In general, embodiments of the invention disclosed herein relate to cooling systems.
In conventional cooling systems, a refrigerant circulates throughout the system. A cold mixture of liquid and gaseous refrigerant passes through an evaporator (i.e., a heat-exchanger), where the refrigerant absorbs heat from a device or region that is to be cooled as the liquid portion of the refrigerant vaporizes. The vapor-phase refrigerant is then compressed to a higher pressure, which raises its temperature, and is subsequently condensed back to the liquid phase by cooling it with air or water flowing across the refrigerant conduit, which removes from the system heat that has been removed from the device or region that has been cooled. The liquid-phase refrigerant then passes through an expansion valve, which allows part of the refrigerant to flash-evaporate, thereby lowering its temperature before it passes back to the evaporator to continue the cycle.
Although this cooling cycle is well-established technology, it has certain limitations. For instance, in applications where significant amounts of cooling capacity are required, the cooling cycle may not provide sufficient cooling without a great deal of bulky equipment and/or without requiring large amounts of electrical power—and hence money—to run the system.
A liquid nitrogen-based cooling system features a cooling circuit and a liquid nitrogen-based heat sink. Heat absorbed by a heat-absorbing medium circulating in the cooling circuit is subsequently absorbed by liquid nitrogen within the heat sink, which causes the liquid nitrogen to vaporize. The vaporized nitrogen is condensed back to liquid form, e.g., by means of a helium-based cryo-refrigeration system. The heat-sink includes at least a first vessel that contains the liquid nitrogen, with the cooling circuit including a series of coils passing around the first vessel in heat-exchanging contact with an exterior surface thereof so that heat can be transferred into the liquid nitrogen. The first vessel and the coils may be contained within a second, outer vessel that minimizes heat transfer from the ambient environment to the heat-absorbing medium flowing in the cooling circuit and the liquid nitrogen within the first vessel.
In a first aspect, the invention features a liquid nitrogen-based cooling system. The cooling system includes a heat sink containing a first heat-absorbing medium, i.e., a supply of liquid nitrogen, and a cooling circuit through which circulates a second heat-absorbing medium. The cooling circuit is arranged to absorb heat from a device or region to be cooled and is in heat-exchanging relationship with the heat sink. A refrigeration subsystem is arranged relative to the heat sink to condense vaporized nitrogen back into liquid nitrogen and return the condensed liquid nitrogen to the supply of liquid nitrogen. Suitably, the heat sink includes a first vessel containing the liquid nitrogen and a plurality of coils arranged in heat-transferring relationship with the liquid nitrogen, which coils form a portion of the cooling circuit through which the second heat-absorbing medium circulates.
In specific embodiments of the cooling system, the plurality of coils may pass around an exterior surface of the first vessel. Additionally, the first vessel and the coils may be disposed within a second, outer vessel, with at least a partial vacuum formed between the first and second vessels and at least a portion of the coils being disposed within the vacuum to inhibit unwanted heat transfer. The second heat-absorbing medium that circulates within the cooling system may include propylene glycol, with one or more anticorrosive agents.
In another aspect, the invention features a method for cooling a device or region of space requiring cooling. The method includes circulating a heat-absorbing medium within a cooling circuit and causing or allowing heat to be transferred to the heat-absorbing medium that is circulating within the cooling circuit. That heat is transported, via the heat-absorbing medium, to a heat sink containing a supply of liquid nitrogen, where the heat is subsequently transferred to the liquid nitrogen contained within the heat sink. This causes at least a portion of the liquid nitrogen to vaporize. Heat is then removed from the vaporized liquid nitrogen (and the overall system) to thereby cause the vaporized liquid nitrogen to condense back to liquid form, and the re-condensed liquid nitrogen is returned to the supply of liquid nitrogen contained within the heat sink.
We have found that cooling with systems and methods in accordance with the invention offers significant increases in efficiency and cost savings.
These and other features of the invention will become clearer in view of the description below and the accompanying figures, in which:
An embodiment of a cooling system 10 in accordance with the invention is illustrated in the figures. As illustrated in
Further details of the liquid nitrogen-based heat sink 14 are illustrated in
As further illustrated in
As the liquid nitrogen absorbs heat, it vaporizes into the headspace within the vessel 26. As noted above, the nitrogen vapor is cooled by the cold head 18 of helium-based cryo-refrigeration system 20—the cold head 18 extends into the interior of the first vessel 26—and condenses back into liquid form, which drips back into the supply of liquid nitrogen.
Furthermore, the first vessel 26 and surrounding coils 28 are suitably contained within a second, outer vessel 30. Like the first vessel 26, the second vessel 30 also suitably has a double-wall construction, with the space between the inner and outer walls of the second vessel 30 being filled with an insulating material such as an aerogel. Additionally, at least a partial vacuum is suitably drawn in the space 32 between the first and second vessels 26, 30, i.e., the space in which the coils 28 are located. The combination of (partial) vacuum between the walls of the first and second vessels 26, 30 and insulating material such as aerogel between the inner and outer walls of the second, outer vessel 30 significantly limits—perhaps even eliminating—heat transfer into the propylene glycol in the coils 26 from the ambient atmosphere.
Based on models we have conducted, it costs significantly less to cool a large-scale system using a cooling system as described above than it costs to cool the same system using a conventional cooling system. For example, according to our calculations, a large-scale server system with 350,000 watts of computing power requires 1.2 million BTU of cooling capability. Current technology like that described in the background section above requires 352,000 watts to run a suitably sized cooling system at a cost (based on local energy rates) of almost $22,000 per month, whereas a system as per the invention only requires 2,500 watts (to drive the circulation pump 18 and the cryo-refrigeration unit 20) to run a suitably sized system at a cost on the order of $155 per month. Such savings are deemed to be highly significant.
This application is based on and claims the priority benefit of U.S. provisional application No. 62/620,664 filed Jan. 23, 2018, the contents of which are incorporated herein by reference.
Number | Date | Country | |
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62620664 | Jan 2018 | US |