Claims
- 1. A connector device comprising:
a signal carrying portion, and a connector housing comprising a conductive loaded, resin-based material comprising conductive materials in a base resin host wherein said connector housing substantially surrounds and electrically isolates said signal carrying portion of the connector.
- 2. The device according to claim 1 wherein the percent by weight of said conductive materials is between about 20% and about 50% of the total weight of said conductive loaded resin-based material.
- 3. The device according to claim 1 wherein the percent by weight of said conductive materials is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.
- 4. The device according to claim 1 wherein the percent by weight of said conductive materials is between about 25% and about 35% of the total weight of said conductive loaded resin-based material.
- 5. The device according to claim 1 wherein said connector housing comprises multiple components and wherein at least one of said components comprises a conductive loaded, resin-based material comprising conductive materials in a base resin host.
- 6. The device according to claim 5 wherein said components of said connector housing are a collet, a collet nut, an outer shell, a latch sleeve, a front nut, a hexagonal nut, a bend relief, or any combination thereof.
- 7. The device according to claim 1 wherein said conductive materials comprise metal powder.
- 8. The device according to claim 7 wherein said metal powder is nickel, copper, or silver.
- 9. The device according to claim 7 wherein said metal powder is a non-conductive material with a metal plating.
- 10. The device according to claim 9 wherein said metal plating is nickel, copper, silver, or alloys thereof.
- 11. The device according to claim 7 wherein said metal powder comprises a diameter of between about 3 μm and about 12 μm.
- 12. The device according to claim 1 wherein said conductive materials comprise non-metal powder.
- 13. The device according to claim 12 wherein said non-metal powder is carbon, graphite, or an amine-based material.
- 14. The device according to claim 1 wherein said conductive materials comprise a combination of metal powder and non-metal powder.
- 15. The device according to claim 1 wherein said conductive materials comprise micron conductive fiber.
- 16. The device according to claim 15 wherein said micron conductive fiber is nickel plated carbon fiber, or stainless steel fiber, or copper fiber, or silver fiber or combinations thereof.
- 17. The device according to claim 15 wherein said micron conductive fiber has a diameter of between about 3 μm and about 12 μm and a length of between about 2 mm and about 14 mm.
- 18. The device according to claim 15 wherein the percent by weight of said micron conductive fiber is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.
- 19. The device according to claim 15 wherein said micron conductive fiber is stainless steel and wherein the percent by weight of said stainless steel fiber is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.
- 20. The device according to claim 19 wherein said stainless steel fiber has a diameter of between about 3 μm and about 12 μm and a length of between about 2 mm and about 14 mm.
- 21. The device according to claim 1 wherein said conductive materials comprise a combination of conductive powder and conductive fiber.
- 22. The device according to claim 21 wherein said conductive fiber is stainless steel.
- 23. The device according to claim 1 wherein said base resin and said conductive materials comprise flame-retardant materials.
- 24. The device according to claim 1 further comprising a metal layer overlying said conductive loaded resin-based material.
- 25. A connector device comprising:
a signal carrying portion, and a connector housing comprising multiple components wherein at least one of said components comprises a conductive loaded, resin-based material comprising conductive materials in a base resin host and wherein said connector housing substantially surrounds and electrically isolates said signal carrying portion of the connector.
- 26. The device according to claim 25 wherein said components of said connector housing are a collet, a collet nut, an outer shell, a latch sleeve, a front nut, a hexagonal nut, a bend relief, or any combination thereof.
- 27. The device according to claim 25 wherein said conductive material comprises micron conductive fiber comprising stainless steel fiber wherein said stainless steel fiber has a diameter of between about 3 μm and about 12 μm and a length of between about 2 mm and about 14 mm and wherein the percent by weight of said stainless steel fiber is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.
- 28. The device according to claim 25 wherein the percent by weight of said conductive materials is between about 20% and about 50% of the total weight of said conductive loaded resin-based material.
- 29. The device according to claim 25 wherein the percent by weight of said conductive materials is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.
- 30. The device according to claim 25 wherein the percent by weight of said conductive materials is between about 25% and about 35% of the total weight of said conductive loaded resin-based material.
- 31. The device according to claim 25 wherein said conductive materials comprise metal powder.
- 32. The device according to claim 31 wherein said metal powder is a non-conductive material with a metal plating.
- 33. The device according to claim 25 wherein said conductive materials comprise non-metal powder.
- 34. The device according to claim 25 wherein said conductive materials comprise a combination of metal powder and non-metal powder.
- 35. The device according to claim 25 wherein said conductive materials comprise micron conductive fiber.
- 36. The device according to claim 25 wherein said conductive materials comprise a combination of conductive powder and conductive fiber.
- 37. The device according to claim 36 wherein said conductive fiber is stainless steel.
- 38. The device according to claim 25 wherein said base resin and said conductive materials comprise flame-retardant materials.
- 39. The device according to claim 25 further comprising a metal layer overlying said conductive loaded resin-based material.
- 40. A method to form a connector housing device, said method comprising:
providing a conductive loaded, resin-based material comprising conductive materials in a resin-based host; and molding said conductive loaded, resin-based material into a connector housing device.
- 41. The method according to claim 40 wherein the percent by weight of said conductive materials is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.
- 42. The method according to claim 40 wherein said conductive materials comprise micron conductive fiber.
- 43. The method according to claim 42 wherein said micron conductive fiber is nickel plated carbon fiber, or stainless steel fiber, or copper fiber, or silver fiber or combinations thereof.
- 44. The method according to claim 42 wherein said micron conductive fiber has a diameter of between about 3 μm and about 12 μm and a length of between about 2 mm and about 14 mm.
- 45. The method according to claim 42 wherein the percent by weight of said micron conductive fiber is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.
- 46. The method according to claim 42 wherein said micron conductive fiber is stainless steel and wherein the percent by weight of said stainless steel fiber is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.
- 47. The method according to claim 46 wherein said stainless steel fiber has a diameter of between about 3 μm and about 12 μm and a length of between about 2 mm and about 14 mm.
- 48. The method according to claim 40 wherein said conductive materials comprise conductive powder.
- 49. The method according to claim 40 wherein said conductive materials comprise a combination of conductive powder and conductive fiber.
- 50. The method according to claim 40 wherein said molding comprises:
injecting said conductive loaded, resin-based material into a mold; curing said conductive loaded, resin-based material; and removing said connector housing device from said mold.
- 51. The method according to claim 40 wherein said molding comprises:
loading said conductive loaded, resin-based material into a chamber; extruding said conductive loaded, resin-based material out of said chamber through a shaping outlet; and curing said conductive loaded, resin-based material to form said connector housing device.
- 52. The method according to claim 40 further comprising subsequent mechanical processing of said molded conductive loaded, resin-based material.
- 53. The method according to claim 40 further comprising overlying a layer of metal on said molded conductive loaded, resin-based material.
Parent Case Info
[0001] This Patent Application claims priority to the U.S. Provisional Patent Application 60/484455, filed on Jul. 2, 2003, which is herein incorporated by reference in its entirety.
[0002] This Patent Application is a Continuation-in-Part of INT01-002CIP, filed as U.S. patent application Ser. No. 10/309,429, filed on Dec. 4, 2002, also incorporated by reference in its entirety, which is a Continuation-in-Part application of docket number INT01-002, filed as U.S. patent application Ser. No. 10/075,778, filed on Feb. 14, 2002, which claimed priority to U.S. Provisional Patent Applications Ser. No. 60/317,808, filed on Sep. 7, 2001, Ser. No. 60/269,414, filed on Feb. 16, 2001, and Ser. No. 60/268,822, filed on Feb. 15, 2001.
Provisional Applications (4)
|
Number |
Date |
Country |
|
60484455 |
Jul 2003 |
US |
|
60317808 |
Sep 2001 |
US |
|
60269414 |
Feb 2001 |
US |
|
60268822 |
Feb 2001 |
US |
Continuation in Parts (2)
|
Number |
Date |
Country |
Parent |
10309429 |
Dec 2002 |
US |
Child |
10884322 |
Jul 2004 |
US |
Parent |
10075778 |
Feb 2002 |
US |
Child |
10309429 |
Dec 2002 |
US |