The technology of the disclosure relates generally to an apparatus and a method for performing lookup table (LUT) calibration.
Mobile communication devices have become increasingly common in current society for providing wireless communication services. The prevalence of these mobile communication devices is driven in part by the many functions that are now enabled on such devices. Increased processing capabilities in such devices means that mobile communication devices have evolved from being pure communication tools into sophisticated mobile multimedia centers that enable enhanced user experiences.
A fifth-generation new radio (5G-NR) wireless communication system is widely regarded as a technological advancement that can achieve significantly higher data throughput, improved coverage range, enhanced signaling efficiency, and reduced latency compared to the existing third-generation (3G) and fourth-generation (4G) communication systems. A 5G-NR mobile communication device usually transmits and receives a radio frequency (RF) signal(s) in a millimeter wave (mmWave) RF spectrum that is typically above 6 GHz. Notably, the RF signal(s) transmitted in the mmWave RF spectrum may be more susceptible to propagation attenuation and interference that can result in substantial reduction in data throughput. To help mitigate propagation attenuation and maintain desirable data throughput, the 5G-NR mobile communication device employs a power amplifier(s) to amplify the RF signal(s) before transmitting in the mmWave RF spectrum.
Envelope tracking (ET) is a power management technique designed to improve operating efficiency of the power amplifier(s). Specifically, the power amplifier(s) is configured to amplify the RF signal(s) based on a time-variant ET voltage that closely tracks a time-variant power envelope of the RF signal(s). The time-variant voltage is typically generated by an ET integrated circuit (ETIC) in the wireless communication device. Notably, the inherent processing delay associated with the ETIC can inadvertently cause the time-variant ET voltage to misalign in time and/or phase with the time-variant power envelope of the RF signal(s). As a result, the peaks of the time-variant ET voltage may become misaligned with the peaks of the time-variant power envelope, which may cause the power amplifier(s) to clip and distort the RF signal(s). In this regard, it is desirable to ensure that the ETIC can maintain good time and phase alignment between the time-variant ET voltage and the time-variant power envelope of the RF signal(s).
Aspects disclosed in the detailed description include a lookup table calibration apparatus and method. The lookup table calibration apparatus includes a power amplifier circuit configured to amplify a radio frequency (RF) signal having time-variant power levels based on a modulated voltage. To ensure proper alignment between the modulated voltage and the time-variant power levels, the power amplifier circuit is further configured to phase-shift the RF signal based on a modulated phase correction voltage. Specifically, the modulated voltage is generated based on a modulated voltage lookup table and the modulated phase correction voltage is generated based on a phase correction voltage lookup table. Herein, the lookup table calibration apparatus can be configured to concurrently populate and/or calibrate the modulated voltage lookup table and the phase correction voltage lookup table based on a measured gain and a measured phase of the RF signal, respectively.
In one aspect, a lookup table calibration apparatus is provided. The lookup table calibration apparatus includes a power amplifier circuit. The power amplifier circuit includes a phase shifter circuit. The phase shifter circuit is configured to phase-shift an RF signal based on a modulated phase correction voltage generated based on a phase correction voltage lookup table. The phase correction voltage lookup table includes multiple power indexes each correlating a respective power level of the RF signal with a respective one of multiple phase correction voltage targets. The power amplifier circuit also includes a power amplifier. The power amplifier is configured to amplify the phase-shifted RF signal based on a modulated voltage generated based on a modulated voltage lookup table. The modulated voltage lookup table includes the multiple power indexes each correlating the respective power level of the RF signal with a respective one of multiple modulated voltage targets. The lookup table calibration apparatus also includes a calibration control circuit. The calibration control circuit is configured to, for each of the multiple power indexes, adjust the modulated voltage until a measured gain of the amplified RF signal equals a reference gain. The calibration control circuit is also configured to, for each of the multiple power indexes, update the respective one of the multiple modulated voltage targets in the modulated voltage lookup table based on the adjusted modulated voltage. The calibration control circuit is also configured to, for each of the multiple power indexes, adjust the modulated phase correction voltage until a measured phase of the amplified RF signal equals a reference phase. The calibration control circuit is also configured to, for each of the multiple power indexes, update the respective one of the multiple phase correction voltage targets in the phase correction voltage lookup table based on the adjusted modulated phase correction voltage.
In another aspect, a method for performing a lookup table calibration is provided. The method includes receiving a measured gain and a measured phase of an RF signal for each of multiple power indexes. The method also includes adjusting a modulated voltage until the measured gain equals a reference gain. The method also includes updating a respective one of multiple modulated voltage targets in a modulated voltage lookup table based on the adjusted modulated voltage. The method also includes adjusting a modulated phase correction voltage until the measured phase equals a reference phase. The method also includes updating a respective one of multiple phase correction voltage targets in a phase correction voltage lookup table based on the adjusted modulated phase correction voltage.
Those skilled in the art will appreciate the scope of the present disclosure and realize additional aspects thereof after reading the following detailed description of the preferred embodiments in association with the accompanying drawing figures.
The accompanying drawing figures incorporated in and forming a part of this specification illustrate several aspects of the disclosure and, together with the description, serve to explain the principles of the disclosure.
The embodiments set forth below represent the necessary information to enable those skilled in the art to practice the embodiments and illustrate the best mode of practicing the embodiments. Upon reading the following description in light of the accompanying drawing figures, those skilled in the art will understand the concepts of the disclosure and will recognize applications of these concepts not particularly addressed herein. It should be understood that these concepts and applications fall within the scope of the disclosure and the accompanying claims.
It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present disclosure. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
It will be understood that when an element such as a layer, region, or substrate is referred to as being “on” or extending “onto” another element, it can be directly on or extend directly onto the other element or intervening elements may also be present. In contrast, when an element is referred to as being “directly on” or extending “directly onto” another element, there are no intervening elements present. Likewise, it will be understood that when an element such as a layer, region, or substrate is referred to as being “over” or extending “over” another element, it can be directly over or extend directly over the other element or intervening elements may also be present. In contrast, when an element is referred to as being “directly over” or extending “directly over” another element, there are no intervening elements present. It will also be understood that when an element is referred to as being “connected” or “coupled” to another element, it can be directly connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as being “directly connected” or “directly coupled” to another element, there are no intervening elements present.
Relative terms such as “below” or “above” or “upper” or “lower” or “horizontal” or “vertical” may be used herein to describe a relationship of one element, layer, or region to another element, layer, or region as illustrated in the Figures. It will be understood that these terms and those discussed above are intended to encompass different orientations of the device in addition to the orientation depicted in the Figures.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises,” “comprising,” “includes,” and/or “including” when used herein specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms used herein should be interpreted as having a meaning that is consistent with their meaning in the context of this specification and the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Aspects disclosed in the detailed description include a lookup table calibration apparatus and method. The lookup table calibration apparatus includes a power amplifier circuit configured to amplify a radio frequency (RF) signal having time-variant power levels based on a modulated voltage. To ensure proper alignment between the modulated voltage and the time-variant power levels, the power amplifier circuit is further configured to phase-shift the RF signal based on a modulated phase correction voltage. Specifically, the modulated voltage is generated based on a modulated voltage lookup table and the modulated phase correction voltage is generated based on a phase correction voltage lookup table. Herein, the lookup table calibration apparatus can be configured to concurrently populate and/or calibrate the modulated voltage lookup table and the phase correction voltage lookup table based on a measured gain and a measured phase of the RF signal, respectively.
Before discussing the lookup table calibration apparatus and method of the present disclosure, starting at
The ETIC 16 includes a voltage modulation circuit 18 configured to generate the modulated voltage VCC and a phase correction circuit 20 configured to generate the modulated phase correction voltage VPHASE. The ETIC 16 receives an envelope indication signal 22 that indicates the time-variant power envelope PPOWER(t). In this regard, the voltage modulation circuit 18 and the phase correction circuit 20 can be configured to generate the modulated voltage VCC and the modulated phase correction voltage VPHASE, respectively, based on the envelope indication signal 22.
The power management circuit 10 is coupled to a transceiver circuit 24. The transceiver circuit 24 can be configured to generate and provide the RF signal 12 to the power amplifier circuit 14. In addition, the transceiver circuit 24 is also configured to generate and provide the envelope indication signal 22 to the ETIC 16. Given that the transceiver circuit 24 generates the RF signal 12 associated with the time-variant power envelope PPOWER(t), the transceiver circuit 24 is able to provide an indication of the time-variant power envelope PPOWER(t) via the envelope indication signal 22.
The power amplifier circuit 14 includes a phase shifter circuit 26 and a power amplifier 28. The phase shifter circuit 26 is coupled to the phase correction circuit 20 to receive the modulated phase correction voltage VPHASE. The phase shifter circuit 26 may include internal storage (not shown), such as registers for example, to correlate various levels of the modulated phase correction voltage VPHASE with various degrees of phase shift. For example, the modulated phase correction voltage VPHASE of 0 V, 1 V, and 2 V can correspond to 0°, 1°, and 2° phase shift, respectively. In this regard, the phase shifter circuit 26 can determine a proper phase shift based on the modulated phase correction voltage VPHASE and, accordingly, phase-shift the RF signal 12 based on the determined phase shift. The phase-shifted RF signal 12 is subsequently amplified by the power amplifier 28.
The transceiver circuit 24 includes a signal processing circuit 30. The signal processing circuit 30 is configured to generate the RF signal 12 and, accordingly, the time-variant power envelope PPOWER(t). In a non-limiting example, the signal processing circuit 30 can include a digital baseband circuit (not shown) that generates a digital version of the RF signal 12 and a digital-to-analog converter (not shown) to convert the digital version of the RF signal 12 into the RF signal 12. The digital version of the RF signal 12 can include an in-phase (I) component and a quadrature (Q) component. Accordingly, the signal processing circuit 30 can sample the time-variant power envelope PPOWER(t) to determine a time-variant amplitude (expressed as √{square root over (I2+Q2)}) of the time-variant power envelope PPOWER(t).
The ETIC 16 includes a target voltage circuit 32. The target voltage circuit 32 includes a modulated voltage lookup table LUT-VCC that correlates a time-variant power level, as represented by the time-variant amplitude (√{square root over (I2+Q2)}), of the time-variant power envelope PPOWER(t) with a time-variant target voltage VTGT. The voltage modulation circuit 18 is coupled to the target voltage circuit 32 and configured to generate the modulated voltage VCC to track the time-variant target voltage VTGT.
The phase correction circuit 20 include a phase correction voltage circuit 34. The phase correction voltage circuit 34 includes a phase correction voltage lookup table LUT-VPHASE that correlates the time-variant power level, as represented by the time-variant amplitude (√{square root over (I2+Q2)}), of the time-variant power envelope PPOWER(t) with the modulated phase correction voltage VPHASE. Accordingly, the phase correction circuit 20 can generate the modulated phase correction voltage VPHASE based on the time-variant power level of the time-variant power envelope PPOWER(t).
For a more detailed description as to how the power management circuit 10 performs the phase correction in the RF signal 12, please refer to U.S. patent application Ser. No. 17/536,189, entitled “POWER MANAGEMENT CIRCUIT SUPPORTING PHASE CORRECTION IN AN ANALOG SIGNAL.”
Herein, the modulated voltage lookup table LUT-VCC and the phase correction voltage lookup table LUT-VPHASE are both populated based on the power indexes PIDX-1-PIDX-N. However, it should be appreciated that it is also possible to populate the modulated voltage lookup table LUT-VCC and the phase correction voltage lookup table LUT-VPHASE based on different power indexes. For example, the modulated voltage lookup table LUT-VCC can be populated with more power indexes than the phase correction voltage lookup table LUT-VPHASE in case a higher granularity is required for the time-variant target voltage VTGT.
The modulated voltage lookup table LUT-VCC and the phase correction voltage lookup table LUT-VPHASE may each be pre-populated in the ETIC 16 (e.g., during fabrication and/or factory test) with a respective set of predetermined parameters. However, when the ETIC 16 is actually coupled with the power amplifier circuit 14 and the transceiver circuit 24 in the power management circuit 10, the predetermined parameters pre-populated in the modulated voltage lookup table LUT-VCC and/or the phase correction voltage lookup table LUT-VPHASE may have to be adjusted for an optimal performance. As such, there is a need to calibrate the modulated voltage lookup table LUT-VCC and/or the phase correction voltage lookup table LUT-VPHASE in the power management circuit 10.
In this regard,
In an embodiment, the lookup table calibration apparatus 36 includes a calibration control circuit 38, which can be a field-programmable gate array (FPGA) or a dedicated calibration equipment, as an example. The lookup table calibration apparatus 36 also includes a measurement circuit 40, which may be provided between an output 42 of the power amplifier circuit 14 and an antenna port 44, to provide a measured gain GMEA and a measured phase ϕMEA of the RF signal 12 to the calibration control circuit 38. The lookup table calibration apparatus 36 may also include a storage circuit 46 (e.g., a flash storage, a register bank, etc.) to store parameters required for the lookup table calibration.
The power management circuit 10 may be placed in a calibration mode during the lookup table calibration. For example, the transceiver circuit 24 can be temporally deactivated and the calibration control circuit 38 can be configured to generate the RF signal 12 for the power amplifier circuit 14. More specifically, the calibration control circuit 38 is configured to generate the RF signal 12 at a respective power level (e.g., √{square root over (I2+Q2)}) corresponding to each of the power indexes PIDX-1-PIDX-N.
In an embodiment, the lookup table calibration apparatus 36 can be configured to calibrate concurrently the modulated voltage lookup table LUT-VCC and the phase correction voltage lookup table LUT-VPHASE during a process, as further described in
The calibration control circuit 38 may be configured to determine a reference gain GREF and a reference phase ϕREF (step 202). In one embodiment, the calibration control circuit 38 may determine and store the reference gain GREF and the reference phase ϕREF in the storage circuit 46. In another embodiment, the reference gain GREF and the reference phase ϕREF may have been prestored in the storage circuit 46. As such, the calibration control circuit 38 may retrieve the reference gain GREF and the reference phase ϕREF from the storage circuit 46.
The calibration control circuit 38 is configured to calibrate the modulated voltage lookup table LUT-VCC and the phase correction voltage lookup table LUT-VPHASE by repeating the following steps (steps 204 to 214) for each of the power indexes PIDX-1-PIDX-N. As mentioned earlier, for each of the power indexes PIDX-1-PIDX-N, the calibration control circuit 38 is configured to generate the RF signal 12 at the respective power level and provide the RF signal to the power amplifier circuit 14.
Specifically, the calibration control circuit 38 receives the measured gain GMEA and the measured phase ϕMEA from the measurement circuit 40 for a respective one of the power indexes PIDX-1-PIDX-N(step 204). Accordingly, the calibration control circuit 38 adjusts the modulated voltage VCC (e.g., by controlling the ETIC 16) until the measured gain GMEA equals the reference gain GREF (step 206). The calibration control circuit 38 then updates a respective one of the modulated voltage targets VCC-TGT-1-VCC-TGT-N in the modulated voltage lookup table LUT-VCC, which corresponds to the respective one of the power indexes PIDX-1-PIDX-N, based on the adjusted modulated voltage VCC (step 208).
The calibration control circuit 38 is further configured to adjust the modulated phase correction voltage VPHASE (e.g., by controlling the ETIC 16) until the measured phase (MEA equals the reference phase (REF (step 210). Accordingly, the calibration control circuit 38 updates a respective one of the phase correction voltage targets VPHASE-TGT-1-VPHASE-TGT-N in the phase correction voltage lookup table LUT-VPHASE, which corresponds to the respective one of the power indexes PIDX-1-PIDX-N, based on the adjusted modulated phase correction voltage VPHASE (step 212).
To ensure that the adjusted modulated phase correction voltage VPHASE does not cause any amplitude change in the adjusted modulated voltage VCC (as determined in step 206), the calibration control circuit may perform an optional step to re-calibrate the adjusted modulated voltage VCC. Specifically, the calibration control circuit 38 may re-adjust the modulated voltage VCC until the measured gain GMEA once again equals the reference gain GREF and then update the respective one of the modulated voltage targets VCC-TGT-1-VCC-TGT-N in the modulated voltage lookup table LUT-VCC based on the re-adjusted modulated voltage VCC (step 214).
Those skilled in the art will recognize improvements and modifications to the preferred embodiments of the present disclosure. All such improvements and modifications are considered within the scope of the concepts disclosed herein and the claims that follow.
This application claims the benefit of provisional patent application Ser. No. 63/188,034, filed May 13, 2021, and provisional patent application Ser. No. 63/188,023, filed May 13, 2021, the disclosures of which are hereby incorporated herein by reference in their entireties.
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