The present application claims priority from Japanese Patent Application No. 2018-056800, filed on Mar. 23, 2018, the disclosure of which is incorporated herein by reference in its entirety.
The present invention relates to a liquid jetting apparatus.
From the past, there is known a liquid jetting apparatus that includes: a channel substrate having liquid channels formed therein: piezoelectric elements provided for the channel substrate to correspond to the liquid channels; and a wiring member equipped with a driver IC. The piezoelectric elements have drive contacts led out to a surface, of the channel substrate, provided with the piezoelectric elements. As a result of the wiring member being joined to the channel substrate, the driver IC is electrically connected to the piezoelectric elements via the drive contacts, and outputs a drive signal to each of the piezoelectric elements. In order to dissipate heat generated from the driver IC when driving the piezoelectric elements, a heat sink is provided to be in contact with the driver IC.
In addition, there is known a recording apparatus including: a flexible wiring substrate having conductive wires and a driver IC that drives a recording head; and a heat sink that dissipates, to outside, heat generated by the driver IC. The heat sink is closely adhered to a surface, of the flexible wiring substrate, on an opposite side to a surface provided with the driver IC, at a position facing the driver IC.
In the liquid jetting apparatus described above, there is a risk that the heat generated by the driver IC is not only transmitted to the heat sink, but is also transmitted as far as a joining portion of the wiring member and the channel substrate, via the wiring member provided with the driver IC. Now, thermal expansion coefficients differ between the drive contacts of the piezoelectric elements and the wiring member (in more detail, an adhesive by which the wiring member is joined to the channel substrate). Therefore, there is a risk that when the heat generated by the driver IC is transmitted as far as the joining portion of the wiring member and the drive contacts, via the wiring member, an internal stress occurs between the adhesive of the wiring member and the drive contacts, and the wiring member is detached from the channel substrate.
On the other hand, in the recording apparatus described above, the flexible wiring substrate made of resin is interposed between the driver IC and the heat sink. Therefore, there is a risk that some of the heat generated by the driver IC is transmitted as far as a joining portion of the flexible wiring substrate and the recording head, via the flexible wiring substrate.
The present teaching was made in view of such circumstances, and has an object of providing a liquid jetting apparatus in which heat from a driver IC is hardly transmitted to a joining portion of a wiring member and a channel substrate.
According to a first aspect of the present teaching, there is provided a liquid jetting apparatus including: a liquid jetting module having drive elements; a wiring member including: a base material having a first surface; wirings formed on the first surface of the base material; and a protective film configured to covers the first surface of the base material and the wirings; and a heat sink, wherein one of the protective film and the base material, of the wiring member, is formed with an opening through which at least some of the wirings are partially exposed, the wirings of the wiring member are electrically connected to terminals of the drive elements, and the heat sink is joined to the at least some of the wirings via the opening of the wiring member.
According to a second aspect of the present teaching, there is provided a liquid jetting apparatus including: a liquid jetting module having drive elements; a wiring member including: a base material having a first surface; wirings formed on the first surface of the base material; and a protective film configured to cover the first surface of the base material and the wirings, one of the protective film and the base material being formed with an opening through which at least some of the wirings are partially exposed; a heat spreader joined to the at least some of the wirings via the opening of the wiring member; and a heat sink being a separate member from the heat spreader and being in contact with the heat spreader, wherein the wirings of the wiring member are electrically connected to terminals of the drive elements.
An embodiment of the present teaching will be described. First, a schematic configuration of an ink-jet printer 1 will be described with reference to
<Schematic Configuration of Printer>
As depicted in
A recording sheet 100 as a recording medium is placed on an upper surface of the platen 2. The ink jetting apparatus 3 includes an ink-jet head 21. The ink-jet head 21 includes four head units 25 (each an example of a liquid jetting module of the present teaching) which jet ink onto the recording sheet 100 placed on the platen 2. The ink jetting apparatus 3 is configured to reciprocate in a left-right direction (hereafter, also referred to a scanning direction) along two guide rails 11, 12 in a region facing the platen 2. An endless belt 13 is coupled to the ink jetting apparatus 3. The endless belt 13 is driven by a drive motor 14, whereby the ink jetting apparatus 3 moves in the scanning direction. The ink jetting apparatus 3, while moving in the scanning direction, jets ink toward the recording sheet 100 placed on the platen 2 from nozzles of each of the head units 25.
Four ink cartridges 15 respectively storing inks of four colors (black, yellow, cyan, magenta) are installed in a removable manner in the cartridge holder 4. The cartridge holder 4 is connected to the ink jetting apparatus 3 by unillustrated tubes. The four colors of inks respectively stored in the four ink cartridges 15 of the cartridge holder 4 are supplied to the ink jetting apparatus 3 via the tubes.
The conveyance mechanism 5 has two conveyance rollers 16, 17 that are disposed so as to sandwich the platen 2 in a front-rear direction. The two conveyance rollers 16, 17 are driven synchronously with each other by an unillustrated conveyance motor. The conveyance mechanism 5 conveys the recording sheet 100 placed on the platen 2, in a frontward direction (hereafter, also referred to a conveyance direction), by the two conveyance rollers 16, 17.
The controller 6 includes the likes of a ROM (Read Only Memory), a RAM (Random Access Memory), and an ASIC (Application Specific Integrated Circuit) that includes various kinds of control circuits. The controller 6 executes various kinds of processing, such as printing, on the recording sheet 100, by the ASIC, according to a program stored in the ROM. For example, in a printing processing, the controller 6 controls the ink jetting apparatus 3, the drive motor 14, the conveyance motor (illustration of which is omitted) of the conveyance mechanism 5, and so on, to print an image or the like on the recording sheet 100, based on a printing instruction inputted from an external apparatus such as a PC. Specifically, the controller 6, while moving the ink jetting apparatus 3 in the scanning direction, causes alternate execution of an ink jetting operation in which ink is jetted from the nozzles of the four head units 25 and a conveyance operation that conveys the recording sheet 100 a certain amount in the conveyance direction by the conveyance rollers 16, 17.
<Detailed Configuration of Ink Jetting Apparatus>
Next, a detailed configuration of the ink jetting apparatus 3 will be described. As depicted in
<Head Holder>
The head holder 20 has a rectangular planar shape which is long in the scanning direction. The head holder 20 is coupled to the endless belt 13 driven by the drive motor 14 (refer to
As depicted in
<Ink-Jet Head>
As depicted in
As depicted in
Since one head unit 25 has two nozzle rows 31, the ink-jet head 21 has a total of eight nozzle rows 31. The eight nozzle rows 31 and the eight cylindrical channels 27 of the head holder 20 correspond to each other, and each of the nozzle rows 31 is supplied with one of the four colors of inks, from a corresponding cylindrical channel 27. That is, one color of ink supplied to the ink jetting apparatus 3 from one ink cartridge 15 is supplied to two nozzle rows 31 of the eight nozzle rows 31, via two cylindrical channels 27. Note that regarding what color of ink is jetted by each of the eight nozzle rows 31, this is not limited to a specific combination, and may be appropriately selected. For example, the same color of ink may be jetted from the two nozzle rows of one head unit 25. Alternatively, four kinds of nozzle rows 31 respectively discharging the four colors of inks may be disposed with left-right symmetry in the scanning direction. For example, the four kinds of nozzle rows 31 may be disposed in order of black, magenta, cyan, and yellow, from a center side to both end sides in the scanning direction.
As depicted in
<Head Unit>
Next, a structure of the head unit 25 will be described in detail. As depicted in
The head main body 33 includes a first channel substrate 36, a second channel substrate 37, a nozzle plate 38, piezoelectric elements 39, a protective member 40, and so on.
The first channel substrate 36 is a silicon single crystal substrate. The first channel substrate 36 has pressure chambers 41 formed therein to respectively correspond to the nozzles 30. The pressure chambers 41 form two pressure chamber rows arranged in the scanning direction. Each of the pressure chamber rows extends in the conveyance direction. Moreover, the first channel substrate 36 includes a vibrating film 45 that covers the pressure chambers 41.
The second channel substrate 37 is a silicon single crystal substrate, and is joined to a lower surface of the first channel substrate 36. The second channel substrate 37 has formed therein two manifolds 42 that respectively communicate with the two ink channels 34 of the holder member 32. Ink supplied to the cylindrical channel 27 from the ink cartridge 15 (refer to
The two manifolds 42 each extend in the conveyance direction (a direction perpendicular to the paper surface of
The nozzle plate 38 is a plate formed by silicon, for example, and is joined to a lower surface of the second channel substrate 37. The nozzles 30 arranged in the conveyance direction are formed in the nozzle plate 38. As mentioned above, the nozzles 30 form the two nozzle rows 31. Each of the nozzles 30 communicates with a corresponding pressure chamber 41 formed in the first channel substrate 36, via the communicating hole 44 formed in the second channel substrate 37.
The piezoelectric elements 39 are disposed on an upper surface of the vibrating film 45 parallel to the ink jetting surface 25a, so as to respectively correspond to the pressure chambers 41. The piezoelectric elements 39 form two piezoelectric element rows 49 arranged in the scanning direction. Each of the piezoelectric element rows 49 extends in the conveyance direction. Each of the piezoelectric elements 39 vibrates the vibrating film 45 utilizing piezoelectric deformation when an applied voltage changes, and imparts to ink within a corresponding pressure chamber 41 a jetting energy for discharging the ink from the nozzle 30. An individual wiring 47 for applying a certain drive voltage is connected to each of the piezoelectric elements 39. Moreover, a common wiring (illustration of which is omitted) which is common to the piezoelectric elements 39 is connected to the piezoelectric elements 39. The individual wirings 47 and the common wiring are formed by gold (Au), and are led out to a region between the two piezoelectric element rows 49, from the piezoelectric elements 39. An end portion on an opposite side to the piezoelectric element 39, of each of the individual wirings 47 is provided with a drive contact 47a to which the COF 22 is connected. Moreover, an end portion on an opposite side to the piezoelectric element 39, of the common wiring is provided with a ground contact (illustration of which is omitted) to which the COF 22 is connected. The drive contacts 47a of the individual wirings 47 and the ground contact of the common wiring are disposed in a region between the two piezoelectric element rows 49, on the upper surface of the vibrating film 45. Note that the drive contacts 47a and the ground contact are also formed by gold (Au), and that the thermal expansion coefficient of gold is about 14 ppm.
Two protective members 40 respectively covering the two piezoelectric element rows 49 are disposed on the upper surface of the vibrating film 45 of the first channel substrate 36. The protective member 40 is provided for a purpose such as isolating the piezoelectric element 39 from outside air and preventing it from coming into contact with moisture.
<COF>
As depicted in
The joining portion 22e of the COF 22 is adhered by an adhesive to the vibrating film 45, between the two left and right piezoelectric element rows 49, in a state where the solder resist 22c faces the vibrating film 45. An anisotropic conductive film (ACF) made of a resin and including conductive particles is, for example, employed as the adhesive. In more detail, in the joining portion 22e of the COF 22, terminals of the wirings 29 are exposed from the solder resist 22c. The terminals exposed from the solder resist 22c, and the drive contacts 47a and the ground contact respectively led out from the piezoelectric elements 39 are electrically connected via the conductive particles included in the anisotropic conductive film. However, when adhering using an adhesive that does not include conductive particles, the terminals exposed from the solder resist 22c may respectively make direct contact with the drive contacts 47a and the ground contact, thereby being electrically connected. Note that a thermal expansion coefficient of the anisotropic conductive film is about 30-100 ppm, and a thermal expansion coefficient of the solder resist 22c is about 100-200 ppm. In the present embodiment, a length in the scanning direction of the joining portion 22e of the COF 22 is approximately 1 mm.
The driver IC 28 is mounted in the extending portion 22f of the COF 22. In the present embodiment, a distance in the up-down direction from the vibrating film 45 to a lower end of the driver IC 28 is approximately 7 mm. Moreover, a width in the scanning direction of the driver IC 28 is approximately 1 mm. The driver IC 28 supplies a drive signal to the piezoelectric elements 39 of the head unit 25, and changes a voltage applied to the piezoelectric elements 39, based on a signal inputted from the later-mentioned circuit substrate 23.
In the extending portion 22f of the COF 22, input wirings 29a (refer to
Moreover, a heat spreader 70 is adhered by an adhesive, via the opening 22d of the solder resist 22c, to the extending portion 22f of the COF 22. As a result, the heat spreader 70 directly contacts the part of each of the output wirings 29b and the part of each of the ground wirings 29c that have been exposed from the opening 22d of the solder resist 22c. The heat spreader 70 is a member that transmits to the later-mentioned heat sink 24 heat that has been generated by the driver IC 28 and has been transmitted to the output wirings 29b and ground wirings 29c. The heat spreader 70 may be formed by, for example, dicing a thin plate of an insulating material of high thermal conductivity, such as silicon, aluminum, or silicon carbide to convert into small pieces. Note that a width in the scanning direction of the heat spreader 70 is approximately 2 mm. Moreover, an adhesive composed mainly of an epoxy resin, for example, may be used as the adhesive. In this case, the adhesive functions also as an underfilling agent for moisture-proofing of each of the output wirings 29b and the ground wirings 29c.
<Circuit Substrate>
As depicted in
As depicted in
<Heat Sink>
The heat sink 24 is a member provided for dissipating, to outside, heat generated by the driver IC 28, in more detail, heat that has been generated by the driver IC 28 and has been transmitted to the output wiring lines 29b and the ground wiring lines 29c of the COF 22. In the present embodiment, the heat sink 24 is formed by a metal material of high thermal conductivity, such as aluminum.
As depicted in
As depicted in
Two of the projections 56 respectively extend downwardly from two left and right edge portions of the central wiring through-hole 57a. Moreover, the two heat spreaders 70 respectively provided to the two COFs 22 that penetrate the central wiring through-hole 57a, are supported in a state of respectively contacting the two central projections 56. In addition, one projection 56 extends downwardly from a left side edge portion of the left side wiring through-hole 57b, and the heat spreader 70 provided to the COF 22 that penetrates this left side wiring through-hole 57b, is supported in a state of contacting the projection 56. One projection 56 extends downwardly also from a right side edge portion of the right side wiring through-hole 57c, and the heat spreader 70 provided to the COF 22 that penetrates this right side wiring through-hole 57c, is supported in a state of contacting the projection 56. Note that as mentioned above, the width in the scanning direction of the heat spreader 70 is larger than the width in the scanning direction of the driver IC 28. Therefore, as depicted in
A total of six channel through-holes 58 are formed in a region between the three wiring through-holes 57a-57c, a region more to a left side than the left side wiring through-hole 57b, and a region more to a right side than the right side wiring through-hole 57c, of the main body portion 55. As depicted in
Note that the heat sink 24 having the above-described shape is formed by applying a press processing to a plate-like base material 60 made of a metal such as aluminum. The base material 60 has a substantially rectangular planar shape. Due to a bending processing by a press, one portion of the base material 60 is separated from the base material 60 except for along a bent portion 60a, and is bent at the bent portion 60a. Moreover, the previously mentioned one portion bent at the bent portion 60a of the base material 60 forms the projection 56 that extends downwardly, and a remaining portion of the base material 60 forms the main body portion 55 that extends along a horizontal plane. In addition, a hole formed in the base material 60 by the projection 56 being bent downwardly, forms the wiring through-hole 57. Moreover, the six channel through-holes 58 are formed in the base material 60 by a punching processing by a press.
When the piezoelectric elements 39 of the head unit 25 are driven by the driver IC 28, the driver IC 28 generates heat. Due to the present embodiment, heat arising in each of the driver ICs 28 is transmitted to the heat spreader 70 via the output wirings 29b and ground wirings 29c, and is further transmitted to the projection 56 and main body portion 55 of the heat sink 24. As a result, some of the heat generated by the driver IC 28 is dissipated to peripheral outside air. In other words, the heat spreader 70 directly contacts the output wirings 29b and ground wirings 29c that connect the driver IC 28 and the drive contacts 47a and ground contacts. Therefore, it can be efficiently prevented that heat generated by the driver IC 28 is transmitted as far as the drive contacts 47a and ground contacts via the output wirings 29b and ground wirings 29c.
Next, modified embodiments in which a variety of modifications are made to the previously described embodiment, will be described. However, configurations that are similar to in the previously described embodiment will be assigned with the same reference symbols as those assigned in the previously described embodiment, and descriptions thereof will be appropriately omitted.
In the above-described embodiment, the projection 56 of the heat sink 24 contacted only the heat spreader 70, and did not contact the driver IC 28. However, the present teaching is not limited to this. For example, as depicted in
Due to the above-described first modified embodiment, the second projection 156b directly contacts the driver IC 28, so heat generated by the driver IC 28 can be dissipated more efficiently. Moreover, the through-hole 156c which is U-shaped in planar view extends from the projection 156 to the main body portion 55. Therefore, heat that has been transmitted to the second projection 156b from the driver IC 28 is transmitted to the main body portion 55 before being transmitted to the first projection 156a. In other words, heat generated by the driver IC 28 is hardly transmitted to the first projection 156a.
In the above-described embodiment, the projection 56 of the heat sink 24 contacted only the heat spreader 70, and did not contact the driver IC 28. However, the present teaching is not limited to this. For example, as depicted in
Due to the above-described second modified embodiment, the driver IC 28 and the heat spreader 70 are respectively contacted by the dedicated first heat sink 124 and second heat sink 224, so not only can heat transmitted to the output wirings 29b and ground wirings 29c be efficiently dissipated, but also heat generated by the driver IC 28 can be efficiently dissipated.
In the above-described embodiment, the heat spreader 70 was employed as a member for transmitting to the heat sink 24 heat transmitted to the output wirings 29b and ground wirings 29c of the COF 22. However, the present teaching is not limited to this. For example, as depicted in
In the above-described third modified embodiment, the heat sink 324 contacted a part of each of the output wirings 29b and a part of each of the ground wirings 29c. However, the present teaching is not limited to this. For example, as depicted in
The above-described fourth modified embodiment also enables heat transmitted to the ground wirings 29c to be efficiently dissipated.
The heat sink 324 of the above-described third modified embodiment and the heat sink 424 of the above-described fourth modified embodiment were installed below the driver IC 28. However, the present teaching is not limited to this. For example, as depicted in
The above-described fifth modified embodiment also enables heat transmitted to the output wirings 29b and ground wirings 29c to be efficiently dissipated.
A COF 22 is merely one example of the wiring member of the present teaching, and the wiring member of the present teaching may include a flexible base material and wirings formed in the base material, as in a flexible wiring substrate (FPC), for example. Further, the ink jetting apparatus 3 may include a heater configured to heat the ink to be supplied to the head units 25.
In the embodiment described above, the present teaching was applied to the ink-jet head which jets ink onto a recording sheet to print an image or the like. However, the present teaching may be applied also to a liquid jetting apparatus used in a variety of applications besides printing of an image or the like. For example, it is possible to apply the present teaching also to a liquid jetting apparatus which jets conductive liquid onto a substrate to form a conductive pattern on a substrate surface.
Number | Date | Country | Kind |
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2018-056800 | Mar 2018 | JP | national |