1. Technical Field
The present disclosure relates to plasma devices and processes for surface processing and material removal or deposition. More particularly, the disclosure relates to an apparatus and method for generating and directing chemically reactive, plasma-generated species in a plasma device along with excited-state species (e.g., energetic photons) that are specific to the selected ingredients.
2. Background of Related Art
Electrical discharges in dense media, such as liquids and gases at or near atmospheric pressure, can, under appropriate conditions, result in plasma formation. Plasmas have the unique ability to create large amounts of chemical species, such as ions, radicals, electrons, excited-state (e.g., metastable) species, molecular fragments, photons, and the like. The plasma species may be generated in a variety of internal energy states or external kinetic energy distributions by tailoring plasma electron temperature and electron density. In addition, adjusting spatial, temporal and temperature properties of the plasma creates specific changes to the material being irradiated by the plasma species and associated photon fluxes. Plasmas are also capable of generating photons including energetic ultraviolet photons that have sufficient energy to initiate photochemical and photocatalytic reaction paths in biological and other materials that are irradiated by the plasma photons.
Plasmas have broad applicability to provide alternative solutions to industrial, scientific and medical needs, especially workpiece surface processing at low temperature. Plasmas may be delivered to a workpiece, thereby affecting multiple changes in the properties of materials upon which the plasmas impinge. Plasmas have the unique ability to create large fluxes of radiation (e.g., ultraviolet), ions, photons, electrons and other excited-state (e.g., metastable) species which are suitable for performing material property changes with high spatial, material selectivity, and temporal control. Plasmas may also remove a distinct upper layer of a workpiece but have little or no effect on a separate underlayer of the workpiece or it may be used to selectively remove a particular tissue from a mixed tissue region or selectively remove a tissue with minimal effect to adjacent organs of different tissue type.
One suitable application of the unique chemical species is to drive non-equilibrium or selective chemical reactions at or within the workpiece to provide for selective removal of only certain types of materials. Such selective processes are especially sought in biological tissue processing (e.g., mixed or multi-layered tissue), which allows for cutting and removal of tissue at low temperatures with differential selectivity to underlayers and adjacent tissues. This is particularly useful for removal of biofilms, mixtures of fatty and muscle tissue, debridement of surface layers.
The plasma species are capable of modifying the chemical nature of tissue surfaces by breaking chemical bonds, substituting or replacing surface-terminating species (e.g., surface functionalization) through volatilization, gasification or dissolution of surface materials (e.g., etching). With proper techniques, material choices and conditions, one can remove one type of tissue entirely without affecting a nearby different type of tissue. Controlling plasma conditions and parameters (including S-parameters, V, I, Θ, and the like) allows for the selection of a set of specific particles, which, in turn, allows for selection of chemical pathways for material removal or modification as well as selectivity of removal of desired tissue type. The present disclosure provides for a system and method for creating plasma under a broad range of conditions including tailored geometries, various plasma feedstock media, number and location of electrodes and electrical excitation parameters (e.g., voltage, current, phase, frequency, pulse condition, etc.).
The supply of electrical energy that ignites and sustains the plasma discharge is delivered through substantially conductive electrodes that are in contact with the ionizable media and other plasma feedstocks. The present disclosure also provides for methods and apparatus that utilize specific electrode structures that improve and enhance desirable aspects of plasma operation such as higher electron temperature and higher secondary emission. In particular, the present disclosure provides for porous media for controlled release of chemical reactants.
Controlling plasma conditions and parameters allows for selection of a set of specific particles, which, in turn, allows for selection of chemical pathways for material removal or modification as well as selectivity of removal of desired tissue type. The present disclosure also provides for a system and method for generating plasmas that operate at or near atmospheric pressure. The plasmas include electrons that drive reactions at material surfaces in concert with other plasma species. Electrons delivered to the material surface can initiate a variety of processes including bond scission, which enables volatilization in subsequent reactions. The electron-driven reactions act synergistically with associated fluxes to achieve removal rates of material greater than either of the reactions acting alone.
The present disclosure provides for a system and method for treating tissue in a liquid media. In particular, the present disclosure provides for a plasma device that generates a plasma within a liquid media. The liquid media provides for higher density radicals, cooler environment and more chemical reaction sites for the plasma generated therein. This results in an increased chemical reaction rate between the plasma and liquid media than the reaction rate between atmospheric gases and the plasma. Liquids can provide 1,000 times higher concentrations of ions than gases, which results in increased chemical kinetics at similar conditions (e.g., temperature, pressure). In addition, liquids can create selective chemical dissolution on a plasma-modified surface. Once tissue is modified by a plasma, the surface terminations of the tissue are more reactive toward the compounds in the liquid than unmodified portions of the tissue. The liquid media provides for increase solubility between a plasma-treated surface and a solvent and can, therefore, be used to control desired chemical reactions. Further, the liquid media can be used to remove the heat from the plasma and the tissue surface.
The present disclosure also provides for systems and methods for whitening teeth. Hydrogen peroxide (H2O2) is commonly used as a tooth-whitening agent. H2O2 is applied directly (e.g., pure liquid form) or produced via chemical reactions from other compounds (e.g., carbamide peroxide). Various light sources are utilized to expedite the whitening reactions (e.g., flash lamps, ultraviolet light sources, etc.). These methods require relatively high volume concentration of hydrogen peroxide to be effective, at least 10% by volume concentration or more (e.g., 35% by volume). Lower concentrations (e.g., 5% to about 10%) require extended treatment time. In addition, use of high levels of hydrogen peroxide raises patient safety concerns. High concentration of hydrogen peroxide results in increased tooth sensitivity, mucosal irritation, alteration of enamel surface, damage to soft tissue (e.g., gums) as well as carcinogenic risks.
The present disclosure provides for a system and method of whitening teeth without using an external bleaching agent (e.g., external source of hydrogen peroxide). The method involves submerging the teeth in deionized water (e.g., via irrigation) and inserting a plasma generation device having a dielectrically covered electrode into the water. The plasma device generates a plasma in the water which produces relatively low concentration of hydrogen peroxide, about 0.03% by volume (several hours of plasma exposure), thereby reducing the safety risks associated with conventional hydrogen peroxide bleaching methods.
A method for whitening teeth is disclosed. The method includes supplying a liquid sufficient to at least partially submerge a portion of a tooth; positioning a plasma device adjacent to the submerged portion of the tooth; supplying ionizable media to the plasma device; and igniting the ionizable media at the plasma device sufficient to form a plasma effluent in the presence of the liquid at the distal portion, whereby the plasma effluent reacts with the liquid to form at least one reactive species that interacts selectively with foreign matter disposed on the tooth.
A method for whitening teeth is disclosed. The method includes supplying a liquid sufficient to at least partially submerge a portion of a tooth; positioning a plasma device adjacent to the submerged portion of the tooth; supplying ionizable media and at least one precursor feedstock to the plasma device; igniting the ionizable media and the at least one precursor feedstock at the plasma device sufficient to form a selectively reactive plasma effluent in the presence of the liquid at the distal portion, whereby the plasma effluent reacts with the liquid to form at least one reactive species that interacts selectively with foreign matter disposed on the tooth.
A method for whitening teeth is also contemplated by the present disclosure. The method includes supplying deionized water sufficient to at least partially submerge a portion of a tooth; positioning a plasma device adjacent to the submerged portion of the tooth; supplying ionizable media and at least one precursor feedstock to the plasma device; and igniting the ionizable media and the at least one precursor feedstock at the plasma device sufficient to form a plasma effluent in the presence of the deionized water at the distal portion, whereby the plasma effluent reacts with the deionized water to form at least one of hydroxide and hydrogen radicals that interacts selectively with foreign matter disposed on the tooth.
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the disclosure and, together with a general description of the disclosure given above, and the detailed description of the embodiments given below, serve to explain the principles of the disclosure, wherein:
Plasmas are generated using electrical energy that is delivered as either direct current (DC) electricity or alternating current (AC) electricity at frequencies from about 0.1 hertz (Hz) to about 100 gigahertz (GHz), including radio frequency (“RF”, from about 0.1 MHz to about 100 MHz) and microwave (“MW”, from about 0.1 GHz to about 100 GHz) bands, using appropriate generators, electrodes, and antennas. Choice of excitation frequency, the workpiece, as well as the electrical circuit that is used to deliver electrical energy to the circuit affects many properties and requirements of the plasma. The performance of the plasma chemical generation, the delivery system and the design of the electrical excitation circuitry are interrelated—as the choices of operating voltage, frequency and current levels (as well as phase) effect the electron temperature and electron density. Further, choices of electrical excitation and plasma device hardware also determine how a given plasma system responds dynamically to the introduction of new ingredients to the host plasma gas or liquid media. The corresponding dynamic adjustment of the electrical drive, such as via dynamic match networks or adjustments to voltage, current, or excitation frequency may be used to maintain controlled power transfer from the electrical circuit to the plasma.
Referring initially to
The precursor source 18 may be a bubbler or a nebulizer configured to aerosolize precursor feedstocks prior to introduction thereof into the device 12. The precursor source 18 may also be a micro droplet or injector system capable of generating predetermined refined droplet volume of the precursor feedstock from about 1 femtoliter to about 1 milliliter in volume. The precursor source 18 may also include a microfluidic device, a piezoelectric pump, or an ultrasonic vaporizer.
The system 10 provides a flow of plasma through the device 12 to a workpiece “W” (e.g., tissue). The workpiece “W” may be any type of material or object suitable for plasma treatment. Plasma feedstocks, which include ionizable media and precursor feedstocks, are supplied by the ionizable media source 16 and the precursor source 18, respectively, to the plasma device 12. During operation, the precursor feedstock and the ionizable media are provided to the plasma device 12 where the plasma feedstocks are ignited to form plasma effluent containing ions, radicals, photons from the specific excited species and metastables that carry internal energy to drive desired chemical reactions in the workpiece “W” or at the surface thereof. The feedstocks may be mixed upstream from the ignition point or midstream thereof (e.g., at the ignition point) of the plasma effluent, as shown in
The ionizable media source 16 provides ionizable feedstock to the plasma device 12. The ionizable media source 16 is coupled to the plasma device 12 and may include a storage tank and a pump (not explicitly shown). The ionizable media may be a liquid or a gas such as argon, helium, neon, krypton, xenon, radon, carbon dioxide, nitrogen, hydrogen, oxygen, etc. and their mixtures, and the like, or a liquid. These and other gases may be initially in a liquid form that is gasified during application.
The precursor source 18 provides precursor feedstock to the plasma device 12. The precursor feedstock may be either in solid, gaseous or liquid form and may be mixed with the ionizable media in any state, such as solid, liquid (e.g., particulates or droplets), gas, and the combination thereof. The precursor source 18 may include a heater, such that if the precursor feedstock is liquid, it may be heated into gaseous state prior to mixing with the ionizable media.
In one embodiment, the precursors may be any chemical species capable of forming reactive species following plasma drive dissociation, such as ions, electrons, excited-state (e.g., metastable) species, molecular fragments (e.g., radicals) and the like, when ignited by electrical energy from the power source 14 or when undergoing collisions with particles (electrons, photons, or other energy-bearing species of limited and selective chemical reactivity) formed from ionizable media 16. More specifically, the precursors may include various reactive functional groups, such as acyl halide, alcohol, aldehyde, alkane, alkene, amide, amine, butyl, carboxlic, cyanate, isocyanate, ester, ether, ethyl, halide, haloalkane, hydroxyl, ketone, methyl, nitrate, nitro, nitrile, nitrite, nitroso, peroxide, hydroperoxide, oxygen, hydrogen, nitrogen, and combination thereof. In embodiments, the chemical precursors may be water, halogenoalkanes, such as dichloromethane, tricholoromethane, carbon tetrachloride, difluoromethane, trifluoromethane, carbon tetrafluoride, and the like; peroxides, such as hydrogen peroxide, acetone peroxide, benzoyl peroxide, and the like; alcohols, such as methanol, ethanol, isopropanol, ethylene glycol, propylene glycol, alkalines such as NaOH, KOH, amines, alkyls, alkenes, and the like. Such chemical precursors may be applied in substantially pure, mixed, or soluble form.
The precursors and their functional groups may be delivered to a surface to react with the surface species (e.g., molecules) of the workpiece “W.” In other words, the functional groups may be used to modify or replace existing surface terminations of the workpiece “W.” The functional groups react readily with the surface species due to their high reactivity and the reactivity imparted thereto by the plasma. In addition, the functional groups are also reacted within the plasma volume prior to delivering the plasma volume to the workpiece.
Some functional groups generated in the plasma can be reacted in situ to synthesize materials that subsequently form a deposition upon the surface. This deposition may be used for stimulating healing, killing bacteria, and increasing hydrophilic or hydroscopic properties. In addition, deposition of certain function groups may also allow for encapsulation of the surface to achieve predetermined gas/liquid diffusion, e.g., allowing gas permeation but preventing liquid exchange, to bond or stimulate bonding of surfaces, or as a physically protective layer.
The precursor source 18 and the ionizable media source 16 may be coupled to the plasma device 12 via tubing 13a and 13b, respectively. The tubing 13a and 13b may be combined into tubing 13c to deliver a mixture of the ionizable media and the precursor feedstock to the device 12 at a proximal end thereof. This allows for the plasma feedstocks, e.g., the precursor feedstock and the ionizable gas, to be delivered to the plasma device 12 simultaneously prior to ignition of the mixture therein.
In another embodiment, the ionizable media source 16 and the precursors source 18 may be coupled to the plasma device 12 via the tubing 13a and 13b at separate connections, e.g., the first connection 31 and a second connection 29, respectively, such that the mixing of the feedstocks occurs within the plasma device 12 upstream from the ignition point. In other words, the plasma feedstocks are mixed proximally of the ignition point, which may be any point between the respective sources 16 and 18 and the plasma device 12, prior to ignition of the plasma feedstocks to create the desired mix of the plasma effluent species for each specific surface treatment on the workpiece “W.”
In a further embodiment, the plasma feedstocks may be mixed midstream, e.g., at the ignition point or downstream of the plasma effluent, directly into the plasma. More specifically, the first and second connections 31, 29 may be coupled to the device 12 at the ignition point, such that the precursor feedstocks and the ionizable media are ignited concurrently as they are mixed (
In a further illustrative embodiment, the ionizable media may be ignited in an unmixed state and the precursors may be mixed directly into the ignited plasma. Prior to mixing, the plasma feedstocks may be ignited individually. The plasma feedstock is supplied at a predetermined pressure to create a flow of the medium through the device 12, which aids in the reaction of the plasma feedstocks and produces a plasma effluent. The plasma according to the present disclosure is generated at or near atmospheric pressure under normal atmospheric conditions.
The system 10 also includes a liquid source 40 that may include a pump or may be a gravity-fed system. The liquid source 40 is configured to supply a liquid media 34 (
With reference to
The electrode 22 is coupled to the power source 14 that drives plasma generation, such that the energy from the power source 14 may be used to ignite the plasma feedstocks flowing through the device 12. More specifically, the ionizable media and the precursors flow through the device 12 through the lumen 29. When the electrode 22 is energized, the plasma feedstocks are ignited and form a plasma effluent which is emitted from the distal end of the device 12 onto the workpiece “W.”
In one embodiment, the device 12 may include an optional return electrode. The return electrode may be shaped as a ring and may be disposed distally of the electrode 22. In another embodiment, the electrode 22 may be used without a return electrode since coupling is provided through the workpiece “W.”
As shown in
In addition, the layer 24 provides for capacitive coupling between the electrode 22 and the ionizable media and/or precursor feedstock. The resulting capacitive circuit element structure provides for a net negative bias potential at the surface of the electrode 22, which attracts the ions and other species from the plasma effluent. These species then bombard the layer 24 and release the electrons generating additional high energy electrons.
The layer 24 may be a native oxide, or a native nitride of the metal from which the electrode 22 is formed, or may be a deposited layer or a layer formed by ion implantation. In one illustrative embodiment, the electrode 22 is formed from an aluminum alloy and the layer 24 is aluminum oxide (Al2O3) or aluminum nitride (AlN). In another illustrative embodiment, the electrode 22 is formed from a titanium alloy and the layer 24 is titanium oxide (TiO2) or titanium nitride (TiN).
The electrode 22 and the layer 24 may also be configured as a heterogeneous system. The electrode 22 may be formed from any suitable electrode substrate material (e.g., conductive metal or a semi-conductor) and the layer 24 may be disposed thereon by various coating processes. The layer 24 may be formed on the electrode 22 by exposure to an oxidizing environment, anodization, electrochemical processing, ion implantation, or deposition (e.g., sputtering, chemical vapor deposition, atomic layer deposition, etc.).
In embodiments, the layer 24 may also be formed from suitable dielectric polymeric materials, such as polytetrafluoroethylene, polypropylene, polyethylene, fluoroethylpropylene, and combinations thereof.
The high energy electrons are generated in part by the materials of the electrode 22 and in particular by the layer 24. Materials having high secondary electron emission property, γ, in response to ion and/or photon bombardment are suitable for this task. Such materials include insulators and/or semiconductors. These materials have a relatively high γ, where γ represents the number of electrons emitted per incident bombardment particle. Thus, metals generally have a low γ (e.g., less than 0.1) while insulative and semiconductor materials, such as metallic oxides have a high γ, from about 1 to about 10 with some insulators exceeding a value of 20. Thus, the layer 24 acts as a source of secondary emitted electrons, in addition to limiting the plasma to the distal end of the electrode 22.
Secondary electron emission, γ, may be described by the formula (1):
γ=Γsecondary/Γion (1)
In formula (1) γ is the secondary electron emission yield or coefficient, Γsecondary is the electron flux, and Γion is the ion flux. Secondary emission occurs due to the impacts of plasma species (ions) onto the layer 24 when the ion impact collisions have sufficient energy to induce secondary electron emission, thus generating γ-mode discharges. Generally discharges are said to be in γ-mode when electron generation occurs preferentially at electrode surfaces (i.e., γ>1) instead of in the gas (an α-mode discharge). In other words, per each ion colliding with the layer 24, a predetermined number of secondary electrons are emitted. Thus, γ may also be thought of as a ratio of the Γsecondary (e.g., the electron flux) and Γion (e.g., the ion flux).
These ion collisions with the surface of the layer 24, in turn, provide sufficient energy for secondary electron emission to generate γ discharges. The ability of coating materials such as layer 24 to generate γ discharges varies with several parameters, with the most influence due to the choice of materials having a high γ as discussed above. This property allows coatings 24 to act as a source of secondary emitted electrons or as a catalytic material to enhance selected chemical reaction paths.
Over time the layer 24 may thin or be removed during the plasma operation. In order to maintain the layer 24 to continually provide a source of secondary emitted electrons, the layer 24 may be continually replenished during the plasma operation. This may be accomplished by adding species that reformulate the layer 24 on the electrode 22. In one embodiment, the precursor source 18 may provide either oxygen or nitrogen gas to the device 12 to replenish the oxide or nitride coating.
Secondary electron emission forms a sheath layer 132 about the electrode 22. The sheath layer has a working range R1, which is representative of the thickness of energetic electron sheath layer 132 disposed about the inner circumference of electrode 22. In other words, the range R1 indicates a region with a greatly increased concentration of electrons with relatively high energies that drive reactions in the gas phase. The coating on the electrode 22 can increase or enhance working range R1 of energetic secondary electrons. In particular, varying the thickness of the coating can be used to adjust the working range R1.. A gap distance Δ shows the zone where the concentration of energetic secondary electrons is relatively lower. Coating the electrodes, as discussed above, reduces gap distance Δ. In some embodiments, distance Δ may be reduced to zero and/or working range R1 may overlap thereby creating a hollow cathode effect. Namely, the range R1 is large enough to fully envelop the inner diameter D of the lumen 29.
Formation of the sheath layer 132 may also be controlled by the supply of the ionizable media and the precursors. Ionizable media and the precursors are selected that are relatively transparent to the energetic electrons released during secondary emission from the surface of the coating. As stated above, the plasma is generated at atmospheric pressure. Due to the increased entropy at such pressure, the generated electrons undergo a multitude of collisions in a relatively short period of time and space forming the sheath layer 132.
Generation of the high energy electrons is also controlled by the supply of the ionizable media and the precursors. Ionizable media and the precursors are selected that are relatively transparent to the energetic electrons released during secondary emission from the surface of the electrode 22. As stated above, the plasma is generated at atmospheric pressure. Due to the increased entropy at such pressure, the generated electrons undergo a multitude of collisions in a relatively short period of time and space forming the high energy electrons.
The reaching distance of the high energy electrons is defined by a formula (2):
Thickness=1/Nσ (2)
In formula (2), N is the number of scattering centers, which may be the molecules of the ionizable media, the precursors and the atmospheric gases. Thus, N defines the media density. The variable, σ, is the average particle cross-section of the scattering centers. The thickness of the high energy electrons is inversely proportional to the product of N and σ. Thus, decreasing N and σ allows for generating more high energy electrons. A lower σ may be provided by using specific ionizable media compounds with molecules having a low cross-section, such as hydrogen and helium. The variable N may be lowered by heating the ionizable media to reduce the gas density and limiting the amount of media provided to the lowest amount needed to sustain the plasma reaction.
With respect to
The liquid media 34 may be saline, deionized water or an aqueous solution of various salts (e.g., NaCl) and/or other chemical precursors from about 1×10−4 M to about 1×10−2 M. In embodiments, dilute acids may also be added to the liquid media 34, including HCl, H2SO4 and the like having pH from about 3 to about 5. In embodiments, bases such as, NaOH, KOH, may also be added. Various reactive gases such as chloride, flouride, ozone, bromine, and the like may also be added to the liquid media 34.
In embodiments, catalysts 40 may be added to the liquid media 34 as shown in
In one embodiment, DC bias may be supplied to the electrode 22 in addition to the RF power. This allows for control over the mobility of the charged particles into the plasma effluent 31. In particular, the DC bias accelerates the charged particles allowing them to reach the workpiece “W.” The charge particles accumulate at the plasma/liquid interface 35 and modify the chemical reactions at the plasma/liquid interface 35 from an equilibrium or bulk state to a non-equilibrium state. The non-equilibrium state gives rise to a selective chemical reaction at the plasma/liquid interface 35, which aids in controlling specific chemical reactions and selective removal processes.
During use, the electrode 22 may be submerged in the liquid media 34 up to a desired depth, such that the distal portion 36 is disposed a predetermined submerged distance “d” from the workpiece “W.” The submerged distance “d” may be adjusted by simply moving the device 12 in and out of the liquid media 34. In another embodiment, the dielectric layer 34 may be slidably disposed over the electrode 22 allowing for adjustment of the distance “l” by moving the dielectric layer 34 along the electrode 22.
This configuration prevents the generation of arcing and plays an important role in controlling the chemical reaction between the plasma effluent 31 and the liquid media 34 at the plasma/liquid interface 35. Submerging of the distal portion 36 concentrates the plasma effluent 31 into discharging within the liquid media 34. The submerged distance “d” is directly proportional to the temperature of the plasma effluent 31. Thus, the deeper the electrode 22 is submerged, the hotter the plasma effluent 31 becomes. Conversely, withdrawing the electrode 22 from the liquid media 34 decreases the temperature of the plasma effluent 31. This is due to the heat removal properties of the liquid media 34, since the distance “d” directly relates to the exposure of the plasma effluent 31 to the liquid media 34, which acts as a heatsink. This relationship between the submerging distance “d” and the temperature may be used to generate particular surgical effects at the workpiece “W.” In particular, varying the temperature of the plasma effluent 31 directly effects the hemostasis effect thereof.
The liquid media 34 and the workpiece “W” may be placed within a container 23. The container 23 may be formed from a conductive material and may be coupled to a ground terminal 27 of the generator 14. In another embodiment, the ground terminal 27 may be an electrode that is placed in the vicinity of the electrode 22 within the liquid media 34.
As discussed above, the ionizable media and the precursor feedstocks are supplied through the lumen 29 and energy is supplied to the electrode 22 to ignite the mixture to form the plasma effluent 31. The ionizable media may be selected to include components (e.g., Ar, He, etc.) that assist plasma action and/or improve plasma chemical processes of breaking down feedstocks into reactive species. The plasma effluent 31 is ignited and sustained by electrical energy that is delivered through the electrode 22.
The plasma effluent 31 is injected into the liquid media 34, thereby generating additional chemical reactions between the volatized components of the ionized media and feedstocks and constituents of the liquid media 34 (e.g., water molecules, ions, etc.). This results in further dissociation (e.g., breaking down of molecular components into constituents) of feedstocks, media, etc. and dispersion thereof into the liquid media 34. More specifically, interaction between the plasma effluent 31 and the liquid media 34 allows for local in-situ generation of radicals and metastable atoms and/or molecules that react with the surface of the workpiece “W.” In addition to chemical reactions, the physical force due to the flow of the plasma effluent 31 also acts on (e.g, etches) the workpiece “W” with increased chemical reaction rates.
The plasma device 12 may also be utilized for whitening teeth. In this embodiment, the liquid media 34 may be deionized water, carbamide peroxide, an aqueous basic solution with sodium hydroxide and other suitable bases, as well as other suitable hydroxide (OH−) and hydrogen (H+) radical doners. The teeth may be submerged in the liquid media 34 (e.g., via irrigation and circulation of the deionized water through the mouth). The plasma device 12, namely, the electrode 22 is submerged into the liquid media 34 to a desired depth. The plasma device 12 may be provided with suitable chemical precursors suitable for removing foreign matter (e.g., stains, plaque, etc.) disposed on tooth enamel, such as oxygen, nitrogen dioxide, carbon dioxide and mixtures thereof. In another embodiment, the plasma device 12 may be used without chemical precursor feedstocks since deionized water provides suitable chemical feedstocks for the whitening procedure.
In a further embodiment, the liquid media 34 may also include a precursor feedstock dissolved therein. The supplied precursors feedstocks or feedstocks dissolved in the liquid media 34 may be chosen for their selectivity in reacting with the foreign matter (e.g., stains, plaque, etc.) disposed on tooth enamel. In other words, the selected precursor feedstocks have higher chemical reactivity with the foreign matter relative to the chemical reactivity with the enamel tissue. Without being limited to any particular theory, it is believed that one specific reaction illustrated by formula (3) may be responsible for the bleaching action:
H2O+e−→OH−+H++e− (3)
The reaction depicted by formula (3) occurs at the plasma/liquid interface 35 and is characterized by the formation of hydroxide (OH−) and hydrogen (H+) radicals due to the energy supplied to the water molecules by the plasma effluent 31. In addition, other radicals may also be formed at the plasma/liquid interface 35, such as oxides and hydrides. The generated radicals bombard the build-up of foreign matter on the teeth thereby whitening the teeth. More specifically, the radicals and other plasma-generated species break the bonds of the build-up into constituent compounds, which are then dissolved in the liquid media 34.
In one embodiment, the plasma device 12 may be used to apply hydrophobic compounds such as hexamethyldisiloxane (“HMDSO”) and CF4 to the workpiece “W” to generate a hydrophobic coating on the surface thereof. The hydrophobic compounds may be supplied to the plasma through the precursor source 18. The hydrophobic compounds are mixed with the ionizable media and are volatized within the plasma device 12 and are then deposited on the workpiece “W” by the plasma effluent 31. Hydrophobic plasma-applied coating may be suitable for preventing bacterial growth on living tissue. In embodiments, the hydrophobic coating may be applied to the teeth to minimized growth of bacteria once the foreign matter has been removed from enamel of teeth.
Titanium oxide (TiO2) catalysts were added into deionized water and plasma was generated within the water medium. The effectiveness of TiO2 catalysts was measured by spectroscopy of hydroxyl (OH) and hydrogen (H) radicals, namely, H beta and H alpha radicals. As illustrated in
Although the illustrative embodiments of the present disclosure have been described herein with reference to the accompanying drawings, it is to be understood that the disclosure is not limited to those precise embodiments, and that various other changes and modifications may be effected therein by one skilled in the art without departing from the scope or spirit of the disclosure. In particular, as discussed above this allows the tailoring of the relative populations of plasma species to meet needs for the specific process desired on the workpiece surface or in the volume of the reactive plasma.
The present application claims the benefit of and priority to International Application No. PCT/US2010/029485 filed by Koo et al. on Mar. 31, 2010, which is a continuation and claims the benefit and priority to International Application No. PCT/US2009/045708 filed by Moore et al. on May 29, 2009, which claims the benefit of and priority to U.S. Provisional Application Ser. No. 61/057,667 entitled “PLASMA-BASED CHEMICAL SOURCE DEVICE AND METHOD OF USE THEREOF” filed by Moore et al. on May 30, 2008, the entire contents of all of which are incorporated by reference herein.
Filing Document | Filing Date | Country | Kind | 371c Date |
---|---|---|---|---|
PCT/US2010/029485 | 3/31/2010 | WO | 00 | 11/21/2012 |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO2011/123125 | 10/6/2011 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
438257 | Raquet | Oct 1890 | A |
2213820 | Maxson | Sep 1940 | A |
2598301 | Rajchman | May 1952 | A |
3134947 | Charasz | May 1964 | A |
3434476 | Shaw et al. | Mar 1969 | A |
3671195 | Bersin | Jun 1972 | A |
3838242 | Goucher | Sep 1974 | A |
3903891 | Brayshaw | Sep 1975 | A |
3938525 | Coucher | Feb 1976 | A |
3991764 | Incropera et al. | Nov 1976 | A |
4010400 | Hollister | Mar 1977 | A |
4017707 | Brown et al. | Apr 1977 | A |
4143337 | Beaulieu | Mar 1979 | A |
4177422 | Deficis et al. | Dec 1979 | A |
4181897 | Miller | Jan 1980 | A |
4188426 | Auerbach | Feb 1980 | A |
4274919 | Jensen et al. | Jun 1981 | A |
4337415 | Dürr | Jun 1982 | A |
4577165 | Uehara et al. | Mar 1986 | A |
4629887 | Bernier | Dec 1986 | A |
4629940 | Gagne et al. | Dec 1986 | A |
4780803 | Dede Garcia-Santamaria | Oct 1988 | A |
4781175 | McGreevy et al. | Nov 1988 | A |
4818916 | Morrisroe | Apr 1989 | A |
4877999 | Knapp et al. | Oct 1989 | A |
4901719 | Trenconsky et al. | Feb 1990 | A |
4922210 | Flachenecker et al. | May 1990 | A |
4956582 | Bourassa | Sep 1990 | A |
5025373 | Keyser, Jr. et al. | Jun 1991 | A |
5041110 | Fleenor | Aug 1991 | A |
5088997 | Delahuerga et al. | Feb 1992 | A |
5098430 | Fleenor | Mar 1992 | A |
5117088 | Stava | May 1992 | A |
5124526 | Muller et al. | Jun 1992 | A |
5135604 | Kumar et al. | Aug 1992 | A |
5155547 | Casper et al. | Oct 1992 | A |
5159173 | Frind et al. | Oct 1992 | A |
5180949 | Durr | Jan 1993 | A |
5217457 | Delahuerga et al. | Jun 1993 | A |
5223457 | Mintz et al. | Jun 1993 | A |
5256138 | Burek et al. | Oct 1993 | A |
5280154 | Cuomo et al. | Jan 1994 | A |
5300068 | Rosar et al. | Apr 1994 | A |
5304279 | Coultas et al. | Apr 1994 | A |
5320621 | Gordon et al. | Jun 1994 | A |
5334834 | Ito et al. | Aug 1994 | A |
RE34780 | Trenconsky et al. | Nov 1994 | E |
5383019 | Farrell et al. | Jan 1995 | A |
5384167 | Nishiwaki et al. | Jan 1995 | A |
5401350 | Patrick et al. | Mar 1995 | A |
5449356 | Walbrink et al. | Sep 1995 | A |
5449432 | Hanawa | Sep 1995 | A |
5505729 | Rau | Apr 1996 | A |
5526138 | Sato | Jun 1996 | A |
5534231 | Savas | Jul 1996 | A |
5554172 | Horner et al. | Sep 1996 | A |
5607509 | Schumacher et al. | Mar 1997 | A |
5618382 | Mintz et al. | Apr 1997 | A |
5656186 | Mourou et al. | Aug 1997 | A |
5669904 | Platt, Jr. et al. | Sep 1997 | A |
5669907 | Platt, Jr. et al. | Sep 1997 | A |
5683366 | Eggers et al. | Nov 1997 | A |
5688357 | Hanawa | Nov 1997 | A |
5697882 | Eggers et al. | Dec 1997 | A |
5707402 | Heim | Jan 1998 | A |
5708330 | Rothenbuhler et al. | Jan 1998 | A |
5720745 | Farin et al. | Feb 1998 | A |
5733511 | De Francesco | Mar 1998 | A |
5810764 | Eggers et al. | Sep 1998 | A |
5818581 | Kurosawa et al. | Oct 1998 | A |
5841531 | Gliddon | Nov 1998 | A |
5843019 | Eggers et al. | Dec 1998 | A |
5843079 | Suslov | Dec 1998 | A |
5845488 | Hancock et al. | Dec 1998 | A |
5849136 | Mintz et al. | Dec 1998 | A |
5858477 | Veerasamy et al. | Jan 1999 | A |
5865937 | Shan et al. | Feb 1999 | A |
5866985 | Coultas et al. | Feb 1999 | A |
5892328 | Shang et al. | Apr 1999 | A |
5909086 | Kim et al. | Jun 1999 | A |
5961772 | Selwyn | Oct 1999 | A |
5977715 | Li et al. | Nov 1999 | A |
6013075 | Avramenko et al. | Jan 2000 | A |
6020794 | Wilbur | Feb 2000 | A |
6024733 | Eggers et al. | Feb 2000 | A |
6027601 | Hanawa | Feb 2000 | A |
6030667 | Nakagawa et al. | Feb 2000 | A |
6033582 | Lee et al. | Mar 2000 | A |
6036878 | Collins | Mar 2000 | A |
6046546 | Porter et al. | Apr 2000 | A |
6047700 | Eggers et al. | Apr 2000 | A |
6053172 | Hovda et al. | Apr 2000 | A |
6063079 | Hovda et al. | May 2000 | A |
6063084 | Farin | May 2000 | A |
6063937 | Dlubala et al. | May 2000 | A |
6066134 | Eggers et al. | May 2000 | A |
6086585 | Hovda et al. | Jul 2000 | A |
6099523 | Kim et al. | Aug 2000 | A |
6102046 | Weinstein et al. | Aug 2000 | A |
6105581 | Eggers et al. | Aug 2000 | A |
6109268 | Thapliyal et al. | Aug 2000 | A |
6110395 | Gibson, Jr. | Aug 2000 | A |
6113597 | Eggers et al. | Sep 2000 | A |
6132575 | Pandumsopom et al. | Oct 2000 | A |
6137237 | MacLennan et al. | Oct 2000 | A |
6142992 | Cheng et al. | Nov 2000 | A |
6149620 | Baker et al. | Nov 2000 | A |
6153852 | Blutke et al. | Nov 2000 | A |
6159208 | Hovda et al. | Dec 2000 | A |
6159531 | Dang et al. | Dec 2000 | A |
6170428 | Redeker et al. | Jan 2001 | B1 |
6172130 | Bellesort | Jan 2001 | B1 |
6178918 | Van Os et al. | Jan 2001 | B1 |
6179836 | Eggers et al. | Jan 2001 | B1 |
6182469 | Campbell et al. | Feb 2001 | B1 |
6183655 | Wang et al. | Feb 2001 | B1 |
6190381 | Olsen et al. | Feb 2001 | B1 |
6197026 | Farin et al. | Mar 2001 | B1 |
6203542 | Ellsberry et al. | Mar 2001 | B1 |
6206871 | Zanon et al. | Mar 2001 | B1 |
6206878 | Bishop et al. | Mar 2001 | B1 |
6207924 | Trassy | Mar 2001 | B1 |
6210402 | Olsen et al. | Apr 2001 | B1 |
6210410 | Farin et al. | Apr 2001 | B1 |
6213999 | Platt, Jr. et al. | Apr 2001 | B1 |
6222186 | Li et al. | Apr 2001 | B1 |
6224592 | Eggers et al. | May 2001 | B1 |
6225593 | Howieson et al. | May 2001 | B1 |
6228078 | Eggers et al. | May 2001 | B1 |
6228082 | Baker et al. | May 2001 | B1 |
6228229 | Raaijmakers et al. | May 2001 | B1 |
6235020 | Cheng et al. | May 2001 | B1 |
6237526 | Brcka | May 2001 | B1 |
6238391 | Olsen et al. | May 2001 | B1 |
6242735 | Li et al. | Jun 2001 | B1 |
6248250 | Hanawa et al. | Jun 2001 | B1 |
6252354 | Collins et al. | Jun 2001 | B1 |
6254600 | Willink et al. | Jul 2001 | B1 |
6254738 | Stimson et al. | Jul 2001 | B1 |
6264650 | Hovda et al. | Jul 2001 | B1 |
6264651 | Underwood et al. | Jul 2001 | B1 |
6264652 | Eggers et al. | Jul 2001 | B1 |
6270687 | Ye et al. | Aug 2001 | B1 |
6277112 | Underwood et al. | Aug 2001 | B1 |
6277251 | Hwang et al. | Aug 2001 | B1 |
6283961 | Underwood et al. | Sep 2001 | B1 |
6287980 | Hanazaki et al. | Sep 2001 | B1 |
6291938 | Jewett et al. | Sep 2001 | B1 |
6296636 | Cheng et al. | Oct 2001 | B1 |
6296638 | Davison et al. | Oct 2001 | B1 |
6299948 | Gherardi et al. | Oct 2001 | B1 |
6309387 | Eggers et al. | Oct 2001 | B1 |
6313587 | MacLennan et al. | Nov 2001 | B1 |
6326584 | Jewett et al. | Dec 2001 | B1 |
6326739 | MacLennan et al. | Dec 2001 | B1 |
6328760 | James | Dec 2001 | B1 |
6329757 | Morrisroe et al. | Dec 2001 | B1 |
6333481 | Augeraud et al. | Dec 2001 | B2 |
6345588 | Stimson | Feb 2002 | B1 |
6346108 | Fischer | Feb 2002 | B1 |
6348051 | Farin et al. | Feb 2002 | B1 |
6353206 | Roderick | Mar 2002 | B1 |
6355032 | Hovda et al. | Mar 2002 | B1 |
6363937 | Hovda et al. | Apr 2002 | B1 |
6365063 | Collins et al. | Apr 2002 | B2 |
6375750 | Van Os et al. | Apr 2002 | B1 |
6379351 | Thapliyal et al. | Apr 2002 | B1 |
6387088 | Shattuck et al. | May 2002 | B1 |
6391025 | Weinstein et al. | May 2002 | B1 |
6396214 | Grosse et al. | May 2002 | B1 |
6401652 | Mohn et al. | Jun 2002 | B1 |
6402517 | Hozumi et al. | Jun 2002 | B1 |
6409933 | Holland et al. | Jun 2002 | B1 |
RE37780 | Lanzani et al. | Jul 2002 | E |
6416507 | Eggers et al. | Jul 2002 | B1 |
6416508 | Eggers et al. | Jul 2002 | B1 |
6416633 | Spence | Jul 2002 | B1 |
6424099 | Kirkpatrick et al. | Jul 2002 | B1 |
6424232 | Mavretic et al. | Jul 2002 | B1 |
6432103 | Ellsberry et al. | Aug 2002 | B1 |
6432260 | Mahoney et al. | Aug 2002 | B1 |
6443948 | Suslov | Sep 2002 | B1 |
6444084 | Collins | Sep 2002 | B1 |
6445141 | Kastner et al. | Sep 2002 | B1 |
6459066 | Khateretal | Oct 2002 | B1 |
6461350 | Underwood et al. | Oct 2002 | B1 |
6461354 | Olsen et al. | Oct 2002 | B1 |
6464695 | Hovda et al. | Oct 2002 | B2 |
6464889 | Lee et al. | Oct 2002 | B1 |
6464891 | Druz et al. | Oct 2002 | B1 |
6468270 | Hovda et al. | Oct 2002 | B1 |
6468274 | Alleyne et al. | Oct 2002 | B1 |
6471822 | Yin et al. | Oct 2002 | B1 |
6474258 | Brcka | Nov 2002 | B2 |
6475217 | Platt | Nov 2002 | B1 |
6482201 | Olsen et al. | Nov 2002 | B1 |
6497826 | Li et al. | Dec 2002 | B2 |
6500173 | Underwood et al. | Dec 2002 | B2 |
6502416 | Kawasumi et al. | Jan 2003 | B2 |
6502588 | Li et al. | Jan 2003 | B2 |
6507155 | Barnes et al. | Jan 2003 | B1 |
6525481 | Klima et al. | Feb 2003 | B1 |
6534133 | Kaloyeros et al. | Mar 2003 | B1 |
6540741 | Underwood et al. | Apr 2003 | B1 |
6544261 | Ellsberry et al. | Apr 2003 | B2 |
6558383 | Cunningham et al. | May 2003 | B2 |
6565558 | Lindenmeier et al. | May 2003 | B1 |
6575968 | Eggers et al. | Jun 2003 | B1 |
6579289 | Schnitzler | Jun 2003 | B2 |
6579426 | Van Gogh et al. | Jun 2003 | B1 |
6582423 | Thapliyal et al. | Jun 2003 | B1 |
6582427 | Goble et al. | Jun 2003 | B1 |
6582429 | Krishnan et al. | Jun 2003 | B2 |
6589237 | Woloszko et al. | Jul 2003 | B2 |
6589437 | Collins | Jul 2003 | B1 |
6595990 | Weinstein et al. | Jul 2003 | B1 |
6617794 | Barnes et al. | Sep 2003 | B2 |
6624583 | Coll et al. | Sep 2003 | B1 |
6625555 | Kuan et al. | Sep 2003 | B2 |
6629974 | Penny et al. | Oct 2003 | B2 |
6632193 | Davison et al. | Oct 2003 | B1 |
6632220 | Eggers et al. | Oct 2003 | B1 |
6642526 | Hartley | Nov 2003 | B2 |
6646386 | Sirkis et al. | Nov 2003 | B1 |
6652717 | Hong | Nov 2003 | B1 |
6653594 | Nakamura et al. | Nov 2003 | B2 |
6657594 | Anderson | Dec 2003 | B2 |
6659106 | Hovda et al. | Dec 2003 | B1 |
6663017 | Endres et al. | Dec 2003 | B2 |
6666865 | Platt | Dec 2003 | B2 |
6685803 | Lazarovich et al. | Feb 2004 | B2 |
6712811 | Underwood et al. | Mar 2004 | B2 |
6719754 | Underwood et al. | Apr 2004 | B2 |
6719883 | Stimson | Apr 2004 | B2 |
6723091 | Goble et al. | Apr 2004 | B2 |
6726684 | Woloszko et al. | Apr 2004 | B1 |
6740842 | Johnson et al. | May 2004 | B2 |
6746447 | Davison et al. | Jun 2004 | B2 |
6763836 | Tasto et al. | Jul 2004 | B2 |
6770071 | Woloszko et al. | Aug 2004 | B2 |
6772012 | Ricart et al. | Aug 2004 | B2 |
6773431 | Eggers et al. | Aug 2004 | B2 |
6774569 | De Vries et al. | Aug 2004 | B2 |
6780178 | Palanker et al. | Aug 2004 | B2 |
6780184 | Tanrisever | Aug 2004 | B2 |
6781317 | Goodman | Aug 2004 | B1 |
6787730 | Coccio et al. | Sep 2004 | B2 |
6805130 | Tasto et al. | Oct 2004 | B2 |
6806438 | Nakano et al. | Oct 2004 | B2 |
6815633 | Chen et al. | Nov 2004 | B1 |
6818140 | Ding | Nov 2004 | B2 |
6832996 | Woloszko et al. | Dec 2004 | B2 |
6837884 | Woloszko | Jan 2005 | B2 |
6837887 | Woloszko et al. | Jan 2005 | B2 |
6837888 | Ciarrocca et al. | Jan 2005 | B2 |
6840937 | Van Wyk | Jan 2005 | B2 |
6849191 | Ono et al. | Feb 2005 | B2 |
6852112 | Platt | Feb 2005 | B2 |
6855143 | Davison et al. | Feb 2005 | B2 |
6855225 | Su et al. | Feb 2005 | B1 |
6861377 | Hirai et al. | Mar 2005 | B1 |
6867859 | Powell | Mar 2005 | B1 |
6876155 | Howald et al. | Apr 2005 | B2 |
6890332 | Truckai et al. | May 2005 | B2 |
6896672 | Eggers et al. | May 2005 | B1 |
6896674 | Woloszko et al. | May 2005 | B1 |
6896775 | Chistyakov | May 2005 | B2 |
6909237 | Park et al. | Jun 2005 | B1 |
6911029 | Platt | Jun 2005 | B2 |
6915806 | Pacek et al. | Jul 2005 | B2 |
6919527 | Boulos et al. | Jul 2005 | B2 |
6920883 | Bessette et al. | Jul 2005 | B2 |
6921398 | Carmel et al. | Jul 2005 | B2 |
6922093 | Kanda | Jul 2005 | B2 |
6924455 | Chen et al. | Aug 2005 | B1 |
6929640 | Underwood et al. | Aug 2005 | B1 |
6949096 | Davison et al. | Sep 2005 | B2 |
6949887 | Kirkpatrick et al. | Sep 2005 | B2 |
6958063 | Soil et al. | Oct 2005 | B1 |
6974453 | Woloszko et al. | Dec 2005 | B2 |
6991631 | Woloszko et al. | Jan 2006 | B2 |
7004941 | Tvinnereim et al. | Feb 2006 | B2 |
7019253 | Johnson et al. | Mar 2006 | B2 |
7046088 | Ziegler | May 2006 | B2 |
7048733 | Hartley et al. | May 2006 | B2 |
7070596 | Woloszko et al. | Jul 2006 | B1 |
7084832 | Pribyl | Aug 2006 | B2 |
7090672 | Underwood et al. | Aug 2006 | B2 |
7096819 | Chen et al. | Aug 2006 | B2 |
7100532 | Pribyl | Sep 2006 | B2 |
7104986 | Hovda et al. | Sep 2006 | B2 |
7115185 | Gonzalez et al. | Oct 2006 | B1 |
7122035 | Canady | Oct 2006 | B2 |
7122965 | Goodman | Oct 2006 | B2 |
7131969 | Hovda et al. | Nov 2006 | B1 |
7132620 | Coelho et al. | Nov 2006 | B2 |
7132996 | Evans et al. | Nov 2006 | B2 |
7150745 | Stern et al. | Dec 2006 | B2 |
7157857 | Brouk et al. | Jan 2007 | B2 |
7160521 | Porshnev et al. | Jan 2007 | B2 |
7161112 | Smith et al. | Jan 2007 | B2 |
7164484 | Takahashi et al. | Jan 2007 | B2 |
7165451 | Brooks et al. | Jan 2007 | B1 |
7166816 | Chen et al. | Jan 2007 | B1 |
7179255 | Lettice et al. | Feb 2007 | B2 |
7186234 | Dahla et al. | Mar 2007 | B2 |
7189939 | Lee et al. | Mar 2007 | B2 |
7189940 | Kumar et al. | Mar 2007 | B2 |
7192428 | Eggers et al. | Mar 2007 | B2 |
7199399 | Chin-Lung et al. | Apr 2007 | B2 |
7201750 | Eggers et al. | Apr 2007 | B1 |
7214280 | Kumar et al. | May 2007 | B2 |
7214934 | Stevenson | May 2007 | B2 |
7217268 | Eggers et al. | May 2007 | B2 |
7217903 | Bayer et al. | May 2007 | B2 |
7220261 | Truckai et al. | May 2007 | B2 |
7227097 | Kumar et al. | Jun 2007 | B2 |
7238185 | Palanker et al. | Jul 2007 | B2 |
7241293 | Davison | Jul 2007 | B2 |
7270658 | Woloszko et al. | Sep 2007 | B2 |
7270659 | Ricart et al. | Sep 2007 | B2 |
7270661 | Dahla et al. | Sep 2007 | B2 |
7271363 | Lee et al. | Sep 2007 | B2 |
7275344 | Woodmansee, III et al. | Oct 2007 | B2 |
7276063 | Davison et al. | Oct 2007 | B2 |
7282244 | Schaepkens et al. | Oct 2007 | B2 |
7291804 | Suslov | Nov 2007 | B2 |
7292191 | Anderson | Nov 2007 | B2 |
7297143 | Woloszko et al. | Nov 2007 | B2 |
7297145 | Woloszko et al. | Nov 2007 | B2 |
7298091 | Pickard et al. | Nov 2007 | B2 |
7309843 | Kumar et al. | Dec 2007 | B2 |
7311708 | McClurken | Dec 2007 | B2 |
7316682 | Konesky | Jan 2008 | B2 |
7318823 | Sharps et al. | Jan 2008 | B2 |
7331957 | Woloszko et al. | Feb 2008 | B2 |
7353771 | Millner et al. | Apr 2008 | B2 |
7355379 | Kitamura et al. | Apr 2008 | B2 |
7357798 | Sharps et al. | Apr 2008 | B2 |
7361175 | Suslov | Apr 2008 | B2 |
7382129 | Mills | Jun 2008 | B2 |
7387625 | Hovda et al. | Jun 2008 | B2 |
7393351 | Woloszko et al. | Jul 2008 | B2 |
7399944 | DeVries et al. | Jul 2008 | B2 |
7410669 | Dieckhoff et al. | Aug 2008 | B2 |
7419488 | Ciarrocca et al. | Sep 2008 | B2 |
7426900 | Brcka | Sep 2008 | B2 |
7429260 | Underwood et al. | Sep 2008 | B2 |
7429262 | Woloszko et al. | Sep 2008 | B2 |
7431857 | Shannon et al. | Oct 2008 | B2 |
7435247 | Woloszko et al. | Oct 2008 | B2 |
7442191 | Hovda et al. | Oct 2008 | B2 |
7445619 | Auge, II et al. | Nov 2008 | B2 |
7449021 | Underwood et al. | Nov 2008 | B2 |
7453403 | Anderson | Nov 2008 | B2 |
7458973 | Ouchi | Dec 2008 | B2 |
7459899 | Mattaboni et al. | Dec 2008 | B2 |
7468059 | Eggers et al. | Dec 2008 | B2 |
7480299 | O'Keeffe et al. | Jan 2009 | B2 |
7489206 | Kotani et al. | Feb 2009 | B2 |
7491200 | Underwood | Feb 2009 | B2 |
7497119 | Brooks et al. | Mar 2009 | B2 |
7498000 | Pekshev et al. | Mar 2009 | B2 |
7506014 | Drummond | Mar 2009 | B2 |
7507236 | Eggers et al. | Mar 2009 | B2 |
7510665 | Shannon et al. | Mar 2009 | B2 |
7511246 | Morris | Mar 2009 | B2 |
7549990 | Canady | Jun 2009 | B2 |
7563261 | Carmel et al. | Jul 2009 | B2 |
7566333 | Van Wyk et al. | Jul 2009 | B2 |
7572255 | Sartor et al. | Aug 2009 | B2 |
7578817 | Canady | Aug 2009 | B2 |
7578818 | Platt | Aug 2009 | B2 |
7589473 | Suslov | Sep 2009 | B2 |
7601150 | Farin | Oct 2009 | B2 |
7608839 | Coulombe et al. | Oct 2009 | B2 |
7611509 | Van Wyk | Nov 2009 | B2 |
7628787 | Sartor et al. | Dec 2009 | B2 |
7632267 | Dahla | Dec 2009 | B2 |
7633231 | Watson | Dec 2009 | B2 |
7648503 | Podhajsky | Jan 2010 | B2 |
7666478 | Paulussen et al. | Feb 2010 | B2 |
7691101 | Davison et al. | Apr 2010 | B2 |
7691102 | Podhajsky et al. | Apr 2010 | B2 |
7708733 | Sanders et al. | May 2010 | B2 |
7715889 | Ito | May 2010 | B2 |
7758575 | Beller | Jul 2010 | B2 |
7824398 | Woloszko et al. | Nov 2010 | B2 |
7879034 | Woloszko et al. | Feb 2011 | B2 |
7887891 | Rius | Feb 2011 | B2 |
7892223 | Geiselhart | Feb 2011 | B2 |
7892230 | Woloszko | Feb 2011 | B2 |
7901403 | Woloszko et al. | Mar 2011 | B2 |
7940008 | Mattaboni et al. | May 2011 | B2 |
7949407 | Kaplan et al. | May 2011 | B2 |
20010025177 | Woloszko et al. | Sep 2001 | A1 |
20010054601 | Ding | Dec 2001 | A1 |
20020014832 | Moradi et al. | Feb 2002 | A1 |
20020022836 | Goble et al. | Feb 2002 | A1 |
20020022838 | Cunningham et al. | Feb 2002 | A1 |
20020023899 | Khater et al. | Feb 2002 | A1 |
20020092826 | Ding | Jul 2002 | A1 |
20020125207 | Ono et al. | Sep 2002 | A1 |
20020132380 | Nakano et al. | Sep 2002 | A1 |
20020148734 | Bleck et al. | Oct 2002 | A1 |
20030006019 | Johnson et al. | Jan 2003 | A1 |
20030008327 | Ornatskaia | Jan 2003 | A1 |
20030027186 | Pierce | Feb 2003 | A1 |
20030036753 | Morgan et al. | Feb 2003 | A1 |
20030075522 | Weichart et al. | Apr 2003 | A1 |
20030093073 | Platt | May 2003 | A1 |
20030105456 | Lin | Jun 2003 | A1 |
20030108683 | Wu | Jun 2003 | A1 |
20030132198 | Ono et al. | Jul 2003 | A1 |
20030158545 | Hovda et al. | Aug 2003 | A1 |
20030208194 | Hovda et al. | Nov 2003 | A1 |
20030228416 | Iwamaru | Dec 2003 | A1 |
20040007985 | De Vries et al. | Jan 2004 | A1 |
20040027127 | Mills | Feb 2004 | A1 |
20040075375 | Miyashila et al. | Apr 2004 | A1 |
20040086434 | Gadgil et al. | May 2004 | A1 |
20040111219 | Gulati | Jun 2004 | A1 |
20040116918 | Konesky | Jun 2004 | A1 |
20040129212 | Gadgil et al. | Jul 2004 | A1 |
20040138658 | Farin et al. | Jul 2004 | A1 |
20040181220 | Farin | Sep 2004 | A1 |
20050015001 | Lec et al. | Jan 2005 | A1 |
20050017646 | Boulos et al. | Jan 2005 | A1 |
20050080413 | Canady | Apr 2005 | A1 |
20050103748 | Yamaguchi et al. | May 2005 | A1 |
20050107786 | Canady | May 2005 | A1 |
20050205212 | Singh et al. | Sep 2005 | A1 |
20060004354 | Suslov | Jan 2006 | A1 |
20060011465 | Burke et al. | Jan 2006 | A1 |
20060017388 | Stevenson | Jan 2006 | A1 |
20060036239 | Canady | Feb 2006 | A1 |
20060038992 | Morrisroe | Feb 2006 | A1 |
20060052771 | Sartor et al. | Mar 2006 | A1 |
20060065628 | Vahedi et al. | Mar 2006 | A1 |
20060084154 | Jones, Jr. et al. | Apr 2006 | A1 |
20060127879 | Fuccione | Jun 2006 | A1 |
20060172429 | Nilsson et al. | Aug 2006 | A1 |
20060175015 | Chen et al. | Aug 2006 | A1 |
20060200122 | Sartor et al. | Sep 2006 | A1 |
20060224146 | Lin | Oct 2006 | A1 |
20060266735 | Shannon et al. | Nov 2006 | A1 |
20060278254 | Jackson | Dec 2006 | A1 |
20070014752 | Roy et al. | Jan 2007 | A1 |
20070021747 | Suslov | Jan 2007 | A1 |
20070021748 | Suslov | Jan 2007 | A1 |
20070029292 | Suslov | Feb 2007 | A1 |
20070029500 | Coulombe et al. | Feb 2007 | A1 |
20070039389 | Brooks et al. | Feb 2007 | A1 |
20070084563 | Holland | Apr 2007 | A1 |
20070087455 | Hoffman | Apr 2007 | A1 |
20070149970 | Schnitzler et al. | Jun 2007 | A1 |
20070163499 | Finn et al. | Jul 2007 | A1 |
20070207442 | Yarborough | Sep 2007 | A1 |
20070210035 | Twarog et al. | Sep 2007 | A1 |
20070213704 | Truckai et al. | Sep 2007 | A1 |
20070251920 | Hoffman | Nov 2007 | A1 |
20070255271 | Dabney et al. | Nov 2007 | A1 |
20070258329 | Winey | Nov 2007 | A1 |
20070282322 | Dabney et al. | Dec 2007 | A1 |
20070282323 | Woloszko et al. | Dec 2007 | A1 |
20070292972 | Paulussen et al. | Dec 2007 | A1 |
20080023443 | Paterson et al. | Jan 2008 | A1 |
20080039832 | Palanker et al. | Feb 2008 | A1 |
20080083701 | Shao et al. | Apr 2008 | A1 |
20080099434 | Chandrachood et al. | May 2008 | A1 |
20080099435 | Grimbergen | May 2008 | A1 |
20080099436 | Grimbergen | May 2008 | A1 |
20080108985 | Konesky | May 2008 | A1 |
20080122252 | Corke et al. | May 2008 | A1 |
20080167398 | Patil et al. | Jul 2008 | A1 |
20080179290 | Collins et al. | Jul 2008 | A1 |
20080185366 | Suslov | Aug 2008 | A1 |
20080268172 | Fukuda et al. | Oct 2008 | A1 |
20080284506 | Messer | Nov 2008 | A1 |
20080292497 | Vangeneugden et al. | Nov 2008 | A1 |
20080296567 | Irving et al. | Dec 2008 | A1 |
20090004620 | Liu et al. | Jan 2009 | A1 |
20090039789 | Nikolay | Feb 2009 | A1 |
20090048594 | Sartor et al. | Feb 2009 | A1 |
20090054893 | Sartor et al. | Feb 2009 | A1 |
20090054896 | Fridman et al. | Feb 2009 | A1 |
20090064933 | Liu et al. | Mar 2009 | A1 |
20090076505 | Arts | Mar 2009 | A1 |
20090216226 | Davison et al. | Aug 2009 | A1 |
20090275941 | Sartor et al. | Nov 2009 | A1 |
20100016856 | Platt, Jr. | Jan 2010 | A1 |
20100042094 | Arts | Feb 2010 | A1 |
20100069902 | Sartor et al. | Mar 2010 | A1 |
20100089742 | Suslov | Apr 2010 | A1 |
20100114096 | Podhajsky | May 2010 | A1 |
20100130973 | Choi et al. | May 2010 | A1 |
20100209293 | Ikawa et al. | Aug 2010 | A1 |
Number | Date | Country |
---|---|---|
3710489 | Nov 1987 | DE |
4139029 | Jun 1993 | DE |
4326037 | Feb 1995 | DE |
9117019 | Apr 1995 | DE |
19537897 | Mar 1997 | DE |
9117299 | Apr 2000 | DE |
19848784 | May 2000 | DE |
29724247 | Aug 2000 | DE |
19524645 | Nov 2002 | DE |
0016542 | Oct 1980 | EP |
0016542 | Oct 1980 | EP |
0 495 699 | Jul 1992 | EP |
0602764 | Jun 1994 | EP |
0956827 | Nov 1999 | EP |
1174901 | Jan 2002 | EP |
1340509 | Sep 1963 | FR |
61-159953 | Jul 1986 | JP |
2010-242857 | Oct 2010 | JP |
1438745 | Nov 1988 | SU |
WO 9901887 | Jan 1999 | WO |
WO 9936940 | Jul 1999 | WO |
WO 0139555 | May 2001 | WO |
WO 2004032176 | Apr 2004 | WO |
WO 2006116252 | Nov 2006 | WO |
WO2009041049 | Apr 2009 | WO |
WO 2009080273 | Jul 2009 | WO |
2009146432 | Dec 2009 | WO |
WO 2009146439 | Dec 2009 | WO |
Entry |
---|
Copy of extended European Search Report issued in Appl. No. 10849146.5 dated Sep. 9, 2013. |
Copy of Supplementary European Search Report from Appl. No. EP 09 75 5799 mailed Aug. 31, 2012. |
U.S. Appl. No. 08/383,162, filed Feb. 3, 1995, Lawrence K. Pacer. |
U.S. Appl. No. 08/619,380, filed Mar. 21, 1996, Gene H. Arts. |
U.S. Appl. No. 08/621,151, filed Mar. 21, 1996, Robert B. Stoddard. |
U.S. Appl. No. 08/878,694, filed Jun. 19, 1997, Lawrence K Pacer. |
U.S. Appl. No. 09/270,856, filed Mar. 17, 1999, Gene H. Arts. |
U.S. Appl. No. 09/504,640, filed Feb. 16, 2000, James Steven Cunningham. |
U.S. Appl. No. 09/666,312, filed Sep. 21, 2000, Robert C. Platt. |
U.S. Appl. No. 12/791,100, filed Jun. 1, 2010, Kristin D. Johnson. |
U.S. Appl. No. 12/845,842, filed Jul. 29, 2010, Kristin D. Johnson. |
Hernandez et al., “A Controlled Study of the Argon Beam Coagultor for Partial Nephrectomy”; The Journal of Urology, vol. 143, May (1990) J. Urol. 143: pp. 1062-1065. |
Ward et al., “A Significant New Contribution to Radical Head and Neck Surgery”; Arch Otolaryngology, Head and Neck Surg., vol. 115 pp. 921-923 (Aug. 1989). |
Lieberman et al., “Capacitive Discharges”, Principles of Plasma Discharges and Materials Processing, John Wiley & Son, Inc. (2005) pp. 387-460. |
Moore et al., “Confined Geometry Interactions of Downstream RF-Excited Atmospheric Plasma Wires”, IEEE Transactions on Plasma Science, 0093-3813, (2008) pp. 1-2. |
Walsh et al., “Contrasting Characteristics of Pulsed and Sinusoidal Cold Atmospheric Plasma Jets”, Applied Physics Letters, 88, 171501 (2006) pp. 1-3. |
Cho et al., “Coplanar ac Discharges Between Cylindrical Electrodes With a Nanoporous Alumina Dielectric: Modular Dielectric Barrier Plasma Devices”, IEEE Transactions on Plasma Science, vol. 33, No. 2, (Apr. 2005) pp. 378-379. |
Xu et al., “DBD Plasma Jet in Atmospheric Pressure Argon”, IEEE Transactions on Plasma Science, vol. 36, No. 4, (Aug. 2008), pp. 1352-1353. |
Alfred Grill, “Electron Cyclotron Resonance Plasmas”, Cold Plasma in Materials Fabrication, IEEE Press (1994) pp. 40-43. |
Brand et al., “Electrosurgical Debulking of Ovarian Cancer: A New Technique Using the Argon Beam Coagulator”; Gynecologic Oncology 39 pp. 115-118 (1990). |
Grund et al., “Endoscopic Argon Plasma . . . Flexible Endoscopy”; Endoscopic Surgery and Allied Technologies, No. 1, vol. 2, pp. 42-46 (Feb. 1994). |
Waye et al., “Endoscopic Treatment Options”; Techniques in Therapeutic Endoscopy, pp. 1.7-1.15, (1987). |
B.D. Cullity, “Introduction to Magnetic Materials”, University of Notre Dame; Addison-Wesley Publishing Company, Reading MA., (1972) pp. 23-28. |
Brian Chapman, “Matching Networks”, Glow Discharge Processes, John Wiley & Sons Inc., NY, (1980) pp. 153-172. |
Yin et al., “Miniaturization of Inductively Coupled Plasma Sources”, IEEE Transactions on Plasma Science, vol. 27, No. 5, (Oct. 1999) pp. 1516-1524. |
Park et al., “Nanoporous Anodic Alumina Film on Glass: Improving Transparency by an Ion-Drift Process”, Electrochemical and Solid-State Letters, 8 (3) (2005), pp. D5-D7. |
P.A. Tulle, “Off-Resonance Microwave-Created Plasmas”, Plasma Physics, Pergamon Press (1973) vol. 15, pp. 971-976. |
Lieberman et al., “Ohmic Heating”, Principles of Plasma Discharges and Materials Processing, John Wiley & Son, Inc. (2005) pp. 97-98. |
Lieberman et al., “Optical Actinometry”, Principles of Plasma Discharges and Materials Processing, John Wiley & Son, Inc. (2005) pp. 277-279. |
Cho et al., “Ozone Production by Nanoporous Dielectric Barrier Glow Discharge in Atmospheric Pressure Air”, Applied Physics Letters, 92, 101504, (2008) pp. 1-3. |
Lieberman et al., “Particle and Energy Balance in Discharges”, Principles of Plasma Discharges and Materials Processing, John Wiley & Son, Inc. (2005) pp. 329-381. |
Woloszko et al., “Plasma Characteristics of Repetitively-Pulsed Electrical Discharges in Saline Solutions Used for Surgical Procedures”, IEEE Transactions of Plasma Science, vol. 30, No. 3, (Jun. 2002) pp. 1376-1383. |
Stoffels et al., “Plasma Needle for In Vivo Medical Treatment: Recent Developments and Perspectives”, Plasma Sources Science and Technology 15 (2006) pp. 169-180. |
Schaper et al., “Plasma Production and Vapour Layer Production at a Pulse Power Electrode in Saline Solution:”, (2008) www.escampig2008.csic.es/PosterSessions/100. |
Akitsu et al., “Plasma Sterilization Using Glow Discharge at Atmospheric Pressure”, Surface & Coatings Technology 193, (2005) pp. 29-34. |
Koo et al., “Room-temperature Slot Microplasma in Atmospheric Pressure Air Between Cylindrical Electrodes With a Nanoporous Alumina Dielectric”, Applied Physics Letters, 91, 041502 (2007) pp. 1-3. |
Brian Chapman, “Secondary Electron Emission”, Glow Discharge Processes, John Wiley & Sons Inc., NY, (1980) pp. 82-138. |
Moore et al., “Sensitive, Nonintrusive, In-Situ Measurement of Temporally and Spatially Resolved Plasma Electric Fields”, Physical Review Letters, vol. 52, No. 7, (Feb. 13, 1984) pp. 538-541. |
Lieberman et al., “Sheaths”, Principles of Plasma Discharges and Materials Processing, John Wiley & Son, Inc. (2005) pp. 11-14. |
Farin et al., Technology of Argon Plasma . . . Endoscopic Applications; Endoscopic Surgery and Allied Technologies, No. 1, vol. 2, pp. 71-77 (Feb. 1994). |
Lieberman et al, “The Collisionless Sheath”, Principles of Plasma Discharges and Materials Processing, John Wiley & Son, Inc. (2005) pp. 167-206. |
Gupta et al., “The Potential of Pulsed Underwater Streamer Discharges as a Disinfection Technique”, IEEE Transactions on Plasma Science, vol. 36, No. 4, (Aug. 2008) pp. 1621-1632. |
Mark H. Mellow, “The Role of Endoscopic Laser Therapy in Gastrointestinal Neoplasms”; Advanced Therapeutic Endoscopy, pp. 17-21, (1990). |
Silverstein et al., “Thermal Coagulation Therapy for Upper Gastrointestinal Bleeding”; Advanced Therapeutic Endoscopy, pp. 79-84, 1990. |
Sobolewski, Mark A., “Current and Voltage Measurements in the Gaseous Electronics Conference RF Reference Cell,” J. Res. Natl. Inst. Stand. Technol., vol. 100, No. 4, pp. 341-351 (1995). |
European Search Report EP 01 10 2843.8, dated May 15, 2001. |
European Search Report EP 05 00 2257, dated Jun. 1, 2005. |
European Search Report EP 05 01 8087, dated Oct. 17, 2005. |
European Search Report EP 06 01 9572 dated Nov. 21, 2006. |
European Search Report EP 07 00 4356 dated Jul. 2, 2007. |
European Search Report EP 07 00 4659 dated Feb. 19, 2008. |
European Search Report EP 07 00 4659—partial dated May 24, 2007. |
European Search Report EP 09 00 4975 dated Sep. 11, 2009. |
European Search Report EP 09 01 0519 dated Nov. 16, 2009. |
European Search Report EP 09 01 0520 dated Dec. 10, 2009. |
European Search Report EP 09 01 5212.5 dated Apr. 1, 2010. |
European Search Report EP 09 17 1599.5 dated Mar. 16, 2010. |
European Search Report EP 09 17 1600.1 dated Jan. 26, 2010. |
European Search Report EP 10 174107.2 dated Nov. 5, 2010. |
European Search Report EP 10 180 912.7 dated Dec. 8, 2010. |
European Search Report EP 10 186524.4 dated Feb. 18, 2011. |
International Search Report PCT/US98/19284, dated Jan. 14, 1999. |
European Search Report EP 11168420.5 dated Jan. 5, 2012. |
European Search Report EP 08015839.7 dated Dec. 19, 2008. |
International Search Report and Written Opinion from Int'l Appl. No. PCT/US2009/005398 mailed Apr. 5, 2010. |
International Search Report and Written Opinion from Int'l Appl. No. PCT/US2009/005389 mailed Oct. 26, 2009. |
Extended European Search Report corresponding to European Application No. 09755793.8, dated Jul. 21, 2014; 8 pages. |
Number | Date | Country | |
---|---|---|---|
20130059273 A1 | Mar 2013 | US |
Number | Date | Country | |
---|---|---|---|
61057667 | May 2008 | US |
Number | Date | Country | |
---|---|---|---|
Parent | PCT/US2009/045708 | May 2009 | US |
Child | 13637340 | US |