1. Field of the Invention
The present invention relates to a liquid supply member that supplies liquid to a liquid discharge port that discharges liquid, a method of making a liquid supply member, and a method of making a liquid discharge head.
2. Description of the Related Art
A typical example of a liquid discharge head is an inkjet recording head. An inkjet recording head includes a recording element unit that discharges ink and a tank holder unit that holds an ink tank. The tank holder unit includes a tank holder and a supply path plate.
Ink is guided from an ink tank through a supply path formed in the tank holder unit to the recording element unit and supplied to a discharge port that discharges the ink.
A supply path H1601 is formed by joining the supply path plate H1600 to the tank holder H1500 so that surfaces H1602 having the opening portions face each other. A member having the supply path H1601 is a liquid supply member. The supply path H1601 includes a supply path H1601x through which liquid flows in a direction that intersects the surfaces H1602 having the opening portions and a supply path H1601y through which ink flows in a direction parallel to the surfaces H1602 (
Japanese Patent Laid-Open No. 2005-096422 describes a laser welding method that can be used for joining the tank holder H1500 to the supply path plate H1600.
In general, the term “laser welding” refers to a method of joining a member that is transparent to a laser beam and a member that is capable of absorbing a laser beam together by making these members contact each other at a portion to be welded and irradiating the portion to be welded with a laser beam. As compared with ultrasonic welding, laser welding has an advantage in that foreign matter is negligibly generated at the welded portion, and laser welding is used as an effective way of forming a supply path.
Referring to
Because the contact portion 600 is disposed so as to form a part of the supply path H1601, after the laser welding, a melted portion W of the contact portion 600 protrudes to the supply path H1601 (
The present invention provides a method of making a liquid supply member with which impedance of ink flow is reduced.
According to an aspect of the present invention, a method of making a liquid supply member, the liquid supply member including a supply path through which liquid is supplied to a discharge port that discharges liquid, includes a preparation step of preparing a transparent member and an absorption member, the transparent member including a first surface in which a first opening portion is formed and being transparent to a laser beam, and the absorption member including a second surface in which a second opening portion is formed and being capable of absorbing a laser beam; a contact step of making the transparent member and the absorption member contact each other at a contact portion in such a manner that the first opening portion and the second opening portion overlap each other with respect to an intersecting direction that intersects the first surface and the second surface that are disposed so as to face each other; and a welding step of forming a first supply path by welding the transparent member and the absorption member to each other by irradiating the contact portion with the laser beam through the transparent member, the first supply path including the first opening portion and the second opening and being a path through which the liquid flows in the intersecting direction, wherein, after the contact step and before the welding step, a space is formed between the contact portion and the first supply path and between the first surface and the second surface.
According to another aspect of the present invention, a liquid supply member is made by making a plurality of members contact each other and welding the members together using a laser beam so that a space is formed between the surfaces of the members and in a supply path through which ink flows in a direction that intersects the surfaces. As a result, a melted portion, which is melted by a laser beam, flows into the space, so that protrusion of the melted portion toward the inside of the supply path is eliminated or the amount of protrusion of the melted portion is decreased. Thus, impedance of ink flow can be reduced.
Further features of the present invention will become apparent from the following description of exemplary embodiments with reference to the attached drawings.
A liquid discharge head according to an embodiment will be described using an example of a general inkjet recording head.
As illustrated in
The recording element unit 300 includes an electronic wiring substrate 340 and a recording element substrate H1101.
The recording element substrate H1101 includes discharge ports H1107 for discharging ink and ink supply ports H1102 that communicate with the discharge ports and supply ink to the discharge ports. The discharge ports are formed in a discharge port forming member H1106, and the ink supply ports are formed in a silicon substrate H1110.
The silicon substrate H1110 has a thickness in the range from 0.5 to 1.0 mm. The ink supply ports H1102 are formed in the silicon substrate H1110 by anisotropic etching. Moreover, heat generating resistive elements H1103 are formed on the silicon substrate H1110. The discharge ports H1107 are formed in the silicon substrate H1110 by photolithography in such a manner that the discharge ports H1107 correspond to the heat generating resistive elements H1103. Furthermore, bumps H1105 made of gold or the like are disposed on the silicon substrate H1110. The bumps H1105 serve as electrode portions for supplying electric signals and electric power for driving the heat generating resistive elements H1103.
Referring to
The tank holder unit 200 includes a tank holder 210 and a transparent member 220. The tank holder 210 holds an ink tank (not shown), which is a liquid container, and includes an absorption member 221 that is capable of absorbing a laser beam. The transparent member 220 is a plate-shaped member that is transparent to a laser beam. By joining the transparent member 220 to the tank holder 210, a liquid supply member having a supply path for supplying ink to the ink supply port H1102 is formed.
In the embodiment of the invention, the absorption member 221 is integrally formed with the tank holder 210. However, the absorption member 221 and the tank holder 210 may be independently formed, and subsequently the absorption member 221 may be attached to the tank holder 210.
In the embodiment of the present invention, in order that a laser beam can be easily irradiated, a plate-shaped member is used as the transparent member 220 that is transparent to a laser beam, and a member that is integrally formed with the tank holder 210 is used as the absorption member 221. However, which of the members is provided with transparency or absorption can be appropriately changed.
In the present invention, the term “a transparent member that is transparent to a laser beam” refers to a member having a transmittance equal to or greater than 30% when the member having a thickness of 2.0 mm is irradiated with a laser beam. The term “an absorption member that is capable of absorbing a laser beam” refers to a member having an absorptance equal to or greater than 90% when the member having a thickness of 2.0 mm is irradiated with a laser beam. By using the members having such transmittance and absorptance, the transparent member and the absorption member can be welded by laser welding.
In the embodiment, transparent Noryl “TPN9221” (made by SABIC Innovative Plastics that was formerly GE Plastics) is used as a material of the transparent member. Transparent Noryl is a transparent material that allows a laser beam to pass therethrough and is highly resistant to corrosion caused by ink. Alternatively, transparent Noryl “TN300” (made by SABIC Innovative Plastics), which does not include a coloring material, can be used as a material of the transparent member.
The term “Noryl” is a trade name for modified polyphenylene ether or modified polyphenylene oxide. Noryl is a thermoplastic resin made by modifying polyphenylene ether (polyphenylene oxide) so as to increase heat resistance and strength. Noryl also has a strong resistance to acids and alkalis.
As a material of the absorption member, black Noryl “SE1X” (made by SABIC Innovative Plastics), which includes dye or pigment that absorbs a laser beam, is used.
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
Referring to
Referring to
Hereinafter, a surface of the transparent member 220 that contacts the absorption member 221 will be referred to as a first surface 220a, and a surface of the absorption member 221 that contacts the transparent member 220 will be referred to as a second surface 221a. A first opening portion 220b and a second opening portion 221b, which are included in the supply path 224, are formed in the first surface 220a and the second surface 221a, respectively.
In order to form the supply path, the transparent member 220 and the absorption member 221 are made to contact each other so that the first opening portion 220b and the second opening portion 221b overlap each other with respect to a direction that intersects the first surface 220a and the second surface 221b, and the transparent member 220 and the absorption member 221 are welded to each other by laser welding. The supply path 224 is formed in an area in which the first opening portion 220b and the second opening portion 221b overlap each other. The supply path 224 includes a first supply path 224x and a third supply path 224y (
Thus, in the present invention, the term “first supply path” refers to a supply path that includes opening portions respectively formed in surfaces of a plurality of members that face each other and through which ink flows in a direction that intersects the surfaces. In the present invention, the term “third supply path” refers to a supply path through which ink flows in a direction that is parallel to the surfaces that face each other.
Next, a contact portion will be described. The contact portion is a portion at which the transparent member 220 and the absorption member 221 contact each other and at which the transparent member 220 and the absorption member 221 are melted and welded together by being irradiated with a laser beam.
The transparent member 220 and the absorption member 221 contact each other at a contact portion 223 in the periphery of the supply path 224 that is irradiated with a laser beam. The transparent member 220 and the absorption member 221 does not contact each other in a non-contact portion that is not irradiated with the laser beam.
By providing the contact portion and the non-contact portion, when the transparent member 220 is made to contact the absorption member 221, pressure is concentrated on the contact portion 223 so that contact at the contact portion becomes closer.
As illustrated in
In the first embodiment, the contact portion 223 protrudes from the first surface 220a of the transparent member 220.
Next, a contact portion 223x, which characterizes the present invention, will be described. The contact portion 223x is a part of the contact portion 223 that is in the periphery of the first supply path 224x. As illustrated in
As illustrated in
Referring to
By disposing the contact portion 223x so as to form the space S as described above, the protrusion of the melted portion W toward the inside of the first supply path 224x is eliminated or the amount of protrusion of the melted portion W is decreased. Thus, reduction in the cross-sectional area of the supply path can be eliminated or decreased, whereby the impedance of ink flow can be suppressed.
The space S may not be completely filled with the melted portion after the welding and a part of the space S may remain. Alternatively, the space S may be filled with the melted portion, and the melted portion may protrude toward the first supply path 224x. However, if the space S is not completely filled with the melted portion and a part of the space S remains or if the space S is exactly filled with the melted portion and the melted portion does not protrude to the supply path, the impedance of ink flow due to the protrusion of the melted portion can be reduced.
The height h (
In an example of the present embodiment, the height of the contact portion 223x relative to the first surface 220b is 0.1 mm before welding and contraction of the transparent member 220 in a direction toward the absorption member 221 due to melting of the contact portion is 0.02 mm. Therefore, after the welding, the height h of the gap between the transparent member 220 and the absorption member 221 is 0.08 mm.
In the example of the present embodiment, the cross-sectional area of the first supply path 224x is 2.0 mm2, the width of the contact portion is 1.0 mm, the distance d between the first supply path 224x and the contact portion 223x (
In general, examples of laser irradiation methods include a scanning method and a simultaneous irradiation method. With the scanning method, the laser irradiation apparatus 51 focuses a laser beam to a small spot and irradiates a contact portion with the laser beam along a path in the contact portion in a scanning manner. With the simultaneous irradiation method, a plurality of light sources that are arranged along the supply path 224 irradiate the contact portion with laser beams in one go (
Next, a contact portion 223y will be described. The contact portion 223y in the periphery of the third supply path 224y (
For these reasons, when the contact portion 223y is configured so as to form the space S when the transparent member 220 and the absorption member 221 are made to contact each other, the contact portion 223y can be disposed at a position such that the space S is filled after welding. Alternatively, the contact portion 223y in the periphery of the third supply path 224y can be disposed so that the contact portion 223y forms a part of the third supply path 224y without forming the space S (
Moreover, in order to dispose the third supply path 224y with a high density while providing an enough welding area that enables a secure welding, the contact portion 223y can be disposed so that the contact portion 223y forms a part of the third supply path 224y without forming the space S (
Regarding the third supply path 224y, if the melted portion, which is generated when the contact portion is melted, protrudes to the supply path, the shape of the melted portion extends in the direction of ink flow. Therefore, the protrusion of the melted portion to the supply path does not substantially affect the ink flow.
Moreover, as described above, the contact portion 223x in the periphery of the first supply path is provided along the periphery of the first supply path, while the contact portion 223y in the periphery of the third supply path is provided so as to extend in the direction of the ink flow. Therefore, the decrease in the cross-sectional area of the third supply path 224y due to the protrusion of the melted portion after welding is smaller than that of the first supply path 224x.
For these reasons, in terms of the ink flow, the contact portion 223y may be configured so that the contact portion 223y in the periphery of the third supply path forms a part of the supply path (
In terms of the design, it is difficult to provide the contact portion 223y so that the space S is formed when the transparent member 220 and the absorption member 221 are made to contact each other and so that the space S is completely filled with a portion that has been melted and cured after welding. Thus, also in terms of the design, the contact portion can be configured as illustrated in
As described above, in the present embodiment, in the periphery of the first supply path 224x, a non-contact portion is provided between the contact portion and the supply path, and, in the periphery of the third supply path 224y, a non-contact portion is not provided between the contact portion and the third supply path 224y and the contact portion forms a part of the contact portion. In the example of the present embodiment, the third supply path 224y has a width of 1.2 mm, and the contact portion 223y has a width of 1.0 mm.
Referring to
Referring to
Thus, in the present invention, the term “second supply path” refers to a supply path including a part of one of surfaces of a plurality of members that face each other, the part not having an opening portion formed therein, and an opening portion formed in the other of the surfaces and being a path through which ink flows in a direction that intersects the surfaces that face each other.
As with the contact portion 223x disposed in the periphery of the first supply path 224x, the contact portion 223z disposed in the periphery of the second supply path 224z is disposed along the periphery of the second supply path 224z. Therefore, as compared with the third supply path 224y through which ink flows in a direction parallel to the first surface 220a and the second surface 221b, reduction in the cross-sectional area of the supply path after welding is large, so that the ink flow may be impeded. By configuring the contact portion 223z so that the space S is formed (
It is not necessary that the space S be completely filled with the melted portion after welding, and a part of the space S may remain. Alternatively, the space S may be filled with the melted portion, and the melted portion may protrude toward the inside of the second supply path 224z. If the space S is not completely filled with the melted portion and a part of the space S remains, or if the space S is exactly filled with the melted portion and the melted portion does not protrude to the supply path, reduction in the cross-sectional area due to protrusion of the melted portion can be efficiently suppressed.
In the modification illustrated in
In the modifications described above, the contact portion 223 (contact portions 223x, 223y, and 223z) are formed only on the first surface 220a. However, the contact portion 223 may be formed on the second surface 221b. (
Referring to
As with the first embodiment, the contact portion 223x is formed on the first surface 220a so that the space S is formed between the first supply path 224x and the contact portion 223x and between the first surface 220a and the second surface 221a. Thus, protrusion of the melted portion W to the first supply path 224x is eliminated or the amount of the protrusion is reduced, so that the impedance of the ink flow can be reduced.
In the present embodiment, in order to increase the ink flow, the first supply path 224x has a tapered shape such that the cross-sectional area taken along a plane that is perpendicular to the direction of ink flow increases in the direction of the ink flow. A tapered portion 220d is formed in a surface (back surface) of the transparent member 220 opposite to the first surface 220a. In the tapered portion 220d, the cross-sectional area of the first supply path 224x increases in a direction toward the outlet (fourth opening portion 220c) of the supply path that communicates with the first opening portion 220b.
When the contact portion 223x is irradiated with a laser beam through the tapered portion 220d, there is a problem in that wielding is not efficiently performed because the angle of incidence of the laser beam with respect to the transparent member 220 is large and reflection or refraction of the laser beam occurs at the incidence surface. Therefore, the surface of the transparent member 220 on which the laser beam is incident can be substantially perpendicular to the laser beam.
In the present embodiment, the tapered portion 220d is disposed so as to overlap the space S and not to overlap the contact portion 223x with respect to the direction in which the laser beam is incident (
For the second supply path 224z of the embodiment illustrated in
Referring to
As with the first and second embodiments, the contact portion 223x is formed on the first surface 220a so that the space S is formed between the first supply path 224x and the contact portion 223x and between the first surface 220a and the second surface 221a. Thus, protrusion of the melted portion W to the first supply path 224x is eliminated of the amount of the protrusion is reduced, so that the impedance of the ink flow can be reduced.
In the present embodiment, a protruding portion 225 is disposed between the first supply path 224x and the contact portion 223x (
Even if the melted portion protrudes to the first supply path 224x, the protruding portion 225 contacts the absorption member 221 after welding, so that flow of the melted portion to the supply path is suppressed. Therefore, even if the melted portion protrudes to the first supply path 224x, the amount of the protrusion can be further reduced. The protruding portion 225 may be disposed on the absorption member 221.
In the second supply path 224z of the modification illustrated in
While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
This application claims the benefit of Japanese Patent Application No. 2009-234020 filed Oct. 8, 2009, which is hereby incorporated by reference herein in its entirety.
Number | Date | Country | Kind |
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2009-234020 | Oct 2009 | JP | national |
Number | Name | Date | Kind |
---|---|---|---|
4313124 | Hara | Jan 1982 | A |
4345262 | Shirato et al. | Aug 1982 | A |
4459600 | Sato et al. | Jul 1984 | A |
4463359 | Ayata et al. | Jul 1984 | A |
4509063 | Sugitani et al. | Apr 1985 | A |
4521787 | Yokota et al. | Jun 1985 | A |
4558333 | Sugitani et al. | Dec 1985 | A |
4608577 | Hori | Aug 1986 | A |
4609427 | Inamoto et al. | Sep 1986 | A |
4636609 | Nakamata | Jan 1987 | A |
4666823 | Yokota et al. | May 1987 | A |
4698645 | Inamoto | Oct 1987 | A |
4723129 | Endo et al. | Feb 1988 | A |
4740796 | Endo et al. | Apr 1988 | A |
5126768 | Nozawa et al. | Jun 1992 | A |
5478606 | Ohkuma et al. | Dec 1995 | A |
5578418 | Noguchi et al. | Nov 1996 | A |
5808641 | Miyagawa et al. | Sep 1998 | A |
6176012 | Ishimatsu | Jan 2001 | B1 |
6361140 | Ishimatsu et al. | Mar 2002 | B1 |
6421623 | Furukawa et al. | Jul 2002 | B1 |
6423934 | Hasegawa et al. | Jul 2002 | B2 |
6527377 | Ikegame et al. | Mar 2003 | B1 |
6604266 | Tajima et al. | Aug 2003 | B1 |
6659588 | Ikegame et al. | Dec 2003 | B2 |
6668454 | Hasegawa et al. | Dec 2003 | B2 |
6719405 | Powers | Apr 2004 | B1 |
6799831 | Inamoto et al. | Oct 2004 | B2 |
6974207 | Drummond et al. | Dec 2005 | B2 |
6980296 | Kwan et al. | Dec 2005 | B2 |
7245378 | Kwan et al. | Jul 2007 | B2 |
7274856 | Drummond | Sep 2007 | B2 |
7282665 | Chen et al. | Oct 2007 | B2 |
7571541 | Silverbrook et al. | Aug 2009 | B2 |
7971358 | Morita | Jul 2011 | B2 |
8087168 | Silverbrook et al. | Jan 2012 | B2 |
8210647 | Shimazu et al. | Jul 2012 | B2 |
8251496 | Hattori et al. | Aug 2012 | B2 |
20070195137 | Morita | Aug 2007 | A1 |
Number | Date | Country |
---|---|---|
08-183182 | Jul 1996 | JP |
2005-096422 | Apr 2005 | JP |
2005-271315 | Oct 2005 | JP |
2006-341557 | Dec 2006 | JP |
Number | Date | Country | |
---|---|---|---|
20110083758 A1 | Apr 2011 | US |