Claims
- 1. A thermal cooling system comprising:
- a component to be cooled;
- a cooling system; and a liquid metal matrix thermal paste comprising a dispersion of thermally conductive particles disposed in a liquid metal matrix selected from the group consisting of liquid gallium and its alloys, said particles being non-reactive with said liquid metal matrix at a temperature below approximately 100.degree. C., whereby the fraction and dispersion of the particles in the liquid metal matrix are such that the resulting paste has a predetermined thermal conductivity and permanently remains compliant, said paste being dispersed between said component and said cooling system.
- 2. A thermal cooling system as set forth in claim 1, wherein said cooling system comprises a piston and chip cooling system, and said paste is disposed between the piston and the component.
- 3. A thermal cooling system as set forth in claim 1, where said cooling system comprises a piston, cylinder and chip cooling system, and said paste is disposed between the piston and the cylinder.
- 4. A method of preparing a liquid metal thermal paste comprising the steps of:
- providing a liquid metal matrix selected from the group consisting of liquid gallium and its alloys; and
- dispersing thermally conductive particles into said liquid metal, said particles being non-reactive with said liquid metal matrix at a temperature below approximately 100.degree. C., whereby the fraction and dispersion of the particles in the liquid metal matrix are such to form a mixture having a predetermined thermal conductivity and permanently remaining compliant.
- 5. Method of preparing a liquid metal matrix thermal paste as set forth in claim 4, wherein said dispersing is by mixing and subsequent exposure to a roll mill.
Parent Case Info
This application is a division of application Ser. No. 07/389,131 filed Aug. 3, 1989.
US Referenced Citations (4)
Divisions (1)
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Number |
Date |
Country |
Parent |
389131 |
Aug 1989 |
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