1. Field of the Invention
Embodiments of the invention relates to load driving circuits, and particularly to a load driving circuits having a function of detecting a load short circuit.
2. Related Art
In a load driving circuit with a so-called high-side configuration having a switching device provided between the positive electrode of a power supply and a load, when the load driving circuit particularly drives an inductive load such as a linear solenoid, an output current is controlled by duty factor control. In output current control performed by the duty factor control, when an object driven by a linear solenoid (a transmission of a vehicle, for example) is excessively loaded to cause a resulting switching operation of the linear solenoid to be carried out with a current up to a large current region, a short circuit failure sometimes occurs in the linear solenoid as the inductive load.
As circuits against such a short circuit, some load driving circuits are known each of which is operated so as to reduce the current flowing a switching element when such a short circuit occurs in a load (see Japanese Patent Application Publication Nos. JP-A-2005-27380 (also referred to herein as “JP-A-2005-27380”) (paragraphs [0060] to [0066] and
In the load driving circuit described in JP-A-2005-27380 (paragraphs [0060] to [0066] and
For further lowering the peak value of the limited current at the occurrence of an actual load short circuit, it is necessary to further lower the impedance in the portion of the circuit for clamping the gate-source voltage of the switching device to further reduce the gate-source voltage. However, there was also such a problem that excessive reduction of the impedance in the portion of the circuit for clamping further inhibits the rising of an output voltage at the normal switching operation to cause problems such as waveform distortion and an increase in turning-on time.
Furthermore, the use of a comparator for comparing the source voltage (output voltage) of the switching element with a reference voltage caused a problem such that the large scale circuit of the comparator expands a chip size to result in an increase in cost.
In addition, in the load driving circuit described in JP-A-2005-312099 (paragraphs [0088] to [0092] and
Embodiments of the invention address these and other problems. Embodiments of the invention provide a load driving circuit which can detect the rising of the output voltage at the turning-on in a normal switching operation with little delay and is prevented from such a malfunction as to incorrectly detect a state with a delay in the detection of the rising of the output voltage in a normal switching operation as a load short circuit state and shift the operation mode into an oscillation mode with which an abnormal state can be detected.
In some embodiments, a load driving circuit is provided which drives a load with a switching device, provided between a power supply terminal connected to the positive electrode of a power supply and an output terminal connected to the load, made to carry out a switching operation. The load driving circuit is provided with a clamping circuit which can carry out a clamping operation of limiting an output current of the switching device and a short circuit detection circuit which is provided between the output terminal and the clamping circuit, detects a drop in the voltage at the output terminal occurring when the load is short-circuited and outputs a control signal to the clamping circuit which signal is a signal for making the clamping circuit carry out the clamping operation of limiting the output current of the switching device. Here, the short circuit detection circuit is characterized by providing a capacitor between the input side thereof and the output side thereof.
This enables the short circuit detection circuit to immediately transmit the rising of the voltage at the output terminal of the load driving circuit to the output side thereof through the capacitor. Thus, the control signal for releasing the clamping operation can be outputted to the clamping circuit with immediate rising to enable an immediate clamp releasing operation. Therefore, in a normal switching operation, the load driving circuit can be prevented from such a malfunction as to incorrectly detect a state with a delay in the detection of the rising of the output voltage in a normal switching operation as a load short circuit state and shift the operation mode into an oscillation mode informing an abnormal state.
In some embodiments, the load driving circuit with the configuration explained in the foregoing can detect the rising of the output voltage at the turning-on in a normal switching operation with little delay while keeping the current limiting function at a load short circuit. Thus, in some embodiments, the load driving circuit has the advantage of being prevented from such a malfunction as to incorrectly detect a state with a delay in the detection of the rising of the output voltage as a load short circuit state and shift the operation mode into an abnormality processing mode such as an oscillation mode informing an abnormal state.
In the following, an embodiment of the invention will be explained in detail with reference to attached drawings.
The load driving circuit 1 has a VCC terminal 3 as a power supply terminal supplying a power supply voltage VCC, a GND terminal 4 as a grounding terminal, and an OUT terminal 9 as an output terminal. To the VCC terminal 3, the positive electrode of a power supply (battery) 5 is connected and to the OUT terminal 9, one end of a load 7 is connected. All of the negative electrode of the power supply 5, the other end of the load 7 and the GND terminal 4 are grounded.
In the load driving circuit 1, between the VCC terminal 3 and the OUT terminal 9, a switching device Q1 of an n-channel MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) is provided. A diode D1 connected in inverse-parallel to the switching device Q1 between the drain terminal and the source terminal thereof is a parasitic diode. In this way, the load driving circuit 1 according to the embodiment is an intelligent power switch of a so-called high-side configuration with the switching device Q1 provided between the positive electrode of the power supply 5 and the load 7. Moreover, between the VCC terminal 3 and the GND terminal 4, a switching device Q2 of an n-channel MOSFET and a constant current device 11 are connected in series. Between the drain terminal and the gate terminal of the switching device Q1 and between the drain terminal and the gate terminal of the switching device Q2, two diodes D2 and D3 connected in inverse-series to each other are provided for protecting the gates of the switching devices Q1 and Q2.
The load driving circuit 1 has an overheating detection circuit 13 detecting the overheating of the switching device Q1. The overheating detection circuit 13 is formed so as to transmit the result of detection to an input and output control logical circuit 17. The overheating detection circuit 13 can be provided as a diode, which is formed so as to detect an overheating state by making use of the temperature dependence in the forward voltage of the diode.
The load driving circuit 1 has a short circuit detection circuit 14 detecting the short circuit of the load 7. The input side of the short circuit detection circuit 14 is connected to the OUT terminal 9 and the output side thereof is connected to the input and output control logical circuit 17 and a level shift driver 19. The short circuit detection circuit 14 is a circuit that detects a drop in the voltage VOUT at the OUT terminal 9 occurring at a short circuit in the load 7 and transmits the detected result to the input and output control logical circuit 17 and the level shift driver 19. The details of the configuration and the working of the short circuit detection circuit 14 will be explained later.
The load driving circuit 1 has a low voltage detection circuit 16. The low voltage detection circuit 16, with the input side thereof connected to the VCC terminal 3 and the output side thereof connected to the input and output control logical circuit 17, has a function of detecting that the power supply voltage VCC supplied from the power supply 5 is lowered and transmitting the detected result to the input and output control logical circuit 17.
The level shift driver 19 has the input side thereof connected to the input and output control logical circuit 17 and has the output side thereof connected to the gate terminals of the switching devices Q1 and Q2. To the input and output control logical circuit 17, an on-off signal for an on- and off-driving of the switching devices Q1 and Q2 is inputted from the outside (in the embodiment, a microcomputer 26) through an IN terminal 22 as an input terminal. In response to the on-off signal, the input and output control logical circuit 17 outputs an on-off signal ONBH to the level shift driver 19. The level shift driver 19 carries out the level shift of the on-off signal ONBH and outputs a level-shifted on-off signal (an output signal GS) to the gate terminals of the switching devices Q1 and Q2.
The load driving circuit 1 has an overcurrent detection circuit 23. The input side of the overcurrent detection circuit 23 is connected to the OUT terminal 9 to which the source terminal of the switching device Q1 is connected and to the connection point of the source terminal of the switching device Q2 and the constant current device 11. The output side of the overcurrent detection circuit 23 is connected to the input and output control logical circuit 17. The overcurrent detection circuit 23 contains a comparator comparing the voltage of the OUT terminal 9 and the voltage at the connection point of the switching device Q2 and the constant current device 11 to carry out comparison of the source voltages of the switching devices Q1 and Q2 when both of them are turned-on. The comparator, with the gate voltages of the switching devices Q1 and Q2 being common thereto, indirectly compares currents flowing in the switching devices Q1 and Q2 by comparing the respective gate-source voltages of both. The comparator, when the source voltage of the switching device Q1 (the voltage VOUT at the OUT terminal 9) is lower than the source voltage of the switching device Q2, that is, when the gate-source voltage of the switching device Q1 is higher than the gate-source voltage of the switching device Q2, makes a decision that an overcurrent flows in the switching device Q1. The result of the decision of the comparator is transmitted to the input and output control logical circuit 17.
The load driving circuit 1 has a load disconnection detection circuit 28 and a constant current device 27. The load disconnection detection circuit 28 has the input side thereof connected to the OUT terminal 9 and has the output side thereof connected to the input and output control logical circuit 17. The constant current device 27 is connected between the VCC terminal 3 and the OUT terminal 9. The load disconnection detection circuit 28 detects a state of load disconnection by detecting a voltage (the voltage VOUT at the OUT terminal 9) produced by a current flowing in the load disconnection detection circuit 28 through the constant current device 27 during the turning-off period of the switching operation. Namely, the load disconnection detection circuit 28 makes a decision that the load 7 is in a disconnected state when the voltage VOUT at the OUT terminal 9 becomes high with the load 7 being electrically disconnected due to a broken wire or with the resistance of the section between the OUT terminal 9 and the load 7 becoming high rather than becoming infinite. The result of the decision by the load disconnection detection circuit 28 is transmitted to the input and output control logical circuit 17.
The load driving circuit 1 has an ST terminal 24 as a status output terminal. Between the ST terminal 24 and the input and output control logical circuit 17, a switching device Q3 of an n-channel MOSFET is provided. The gate terminal of the switching device Q3 is connected to the input and output control logical circuit 17 at a terminal outputting a status decision signal. The drain terminal of the switching device Q3 is connected to the ST terminal 24 and the source terminal thereof is grounded. A diode D8 connected to the drain terminal and the source terminal of the switching device Q3 in inverse parallel thereto is a parasitic diode. In addition, a diode D9, connected between the IN terminal 22 and the GND terminal 4, is provided for protecting the input and output control logical circuit 17 and a diode D10 is provided for protecting the switching device Q3. To the IN terminal 22 and the ST terminal 24, a microcomputer 26 is connected.
The load driving circuit 1 further has an internal power supply circuit 18 connected to the VCC terminal 3 for producing specified voltages (voltages of 5V, VCC-5V etc., for example) by using the power supply voltage VCC supplied from the power supply 5. The internal power supply circuit 18 supplies the produced voltages to the overheating detection circuit 13, the short circuit detection circuit 14, the low voltage detection circuit 16, the overcurrent detection circuit 23, the load disconnection detection circuit 28, the input and output control logical circuit 17 and the level shift driver 19 as high potential side voltages or low potential side voltages of the power supply. The supplied voltages are used for bringing the amplitudes of signals outputted from the foregoing circuits to the level of 5V, for example.
Next to this, the operation of the load driving circuit 1 according to the embodiment of the invention will be explained with reference to the following Table 1 and Table 2.
Table 1 is a truth table showing operation modes of the load driving circuit 1 and Table 2 shows excerpts of items of information with respect to the overcurrent detection current IOC, the peak current PeakI under the overcurrent detection mode etc. from the specification prescribing characteristic items of the load driving circuit 1. In addition, an operation time chart corresponding to Table 1 is shown in
First, when the load driving circuit 1 is under a normal state (a normal operation mode in Table 1) and the voltage VIN at the IN terminal 22 is at an L (Low) level, the input and output control logical circuit 17, having the voltage VIN at the L level inputted, outputs an H (High) level signal to the gate terminal of the switching device Q3 to turn-on the switching device Q3 to thereby bring the ST terminal 24 to the L level. At this time, the input and output control logical circuit 17 outputs an on-off signal ONBH at the H level to the level shift driver 19. The level shift driver 19, having the on-off signal ONBH at the H level inputted, outputs the output signal GS at the L level instructing turning-off to the gates of the switching devices Q1 and Q2. This makes the switching devices Q1 and Q2 turned-off. As a result, the voltage at the OUT terminal 9 is brought to the L level through the load 7. In other words, the load 7, normally having a low resistance value of the order of 10 Ω, pulls-down the voltage at the OUT terminal 9. In short, when the voltage at the IN terminal 22 is at the L level (hereinafter “the voltage at the xx terminal” will be also referred to simply as “the xx terminal”), that is, when the voltage VIN in
While, when the level of the voltage at the IN terminal 22 becomes the H (High) level under the normal state, the input and output control logical circuit 17 outputs the L level signal to the gate terminal of the switching device Q3 to turn-off the switching device Q3 to thereby bring the level of the voltage at the ST terminal 24 to the H level (the voltage inside the microcomputer 26 pulls-up the voltage at the ST terminal 24). At this time, as will be explained later in detail, the input and output control logical circuit 17 also outputs the on-off signal ONBH at the L level to the level shift driver 19, by which the level shift driver 19 outputs the output signal GS at the H level instructing turning-on to the gate terminals of the switching devices Q1 and Q2. Then, the switching devices Q1 and Q2 are made turned-on to result in the H level voltage at the OUT terminal 9, by which a current flows in the load 7. Namely, in
However, in an IN terminal disconnection (Open) state in which no connection is provided between the IN terminal 22 and the microcomputer 26 (IN terminal disconnection mode in Table 1), a pull-down function built in the input and output control logical circuit 17 brings the state of the input and output control logical circuit 17 to be equivalent to the state when a voltage at the L level is inputted to the IN terminal 22. This brings the levels of the voltages at both of the OUT terminal 9 and the ST terminal 24 to the L level, which is the same state as a state when a voltage at the L level is inputted to the IN terminal 22.
In the next, the detection of load disconnection will be explained. The detection of load disconnection is, as is shown with respect to the load disconnection detection mode in Table 1, carried out with the IN terminal 22 being at the L level. Namely, like in the case in which the IN terminal 22 is at the L level in the normal state, the detection of load disconnection is carried out when the output signal GS outputted from the level shift driver 19 comes to be at the L level to make the switching device Q1 turned-off. Here, the state of the load disconnection is to include not only the state in which the connecting section between the OUT terminal 9 and the load 7 is made completely opened but also the state in which the resistance in the connecting section becomes high rather than infinite.
In such a state that the load 7 is disconnected, the current from the constant current device 27 does not flow onto the load 7 side but flows into the load disconnection detection circuit 28 as was explained in the foregoing. In addition, the current charges a parasitic capacitor on the OUT terminal 9 and becomes a component of the leak current of internal circuits. This, as is shown in
Subsequent to this, overcurrent detection will be explained. The overcurrent detection is, as is shown with respect to the overcurrent detection mode in Table 1, carried out with the IN terminal 22 being at the H level. Namely, the overcurrent detection is carried out when the output signal GS outputted from the level shift driver 19 comes to be at the H level to make the switching devices Q1 and 02 turned-off. The current flowing in the load 7 is equal to the current flowing in the switching device Q1 shown in
The overcurrent detection circuit 23 is provided with a comparator with differential inputs with which comparator the source voltage of the switching device Q1 and the source voltages of the switching device Q2 are compared and the difference between them is amplified. When the source voltage of the switching device Q1 is lower than the source voltage of the switching device Q2 with an overcurrent flowing in the switching device Q1, an overcurrent detection signal (a logical signal at the H level in
The overcurrent detection signal outputted from the overcurrent detection circuit 23 to the input and output control logical circuit 17 makes the input and output control logical circuit 17 output an H level signal to the gate terminal of the switching device Q3 on the basis of the overcurrent detection signal to turn-on the switching device Q3, which brings the level of the output signal of the ST terminal 24 to the L level. In addition, the input and output control logical circuit 17 outputs the on-off signal ONBH at the H level to the level shift driver 19 on the basis of the overcurrent detection signal at the H level outputted from the overcurrent detection circuit 23 to thereby make the level shift driver 19 output the output signal GS at the L level. The output signal GS at the L level is inputted to the gate terminals of the switching devices Q1 and Q2 to turn-off the switching devices Q1 and Q2, which brings the level of the OUT terminal 9 to the L level.
The voltage at the OUT terminal 9 with the level thereof brought to the L level is detected by the short circuit detection circuit 14, which outputs a signal SCB at the L level to the input and output control logical circuit 17 and the level shift driver 19. With the signal SCB at the L level and the overcurrent detection signal outputted from the overcurrent detection circuit 23, the input and output control logical circuit 17 changes the on-off signal ONBH to a signal with a pulse shaped oscillating waveform with the frequency thereof far higher than the switching frequency of the output voltage driving the load in a normal operation and outputs the changed on-off signal ONBH to the level shift driver 19. The level shift driver 19, having the on-off signal ONBH with the oscillating waveform and the signal SCB at the L level inputted, outputs the output signal GS, having the oscillating waveform with the peak value thereof clamped, to drive the switching devices Q1 and Q2 by the output signal GS with a loss due to an overcurrent being decreased. As a result, a voltage with an oscillating waveform is outputted from the OUT terminal with the peak value which depends on impedance of the load 7 and current from the switching device Q1.
Also in the case in which the overheating detection circuit 13 has detected the overheating of the switching device Q1, the input and output control logical circuit 17, on the basis of an overheating detection signal outputted from the overheating detection circuit 13, outputs the signal at the H level to the gate terminal of the switching device Q3 to turn-on the switching device Q3 to thereby bring the level of the voltage at the ST terminal to be at the L level. In addition, the input and output control logical circuit 17 outputs the on-off signal ONBH at the H level to the level shift driver 19 on the basis of the overheating detection signal outputted from the overheating detection circuit 13 to thereby make the level shift driver 19 output the output signal GS at the L level. The output signal GS at the L level is inputted to the gate terminals of the switching devices Q1 and Q2 to turn-off the switching devices 01 and Q2, which brings the level of the voltage at the OUT terminal 9 to be at the L level. At this time, the microcomputer 26, on the basis of an abnormal state in which each of the voltages at the ST terminal 24 and the OUT terminal 9 is at the L level when the voltage at the IN terminal 22 is at the H level, makes a decision of the overheating detection.
The overcurrent detection characteristics in the load driving circuit 1 are measured by a measuring circuit shown in
When a measurement is carried out with respect to the overcurrent detection current IOC in the normal switching operation of the load driving circuit 1, as is shown in
Moreover, when a measurement is carried out with respect to a peak current under overcurrent detection mode Peakl at the short circuit detection in the load driving circuit 1, the OUT terminal 9 is brought into a state the same as the state at a load short circuit (grounded by low impedance wiring). This, as is shown in
In addition, although not shown in
Thus, the microcomputer 26, on the basis of the abnormality that the level of the ST terminal 24 becomes the L level when the IN terminal 22 is at the H level, makes the decision of overcurrent, overheating or lowered voltage.
Here, “SELF-RESET” written in Table 1 means that when the state of the load driving circuit 1 becomes normal with the cause of the detected abnormality removed, the operation of the load driving circuit 1 is automatically reset to the normal operation without any special electrical resetting operation. Moreover, the “OUT OUTPUT OSCILLATION MODE” written in Table 1 means the oscillating operations of the voltage VOUT and the output current IOUT at the OUT terminal 9 observed in the period of “OVERCURRENT DETECTION” shown in
Here, the “OVER CURRENT DETECTION MODE” written in Table 2 is the “OUT OUTPUT OSCILLATION MODE”. The measurement of the peak current Peakl is carried out when the output current IOUT is made oscillated with the measuring circuit brought into the state of measuring the peak current Peakl of the output current IOUT shown as “MEASUREMENT OF IOUT=PeakI” in
In order to reduce the level of the peak current Peakl to a desired value, it is necessary to reduce the value of the gate-source voltage of the switching device Q1 to the value required for the reduction. A clamping circuit 42 in the inner circuit of the level shift driver 19 shown in
The level shift driver 19 has a p-channel MOSFET Q41 with the source terminal thereof connected to the power supply that supplies the power supply voltage VCC, the gate terminal thereof receiving the on-off signal ONBH from the input and output control logical circuit 17 and the drain terminal thereof connected to an internal GND through a bias circuit B41. The bias circuit B41 is a circuit that supplies a bias voltage for pulling-down the gate voltage of each of the p-channel MOSFETs Q43 and Q53 to a voltage at the L level when the p-channel MOSFET Q41 is turned off. The connection point of the drain terminal of the p-channel MOSFET Q41 and the bias circuit B41 is connected to the gate terminals of p-channel MOSFETs Q43 and Q53. The p-channel MOSFETs Q43 and Q53 are connected to the power supply, which supplies the power supply voltage VCC, with the source terminals thereof and are connected to the one end of a voltage dividing circuit T41 and the one end of a voltage dividing circuit T51 with their respective drain terminals. The voltage dividing circuit T41 is connected to the internal GND with the other end thereof and is connected to the gate terminal of an n-channel MOSFET Q46 with the divided voltage outputting terminal thereof. The n-channel MOSFET Q46 is connected to the internal GND with the source terminal thereof and is connected to the output side of a charge-pumping circuit 41, which supplies a voltage higher than the power supply voltage VCC, with the drain terminal thereof. The voltage dividing circuit T51 is connected to the gate terminal of an n-channel MOSFET Q56 with the divided voltage outputting terminal thereof. The other end of the voltage dividing circuit T51 and the source terminal of the n-channel MOSFET Q56 are connected together to be further connected to the anode terminal of a diode D51. The n-channel MOSFET Q56 is connected to the output side of the charge-pumping circuit 41 with the drain terminal thereof. The charge-pumping circuit 41 is formed so as to output the output signal GS to the gate terminals of the switching devices Q1 and Q2 shown in
Between the output terminal of the output signal GS and the anode terminal of the diode D 51, the clamping circuit 42 explained before is arranged. The clamping circuit 42 has a resistor R61 with the one end thereof connected to the output terminal of the output signal GS. The other end of the resistor R61 is connected to the anode terminal of a diode D61 at one end of the series connection of a plurality of diodes D61 to D6n (n is an arbitrary number) arranged in the same direction. The cathode terminal of the diode D6n is connected to the drain terminal of an n-channel MOSFET Q66 and the source terminal of the n-channel MOSFET Q66 is connected to the anode terminal of the diode D51.
The clamping circuit 42 further has a p-channel MOSFET Q63 and a voltage dividing circuit T61. The p-channel MOSFET Q63 has a source terminal connected to the power supply that supplies the power supply voltage VCC and has a drain terminal connected to one end of the voltage dividing circuit T61 and has a gate terminal connected to the output side of a short circuit detection circuit (here, a related short circuit detection circuit 14a). The other end of the voltage dividing circuit T61 is connected to the source terminal of the n-channel MOSFET Q66 and the divided voltage outputting terminal of the voltage dividing circuit T61 is connected to the gate terminal of the n-channel MOSFET Q66.
The short circuit detection circuit 14a with a related configuration shown in
Here, inside the level shift driver 19, at an on-driving timing at which the level of the on-off signal ONBH becomes the L level, the p-channel MOSFET Q41 is turned-on, by which the level of the voltage of each of the gate terminals of the p-channel MOSFETs Q43 and Q53 in the next stage becomes the H level to turn-off both of the p-channel MOSFETs Q43 and Q53. This causes the levels of the divided voltages outputted from the voltage dividing circuits T41 and T51 connected to the drain terminals of the p-channel MOSFETs Q43 and Q53, respectively, to be at their L levels, by which both of the n-channel MOSFETs Q46 and Q56, each having the divided voltage at the L level inputted to its own gate terminal, are made to be turned-off. Therefore, a voltage with the level thereof stepped up by the charge-pumping circuit 41 to be higher than the power supply voltage VCC is outputted from the level shift driver 19 through the resistor R51 as the output signal GS at the H level without being pulled down by the n-channel MOSFETs Q46 and Q56. The stepped up output signal GS is inputted to the gate terminals of the switching devices Q1 and Q2 to drive the switching devices Q1 and Q2 so as to be turned-on.
In on-driving, when the short circuit detection circuit 14a detects the drop in the voltage VOUT at the OUT terminal 9 to thereby detect a load short circuit, the short circuit detection circuit 14a outputs the signal SCB at the L level. Namely, in the short circuit detection circuit 14a, the drop in the voltage VOUT causes the p-channel MOSFET Q32 to turn-on to bring the level of the voltage at the connection point of the drain terminal of the p-channel MOSFET Q32, the bias circuit B31 and the inverter circuit 31, i.e. the level of the voltage inputted to the inverter circuit 31, to the H level, by which the level of the signal SCB outputted from the inverter circuit 31 becomes the L level. This turns-on the p-channel MOSFET Q63 in the clamping circuit 42 to raise the divided output voltage of the voltage dividing circuit T61, which is to raise the gate voltage of the n-channel MOSFET Q66 and is to turn on the n-channel MOSFET Q66. As a result, the voltage between the output terminal of the charge-pumping circuit 41 and the OUT terminal 9 is divided into the voltage determined by the resistance of the resistor R51 and the impedance determined by the resistor R61, the diodes D61 to D6n and D51 to clamp the voltage of the output signal GS. By the value of the voltage of clamping the output signal GS, the level of the desired peak current Peakl is determined. Therefore, the resistance value of the resistor R61 and the number n of the diodes D61 to D6n normally become the important factors in the adjustment for determining the level of the peak current PeakI. Here, the resistor R51 is an element relating to the switching time and the diode D51 is an element for protecting the circuit, so that they are out of the important factors in the adjustment.
Next, at an off-driving timing at which the level of the on-off signal ONBH becomes the H level, the p-channel MOSFET Q41, being made turned-off, makes both of the p-channel MOSFETs Q43 and Q53 in the next stage turned-on due to the pull-down effect of the bias circuit B41. This brings the levels of the divided output voltages of the voltage dividing circuits T41 and T51 connected to the p-channel MOSFETs Q43 and Q53 to the H level to turn-on both of the n-channel MOSFETs Q46 and Q56, respectively. At this time, the charge-pumping circuit 41 is stopped while being controlled by a circuit not shown. However, in each of the switching devices Q1 and Q2 shown in
Here, the operation when the short circuit detection circuit 14a shown in
The short circuit detection circuit 14 has a configuration in which a resistor R32 (resistance value R) is connected in series to the output side of the short circuit detection circuit 14a and a capacitor C31 (capacitance value C) functioning as a kind of a speed-up capacitor is connected between the input side and the output side (between the OUT terminal 9 and an output terminal of the signal SCB). Namely, the short circuit detection circuit 14, with the capacitor C31 connected between the input side and the output side thereof, forms a circuit in which an output voltage becomes equal to the input voltage at the instant of a step-like change in the input voltage and thereafter decreases with a speed corresponding to a time constant determined by the resistance value of the resistor R32 and the capacitance value of the capacitor C31. Therefore, letting the sum of the drain (gate)-source voltage of the p-channel MOSFET Q31 in diode connection and the threshold value of the input voltage of the p-channel MOSFET Q32 be Vth, the threshold value of the input voltage of the short circuit detection circuit 14 expressed as VCC−Vth is determined as being equal to the threshold value of the input voltage of the short circuit detection circuit 14a. Here, for obtaining a desired threshold value of the input voltage, the p-channel MOSFET Q31 in diode connection can be substituted by another device such as a diode or a resistor.
Here, at the on-driving timing at which the level of the voltage at the OUT terminal 9 is the H level, the p-channel MOSFET Q32 is made to be turned-off. Thus, by the bias circuit B31 for pulling-down the voltage of the drain terminal of the p-channel MOSFET Q32 to a voltage at the L level when the p-channel MOSFET Q41 is turned off, the level of the input voltage to the inverter circuit 31 at the next stage becomes the L level and the level of the output voltage thereof becomes the H level. The output voltage of the inverter circuit 31 at the H level is given to the output terminal of the signal SCB through the resistor R32, by which the level of the signal SCB becomes the H level.
While, at the off-driving timing at which the level of the voltage at the OUT terminal 9 is the L level, the p-channel MOSFET Q32 is made to be turned-on. Here, the p-channel MOSFET Q32 is protected by the resistor R31 and the diode D31 with the voltage at the gate terminal thereof limited to be lower than the gate breakdown voltage thereof, by which the threshold value of the input voltage of the p-channel MOSFET Q32 is established within the range of the limited voltage from the power supply voltage VCC. AT this time, a voltage at the H level is inputted to the inverter circuit 31 to make the output voltage thereof at the L level. This causes the voltage of the signal SCB to be equivalently pulled-down to the L level by the resistor R32. In this way, the p-channel MOSFET Q32 and the inverter circuit 31 form a logic element which outputs a non-inverted signal of an input signal.
In this state, the initiation of the next turning-on in a normal switching operation initiates the rising in the voltage at the OUT terminal 9. Letting the voltage across the terminals of the capacitor C31 (capacitance C) be Vc, a transient current as a charging and discharging current of the capacitor C31 with the value thereof expressed as C·dVc/dt flows from the OUT terminal 9 to the output terminal of the signal SCB through the capacitor C31. The transient current further flows through the path of the resistor R32 (resistance R) and the output terminal of the inverter circuit 31 to the internal GND (because the voltage at the OUT terminal 9 at this time is still less than the threshold value of the input voltage to the short circuit detection circuit 14 to cause the output voltage of the inverter circuit 31 to be still at the L level).
Letting the output impedance of the inverter circuit 31 be negligibly small, the voltage appears at the SCB terminal in the transient state follows the waveform of the rising voltage at the OUT terminal 9 to become a voltage having a rising waveform with the magnitude thereof expressed as R·C·dVc/dt. As will be explained later in detail, the voltage of the SCB signal based on the current charging and discharging the capacitor C31 rises to reach the threshold value of the input voltage to the p-channel MOSFET Q63 in the clamping circuit 42 earlier than the output voltage of the inverter circuit 31. This means that the clamp releasing operation of the clamping circuit 42 is initiated earlier than in the case without the capacitance C31 and the resistor R32.
Next to this, a comparison will be made between the operation of the short circuit detection circuit 14 and the operation of the related short circuit detection circuit 14a with reference to
Compared with this, in the short circuit detection circuit 14, the voltage of the signal SCB increases with an increase in the voltage at the OUT terminal 9. Thus, when the voltage at the OUT terminal 9 reaches the threshold value of the input voltage to the short circuit detection circuit 14, the value of the voltage of the signal SCB has reached the value higher than zero. In addition, since the value of the voltage of turning-off the p-channel MOSFET Q63 in the clamping circuit 42 for releasing the clamping operation (threshold value) is set lower than the threshold value of the input voltage to the short circuit detection circuit 14 as will be explained later, then the value of the signal SCB higher than zero is further higher than the threshold value of the clamping circuit 42 when the voltage at the OUT terminal 9 reaches the threshold value of the input voltage to the short circuit detection circuit 14. This is that the clamping circuit 42 has released the clamping operation thereof already when the voltage at the OUT terminal 9 reaches the threshold value of the input voltage to the short circuit detection circuit 14.
Here, the electric potential of the internal GND is higher than the electric potential of the GND terminal 4, i.e. the ground potential. For example, the electric potential of the internal GND is on the order of VCC −6V. Thus, letting VCC be 15V, the electric potential at the internal GND becomes 9V. In the short circuit detection circuit 14, at the beginning of an increase in the voltage at the OUT terminal 9, the foregoing voltage equivalent to R·C·dVc/dt is added to the internal GND at the electric potential higher than the ground potential. Therefore, before the voltage at the OUT terminal 9 (with the initial value thereof being at the ground potential) reaches the threshold value of the p-channel MOSFET Q32, the voltage of the signal SCB is to reach the threshold value of the input voltage of the p-channel MOSFET Q63 in the clamping circuit 42 to release the clamping operation.
The voltage of the signal SCB is also inputted to the input and output control logical circuit 17, which stops, in on-driving in a normal state, making the decision of overcurrent detection and outputs the on-off signal ONBH at the L level as is shown on the left side of a timing chart at the upper-left of
When the load driving circuit 1 is brought into an overcurrent state during the on-driving, the level of the voltage at the OUT terminal 9 becomes lower. And when the level of the voltage at the OUT terminal 9 becomes lower than the threshold value of the input voltage to the short circuit detection circuit 14 or 14a, the level of the voltage of the signal SCB becomes the L level. Then, the input and output control logical circuit 17 makes the decision of the overcurrent detection with the signal SCB at the L level and the overcurrent detection signal and brings the level of the on-off signal ONBH to the H level with a subsequent change into a signal with an oscillating waveform when the signal SCB at the L level is continuously inputted over a specified length of time. This makes the output signal GS drive the switching devices Q1 and Q2 also with a similar oscillating waveform.
While, by the signal SCB at the L level, the clamping circuit 42 clamps the output signal GS, with which the switching devices Q1 and Q2 are driven to make the voltage at the OUT terminal 9 outputted and inputted to the short circuit detection circuit 14 or 14a as a voltage with an oscillating waveform with the peak value which depends on impedance of the load 7 and current from the switching device Q1.
When the load driving circuit 1 is recovered from the overcurrent state, the voltage at the OUT terminal 9 rises from 0V with the value thereof exceeding the threshold value of the short circuit detection circuit 14 or 14a. At this time, when the signal SCB rises from 0V simultaneously with the rising of the voltage at the OUT terminal 9 with the value thereof exceeding the threshold value of the clamping circuit 42, no oscillating waveform is exhibited in the voltage at the OUT terminal 9. However, in the related short circuit detection circuit 14a, as was explained before, the delay in the rising to the H level in the voltage of the signal SCB to the voltage at the OUT terminal 9, which has become a non-zero voltage already, causes an oscillating waveform to be still exhibited in the voltage at the OUT terminal 9, although the load driving circuit 1 has been recovered from the overcurrent state. The time in which the oscillating waveform is exhibited becomes longer by the time of the delay.
In the related short circuit detection circuit 14a, no capacitor C31 and no resistor R31 are provided. This is equivalent to the case at the limit, at which the time constant CR based on the capacitance value C and the resistance value R of the capacitor C31 and the resistor R31, respectively, is reduced to become zero in the short circuit detection circuit 14 according to the invention. The waveform of the voltage of the signal SCB in the case is the waveform shown in the middle part in
By comparing the waveform with the waveform of the voltage of the signal SCB of the short circuit detection circuit 14 according to the invention shown in the lower part, it is known that with an increased time constant CR, the voltage of the signal SCB varies by following the variation in the voltage at the OUT terminal 9 to shorten the time length during which the voltage of the signal SCB is regarded as zero though the voltage at the OUT terminal 9 is not zero.
Therefore, even in such a case that the voltage at the OUT terminal 9 is affected by conditions such as the power supply voltage or a temperature to decrease the rising speed thereof to cause a delay in reaching the threshold value VCC−Vth of the input voltage to the short circuit detection circuit 14, the voltage of the signal SCB, having risen simultaneously with the rising of the voltage at the OUT terminal 9, can shorten the time length from the time at which the voltage at the OUT terminal 9 reaches the threshold value VCC−Vth to the time at which the voltage of the signal SCB reaches the threshold value of the clamping circuit 42 to release the clamping operation thereof. In addition, it sometimes becomes also possible for the voltage of the signal SCB to release the clamping operation before the voltage at the OUT terminal 9 reaches the threshold value as was explained in the foregoing. Therefore, the value of the time constant CR determined by the capacitance value C of the capacitor C31 and the resistance value of the resistor R32 is made to be sufficiently large so that the voltage of the signal SCB rises before the voltage at the OUT terminal 9 shifts into the oscillation mode. Thus, the problem can be avoided in that in a normal operation of the load driving circuit 1, a state in which the rising of the signal SCB is delayed due to the delay in the detection of the rising of the voltage at the OUT terminal 9 is incorrectly detected as an overcurrent state or a short circuit state and the clamping circuit 42 is left operated with an oscillation mode unreleased.
Suppose that the load driving circuit 1 is formed on a semiconductor chip. Then, actually selectable values for the capacitance C and the resistance R become those in the range on the order of several picofarads to hundreds of picofarads and in the range on the order of tens of kilo-ohms to hundreds of kilo-ohms, respectively, for example. However, insofar as the value of a time constant CR determined by a capacitance value C and a resistance value R is a value, which enables the voltage of the signal SCB to rise within a time shorter than the delay time from the rising of the voltage at the OUT terminal to the release of the oscillation mode as is explained before when a signal at the OUT terminal at the H level is inputted to the short circuit detection circuit 14, the capacitance value C and the resistance value R are not limited to those described in the foregoing. This is similar to the case in which the capacitor C31 and the resistor R32 are formed as external parts.
Although not particularly shown in
As is explained in the foregoing, the load driving circuit 1 according to the embodiment of the invention can detect the rising of the output voltage at the turning-on in a normal switching operation with little delay while keeping the current limiting function at a load short circuit. Thus, the load driving circuit 1 is prevented from such a malfunction as to incorrectly detect a state with a delay in the detection of the rising of the output voltage in a normal switching operation as a load short circuit state and shift the operation mode into an oscillation mode informing an abnormal state.
While the present invention has been particularly shown and described with reference to the preferred embodiment thereof, it will be understood by those skilled in the art that the foregoing and other changes in form and details can be made therein without departing from the spirit and scope of the present invention.
This application is based on, and claims priority to, Japanese Patent Application No. 2014-121328, filed on Jun. 12, 2014. The disclosure of the priority application, in its entirety, including the drawings, claims, and the specification thereof, is incorporated herein by reference.
Number | Date | Country | Kind |
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2014-121328 | Jun 2014 | JP | national |