 is configured to supply ink in the ink tank attached to the tank holder H2000 to the recording element unit H1002.
Specifically, the ink supply unit H1003 includes an ink supply member H1500, a flow passage forming member H1600, a joint rubber H2300, filters H1700, and seal rubbers H1800.
The recording element unit H1002 includes two rectangular recording element substrates H1100 and H1101 and a supporting member H1200 including a supporting substrate H1201 and a supporting plate H1202. The recording element substrates H1100 and H1101 are held by supporting portions of the supporting substrate H1201. Ink supply passages for sending ink supplied from the ink supply unit H1003 to the recording element substrates H1100 and H1101 are formed in the supporting member H1200.
The recording element unit H1002 includes an electric contact substrate H2200 and an electric wiring substrate H1300 for transmitting electric pulse signals and electric power from the recording apparatus main body in which the liquid ejection head H1000 is mounted to the recording element substrates H1100 and H1101.
The liquid ejection head H1000 is a side shooter type bubble jet head. In each of the recording element substrates H1100 and H1101, a plurality of electrothermal transducers H1103 that are energy generating elements that generate energy used for ejecting liquid are arranged. The electrothermal transducers H1103 are arranged on the upper surface of the silicon substrate H1110 along the ink supply port or ports H1102 in a staggered manner.
On the upper surface of the silicon substrate H1110, an ejection port plate H1111 is provided. The ejection port plate H1111 has ejection ports H1107 formed so as to face the electrothermal transducers H1103, and ink flow passage walls H1106 that form ink flow passages for leading ink supplied to the ink supply port or ports H1102 to the ejection ports H1107.
The electrothermal transducers H1103 are connected to electrodes H1104 arranged along the two sides at both ends of the silicon substrate H1110. The electrothermal transducers H1103, and wiring (not shown) connecting the electrothermal transducers H1103 and the electrodes H1104 are formed by a film formation technique. On each electrode H1104, a bump H1105 is formed of gold.
In response to electric pulse signals from the recording apparatus main body, the electrothermal transducers H1103 generate thermal energy and cause film boiling in ink. Thus, ink is ejected from the ejection ports H1107.
The supporting substrate H1201 is formed by compression molding alumina (Al2O3) powder and then firing it. The thickness of the supporting substrate H1201 may be about 0.5 mm to 10 mm. The material forming the supporting substrate H1201 is not limited to alumina. The material forming the supporting substrate H1201 can have a linear expansion coefficient equal to that of the material forming the recording element substrates H1100 and H1101 and a thermal conductivity equal to or higher than that of the material forming the recording element substrates H1100 and H1101. Examples of the material forming the supporting substrate H1201 include aluminum nitride (AlN), silicone nitride (Si3N4), and silicon carbide (SiC).
The supporting substrate H1201 is provided with ink supply ports H6001 and H6002 for leading ink supplied from the ink supply unit H1003 (see
In addition, the supporting substrate H1201 has grooves H6003 formed in the vicinities of both ends in the longitudinal direction of the ink supply port H6001, and grooves H6004 formed in the vicinities of both ends in the longitudinal direction of the ink supply ports H6002. In other words, the grooves H6003 are provided in the vicinities of the two sides facing each other in the longitudinal direction, of the periphery of the surface on which the recording element substrate H1100 is provided, of the supporting substrate H1201; and the grooves H6004 are provided in the vicinities of the two sides facing each other in the longitudinal direction, of the periphery of the surface on which the recording element substrate H1101 is provided, of the supporting substrate H1201. The grooves H6003 each include a first potion H6003a and a pair of second portions H6003b, and the grooves H6004 each include a first potion H6004a and a pair of second portions H6004b.
The first portions H6003a of the grooves H6003 are disposed at both ends in the longitudinal direction of the ink supply port H6001 so as to face each other. The first portions H6004a of the grooves H6004 are disposed at both ends in the longitudinal direction of the ink supply ports H6002 so as to face each other. The pairs of second portions H6003b of the grooves H6003 extend a predetermined length from both ends of the first portions H6003a, in the longitudinal direction of the ink supply port H6001, toward each other. The pairs of second portions H6004b of the grooves H6004 extend a predetermined length from both ends of the first portions H6004a, in the longitudinal direction of the ink supply ports H6002, toward each other.
The width W2 of the second portions H6003b and H6004b of the grooves H6003 and H6004 is larger than the width W1 of the first portions H6003a and H6004a of the grooves H6003 and H6004.
The supporting plate H1202 is bonded to the supporting substrate H1201 with first adhesive. The first adhesive can be resistant to ink. The recording element substrates H1100 and H1101 are bonded to the supporting substrate H1201 with second adhesive. Both the layer of first adhesive and the layer of second adhesive may have a thickness of 50 μm or less.
The supporting plate H1202 has a thickness equal to those of the recording element substrates H1100 and H1101 so that the height from the supporting substrate H1201 of the recording element substrates H1100 and H1101 is about equal to that of the electric wiring substrate H1300. Thus, the thickness of the supporting plate H1202 is also about 0.5 mm to 1.0 mm. The supporting plate H1202 is formed of alumina. However, the supporting plate H1202 may be formed of any material (ceramic material, metal material, or the like) as long as the material has a linear expansion coefficient equal to that of the material forming the supporting substrate H1201.
Openings H1204 and H1205 for exposing the recording element substrates are formed in the supporting plate H1202. The recording element substrates H1100 and H1101 are disposed in the openings H1204 and H1205. Thus, around the recording element substrates H1100 and H1101, and between the recording element substrates H1100 and H1101 and the supporting plate H1202, recesses H7001 and H7002 are formed. The bottoms of the recesses H7001 and H7002 are parts of the upper surface of the supporting substrate H1201. In the recesses H7001 and H7002, the distal ends of the second portions H6003b and H6004b of the grooves H6003 and H6004 are exposed.
In the state shown in
Although the recording element substrates H1100 and H1101 are separated from the electric wiring substrate H1300 by the recesses H7001 and H7002, the electrodes H1104 of the recording element substrates H1100 and H1101 are electrically connected to the electric wiring substrate H1300 by electrode terminals H1302 serving as connecting portions. The electrodes H1104 and the electrode terminals H1302 are connected, for example, by a thermal ultrasonic joining method.
The electrode terminals H1302 are disposed over the recesses H7001 and H7002 and transmit electric pulse signals from the recording apparatus main body, from the electric wiring substrate H1300 to the electrodes H1104 of the recording element substrates H1100 and H1101.
Next, a sealing resin layer forming method according to this embodiment will be described. The formation of sealing resin layers is performed in the state shown in
The sealing resin application apparatus 1700 includes an ejection device 1702. A syringe 1703 filled with uncured first sealing resin H1307 and a syringe 1704 filled with uncured second sealing resin H1308 are connected to the ejection device 1702.
Needles 1703a and 1704a capable of ejecting uncured sealing resin are attached to the tips of the syringes 1703 and 1704. The external diameter of the needle 1703a is smaller than the width of the recesses H7001 and H7002. Specifically, the external diameter of the needle 1703a may be smaller than the width of the recesses H7001 and H7002 by about 0.2 mm to 0.6 mm.
With reference to
First, the needle 1703a of the syringe 1703 is positioned over part A of the recess H7001 where there is no second portion H6003b. The distance between the tip of the needle 1703a and the upper surface of the electric wiring substrate H1300 may be about −0.2 mm to 0.3 mm. In this state, uncured first sealing resin H1307 is continuously ejected from the tip of the needle 1703a, and the needle 1703a is moved to part A′.
In this way, uncured first sealing resin H1307 is injected between part A and part A′. Similarly, uncured first sealing resin H1307 is injected between part B and part B′, between part C and part C′, and between part D and part D′. Since the bottoms of the recesses H7001 and H7002 between part A and part A′, between part B and part B′, between part C and part C′, and between part D and part D′ are flat, air can be prevented from being mixed into uncured first sealing resin H1307.
Thus, a decrease in print quality due to the adhesion of sealing resin to the recording element substrates due to the burst of bubbles of air mixed into sealing resin can be prevented, and a cost reduction due to the improvement of manufacturing yield can be achieved.
The uncured first sealing resin H1307 injected into the recesses H7001 and H7002 enters the grooves H6003 and H6004 from the distal ends of the second portions H6003b and H6004b, and the grooves H6003 and H6004 are filled with uncured first sealing resin H1307.
Since the second portions H6003b and H6004b of the grooves H6003 and H6004 are wider than the first portions H6003a and H6004a, uncured first sealing resin H1307 can easily enter the grooves H6003 and H6004. First sealing resin H1307 can have low viscosity and high fluidity when it is uncured.
Since the first portions H6003a and H6004a of the grooves H6003 and H6004 are narrow, owing to capillary action, uncured first sealing resin H1307 spreads easily throughout the grooves H6003 and H6004.
As described above, the first sealing resin injected into the recesses H7001 and H7002 fills the grooves H6003 and H6004 and fills the recesses H7001 and H7002.
Since, in the state shown in
After the recesses H7001 and H7002 have been filled with uncured first sealing resin H1307, uncured second sealing resin H1308 is applied with the syringe 1704 as shown in
The tip of the needle 1704a of the syringe 1704 is positioned over part E and slightly above the electrode terminals H1302 shown in
In this way, uncured second sealing resin H1308 is applied between part E and part E′. Similarly, uncured second sealing resin H1308 is applied between part F and part F′, between part G and part G′, and between part H and part H′.
After that, first sealing resin H1307 and second sealing resin H1308 are cured by heating.
In this embodiment, first sealing resin H1307 and second sealing resin H1308 are thermosetting epoxy resins. A heating thermostatic bath is used for heating sealing resin. Sealing resins H1307 and H1308 can be cured at the same temperature.
While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
This application claims the benefit of Japanese Patent Application No. 2011-189346 filed Aug. 31, 2011, which is hereby incorporated by reference herein in its entirety.
Number | Date | Country | Kind |
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2011-189346 | Aug 2011 | JP | national |